CN115643816A - 一种载板以及转移装置 - Google Patents
一种载板以及转移装置 Download PDFInfo
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- CN115643816A CN115643816A CN202180001170.XA CN202180001170A CN115643816A CN 115643816 A CN115643816 A CN 115643816A CN 202180001170 A CN202180001170 A CN 202180001170A CN 115643816 A CN115643816 A CN 115643816A
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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Abstract
本申请实施例提供了一种载板以及一种转移装置，所述载板具体包括依次设置的中载基板、解离调节结构以及解离胶层，所述解离调节结构被配置为调节所述解离胶层的解离精度，所述解离胶层被配置为与多个发光二极管芯片连接。所述载板可以提高所述发光二极管芯片的良率和解离精度，从而，可以提高所述发光二极管芯片在进行巨量转移过程中的良率和巨量转移的效率。
Description
PCT国内申请，说明书已公开。
Claims (22)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2021/094195 WO2022241626A1 (zh) | 2021-05-17 | 2021-05-17 | 一种载板以及转移装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115643816A true CN115643816A (zh) | 2023-01-24 |
Family
ID=84141011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180001170.XA Pending CN115643816A (zh) | 2021-05-17 | 2021-05-17 | 一种载板以及转移装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20240047250A1 (zh) |
| CN (1) | CN115643816A (zh) |
| WO (1) | WO2022241626A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115881862A (zh) * | 2023-02-16 | 2023-03-31 | 江西兆驰半导体有限公司 | 一种mini LED芯片减薄方法及mini LED |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107331644A (zh) * | 2016-04-29 | 2017-11-07 | 上海微电子装备（集团）股份有限公司 | 一种晶圆临时键合方法 |
| CN112289908B (zh) * | 2020-09-11 | 2022-08-02 | 罗化芯显示科技开发(江苏)有限公司 | 一种mini-LED芯片巨量转移的方法 |
| CN112310252B (zh) * | 2020-10-16 | 2022-02-22 | 深圳市华星光电半导体显示技术有限公司 | Micro LED晶粒、Micro LED基板及其制备方法 |
-
2021
- 2021-05-17 CN CN202180001170.XA patent/CN115643816A/zh active Pending
- 2021-05-17 US US17/760,982 patent/US20240047250A1/en active Pending
- 2021-05-17 WO PCT/CN2021/094195 patent/WO2022241626A1/zh active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| US20240047250A1 (en) | 2024-02-08 |
| WO2022241626A1 (zh) | 2022-11-24 |
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