CN115655662A

CN115655662A - Method and system for accurately testing edge-emitting semiconductor laser

Info

Publication number: CN115655662A
Application number: CN202211279006.8A
Authority: CN
Inventors: 李万军; 向欣; 王远红
Original assignee: Wuhan Yunling Optoelectronics Co ltd
Current assignee: Wuhan Yunling Optoelectronics Co ltd
Priority date: 2022-10-19
Filing date: 2022-10-19
Publication date: 2023-01-31
Anticipated expiration: 2042-10-19
Also published as: CN115655662B

Abstract

The invention relates to an accurate testing method of an edge-emitting semiconductor laser, which comprises the following steps: s1, placing a laser chip to be tested on a test platform deck, and arranging a light receiving assembly beside the test platform deck; s2, a condensing lens is arranged between the test carrying platform and the light receiving assembly; s3, pushing the laser chip to be tested from multiple angles by adopting a guiding system so as to adjust the position of the laser chip to be tested on the test carrying platform until a light emitting area of the laser chip to be tested is accurately aligned with the condensing lens; s4, electrifying the laser chip to be tested, and collecting light emitted by the laser chip to be tested after passing through the condenser lens so as to reduce the divergence leg of the light beam; and S5, carrying out optical performance test after the light receiving assembly receives the gathered light beam. An accurate test system of the edge-emitting semiconductor laser is also provided. The invention can solve the problem of incomplete light receiving of the traditional test system, improve the light receiving precision of the light receiving assembly and obviously improve the accuracy of the optical performance test of the edge-emitting semiconductor laser chip.

Description

Method and system for accurately testing edge-emitting semiconductor laser

Technical Field

The invention relates to the technical field of chip testing, in particular to a method and a system for accurately testing an edge-emitting semiconductor laser.

Background

With the rapid development of the optical communication industry, semiconductor laser chips are widely used as main light sources at the emitting end, and the edge-emitting semiconductor laser chips have an important share. All edge-emitting semiconductor laser chips need to be subjected to photoelectric performance test, and because the positions and the divergence angles of the light-emitting points of different laser chips manufactured in an application scene and a process are different, the requirements on the pilot part and the light-receiving part of an optical performance test system are high. Particularly, the laser chip adapted to the new application environment has high requirements for the optical performance testing accuracy, and the testing requirements are diversified, so that the guiding and light receiving accuracy of the testing system needs to be improved. On one hand, the conventional edge-emitting semiconductor laser chip test system has the problem of low test precision in the matching of the traditional guiding and light receiving components; on the other hand, the light receiving adaptive assembly is single, if various optical performance representations are required, repeated testing needs to be carried out on a single semiconductor laser chip, and testing time and cost are greatly increased; finally, the traditional test system is complex to debug when switching products, increasing labor and time costs.

Edge-emitting semiconductor laser chips have various designs depending on their application scenes, and laser chips for different applications have different differences in light-emitting positions, divergence angles, chip sizes, and the like. Moreover, the edge-emitting semiconductor lasers with the same application conditions have different divergence angles due to different manufacturing processes of different manufacturers. For the above reasons, there is a high requirement for the precision of the testing machine, and the requirements are reflected in the aspects of guiding and receiving light for testing the optical performance of the laser chip.

The guide is used for carrying out optical performance test on the light-emitting position of the laser chip aligned with the light-receiving component. A conventional semiconductor laser testing system generally adopts a camera picture template for guiding in the aspect of chip guiding, the scheme is to guide by setting the graphic characteristics of a laser chip to be tested and setting the percentage range of the similarity matching degree of the graphics, the working logic of the scheme is to use the center of a camera as a reference, a test bench performs left-right, up-down and angle rotation actions, and the laser chip to be tested is placed at a preset position. The first defect of the scheme is that the similarity matching degree is set to be too large, so that a normal laser chip can not be identified easily, and material throwing is caused; and the pilot accuracy is poor when the similarity matching degree is set to be too small. A second drawback is that if the deviation of the laser chip to be aligned is large, on the one hand, the maximum limit of the movable angle of the test table may be exceeded, and the chip cannot be successfully aligned, and on the other hand, the center of motion of the angular rotation action is the center of motion of the test table. Another commonly used guiding scheme is mechanical guiding, which is generally equipped with a square push plate to perform left-right and up-down guiding actions. The main defect of this scheme is when the suction of if the testboard is less or push pedal dynamics is too big, causes easily to throw the material or leads the skew problem of positive back position.

The configuration of the optical performance testing section has a great influence on the measurement of the optical performance of the semiconductor laser. The laser chip optical performance testing device is characterized in that a plane light receiving photodiode assembly, an integrating sphere, an optical fiber collimator and the like are generally directly arranged in the light emitting direction of a laser chip during the traditional laser chip optical performance testing, and the movable range of the light receiving assembly at the position is small, so that the accuracy during the laser chip testing aiming at different light emitting positions and divergence angles is poor, and the debugging work during the testing of different products is complex. In addition, for laser chips with different divergence angles, the light receiving assembly has size limitation, and the problem of incomplete light receiving is caused, so that the accuracy of optical performance test is influenced.

Finally, the light receiving assembly of the conventional laser chip testing system is difficult to accurately align with the light emitting area of the laser chip; the debugging work when the laser chips at different light-emitting positions are switched to be tested is more complicated, and the efficiency is influenced. Moreover, when a traditional laser testing system tests laser chips with different light-emitting positions, camera picture templates or mechanical guide plate positions need to be set one by one, operation and debugging are complex during use, and efficiency is affected. In addition, the conventional laser chip test system has fewer optical test components due to structural limitations, and if various optical test performances are to be represented, a single chip needs to be tested repeatedly, so that the production cost is increased.

Disclosure of Invention

The invention aims to provide a method and a system for accurately testing an edge-emitting semiconductor laser, which can at least solve part of defects in the prior art.

In order to achieve the above purpose, the embodiments of the present invention provide the following technical solutions: an accurate test method for an edge-emitting semiconductor laser comprises the following steps:

s1, placing a laser chip to be tested on a test platform deck, and arranging a light receiving assembly beside the test platform deck;

s2, a condensing lens is arranged between the test carrying platform and the light receiving assembly;

s3, pushing the laser chip to be tested from multiple angles by adopting a guide system so as to adjust the position of the laser chip to be tested on the test platform deck until a light emitting area of the laser chip to be tested is accurately aligned with the condensing lens;

s4, electrifying the laser chip to be tested, and collecting light emitted by the laser chip to be tested after passing through the condenser lens so as to reduce the divergence leg of the light beam;

and S5, carrying out optical performance test after the light receiving assembly receives the gathered light beam.

Further, when the laser chip to be tested, the light receiving assembly and the condensing lens are arranged, a light reflector is further arranged, so that when the optical performance is tested, light emitted by the laser chip to be tested firstly passes through the light emitting mirror, then is reflected by the light emitting mirror and then enters the condensing lens for condensation.

Further, leading positive system is leading just before, the setting through operating position earlier, leading positive system is including leading just baffle and leading just push pedal, and the mode of setting specifically is:

inputting the size parameters of the laser chip to be tested into an upper computer, and then inputting the gram weight value for calibrating the height of the guiding push plate;

taking a lens center mark of a monitoring camera right above the test loading platform as a reference, and calculating a horizontal working position and a working original point position of the guide push plate by the upper computer based on the size parameters input into the upper computer;

then, calibrating the position of the working height of the guide system, wherein the guide push plate moves downwards in a small-motion step-by-step manner along the vertical direction from an initial point, the grammage meter of the guide push plate performs grammage detection in the whole process, the numerical value of the grammage meter of the guide push plate starts to change after the guide push plate contacts the test carrier, when the detected numerical value exceeds a set numerical value, the guide push plate stops moving in the vertical direction, the upper computer records the position in the vertical direction as the vertical working position of the push plate, and automatically calculates the working origin position in the vertical direction;

and finally, automatically setting the working position of the pilot system.

Further, before condenser lens arranges, through the settlement of operating position earlier, the settlement adopts the response to detect the board and realizes, adopts the mode that the operating position of condenser lens was set for to the response detection board specifically does:

continuously applying bias current to a forward electrode of the laser chip to be tested, and moving the induction detection plate to a light-emitting position of the laser chip to be tested;

when the laser chip to be detected shines on the induction detection plate, a point (X, Z) with the highest light intensity/heat quantity exists, and then the coordinate is compared with the origin coordinates (0, 0) of the induction detection plate in position, so that the distance difference between the X direction and the Z direction is calculated; then, according to the distance difference, moving a central coordinate point (0, 0) of the induction detection plate to a point (X, Z) with the highest light intensity/heat so as to finish the position calibration of the induction detection plate, and storing the position (X1, Z1) of the induction detection plate after moving into an upper computer;

the condensing lens and the induction detection plate share the same coordinates in the directions from 1 to 9 and the Z direction, and the difference between the X direction and the Z direction is fixed X2, so that the working position of the condensing lens is calculated to be (X1-X2, Z1) according to the working position of the induction detection plate, and the working position of the condensing lens is automatically stored in a program parameter so as to finish the automatic correction of the working position of the condensing lens.

Further, receive the optical subassembly before arranging, earlier through the settlement of operating position, set for and adopt the response to detect the board and realize, adopt the response detects the board and sets for the mode of receiving the operating position of optical subassembly specifically to be:

continuously applying bias current to a positive electrode of the laser chip to be detected, and moving the induction detection plate to a light-emitting position of the laser chip to be detected;

when light emitted by the laser chip to be detected irradiates the induction detection plate, a point (X, Z) with the highest light intensity/heat exists, and then the coordinate is compared with the original point coordinate (0, 0) of the induction detection plate in position, so that the distance difference between the X direction and the Z direction is calculated; then, according to the distance difference, moving a central coordinate point (0, 0) of the induction detection plate to a point (X, Z) with the highest light intensity/heat so as to finish the position calibration of the induction detection plate, and storing the position (X1, Z1) of the induction detection plate after moving into an upper computer;

the light receiving component and the induction detection plate share the same coordinates in the directions from 1 to 9 and the Z direction, and the difference between the X direction and the Z direction is fixed X2, so that the working position of the light receiving component is calculated to be (X1-X2, Z1) from the working position of the induction detection plate, and the working position of the light receiving component is automatically stored in program parameters to finish the automatic correction of the working position of the light receiving component.

Further, the guiding system comprises a plurality of guiding push plates which respectively push the laser chip to be tested from a plurality of angles so as to adjust the position of the laser chip to be tested on the test platform deck.

Further, it just still includes leading the baffle to lead the system, it has threely, three to lead the push pedal just to lead the push pedal independent work, and promote respectively from three direction the laser chip that awaits measuring, every lead the push pedal and promote just no longer the backward movement after targetting in place to follow three direction cooperation lead the baffle with the laser chip that awaits measuring card accurately controls on the position that awaits measuring.

Further, in the process of setting the position of the guiding system, setting the position of the condensing lens and setting the position of the light receiving assembly, a driving mechanism is adopted to be matched with an upper computer to complete automatic setting.

The embodiment of the invention provides another technical scheme: an accurate testing system for a side-emitting semiconductor laser comprises a testing carrier, a guiding system, a condensing lens, a testing probe and a light receiving assembly,

the test carrier is used for arranging the laser chip to be tested,

the guide system is used for pushing the laser chip to be tested from a plurality of angles so as to adjust the position of the laser chip to be tested on the test platform deck,

the condenser lens is used for condensing the light emitted by the laser chip to be tested,

the test probe is used for electrifying the laser chip to be tested,

and the light receiving assembly is used for receiving the light beams collected by the condenser lens and carrying out optical performance test.

Furthermore, the light receiving assembly comprises a plane light receiving photodiode, an integrating sphere, an optical fiber collimator and a bare optical fiber.

Compared with the prior art, the invention has the beneficial effects that:

1. the guide system can realize the accurate positioning of the laser chip to be tested.

2. The design of the condensing lens can solve the problem that the traditional test system cannot receive light completely, the light receiving precision of the light receiving assembly is improved, and the accuracy of the optical performance test of the edge-emitting semiconductor laser chip is improved remarkably.

3. The design of response detecting plate can promote the precision of setting for of receiving light subassembly operating position, promotes light capability test accuracy, and receives light subassembly position can automatic set for, greatly reduces the debugging time of receiving the light subassembly.

4. The design of the light reflector structure can avoid the influence of the light collecting part reflecting the light back to the laser chip, and the test accuracy is enhanced.

5. The layout of the guiding system and the automatic adjustment function design thereof can increase the guiding precision of the edge-emitting semiconductor laser chip, improve the testing accuracy, automatically generate the working position of the push plate, and greatly shorten the debugging time after switching products.

6. Lead positive plate gram and heavily detect the function, accessible push pedal gram is heavily set for realizing the automatic settlement of push pedal height, and the risk of damage microscope carrier when having avoided the high debugging of push pedal just reduces the debugging time, improves production efficiency.

7. The design of the pilot system can be compatible with edge-emitting semiconductor laser chips with different design specifications, the compatibility of the test system is improved, and various product tests are realized.

8. Each leads just push pedal and all is equipped with buffer spring, and the spring dynamics is adjustable, can avoid the chip to lead the damage of time to the chip.

Drawings

Fig. 1 is a schematic top view of an accurate testing system for an edge-emitting semiconductor laser according to an embodiment of the present invention;

fig. 2 is a structural diagram of a light collecting assembly of an accurate testing system of an edge-emitting semiconductor laser according to an embodiment of the present invention;

fig. 3 is a schematic side view of an accurate testing system for an edge-emitting semiconductor laser according to an embodiment of the present invention;

fig. 4 is a schematic diagram of a reflective mirror of an accurate testing system for an edge-emitting semiconductor laser according to an embodiment of the present invention;

fig. 5 is a schematic diagram of a guiding push plate of an accurate testing system for an edge-emitting semiconductor laser according to an embodiment of the present invention at an original position;

fig. 6 is a working position diagram of a guiding push plate when a light emitting region of a laser chip to be tested of the precise testing system of an edge-emitting semiconductor laser provided by the embodiment of the invention is at the center;

fig. 7 is a working position diagram of a guiding push plate when a light emitting area of a laser chip to be tested of an accurate testing system of an edge-emitting semiconductor laser provided by an embodiment of the invention deviates from the center;

fig. 8 is a schematic diagram of a guiding push plate of an accurate testing system for an edge-emitting semiconductor laser according to an embodiment of the present invention;

fig. 9 is a schematic diagram of a condensing lens of an accurate testing system for an edge-emitting semiconductor laser according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 9, an embodiment of the invention provides a method for accurately testing an edge-emitting semiconductor laser, including the following steps: s1, placing a laser chip 2 to be tested on a test platform 1, and arranging a light receiving assembly beside the test platform 1; s2, a condensing lens 17 is arranged between the test carrying platform 1 and the light receiving assembly; s3, pushing the laser chip 2 to be tested from multiple angles by adopting a guiding system so as to adjust the position of the laser chip 2 to be tested on the test carrying platform 1 until a light emitting area of the laser chip 2 to be tested is accurately aligned with the condensing lens 17; s4, the laser chip 2 to be tested is electrified, and light emitted by the laser chip 2 to be tested is gathered after passing through the condensing lens 17, so that the divergence leg of the light beam is reduced; and S5, carrying out optical performance test after the light receiving assembly receives the gathered light beam. In this embodiment, the test stage 1 is used to carry and power up the laser chip 2 to be tested, so as to implement performance tests under different conditions. The light receiving assemblies are used for matching with different light receiving assemblies to carry out accurate optical performance test; the matching can drive the motor assembly, and the automatic calibration of the working position is realized. The condensing lens 17 is used for converting the light path of the light emitted by the laser chip 2 to be tested, so as to play a role in condensing the light beam and improve the accuracy of optical performance test; and the software can automatically calibrate the working position of the condenser lens 17 by matching with the driving motor. The guide system is used for adjusting the chip to be tested to the optimal position according to the difference of the chip size and the light-emitting position, so as to realize accurate optical performance test; the matching can drive the motor, can carry out the automatic adjustment of operating position through input chip information, reduces the debugging time. Specifically, the laser chip 2 to be tested, the condensing lens 17 and the light receiving component are on the same horizontal plane. After the laser chip 2 to be tested is placed on the test stage 1, the test stage 1 is provided with a test stage temperature control plate 31, the temperature can be adjusted, and the test stage is also provided with a test stage negative pressure air path 32, so that the laser chip to be tested can be adsorbed after the laser chip to be tested is positioned. The guiding system pushes the laser chip 2 to be tested from multiple angles, preferably, referring to fig. 1, in a top view, four directions including front, back, left and right can be defined, the front is blocked and positioned by the guiding baffle 4, therefore, only the left, right and back directions need to be adjusted, and the guiding baffle 4 is fixed through the fixing screws of the guiding baffle. The left direction and the right direction are the X direction, the Y direction is adjusted in a rear mode, so that the X-direction guiding push plate firstly conducts X-direction guiding on the laser chip to be detected based on the preset chip size, and a light emitting area of the chip is aligned to the center of the condensing lens; the Y-direction guiding push plate guides the laser chip to be tested in a Y-direction so that the light emergent cavity surface of the chip is tightly flush with the guiding baffle; at this time, the light emitting area of the chip is precisely aligned with the condensing lens. For convenience of description, a left guide push plate 5, a right guide push plate 9 and a rear guide push plate 13 may be defined to respectively push the laser chip 2 to be tested from three directions, and each guide push plate does not move backwards after being pushed in place, so that the laser chip 2 to be tested is accurately clamped and controlled at a position to be tested by matching with the guide baffle 4 from three directions. For automatic adjustment, a driving mechanism may be configured for these push plates, which may be defined as a left guide push plate buffer spring 6, a left guide push plate X-direction moving guide 7, a left guide push plate X-direction driving motor 8, a right guide push plate buffer spring 10, a right guide push plate X-direction moving guide 11, a right guide push plate X-direction driving motor 12, a back guide push plate buffer spring 14, a back guide push plate Y-direction moving guide 15, a back guide push plate Y-direction driving motor 16, a right guide push plate Z-direction driving motor 43, and a right guide push plate Z-direction moving guide 44, where each guide push plate is configured with a buffer spring, and the spring force is adjustable, so as to avoid damage to the chip during chip guide, for example, the right guide push plate spring may be adjusted by a right guide push plate spring adjusting screw 45. After the alignment is finished, the test probe is pressed down to the positive electrode of the laser chip to be tested and is powered on, and the electrical performance and the optical performance are tested. When the optical performance is tested, light emitted by the laser chip to be tested is collected after passing through the condenser lens, so that the divergence angle of the light beam is reduced. And after receiving the collected light beam, the plane light-receiving photodiode assembly, the integrating sphere, the optical fiber collimator, the bare optical fiber and other assemblies in the light-receiving assembly perform optical performance tests, such as optical power, optical spectrum and the like.

As an optimized scheme of the embodiment of the present invention, please refer to fig. 1 to 9, when the laser chip to be tested, the light receiving component and the condensing lens are arranged, a light reflecting mirror 41 is further arranged, so that when an optical performance is tested, light emitted by the laser chip to be tested first passes through the light emitting mirror 41, then is reflected by the light emitting mirror 41 and then enters the condensing lens 17 for being condensed. In this embodiment, in order to avoid the influence of the light collecting part reflecting light back to the laser chip and enhance the test accuracy, a light reflecting mirror 41 may be provided. Specifically, the laser chip to be tested, the condensing lens and the light receiving assembly are on the same horizontal plane. After a laser chip to be tested is placed on a test carrier, a guiding system pushes the laser chip to be tested from multiple angles, preferably, referring to fig. 1, in a top view angle, four directions including front, back, left and right can be defined, and the front is blocked and positioned by a guiding baffle plate, so that only the left, right and back three directions need to be adjusted, namely the left and right directions are the adjustment X direction, and the rear is the adjustment Y direction, so that the guiding push plate in the X direction can firstly perform X-direction guiding on the laser chip to be tested based on the preset chip size, and a light emitting area of the chip is aligned to the center of a condensing lens; the Y-direction guiding push plate is used for carrying out Y-direction guiding on the laser chip to be tested, so that the light emergent cavity surface of the chip is tightly flush with the guiding baffle; at this time, the light emitting area of the chip is precisely aligned with the condensing lens. For convenience of description, a left guide push plate, a right guide push plate and a rear guide push plate can be defined, and for automatic adjustment, driving mechanisms can be configured for the left guide push plate, the left guide push plate can be defined as a left guide push plate buffer spring, a left guide push plate X-direction moving guide rail, a left guide push plate X-direction driving motor, a right guide push plate buffer spring, a right guide push plate X-direction moving guide rail, a right guide push plate X-direction driving motor, a rear guide push plate buffer spring, a rear guide push plate Y-direction moving guide rail and a rear guide push plate Y-direction driving motor, wherein each guide push plate is configured with a buffer spring, the spring force is adjustable, and damage to a chip during chip guide can be avoided. After the alignment is finished, the test probe is pressed down to the positive electrode of the laser chip to be tested and is powered on, and the electrical performance and the optical performance are tested. During optical performance testing, a light beam 36 emitted by a laser chip to be tested firstly passes through the light reflector 41, a light beam 42 reflected by the light reflector 41 enters the condensing lens for condensing, and finally, a light receiving component receives the light beam 37 condensed by the condensing lens for optical performance testing. Preferably, the mirror 41 is also provided with a mirror X-direction drive motor 38, a mirror Z-direction drive motor 39, and a mirror Z-direction movement guide 40.

As an optimization scheme of the embodiment of the present invention, please refer to fig. 1 to 9, before performing pilot, the pilot system first passes through setting of a working position, the pilot system includes a pilot baffle and a pilot push plate, and the setting mode specifically includes: inputting the size parameters of the laser chip to be tested into an upper computer, and then inputting the gram weight value for calibrating the height of the guiding push plate; taking a lens center mark of a monitoring camera right above the test loading platform as a reference, and calculating a horizontal working position and a working original point position of the guide push plate by the upper computer based on the size parameters input into the upper computer; then, calibrating the position of the working height of the guide system, wherein the guide push plate moves downwards in a small-motion step-by-step manner along the vertical direction from an initial point, the grammage meter of the guide push plate performs grammage detection in the whole process, the numerical value of the grammage meter of the guide push plate starts to change after the guide push plate contacts the test carrier, when the detected numerical value exceeds a set numerical value, the guide push plate stops moving in the vertical direction, the upper computer records the position in the vertical direction as the vertical working position of the guide push plate, and automatically calculates the working origin position in the vertical direction; and finally, automatically setting the working position of the pilot system. In the embodiment, for full-automatic setting adjustment, an upper computer and a driving mechanism can be introduced, and the upper computer and the driving mechanism are linked to realize automatic setting of the working position of the guide push plate. Specifically, an upper computer program is preset, and for example, a 'one-key setting guiding push plate position' is established on the upper computer. Inputting the size parameters of the laser chip to be tested into the upper computer program parameter information frame, including the length, width, height and light emitting area position (distance from the left end of the chip) of the laser chip to be tested, and inputting the gram weight value for calibrating the height of the guiding push plate. After clicking 'one key in the upper computer program to set the position of the guiding push plate', the guiding system takes the central mark of the lens as the reference, and based on the input position information of the length, the width and the luminous zone of the chip, the program software can automatically calculate the horizontal working position and the working origin position of the three-way guiding push plate (the working origin is compensated and set based on the working position). Then the guiding system performs position calibration of the working height, each guiding push plate moves downwards in a small movement step along the vertical direction from the initial point, and the guiding push plate grammage meter performs grammage detection in the whole process, for example, the right guiding push plate grammage detection system 46. When the guiding push plate contacts the carrier platform, the grammer value of the guiding push plate starts to change, when the detected value exceeds the set value, the guiding push plate drives the click to stop the movement in the vertical direction, the program automatically records the position in the vertical direction as the vertical working position of the guiding push plate, and the working origin position in the vertical direction is automatically calculated. And finally, automatically setting the working position of the pilot system. Preferably, the monitoring camera may be a CCD lens, which is disposed directly above the test stage 1 in a top view in fig. 1, is located in a top view state, and is located in a center, each lens has a center mark, and all of the lenses may be based on the center mark, and the monitoring camera is not shown in fig. 1.

As an optimized solution of the embodiment of the present invention, please refer to fig. 1 to 9, before the condenser lens is arranged, the setting is implemented by using an induction detection plate through setting the working position, and the manner of setting the working position of the condenser lens by using the induction detection plate specifically includes: continuously applying bias current to a positive electrode of the laser chip to be detected, and moving the induction detection plate to a light-emitting position of the laser chip to be detected; when the laser chip to be detected shines on the induction detection plate, a point (X, Z) with the highest light intensity/heat quantity exists, and then the coordinate is compared with the origin coordinates (0, 0) of the induction detection plate in position, so that the distance difference between the X direction and the Z direction is calculated; then, according to the distance difference, moving a central coordinate point (0, 0) of the induction detection plate to a point (X, Z) with the highest light intensity/heat so as to finish the position calibration of the induction detection plate, and storing the position (X1, Z1) of the induction detection plate after moving into an upper computer; the condensing lens and the induction detection plate share the same coordinates in the directions from 1 to 9 and the Z direction, and the difference between the X direction and the Z direction is fixed X2, so that the working position of the condensing lens is calculated to be (X1-X2, Z1) from the working position of the induction detection plate, and the working position of the condensing lens is automatically stored in the program parameters to finish the automatic correction of the working position of the condensing lens. In the embodiment, for full-automatic setting adjustment, an upper computer and a driving mechanism can be introduced, and the upper computer and the driving mechanism are linked to realize automatic setting of the working position of the guide push plate. The driving mechanism can comprise a condensing lens X-direction driving motor 33, a condensing lens Z-direction driving motor 34, a condensing lens Z-direction moving guide rail 35 and a condensing lens X-direction moving guide rail 47, power is given through the driving mechanism, the position adjustment of the condensing lens is achieved, and the driving mechanism and the condensing lens X-direction moving guide rail all receive instructions of an upper computer. Similarly, the sensing board is also provided with a driving mechanism, specifically including a sensing board Z-direction driving motor 48 and a sensing board Z-direction movement guide 49. Specifically, after "a key in the upper computer program is clicked to set the position of the condensing lens", the test probe 3 automatically falls on the forward electrode of the laser chip 2 to be tested to continuously apply a bias current, and the sensing probe plate 18 moves to the position where the laser chip 2 to be tested emits light. After the light irradiates on the induction detection plate 18, a point (X, Z) with the highest light intensity/heat is provided, and then the coordinate is compared with the origin coordinate (0, 0) of the induction detection plate 18 to calculate the distance difference between the X direction and the Z direction. Then, the central coordinate (0, 0) point of the sensing board 18 is moved to the point (X, Z) with the highest light intensity/heat by the driving mechanism of the light receiving component, so as to complete the position automatic calibration of the sensing board 18, and the working position parameters (X1, Z1) are automatically stored in the program parameters. The working position (X1-X2, Z1) of the condenser lens 17 automatically stores the working position of the condenser lens 17 in the program parameters, and the automatic correction of the working position of the condenser lens 17 is completed. (the leftward movement is defined as a negative direction, so that the abscissa of the working position of the condenser lens is X1-X2).

As an optimized solution of the embodiment of the present invention, please refer to fig. 1 to 9, before the light receiving assemblies are arranged, the setting is implemented by using an induction detection plate through setting the working position, and the manner of setting the working position of the light receiving assembly by using the induction detection plate specifically includes: continuously applying bias current to a positive electrode of the laser chip to be detected, and moving the induction detection plate to a light-emitting position of the laser chip to be detected; when light emitted by the laser chip to be detected irradiates the induction detection plate, a point (X, Z) with the highest light intensity/heat exists, and then the coordinate is compared with the original point coordinate (0, 0) of the induction detection plate in position, so that the distance difference between the X direction and the Z direction is calculated; then, according to the distance difference, moving a central coordinate point (0, 0) of the induction detection plate to a point (X, Z) with the highest light intensity/heat so as to finish the position calibration of the induction detection plate, and storing the position (X1, Z1) of the induction detection plate after moving into an upper computer; the light receiving component and the induction detection plate share the same coordinates in the directions from 1 to 9 and the Z direction, and the difference between the X direction and the Z direction is fixed X2, so that the working position of the light receiving component is calculated to be (X1-X2, Z1) from the working position of the induction detection plate, and the working position of the light receiving component is automatically stored in program parameters to finish the automatic correction of the working position of the light receiving component. In this embodiment, the working position of the light receiving element (the planar light receiving photodiode element, the integrating sphere, the fiber collimator, the bare fiber, etc.) is set according to the same principle as the working position of the condensing lens, and the working position of the light receiving element is automatically set by the X/Z direction working position program of the condensing lens. The X-direction distance between the light receiving components is fixed, so that the working position of each light receiving component can be automatically set by a program.

The embodiment of the invention provides an accurate testing system of a side-emitting semiconductor laser, which comprises a testing microscope carrier 1, a guiding system, a condensing lens 17, a testing probe 3 and a light receiving assembly, wherein the testing microscope carrier 1 is used for arranging a laser chip 2 to be tested, the guiding system is used for pushing the laser chip 2 to be tested from multiple angles to adjust the position of the laser chip 2 to be tested on the testing microscope carrier 1, the condensing lens 17 is used for condensing light emitted by the laser chip 2 to be tested, the testing probe 3 is used for electrifying the laser chip 2 to be tested, and the light receiving assembly is used for receiving light beams condensed by the condensing lens 17 and testing the optical performance. The light receiving assembly comprises a plane light receiving photodiode assembly, an integrating sphere, an optical fiber collimator and a bare optical fiber. In this embodiment, the test stage 1 is used to carry and power up the laser chip 2 to be tested, so as to implement performance tests under different conditions. The light receiving assemblies are used for matching with different light receiving assemblies to carry out accurate optical performance test; the matching can drive the motor assembly, and the automatic calibration of the working position is realized. The condensing lens 17 is used for converting the light path of the light emitted by the laser chip 2 to be tested, so as to play a role in condensing the light beam and improve the accuracy of optical performance test; and the software can automatically calibrate the working position of the condenser lens 17 by matching with the driving motor. The guide system is used for adjusting the chip to be tested to the optimal position according to the difference of the chip size and the light-emitting position, so as to realize accurate optical performance test; the matching can drive the motor, can carry out the automatic adjustment of operating position through input chip information, reduces the debugging time. Specifically, the laser chip 2 to be tested, the condensing lens 17 and the light receiving component are on the same horizontal plane. After a laser chip 2 to be tested is placed on a test carrier 1, a guiding system pushes the laser chip 2 to be tested from multiple angles, preferably, referring to fig. 1, in a top view angle, four directions including front, back, left and right can be defined, and the front is blocked and positioned by a guiding baffle 4, so that only the left, right and back three directions need to be adjusted, the left and right two directions are the X direction and the rear is the Y direction, so that the X-direction guiding push plate firstly conducts X-direction guiding on the laser chip to be tested based on a preset chip size, and a light emitting area of the chip is aligned with the center of a condensing lens; the Y-direction guiding push plate guides the laser chip to be tested in a Y-direction so that the light emergent cavity surface of the chip is tightly flush with the guiding baffle; at this time, the light emitting area of the chip is precisely aligned with the condensing lens. For convenience of description, a left guide push plate 5, a right guide push plate 9 and a rear guide push plate 13 can be defined, the laser chip 2 to be tested is respectively pushed from three directions, and each guide push plate does not move backwards after being pushed in place, so that the laser chip 2 to be tested is accurately clamped and controlled on a position to be tested by matching with the guide baffle 4 from three directions. For automatic adjustment, a driving mechanism may be configured for these push plates, which may be defined as a left guide push plate buffer spring 6, a left guide push plate X-direction moving guide 7, a left guide push plate X-direction driving motor 8, a right guide push plate buffer spring 10, a right guide push plate X-direction moving guide 11, a right guide push plate X-direction driving motor 12, a back guide push plate buffer spring 14, a back guide push plate Y-direction moving guide 15, a back guide push plate Y-direction driving motor 16, a right guide push plate Z-direction driving motor 43, and a right guide push plate Z-direction moving guide 44, where each guide push plate is configured with a buffer spring, and the spring force is adjustable, so as to avoid damage to the chip during chip guide, for example, the right guide push plate spring may be adjusted by a right guide push plate spring adjusting screw 45. After the alignment is finished, the test probe is pressed down to the positive electrode of the laser chip to be tested and is powered on, and the electrical performance and the optical performance are tested. When the optical performance is tested, light emitted by the laser chip to be tested is collected after passing through the condenser lens, so that the divergence angle of the light beam is reduced. The optical performance test is performed after the components such as the plane light-receiving photodiode 19, the integrating sphere 20, the optical fiber collimator 21, the bare optical fiber and the like in the light-receiving component receive the collected light beams, such as the optical power, the optical spectrum and the like. Preferably, the transceiver module is also equipped with a driving mechanism, which specifically includes an X-direction motion guide rail 22, an X-direction driving motor 23, a planar light-receiving photodiode Z-direction driving motor 24, a planar light-receiving photodiode Z-direction motion guide rail 25, an integrating sphere Z-direction driving motor 26, an integrating sphere Z-direction motion guide rail 27, an optical fiber collimator Z-direction driving motor 28, and an optical fiber collimator Z-direction motion guide rail 29.

To this end, the object of the above embodiment is:

firstly, the guiding part adopts a three-way independent push plate with a spring buffer, and the guiding structure of the light-emitting surface of the laser chip adopts a thin baffle design. The three-way push plate is independently provided with a buffer spring, so that the damage to a laser chip when the push plate moves can be avoided; the three-way independent push plate works in a mode of pushing right, then pushing left and finally pushing up, and each push plate does not move backwards when moving to a working position any more, so that the three-way push plate and the thin baffle plate accurately clamp and control the laser chip on a position to be measured, the guiding precision is high, and material throwing is avoided; each push plate movement point position of the guide system is controlled by an upper computer program, and the setting of the push plate movement point position is automatically calculated by the program only by inputting the size of the laser chip to be tested, the position of a light-emitting point and the height calibration gram weight value of the guide plate, so that the debugging time when products are switched is greatly reduced; the light-emitting surface thin baffle is fixed on the base below the carrier through fastening screws, the height of the light-emitting surface thin baffle is adjustable, the height of the upper edge of the baffle is generally set to be 30 micrometers, the baffle can play a role in clamping and controlling a conventional edge-emitting semiconductor laser chip, a light-emitting point of the laser chip cannot be blocked, the height of the baffle is not limited to be 30 micrometers, and the baffle can be adjusted according to different products. And the three-way guide push plate is made of non-conductive rubber with soft texture, so that the damage of the push plate to the chip is directly avoided, and the influence on the test result caused by the short circuit of the cavity surface of the chip due to the conduction of the push plate is avoided.

And secondly, a condensing lens is added between the semiconductor laser chip to be tested and a light receiving component (a plane light receiving photodiode component, an integrating sphere, an optical fiber collimator, a bare optical fiber and the like) in the optical performance testing part. The lens can gather light beams emitted by the laser chip, so that a subsequent light receiving component can receive more complete light, and due to the existence of the thin baffle plate, the lens can be adjusted to a position very close to the light emitting end of the laser chip, can be compatible with optical performance tests of edge-emitting semiconductor lasers with different divergence angles, and can greatly improve the test accuracy; in addition, due to the existence of the condensing lens, the rear end can be adapted to various types and specifications of light receiving assemblies, the test system is not limited to the light receiving assemblies, and the test system can realize the diversification of optical performance tests; in addition, due to the light condensation effect of the lens, the position adjustment range of the light receiving assembly arranged at the rear end is wider, the matching and the use are more flexible, the light receiving assembly can be adjusted to the optimal light receiving position more accurately, and the test accuracy is improved; finally, the design idea of light beam adjustment is not limited to a laser chip to a condenser lens and then to a linear layout of a light collecting component, the original condenser lens can also be designed into a light reflecting plate with an angle of 45 degrees, the condenser lens and the light collecting component are assembled above the vertical reflecting plate, the design can directly eliminate the influence of the light collecting part on reflecting the light to the laser chip, and the test accuracy is enhanced.

Finally, the condenser lens component of the optical performance testing part is provided with an induction detecting plate, the center of the induction detecting plate and the center of the condenser lens are assembled on the same horizontal height, and the working principle is as follows: the inside coordinate sign that has of response detecting plate, the light that the laser instrument chip sent can be received to the response detecting plate, and the highest coordinate point of light intensity/heat is inducted out, then move the initial point of coordinates that the detecting plate predetermines to this point, condensing lens and response detecting plate are in same height and the transverse distance of the two is fixed this moment, the host computer program can be fed back to the best working coordinate position of response detecting plate automatic identification so, the host computer program can accurate mark condensing lens's best operating position after the conversion, rear end receives optical assembly position and can also pass through host computer program automatic setting to best operating position. The design can improve the light receiving precision, greatly increase the accuracy of optical performance test, and shorten the debugging time after switching products.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An accurate test method for an edge-emitting semiconductor laser is characterized by comprising the following steps:

2. The method for accurately testing an edge-emitting semiconductor laser as claimed in claim 1, wherein: when the laser chip to be tested, the light receiving assembly and the condensing lens are arranged, the light reflecting mirror is also arranged, so that when the optical performance is tested, light emitted by the laser chip to be tested firstly passes through the light emitting mirror, then is reflected by the light emitting mirror and then enters the condensing lens for condensing.

3. The method for accurately testing an edge-emitting semiconductor laser according to claim 1, wherein the pilot system is set to a working position before conducting pilot, the pilot system comprises a pilot baffle and a pilot push plate, and the setting mode is specifically as follows:

and finally, automatically setting the working position of the pilot system.

4. The method for accurately testing an edge-emitting semiconductor laser as claimed in claim 1, wherein the condensing lens is set by an induction probe plate after being set to the working position before being arranged, and the method for setting the working position of the condensing lens by the induction probe plate is specifically as follows:

the condensing lens and the induction detection plate share the same Y-direction coordinate and the same Z-direction coordinate, and the difference between the X-direction coordinate and the Z-direction coordinate is fixed X2, so that the working position of the condensing lens is calculated to be (X1-X2, Z1) from the working position of the induction detection plate, and the working position of the condensing lens is automatically stored in program parameters to finish the automatic correction of the working position of the condensing lens.

5. The method for accurately testing an edge-emitting semiconductor laser according to claim 1, wherein the light-receiving module is set by an induction probe plate after being set to the operating position before being arranged, and the method for setting the operating position of the light-receiving module by the induction probe plate is specifically as follows:

when light emitted by the laser chip to be detected irradiates the induction detection plate, a point (X, Z) with the highest light intensity/heat exists, and then the coordinate is compared with the original point coordinate (0, 0) of the induction detection plate in position, so that the distance difference between the X direction and the Z direction is calculated; then, according to the distance difference, moving a central coordinate point (0, 0) of the induction detection plate to a point (X, Z) with the highest light intensity/heat so as to finish the position calibration of the induction detection plate, and storing the position (X1, Z1) of the moved induction detection plate in an upper computer;

the light receiving component and the sensing detection plate share the same Y-direction coordinate and the same Z-direction coordinate, and the difference between the X-direction coordinate and the Z-direction coordinate is fixed X2, so that the working position of the light receiving component is calculated to be (X1-X2, Z1) from the working position of the sensing detection plate, and the working position of the light receiving component is automatically stored into program parameters to finish the automatic correction of the working position of the light receiving component.

6. The method for accurately testing an edge-emitting semiconductor laser as claimed in claim 1, wherein: the guide system comprises a plurality of guide push plates which are used for pushing the laser chip to be tested from multiple angles respectively so as to adjust the position of the laser chip to be tested on the test platform deck.

7. The method for accurately testing an edge-emitting semiconductor laser as claimed in claim 6, wherein: leading the system and still just including leading positive baffle, it has threely, three to lead positive push pedal independent work, and promotes from three direction respectively the laser instrument chip that awaits measuring, every lead the push pedal and promote just no longer the backward movement after targetting in place to follow the cooperation of three direction lead positive baffle will the laser instrument chip that awaits measuring card accurately controls on the position that awaits measuring.

8. The method for accurately testing an edge-emitting semiconductor laser as claimed in claim 1, wherein: and in the process of setting the position of the guide system, setting the position of the condensing lens and setting the position of the light collecting assembly, a driving mechanism is adopted to be matched with an upper computer to complete automatic setting.

9. The utility model provides an accurate test system of limit emission semiconductor laser which characterized in that: comprises a test carrier, a guide system, a condenser lens, a test probe and a light receiving component,

the test stage is used for arranging a laser chip to be tested,

the test probe is used for electrifying the laser chip to be tested,

10. The edge-emitting semiconductor laser precision test system of claim 9, wherein: the light receiving assembly comprises a plane light receiving photodiode, an integrating sphere, an optical fiber collimator and a bare optical fiber.