CN115616260A - Thin film probe card assembly - Google Patents
Thin film probe card assembly Download PDFInfo
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- CN115616260A CN115616260A CN202211174413.2A CN202211174413A CN115616260A CN 115616260 A CN115616260 A CN 115616260A CN 202211174413 A CN202211174413 A CN 202211174413A CN 115616260 A CN115616260 A CN 115616260A
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- probe card
- card assembly
- thin film
- cantilever structure
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- 239000000523 sample Substances 0.000 title claims abstract description 98
- 239000010409 thin film Substances 0.000 title claims description 22
- 239000000463 material Substances 0.000 claims abstract description 20
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 5
- 239000010408 film Substances 0.000 claims description 20
- 239000012528 membrane Substances 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 229920006324 polyoxymethylene Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 2
- -1 polyoxymethylene Polymers 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
Abstract
The embodiment of the specification provides a film probe card assembly, including the probe, film and welt, the probe includes support piece, the first face of film is fixed in support piece, a plurality of filling holes have been seted up to the second face of film, it has flexible material to fill in the filling hole, the welt welds in the second face of film, be equipped with the filling hole correspond quantity via the cantilever structure of cutting formation, cantilever structure's free end is located the vertical projection region in filling hole, cantilever structure's free end is carried on the back in the welding of the one side in filling hole has the probe, the probe is used for forming mechanical contact and electrical contact with the wafer that awaits measuring. Through the cooperation of the cantilever structure and the flexible material in the filling hole, when the probe slides to puncture the oxide layer, the sliding direction and the sliding distance of the probe are controllable, and appropriate pressure is provided to ensure that the oxide layer is effectively punctured to form stable and effective contact.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a thin film probe card assembly.
Background
When testing unpackaged chips on a semiconductor wafer, a probe card is generally used to perform a testing process, and as semiconductor chips are miniaturized and integrated, the operating frequency of the chips is increasing, and high-frequency wafer-level testing is mostly performed by using a thin film probe card. When the film probe card is tested, the probe tip slides to puncture a natural oxide layer of a chip test pad to form contact with a test point position, so that when the probe performs sliding action, the sliding direction and the puncturing force need to be reliable, damage to a chip or poor contact is avoided, pressure enough for puncturing the oxide layer needs to be provided, appropriate strength and flexibility are needed, and effective contact can be guaranteed while the sliding direction is controlled.
Disclosure of Invention
In view of this, embodiments of the present disclosure provide a thin film probe card assembly, which can ensure that a probe tip slides properly during testing, and the sliding direction is controllable, and can also provide proper pressure to ensure that an oxide layer is effectively punctured to form a stable and effective contact.
The embodiment of the specification provides the following technical scheme:
a thin film probe card assembly comprising:
a probe head comprising a support;
the first surface of the thin film is fixed on the supporting piece, the second surface of the thin film is provided with a plurality of filling holes, and flexible materials are filled in the filling holes;
the welt, the welt weld in the second face of film, be equipped with the cantilever structure that the corresponding quantity of filling hole formed via the cutting, cantilever structure's free end is located in the vertical projection area of filling hole, cantilever structure's free end carry on the back in the one side welding of filling hole has the probe, the probe is used for forming mechanical contact and electrical contact with the wafer that awaits measuring.
In the above scheme, a plurality of cantilever structures are formed by cutting the backing plate, the probes are welded to the free ends of the cantilever structures, and the free ends of the cantilever structures abut against the filling holes filled with the flexible material on the opposite sides of the welding positions of the probes. When in test, the probe is limited by the cantilever structure, is pushed by a test point position on the chip and moves upwards along the swing path of the cantilever structure, the cantilever structure has enough strength to limit the swing path of the free end of the cantilever structure, so that the probe is prevented from deflection or torsion in the horizontal direction, the swing action slides in the horizontal direction, an oxide layer is punctured, and mechanical contact and electrical contact with the point position to be tested are formed; the free end can be subjected to the reaction force provided by the flexible material after swinging upwards, so that the swinging position is limited, the proper contact force is provided, and effective contact is ensured.
The invention also provides a scheme that the adjacent cantilever structures are parallel or vertical to each other;
and/or the shape and size of the adjacent cantilever structures are the same.
The invention also provides a scheme that the cantilever structure is C-shaped or U-shaped.
The invention also provides a scheme, wherein the cantilever structure comprises a first straight line section, an arc section and a second straight line section, the first straight line section is parallel to the second straight line section, and the arc section is an arc with the radius of 1-3 mm.
The invention also provides a scheme, wherein the lengths of the first straight line section and the second straight line section are the same and are both 2-4 mm.
The invention also provides a scheme that the filling hole comprises a conical hole and a cylindrical hole.
The invention also provides a scheme that the diameter of the circle of the filling hole facing to the free end side of the cantilever structure is 0.5-2 mm.
The invention also provides a scheme that the flexible material comprises polyimide, polyformaldehyde resin, polyurethane, nylon and a combination thereof.
The invention also provides a scheme that the filling hole penetrates through the thin film.
The invention also provides a scheme, the probe head further comprises a flexible layer, the first surface of the flexible layer is fixedly connected with the supporting piece, and the second surface of the flexible layer is fixedly connected with the first surface of the thin film.
Compared with the prior art, the beneficial effects that can be achieved by the at least one technical scheme adopted by the embodiment of the specification at least comprise: according to the film probe card assembly, the cantilever structure is matched with the flexible material, so that the deformation direction of the probe is restrained on the premise of ensuring the flexibility of the probe, and the contact stability of the probe is improved; the cantilever structure provides enough strength, so that the probe is prevented from deflecting or twisting in the horizontal direction, the probe is kept stable when sliding in the process of puncturing an oxide layer, and the sliding direction and the sliding distance of the probe are controllable; by adjusting the material combination or proportion of the flexible material in the filling hole, proper flexibility and supporting strength in the vertical direction are provided, and the probe is ensured to be stably and effectively contacted with a test point; the structural design of the film and the lining plate can also improve the durability of the probe card and prolong the service life.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic side cross-sectional view of a membrane probe card assembly in one embodiment of the invention;
FIG. 2 is a schematic side cross-sectional view of a membrane probe card assembly in a probe head position in accordance with one embodiment of the invention;
FIG. 3 is an enlarged cross-sectional side view of the location of the backing plate and probe in one embodiment of the invention;
FIG. 4 is a schematic top view of a liner in an embodiment of the invention;
FIG. 5 is a schematic bottom view of the liner plate and fill hole combination in one embodiment of the invention;
wherein, 1, PCB board, 2, mounting rack, 31, third fastening screw, 32, second fastening screw, 4, ZIF connector, 5, probe head, 511, adjusting board, 512, support piece, 52, backboard, 53, film, 54, probe, 55, a cementing layer, 56, a flexible layer, 561, a first fastening screw, 571, a filling hole, 572, a lining plate, 573, a cantilever structure, 574, a first straight line segment, 575, an arc segment, 576, a second straight line segment, 58 and a partition plate.
Detailed Description
Embodiments of the present application are described in detail below with reference to the accompanying drawings.
The following description of the embodiments of the present application is provided by way of specific examples, and other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure herein. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. The present application is capable of other and different embodiments and its several details are capable of modifications and/or changes in various respects, all without departing from the spirit of the present application. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It is noted that various aspects of the embodiments are described below within the scope of the appended claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present application, one skilled in the art should appreciate that one aspect described herein may be implemented independently of any other aspects and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number and aspects set forth herein. Additionally, such an apparatus may be implemented and/or such a method may be practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present application, and the drawings only show the components related to the present application rather than the number, shape and size of the components in actual implementation, and the type, amount and ratio of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
In the description of the present specification, it should be understood that the terms "upper", "lower", "inner", "outer" and the like as used in the exemplary embodiments of the present specification, and the terms "first", "second", "third" and the like are used in the angles shown in the drawings, and should not be construed as limiting the exemplary embodiments of the present specification.
Currently, the communication industry and the consumer electronics industry develop rapidly, the market puts higher requirements on the related performance of semiconductor products, and the development process of miniaturization and integration of semiconductor devices is greatly promoted. Among them, in the production process of Radio Frequency (RF) chips, especially high frequency RF chips, functional testing is one of the important processes in chip manufacturing. When testing unpackaged chips on a semiconductor wafer, a film probe card is mostly adopted, transmission lines of test signals are arranged on an elastic film in an array mode or a multi-array mode, the generation of parasitic capacitance and parasitic inductance is reduced, a signal path is shortened, the impedance matching degree is improved, and the method has the advantages of low crosstalk, high reliability, small damage to the chips and the like, and is widely applied to wafer level high-frequency test and analysis.
When the thin film probe card is tested, when a probe at the tail end of the probe card contacts the surface of a chip, the probe slides under the thrust of the surface and punctures a natural oxidation layer on the surface of the chip to contact with metal in the chip, so that the following problems need to be solved when the probe card is designed: the probe tip of the probe needs to provide certain pressure to puncture the natural oxide layer of the chip test bonding pad; the probe needs sufficient stability when piercing the oxide layer to ensure the sliding path and direction; the probe head needs to have certain flexibility so as to ensure that all probes can be contacted with the chip test bonding pad; the substrate on which the probes are mounted needs to have sufficient strength to reduce contact failures due to deformation caused by reaction forces on the probes during testing.
In order to solve the above problems, the inventors have improved a bonding pad and a membrane mechanism of a probe, and have proposed a membrane probe card assembly. Firstly, arranging a plurality of cutting grooves on a lining plate, so that each cutting groove can form a cantilever structure, and welding a probe on one surface of the cantilever structure facing to a chip to be tested; secondly, the film is connected to the one side of welt back to the chip that awaits measuring, the filling hole is seted up to the position that corresponds cantilever structure's free end on the film, it has flexible material to fill therein, through such structural design, when the test, cantilever structure can control the ascending swing direction of probe, prevent that the probe from taking place beat or torsion when the swing, cantilever structure receives flexible material's counter force in the filling hole after the upwards swing, thereby make the slip direction and the sliding distance of probe when the slippage on oxide layer surface controllable, and can make probe and chip form effectual contact through flexible material's elastic force.
The technical solutions provided by the embodiments of the present application are described below with reference to the accompanying drawings.
The thin film probe card assembly shown in fig. 1 to 5 includes:
a probe head 5, the probe head 5 comprising a support 512;
the first surface of the film 53 is fixed on the support 512, the second surface of the film 53 is provided with a plurality of filling holes 571, and the filling holes 571 are filled with flexible materials;
the backing plate 572 is welded on the second surface of the film 53, and is provided with a number of cantilever structures 573 formed by cutting corresponding to the filling holes 571, free ends of the cantilever structures 573 are located in the vertical projection area of the filling holes 571, probes 54 are welded on the surfaces of the cantilever structures 573 opposite to the filling holes 571, and the probes 54 are used for forming mechanical contact and electrical contact with a wafer to be tested.
Specifically, the thin film probe card assembly is suitable for signal testing of integrated circuit structures, including but not limited to testing of unpackaged chips on a wafer, and comprises a PCB (printed circuit board) 1, a mounting frame 2, a ZIF (zero interference filter) connector 4 and a probe head 5. The PCB1 is generally a multilayer epoxy resin circuit board, a plurality of ZIF connectors 4 are distributed on the PCB, signal wiring and power wiring are contained inside the PCB, a plurality of electronic components are welded on the surface of the PCB, and the PCB is structurally connected with a testing machine through the ZIF connectors 4 to realize signal transmission. The PCB board 1 is fixed to the mounting bracket 2 by a third fastening screw 31; the central position of the PCB1 is hollowed to form a hollow structure, the second fastening screw 32 sequentially passes through the back plate 52, the adjusting plate 511 and the partition plate 58 to fix the probe head 5 in the hollow structure of the PCB1, and the first fastening screw 561 fixes the back plate 52 to the adjusting plate 511.
The adjusting plate 511 is provided with a support 512 protruding toward the side of the chip to be tested, and the support 512 is made of ABS,4J29, etc. and is adhered to the adjusting plate 511. The supporting member 512 is covered with a film 53, that is, a first surface of the film 53 facing the supporting member 512 is fixedly connected to the supporting member 512, the film 53 is usually made of polyimide, a backing plate 572 is welded to a second surface of the film 53 facing the chip to be tested, the probes 54 are welded to the backing plate 572, a plurality of filling holes 571 are opened on the second surface of the film 53, and the filling holes 571 are filled with flexible materials. A number of deformation grooves corresponding to the filling holes 571 are formed in the backing plate 572 by cutting to form the cantilever structures 573, and the free ends of the cantilever structures 573 are located in the vertical projection area of the filling holes 571. When wafer level test is carried out, each probe contacts the surface of the chip, under the action of thrust, the free end of the cantilever structure 573 swings upwards and enters the filling hole 571, the free end pushes against the surface of the chip reversely and slides under the action of elastic force of the flexible material filled in the filling hole, and the action finishes the sliding and puncturing action of an oxide layer on the surface of the chip and forms mechanical contact and electrical contact with a metal material in the chip.
In the above solution, the cantilever structure 573 can limit the swing direction of the probe 54, prevent the probe from deflecting or twisting during swinging, constrain the deformation direction of the probe, improve the contact stability of the probe, and provide a force for piercing the oxide layer through the flexible material, thereby ensuring effective contact with the chip after piercing.
In some embodiments, as shown in fig. 4 and 5, adjacent cantilever structures 573 are parallel to each other or perpendicular to each other. It should be noted that other angles may be formed between adjacent cantilever structures 573.
In some embodiments, the cantilever structures 573 are the same shape and size as shown in fig. 4 and 5.
In some embodiments, the cantilever structure 573 is C-shaped.
In some embodiments, the cantilever structure 573 is U-shaped, as shown in fig. 4 and 5.
Specifically, the cantilever structure 573 includes a first straight line segment 574, an arc segment 575 and a second straight line segment 576, wherein the first straight line segment 574 is parallel to the second straight line segment 576, and the curve segment 575 is an arc with a radius of 1-3 mm. Preferably, the first and second linear segments 574 and 576 are the same length and both have a length in the range of 2 to 4mm.
It should be noted that the shape of the cantilever structure 573 is not limited to the C-shape or the U-shape in the above embodiments, and may also include other regular shapes or irregular shapes.
In the above solution, the shape and/or the arm length (the distance between the free end and the fixed end of the cantilever structure) of the cantilever structure 573 are adjusted to adjust the deformation force of the probe, so that the probe head structure has wider applicability.
In some embodiments, the shape of the filling hole 571 includes a tapered hole, a cylindrical hole. It should be noted that the tapered holes include a forward tapered hole (the circular radius of the tapered hole on the side facing the lining plate 572 is larger than the circular radius on the side facing the support 512) and a backward tapered hole (the circular radius of the tapered hole on the side facing the lining plate 572 is smaller than the circular radius on the side facing the support 512). Preferably, the filling holes 571 have a circular diameter of 0.5 to 2mm on the side facing the free end of the cantilever structure 573.
In the scheme, the deformation force of the probe is adjusted by adjusting the shape and/or the aperture size of the filling hole, so that the probe head structure has wider applicability.
In some embodiments, the flexible material comprises polyimide, polyoxymethylene resin, polyurethane, nylon, and combinations thereof.
In the scheme, the contact force between the probe and the chip to be tested is adjusted by adjusting the type and/or the proportion of the flexible material, so that the probe head structure has wider applicability.
In some embodiments, fill holes 571 extend through membrane 53.
In some embodiments, the probe head 5 further comprises a flexible layer 56, in particular, a first side of the flexible layer 56 is adhesively fixed to a side of the support 512 facing the probes 54 by a glue layer 55, and a second side of the flexible layer 56 is adhesively fixed to a first side of the film 53. Fine vertical adjustment is achieved by adding a flexible layer 56 between the support member 512 and the membrane 53 and backing plate 572 to enable the probes 54 to make more stable mechanical and electrical contact.
In some embodiments, the first fastening screw 561 penetrates the back plate 52 and the adjusting plate 511 to be screwed to the partition plate 58 in sequence, and the pressing effect of the film 53 and the PCB1 is adjusted by adjusting the first fastening screw 561.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments can be referred to each other, and each embodiment focuses on the differences from the other embodiments.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A thin film probe card assembly, comprising:
a probe head comprising a support;
the first surface of the thin film is fixed on the supporting piece, the second surface of the thin film is provided with a plurality of filling holes, and flexible materials are filled in the filling holes;
the welt, the welt weld in the second face of film, be equipped with the cantilever structure that the corresponding quantity of filling hole formed via the cutting, cantilever structure's free end is located in the vertical projection area of filling hole, cantilever structure's free end carry on the back in the one side welding of filling hole has the probe, the probe is used for forming mechanical contact and electrical contact with the wafer that awaits measuring.
2. The membrane probe card assembly of claim 1, wherein adjacent cantilever structures are parallel or perpendicular to each other;
and/or the shape and size of the adjacent cantilever structures are the same.
3. The thin film probe card assembly of claim 1, wherein the cantilever structure is C-shaped or U-shaped.
4. The thin film probe card assembly of claim 3, wherein the cantilever structure comprises a first straight line segment, a circular arc segment and a second straight line segment, the first straight line segment is parallel to the second straight line segment, and the circular arc segment is a circular arc with a radius of 1-3 mm.
5. The thin film probe card assembly of claim 4, wherein the first straight segment and the second straight segment are the same length and are each 2-4 mm.
6. The thin film probe card assembly of claim 1, wherein the fill hole comprises a tapered hole, a cylindrical hole.
7. The membrane probe card assembly of claim 6, wherein the fill hole has a circular diameter of 0.5-2 mm on a side facing the free end of the cantilever structure.
8. The membrane probe card assembly of claim 1, wherein the flexible material comprises polyimide, polyoxymethylene, polyurethane, nylon, and combinations thereof.
9. The thin film probe card assembly of claim 1, wherein said fill hole penetrates said thin film.
10. The membrane probe card assembly of claim 1, wherein the probe head further comprises a flexible layer, a first side of the flexible layer fixedly attached to the support, and a second side of the flexible layer fixedly attached to the first side of the membrane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211174413.2A CN115616260B (en) | 2022-09-26 | 2022-09-26 | Thin film probe card assembly |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211174413.2A CN115616260B (en) | 2022-09-26 | 2022-09-26 | Thin film probe card assembly |
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| CN115616260A true CN115616260A (en) | 2023-01-17 |
| CN115616260B CN115616260B (en) | 2024-02-23 |
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| US5134365A (en) * | 1989-07-11 | 1992-07-28 | Nihon Denshizairyo Kabushiki Kaisha | Probe card in which contact pressure and relative position of each probe end are correctly maintained |
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| TW202223407A (en) * | 2020-12-09 | 2022-06-16 | 義大利商探針科技公司 | Contact probe for probe heads of electronic devices and corresponding probe head |
| CN114200279A (en) * | 2021-11-29 | 2022-03-18 | 强一半导体（苏州）有限公司 | Film probe card and probe head thereof |
| CN114200278A (en) * | 2021-11-29 | 2022-03-18 | 强一半导体（苏州）有限公司 | Film probe card and probe head thereof |
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| CN115616260B (en) | 2024-02-23 |
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