CN115576136A - Glass-based backlight plate for Mini LED display and manufacturing method - Google Patents

Glass-based backlight plate for Mini LED display and manufacturing method Download PDF

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Publication number
CN115576136A
CN115576136A CN202211338672.4A CN202211338672A CN115576136A CN 115576136 A CN115576136 A CN 115576136A CN 202211338672 A CN202211338672 A CN 202211338672A CN 115576136 A CN115576136 A CN 115576136A
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glass
circuit
circuit board
film layer
copper
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CN202211338672.4A
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CN115576136B (en
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陈旺寿
吴贵华
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Individual
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Priority to CN202211338672.4A priority Critical patent/CN115576136B/en
Priority to PCT/CN2022/129200 priority patent/WO2024087238A1/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Abstract

The invention relates to a glass-based backlight plate for Mini LED display and a manufacturing method thereof, wherein the glass-based backlight plate comprises two glass circuit boards, the two sides of each glass circuit board are provided with circuit surfaces, the two glass circuit boards are jointed through a jointing glue layer, and the circuit surface of the glass circuit board, which is not jointed, is a control circuit surface; the glass-based backlight plate also comprises a first through hole lead arranged in the glass circuit board and used for electrically connecting two circuit surfaces of each glass circuit board and a second through hole lead arranged in the glass circuit board and used for electrically connecting the circuits of the two glass circuit boards; the circuit surface of the glass circuit board is formed by manufacturing circuit patterns on a metal layer formed on the glass supporting body; the metal layer comprises a first metal film layer, a second copper film layer and a third metal film layer from the glass bearing body to the outside in sequence. The invention greatly improves the control precision and the control quantity of the LED dot matrix, improves the yield, and avoids the problems of difficult mass production and the like.

Description

Glass-based backlight plate for Mini LED display and manufacturing method
Technical Field
The invention relates to the technical field of Mini LED backlight boards, in particular to a glass-based backlight board for Mini LED display and a manufacturing method thereof.
Background
Mini LED refers to the LED chip of 100-300um size, the chip interval is between 0.1-1mm, adopt SMD, COB or the miniature LED device module of IMD encapsulation form, the application of Mini LED mainly divide into: (1) a Mini LED chip + LCD backlight scheme is used; (2) the self-luminous scheme of the Mini RGB display screen is directly used. The Mini LED is a mainstream technical form for upgrading the LCD in the future, has more advantages compared with the OLED, and the current Mini LED substrate comprises a PCB scheme and a glass-based scheme which are carriers of LED chips. The glass substrate has the advantages of high cost and heat dissipation, low thermal expansion rate, higher flatness, contribution to the performance such as Mini LED welding and the like, and has larger market potential in the field of Mini LEDs in the future.
However, because the Mini LED driving units have many modules and complicated circuits, and need to perform multidimensional scanning and current and voltage control of different modules to achieve different display effects, a multi-layer circuit structure is required for the control circuit to achieve the control requirement. Different from a PCB or FPC substrate scheme, the PCB and the FPC substrate can resist pressure, are not easy to break, are easy to punch and the like, and can easily realize a multi-layer circuit structure. However, the glass-based Mini LED backlight is different from a PCB (Printed Circuit board) or FPC (Flexible Printed Circuit board) based backlight, and for the glass-based backlight, because a glass substrate is fragile, does not resist strong pressure, is not suitable for too many holes, and the like, when a multilayer Circuit is manufactured, there are problems of complicated process, difficult soldering of LED chips, and very low yield, which results in that large-area industrial application is impossible. Chinese patent application CN202010990249.7 discloses a display circuit board suitable for a micro-space display screen, which comprises a glass substrate and a plurality of electronic components arranged on the glass substrate; the glass substrate is characterized in that circuit layers are arranged on the front side and the back side of the glass substrate, at least one of the circuit layers on the front side or the back side adopts a plurality of circuit layers, insulating layers are arranged among the circuit layers of the plurality of circuit layers, and the insulating layers are provided with windows so as to realize the electric connection among the circuit layers and the electric connection between the circuit layers and electronic components; each circuit layer of the multilayer circuit layers is also provided with a window, the window of each circuit layer and the window of the insulating layer form a cross-layer window, a bonding pad on each circuit layer is exposed out of the window, and pins of the electronic components are welded with bonding pads on different circuit layers through the cross-layer window to realize the electric connection of the electronic components and different circuit layers; however, in the patent application, the circuit layers of the multilayer circuit layer need to be separated by the insulating layers, and the circuit layers of the multilayer circuit layer need to be electrically connected by pressing, and the problem that the glass substrate is fragile, not resistant to strong pressure and not suitable for excessive punching exists, so that the process is complex and the yield is low when the multilayer circuit is formed; meanwhile, because a circuit layer needs to be arranged on the multiple insulating layers, and the insulating materials which can be provided with the circuit layer are mostly organic matters which are not heat-resistant and irradiated by ultraviolet, circuits on the insulating layers fall off and are scrapped when the circuit is used for a long time; and because the insulating layer adopts silk screen printing or coating mode mostly, the surface roughness is poor, and is heat-resisting low, can't counterpoint and can't adopt high temperature reflow soldering technology when welding the lamp pearl, is not suitable for the industrialization to be used.
In summary, it is very desirable to provide a new glass-based backlight panel for Mini LED display and a method for fabricating the same, which can realize a multi-layer circuit structure.
Disclosure of Invention
In order to solve one or more technical problems in the prior art, the invention provides a glass-based backlight plate for Mini LED display and a manufacturing method thereof.
The invention provides a glass-based backlight board for Mini LED display in a first aspect, which comprises two glass circuit boards, wherein both sides of each glass circuit board are circuit surfaces, the two glass circuit boards are jointed through a jointing glue layer, the circuit surface of the glass circuit board which is not jointed is a control circuit surface, and one control circuit surface is used for jointing a Mini LED chip in the control circuit surface of the glass-based backlight board; the glass-based backlight plate also comprises through hole leads, wherein the through hole leads comprise a first through hole lead which is arranged in the glass circuit board and used for electrically connecting two circuit surfaces of each glass circuit board and a second through hole lead which is arranged in the glass circuit board and used for electrically connecting the circuits of the two glass circuit boards; the circuit surface of the glass circuit board is formed by manufacturing circuit patterns on a metal layer formed on the glass carrier; the metal layer comprises a first metal film layer, a second copper film layer and a third metal film layer from the glass bearing body to the outside in sequence.
Preferably, the bonding glue layer is made of one or more of RGB glue, BM glue, OC glue, PS glue and TFT glue; and/or the thickness of the adhesive layer is 10-50 mu m.
Preferably, the thickness of the first metal film layer is 10-200 nm; the thickness of the second copper film layer is 5-100 mu m; the thickness of the third metal film layer is 0.5-10 μm; the first metal film layer is made of copper or copper alloy, wherein in the copper alloy, the mass percentage of copper atoms is 10% -95%, and preferably, the copper alloy is one or more of copper-nickel alloy, copper-titanium alloy, copper-molybdenum alloy and copper-chromium alloy; the second copper film layer is made of copper; the third metal film layer is made of one or more of nickel, tin and silver; and/or the first metal film layer is formed by a magnetron sputtering method, the second copper film layer is formed by an acid plating method, and the third metal film layer is formed by a magnetron sputtering method or an acid plating method.
Preferably, the glass circuit board is also provided with a lead on the circuit surface; and/or arranging bonding glue between the two glass circuit boards and curing the glue to form a bonding glue layer to realize bonding between the glass circuit boards, wherein the curing pressure is 0.15-0.3 MPa, the curing temperature is 80-200 ℃, and the curing time is 1-5 min.
Preferably, the first through hole lead and the second through hole lead are formed by filling a through hole opened in the glass circuit board with a conductive paste and curing the conductive paste.
Preferably, when the first through hole lead and the second through hole lead are formed, the conductive slurry is filled in a dispensing injection mode, the pressure of the dispensing injection is 0.15-0.3 MPa, the curing temperature is 80-200 ℃, and the curing time is 1-5 min; and/or the conductive paste is one or more of copper paste, aluminum paste or silver paste.
Preferably, the thickness of each glass supporting body is 0.02-8.0 mm; the thickness of the circuit surface on the glass circuit board is not less than 1 μm, preferably not less than 5 μm; and/or the circuit surface on each glass circuit board comprises a plurality of uniformly distributed line elements, the width of each line element being not more than 5000 μm, preferably not more than 30 μm.
Preferably, each circuit surface of each glass circuit board comprises a plurality of uniformly distributed circuit units, and the circuit surface for attaching comprises the circuit units with the width larger than that of the circuit units comprised in the control circuit surface; the width of a circuit unit included in the two circuit surfaces between the two control circuit surfaces is gradually reduced from the control circuit surface which is not used for attaching the Mini LED chip to the control circuit surface which is used for attaching the Mini LED chip; the width of the line unit included in the control circuit surface not used for attaching the Mini LED chip is larger than the width of the line unit included in the control circuit surface used for attaching the Mini LED chip.
In a second aspect, the present invention provides a method for manufacturing a glass-based backlight plate for Mini LED display according to the first aspect, wherein the method comprises the following steps:
(1) Sequentially forming a first metal film layer, a second copper film layer and a third metal film layer on two sides of the two glass bearing bodies to obtain two glass circuit boards with two metal layers on two sides;
(2) Manufacturing circuit patterns on a glass circuit board with two metal layers on two sides, and arranging through holes on the glass circuit board;
(3) Aligning the two glass circuit boards, arranging a bonding adhesive layer between the two glass circuit boards, and curing to obtain a glass-based circuit board module;
(4) And dispensing and injecting conductive slurry into the through holes in the glass-based circuit board module, and curing to obtain the glass-based backlight plate for Mini LED display.
Preferably, in the step (2), a lead is arranged on the circuit surface of the glass circuit board; and/or after the step (4), a step of attaching the Mini LED chip to one surface control circuit of the glass-based backlight plate for the Mini LED display through an SMT or die bonder is further included.
Compared with the prior art, the invention at least has the following beneficial effects:
(1) The invention provides a scheme for laminating two glass Circuit boards, which meets the requirements of Mini LED display on a multilayer Circuit aiming at the problems that a glass-based Mini LED backlight is different from a PCB (Printed Circuit board) or FPC (Flexible Printed Circuit board) based backlight board, and the glass-based backlight board has the defects of complex process, difficult welding of LED chips, high yield and the like due to the fact that a glass substrate is fragile, cannot resist strong pressure, and is not suitable for excessive punching, and the like when the multilayer Circuit is formed.
(2) The structure of the glass-based backlight plate for Mini LED display solves the problems that a single piece of glass cannot realize multi-dimensional circuit control and a multi-layer bridging structure needs to be manufactured on the surface of the glass, so that the LED dot matrix control precision, the control quantity and the yield are greatly improved, the problems of difficult volume production, high cost caused by bridging and the like are solved, and the structure of the glass-based backlight plate for Mini LED display can be derived into more layers of circuit control such as a 3-layer glass circuit board, a 4-layer glass circuit board, a 5-layer glass circuit board and the like, so that dot matrix control with more dimensions can be realized.
Drawings
The drawings of the present invention are provided for illustrative purposes only, and the proportion, size and number of parts in the drawings are not necessarily consistent with those of an actual product.
Fig. 1 is a schematic structural diagram of a glass-based backlight plate for Mini LED display provided in example 1 of the present invention;
FIG. 2 is a schematic view of the structure of a first glass circuit board included in FIG. 1;
FIG. 3 is a schematic view of the structure of a second glass circuit board included in FIG. 1;
FIG. 4 is a schematic structural diagram of a glass-based backlight plate for Mini LED display provided in example 2 of the present invention;
fig. 5 is a schematic structural diagram of a glass-based backlight plate for Mini LED display provided in embodiment 3 of the present invention.
In the figure: 1: a first glass circuit board; 2: gluing a glue layer; 3: a second glass circuit board; 4: a first through hole lead; 5: a second via lead; 6: a Mini LED chip; 7: a line unit; 8: and (6) leading wires.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. It should be apparent that the described embodiments are only some of the embodiments of the present invention, and not all of them. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The invention provides a glass-based backlight plate (abbreviated as glass-based backlight plate) for Mini LED display in a first aspect, for example, as shown in fig. 1, fig. 4 and fig. 5, the glass-based backlight plate comprises two glass circuit boards, both sides of the glass circuit boards are circuit surfaces, the two glass circuit boards are bonded by a bonding adhesive layer, the circuit surface on which the glass circuit boards are not bonded is a control circuit surface, and one control circuit surface is used for bonding Mini LED chips in the control circuit surface comprised by the glass-based backlight plate; in some embodiments, the glass-based backlight panel comprises a control circuit surface which is also adhered with a Mini LED chip; the glass-based backlight plate also comprises through hole leads, wherein the through hole leads comprise a first through hole lead which is arranged in the glass circuit board and used for electrically connecting two circuit surfaces of each glass circuit board and a second through hole lead which is arranged in the glass circuit board and used for electrically connecting the circuits of the two glass circuit boards, and the second through hole lead is used for electrically connecting the circuits of the two glass circuit boards so as to realize linkage control; in the invention, a circuit on each glass circuit board is a control circuit, and the second through hole lead is used for electrically connecting two control circuits; the circuit surface of the glass circuit board is formed by manufacturing circuit patterns on metal layers formed on the glass bearing body, namely, two circuit surfaces of each glass circuit board are formed by manufacturing circuit patterns on metal layers formed on two surfaces of the glass bearing body; the metal layer sequentially comprises a first metal film layer, a second copper film layer and a third metal film layer from the glass bearing body to the outside; in the invention, the first metal film layer is used as a seed layer for plating a second copper film layer at the back; the second copper film layer is used as a conductive layer and conducts current; the third metal film layer is used as an anti-oxidation layer and used for protecting the copper conducting layer from being oxidized.
For the glass-based backlight plate, due to the facts that glass base materials are fragile, cannot resist strong pressure, cannot be perforated too much and the like, when a multilayer circuit is formed, the problems of complex process, difficulty in welding LED chips, very low yield and the like exist, and due to the facts that glass base materials are fragile, cannot resist strong pressure, cannot be perforated too much and the like, the problems cannot be overcome, and related reports that two glass base materials are introduced into a glass-based backlight plate structure for Mini LED display are not found in the prior art; in the glass-based backlight board for Mini LED display in the prior art, usually, multiple circuit layers are arranged on one side or two sides of a glass substrate, each circuit layer is formed by pressing conductive raw materials under a large pressure to form a conductive layer, and an insulating layer is required to be arranged between the circuit layers to separate the circuit layers, and the insulating layer is formed by pressing under the large pressure to form the conductive layer, and a cross-layer window formed by windowing the circuit layers and windowing of the insulating layer is required to be welded with pads on different circuit layers, so as to realize electrical connection between an electronic component and different circuit layers.
Different from the prior art, the invention provides a scheme for adhering two glass circuit boards for the first time, the requirement of Mini LED display on a multilayer circuit is realized, and two circuit surfaces of each glass circuit board are formed by manufacturing circuit patterns on metal layers formed on two surfaces of a glass supporting body; the metal layer comprises a first metal film layer, a second copper film layer and a third metal film layer from the glass bearing body to the outside in sequence, the glass substrate backlight structure for Mini LED display, which comprises two glass circuit boards, can be obtained by directly laminating the glass circuit boards through a laminating adhesive, wherein the laminating adhesive layer can serve as an insulating layer, and only one circuit layer is arranged on the front surface and the back surface of each glass circuit board, so that the problems that when the multilayer circuit layers are arranged on the two sides of the glass substrate, the circuit layers are separated by the insulating layer between the circuit layers of the multilayer circuit layers, and the circuit layers of the multilayer circuit layers can be electrically connected by adopting a large-pressure pressing mode are solved, and the problems that the glass substrate is not resistant to strong pressure and is easy to break in the pressing process are solved; the circuits of each layer are only required to be connected at the position of the master control line, and the rest positions are not required to be connected, so that the punching quantity is greatly reduced; the structure of the glass-based backlight plate for Mini LED display solves the problems that a single piece of glass cannot realize multi-dimensional circuit control and a multi-layer bridging structure needs to be manufactured on the surface of the glass, so that the LED dot matrix control precision, the control quantity and the yield are greatly improved, the problems of difficult volume production, high cost caused by bridging and the like are solved, and the structure of the glass-based backlight plate for Mini LED display can be derived into more layers of circuit control such as a 3-layer glass circuit board, a 4-layer glass circuit board, a 5-layer glass circuit board and the like, so that dot matrix control with more dimensions can be realized.
According to some preferred embodiments, for example, as shown in fig. 1, 2, 3, 4 and 5; the glass-based backlight plate comprises a first glass circuit board and a second glass circuit board; the glass-based backlight plate is of a sandwich structure in which a layer of adhesive layer is sandwiched between two glass circuit boards; specifically, the front surface and the back surface of the first glass circuit board are both circuit surfaces; the first glass circuit board is internally provided with a first through hole lead used for electrically connecting the front circuit surface and the back circuit surface of the first glass circuit board, one circuit surface of the first glass circuit board is a control circuit surface, the other circuit surface (circuit surface used for jointing) provides power for the front circuit surface and the back circuit surface of the first glass circuit board, and the circuit surface used for jointing of the first glass circuit board provides power and ground wire introduction for the control circuit surface of the first glass circuit board through the first through hole lead arranged in the first glass circuit board; the front surface and the back surface of the second glass circuit board are both circuit surfaces, a first through hole lead used for electrically connecting the front surface and the back surface of the second glass circuit board is arranged in the second glass circuit board, one circuit surface of the second glass circuit board is a control circuit surface, and the control circuit surface is used for being attached to a Mini LED chip; the other circuit surface (circuit surface for jointing) of the second glass circuit board provides power for circuits on the front side and the back side of the second glass circuit board, and the circuit surface for jointing of the second glass circuit board provides power and ground wire for the control circuit surface of the second glass circuit board through a first through hole lead arranged in the second glass circuit board; and finally, the circuit of the first glass circuit board is electrically connected with the circuit of the second glass circuit board through a second through hole lead wire, and linkage control is carried out.
It is specifically stated that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the specific meaning of the above terms in the present invention can be understood as appropriate to those of ordinary skill in the art.
According to some preferred embodiments, the bonding glue layer is made of one or more of RGB glue, BM glue, OC glue (i.e., OCA glue), PS glue and TFT glue, and preferably, the bonding glue layer is made of OC glue, and the source of the bonding glue is not specifically limited, and products directly available on the market are adopted; and/or the thickness of the conformable subbing layer is 10 to 50 μm (e.g., 10, 15, 20, 25, 30, 35, 40, 45, or 50 μm).
According to some preferred embodiments, the first metal film layer has a thickness of 10 to 200nm (e.g., 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, or 200 nm); the second copper film layer has a thickness of 5 to 100 μm (e.g., 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, or 100 μm); and/or the third metal film layer has a thickness of 0.5 to 10 μm (e.g., 0.5, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, 7.5, 8, 8.5, 9, 9.5, or 10 μm); in the invention, the thickness of the first metal film layer is preferably 10-200 nm, the first metal film layer with the thickness can well meet the requirement of the adhesive force between the glass carrier and the second copper film layer, and the adhesive force between the glass carrier and the conductive copper is improved, so that the copper foil with the thickness of 5-100 mu m can be electroplated on the glass carrier; in addition, the arrangement of the first metal film layer with the thickness of 10-200 nm can load enough current to realize the electroplating process of the second copper film layer when the second copper film layer is electroplated; the thickness of the second copper film layer is preferably 5-100 mu m, and the inventor finds that the second copper film layer with the thickness can effectively meet the requirement of low resistance or low impedance of a glass circuit board, and reduces the current loss of the glass circuit board; the thickness of the third metal film layer is preferably 0.5-10 μm, and the inventor finds that the third metal film layer with the thickness can ensure good enough anti-oxidation and anti-corrosion effects; the copper circuit is easy to oxidize when exposed in the air, and meanwhile, the problem of adhesive force exists between copper and soldering tin.
According to some preferred embodiments, the first metal film layer is made of copper or a copper alloy, wherein the mass percentage of copper atoms in the copper alloy is 10% to 95%, and preferably, the copper alloy is one or more of a copper-nickel alloy, a copper-titanium alloy, a copper-molybdenum alloy and a copper-chromium alloy; the second copper film layer is made of copper; and/or the third metal film layer is made of one or more of nickel, tin and silver.
According to some preferred embodiments, the first metal film layer is formed by a magnetron sputtering method, the second copper film layer is formed by an acid plating method, and the third metal film layer is formed by a magnetron sputtering method or an acid plating method.
According to some preferred embodiments, the process conditions for forming the first metal film layer by magnetron sputtering are as follows: the total power of the sputtering power supply is 1-20 kW, the argon pressure is 0.2-1.0 Pa, and the temperature of the glass bearing body is 50-200 ℃; the process conditions for forming the second copper film layer by acid electroplating are as follows: the pH value is 3-6 4 The concentration is 20-200 g/L, H 2 SO 4 The concentration is 100-300 g/L, the concentration of chloride ions is 10-200 ppm, and the temperature is 20-80 ℃; when the third metal film layer is formed by a magnetron sputtering method, the process conditions for forming the third metal film layer by magnetron sputtering are as follows: the total power of the sputtering power supply is 2-100 kW, the argon pressure is 0.6-1.0 Pa, and the temperature of the glass bearing body is 50-300 ℃; when the third metal film layer is formed by the acid plating method, the process conditions for forming the third metal film layer by the acid plating method are as follows: the pH value is 3 to 6 4 Or SnSO 4 Or AgSO 4 The concentration is 20-200 g/L, H 2 SO 4 The concentration is 100-300 g/L, the concentration of chloride ions is 10-200 ppm, and the temperature is 20-80 ℃.
According to some preferred embodiments, before forming the first metal film layer, the glass carrier is washed and dried, and the washing and drying conditions are not particularly limited in the present invention, and conventional operations may be adopted.
According to some preferred embodiments, the circuit surface of the glass circuit board is further provided with a lead, in the present invention, the lead and the second via lead are used for realizing the electrical connection of two control circuits, so as to realize interactive control, in other words, the lead and the second via lead are used for electrically connecting the circuits of two glass circuit boards, so as to realize linkage control; in the present invention, for example, the lead and the second via hole lead may be provided on the same side of the circuit surface of the glass circuit board, for example, the lead may be provided on the left side as shown in fig. 1, 2, 3, 4, and 5, or the lead and the second via hole lead may be provided on both the left and right sides of the circuit surface of the glass circuit board as needed.
According to some preferred embodiments, the bonding between the glass circuit boards is achieved by disposing a bonding paste between two glass circuit boards and forming a bonding paste layer by curing at a pressure of 0.15 to 0.3MPa at a temperature of 80 to 200 ℃ (e.g., 80 ℃, 90 ℃, 100 ℃, 110 ℃, 120 ℃, 130 ℃, 140 ℃, 150 ℃, 160 ℃, 170 ℃, 180 ℃, 190 ℃ or 200 ℃) for 1 to 5min (e.g., 1, 2, 3, 4 or 5 min).
The two glass circuit boards are bonded without pressing under the action of large pressure, and bonding glue is arranged between the first glass circuit board and the second glass circuit board and is cured for 1-5 min at 80-200 ℃ under the condition that the pressure is only 0.15-0.3 MPa.
According to some preferred embodiments, the first via lead and the second via lead are each formed by filling a conductive paste into a via hole opened in a glass circuit board and curing.
According to some preferred embodiments, in forming the first and second via leads, the conductive paste is filled by dispensing injection at a pressure of 0.15 to 0.3MPa at a temperature of 80 to 200 ℃ for 1 to 5min; and/or the conductive paste is one or more of copper paste, aluminum paste or silver paste.
When the first through hole lead and the second through hole lead are formed, the conductive slurry is filled in a dispensing injection mode under the condition that the pressure is only 0.15-0.3 MPa, and then the conductive slurry is cured for 1-5 min at the temperature of 80-200 ℃.
According to some preferred embodiments, the thickness of each glass carrier body is 0.02 to 8.0mm; the thickness of the circuit surface on the glass circuit board is not less than 1 μm, preferably not less than 5 μm; and/or the circuit surface on each glass circuit board comprises a plurality of uniformly distributed line units, the width of each line unit is not more than 5000 microns, and preferably not more than 30 microns; in the present invention, the thickness of the circuit unit included in the circuit surface is the same as the thickness of the circuit surface, and the thicknesses of the circuit surfaces may be the same or different, preferably the same.
According to some preferred embodiments, for example, as shown in fig. 1, each circuit surface of each glass circuit board comprises a plurality of uniformly distributed line units, and the circuit surface for attaching comprises line units with a width W larger than that of the control circuit surface; the invention does not specifically limit the gaps among the plurality of circuit units included in each circuit surface, and the conventional gaps can be adopted and can be the same or different, as long as the plurality of circuit units included in each circuit surface are uniformly distributed; the width W of the line units included in the two circuit surfaces between the two control circuit surfaces is gradually reduced from the control circuit surface not used for attaching the Mini LED chip to the control circuit surface used for attaching the Mini LED chip; the width W of the line unit included in the control circuit surface which is not used for attaching the Mini LED chip is larger than the width W of the line unit included in the control circuit surface which is used for attaching the Mini LED chip; the length of the circuit units included in each circuit surface of the glass circuit board is not specifically limited, and the length of the circuit units is consistent with or smaller than that of the glass circuit board; in the invention, the circuit surface of the glass circuit board is preferably formed by adopting the circuit unit distribution mode, compared with the scheme that the circuit units of the circuit pattern of the glass circuit board are distributed layer by layer in corresponding positions and have equal width, the circuit unit distribution mode which is preferably selected by the glass-based backlight plate can integrally and effectively avoid the problem that a glass bearing body is easy to break when being punched, and further improve the structural stability and pressure resistance of the whole glass-based backlight plate, so that the yield of the glass-based backlight plate for Mini LED display can be further improved, and the problems of difficult mass production and the like are solved; due to the arrangement mode, the overall pressure resistance of the glass-based backlight plate can be better improved, so that a glass bearing body included by the glass-based backlight plate is not easy to break, and the glass-based backlight plate for Mini LED display has the advantages of higher mass production, higher yield and the like when needing to comprise more layers of circuit control such as 3 layers (three) of glass circuit boards, 4 layers (four) of glass circuit boards, 5 layers (five) of glass circuit boards and the like.
In a second aspect, the present invention provides a method for manufacturing a glass-based backlight plate for Mini LED display according to the first aspect, wherein the method comprises the following steps:
(1) Sequentially forming a first metal film layer, a second copper film layer and a third metal film layer on two sides of the two glass bearing bodies to obtain two glass circuit boards with two metal layers on two sides;
(2) Manufacturing circuit patterns on a glass circuit board with two metal layers on two sides, and arranging through holes on the glass circuit board;
(3) Aligning the two glass circuit boards, arranging a layer of adhesive layer between the two glass circuit boards, and curing to obtain a glass-based circuit board module; in the invention, the adhesive layer is arranged by screen printing, for example;
(4) And dispensing and injecting conductive slurry into the through holes in the glass-based circuit board module, and curing to obtain the glass-based backlight plate for Mini LED display.
In the present invention, the circuit pattern is created according to the circuit structure diagram, which may be specifically performed according to the following method:
(a) Coating photoresist; for example, a photoresist layer is coated on the third metal film layer:
(b) Designing a film line meeting the requirements; for example, designing a film circuit meeting the requirement on a photoresist layer;
(c) Exposing; exposing the photoresist layer with the designed film circuit:
(d) Developing; developing the exposed photoresist layer;
(e) Etching; in the present invention, for example, the wiring may be etched in an acidic etchant;
(f) And (5) degumming.
The present invention does not specifically limit the process conditions of steps (a) to (f) included in the fabrication of the circuit pattern, and is a conventional operation.
According to some preferred embodiments, in the step (2), a lead is arranged on the circuit surface of the glass circuit board; and/or after the step (4), a step of attaching the Mini LED chip to one surface control circuit of the glass-based backlight plate for the Mini LED display through an SMT or die bonder is further included.
The present invention will be further described with reference to the following examples. These examples are merely illustrative of preferred embodiments of the present invention and the scope of the present invention should not be construed as being limited to these examples.
Example 1
The embodiment provides a glass-based backlight plate for a Mini LED display, as shown in fig. 1, the glass-based backlight plate comprises a first glass circuit board and a second glass circuit board; the glass-based backlight plate is a sandwich structure in which a layer of laminating adhesive layer (OC laminating adhesive layer) is clamped between two glass circuit boards; the front surface and the back surface of the first glass circuit board are both circuit surfaces; a first through hole lead used for electrically connecting the front circuit surface and the back circuit surface of the first glass circuit board is arranged in the first glass circuit board, and one circuit surface of the first glass circuit board is a control circuit surface; the front surface and the back surface of the second glass circuit board are both circuit surfaces, a first through hole lead used for electrically connecting the front surface and the back surface of the second glass circuit board is arranged in the second glass circuit board, one circuit surface of the second glass circuit board is a control circuit surface, and a Mini LED chip is attached to the control circuit surface; the circuit surfaces of the first glass circuit board and the second glass circuit board are both provided with leads; finally, the circuit of the first glass circuit board and the circuit of the second glass circuit board are electrically connected with a second through hole lead arranged in the glass circuit board through leads for linkage control; the two circuit surfaces of the first glass circuit board and the second glass circuit board are formed by manufacturing circuit patterns on metal layers formed on two surfaces of the glass carrier; the metal layer comprises a first metal film layer, a second copper film layer and a third metal film layer from the glass bearing body to the outside in sequence; each circuit surface of each glass circuit board comprises a plurality of uniformly distributed circuit units, and the width of each circuit unit included in the circuit surface for attaching is larger than that of each circuit unit included in the control circuit surface; the width of a circuit unit included in the two circuit surfaces between the two control circuit surfaces is gradually reduced from the control circuit surface which is not used for attaching the Mini LED chip to the control circuit surface which is used for attaching the Mini LED chip; the width of the line unit included in the control circuit surface not used for attaching the Mini LED chip is larger than the width of the line unit included in the control circuit surface used for attaching the Mini LED chip.
The manufacturing method of the glass-based backlight plate in the embodiment comprises the following steps:
(1) sequentially forming a first metal film layer, a second copper film layer and a third metal film layer on two sides of the two glass supporting bodies to obtain two glass circuit boards with two metal layers on two sides; the first metal film layer is made of copper-nickel alloy (copper content is 50% by mass), is 10nm thick and is formed by sputtering through a magnetron sputtering process, and the process conditions are as follows: the total power of the sputtering power supply is 2kW, the argon pressure is 0.6Pa, and the temperature of the glass bearing body is 150 ℃; the second copper film layer is made of copper, has the thickness of 25 mu m and is formed by an acid electroplating method, and the process conditions are as follows: cuSO 4 Concentration of 75g/L, H 2 SO 4 Concentration 240g/L, chloride ion (Cl) - ) The concentration is 50ppm, and the temperature is 30 ℃; the third metal film layer is made of silver, has the thickness of 5 mu m and is formed by an acid electroplating process and an electroplating method, and the process conditions are as follows: agSO 4 Concentration of 75g/L, H 2 SO 4 Concentration 240g/L, chloride ion (Cl) - ) The concentration was 50ppm and the temperature was 30 ℃.
(2) The circuit pattern is made on the glass circuit board with two metal layers, and the glass circuit board is provided with a through hole and a lead.
(3) Aligning the two glass circuit boards, arranging a bonding adhesive layer (OC bonding adhesive layer) between the two glass circuit boards in a screen printing mode, and curing to obtain a glass-based circuit board module; the curing pressure is 0.15MPa, the curing temperature is 120 ℃, and the curing time is 3min.
(4) Dispensing and injecting conductive paste (copper paste) into the through holes in the glass-based circuit board module, curing to obtain a glass-based backlight board for Mini LED display, and attaching the Mini LED chip to the control circuit surface of the second glass circuit board by an SMT technology; the first through hole lead and the second through hole lead of the glass-based backlight plate are formed by filling conductive paste into through holes arranged in a glass circuit board and curing, when the first through hole lead and the second through hole lead are formed, the conductive paste (copper paste) is filled in a dispensing injection mode, the pressure of dispensing injection is 0.15MPa, the curing temperature is 120 ℃, and the curing time is 3min.
When 1000 glass-based backlight plates for Mini LED display described in this example were formed, the yield was 99.8%.
The glass-based backlight plate for Mini LED display in the embodiment can control tens of thousands of lamp beads on a 12-inch display screen, can control tens of thousands of lamp beads on an X-Y axis (namely, the X axis and the Y axis can control tens of thousands of lamp beads), and can realize independent control of hundreds of control partitions.
Example 2
The present embodiment provides a glass-based backlight panel for a Mini LED display, as shown in fig. 4; this embodiment is substantially the same as embodiment 1 except that:
in this embodiment, the circuit units included in the circuit surfaces of the first glass circuit board and the second glass circuit board of the glass-based backlight panel for Mini LED display are distributed in different manners, that is, in this embodiment, each circuit surface of each glass circuit board includes a plurality of uniformly distributed circuit units, the width of the circuit units included in the circuit surface of the same glass circuit board is equal, and the distribution positions correspond to each other, but the width of the circuit unit included in the circuit surface of the first glass circuit board is greater than the width of the circuit unit included in the circuit surface of the second glass circuit board.
When 1000 glass-based backlight plates for Mini LED display described in this example were formed, the yield was 98.6%.
The glass-based backlight plate for Mini LED display in the embodiment can control tens of thousands of lamp beads on a 12-inch display screen, can control tens of thousands of lamp beads on an X-Y axis, and can realize independent control of hundreds of control zones.
Example 3
The present embodiment provides a glass-based backlight panel for a Mini LED display, as shown in fig. 5; this embodiment is substantially the same as embodiment 1 except that:
in this embodiment, the circuit units included in the circuit surfaces of the first glass circuit board and the second glass circuit board of the glass-based backlight board for Mini LED display are distributed in the same manner, that is, in this embodiment, each circuit surface of each glass circuit board includes a plurality of uniformly distributed circuit units, and the circuit surfaces of the two glass circuit boards have the same width and the distribution positions are corresponding.
When 1000 glass-based backlight plates for Mini LED display described in this example were formed, the yield was 98.1%.
The glass-based backlight plate for Mini LED display in the embodiment can control tens of thousands of lamp beads on a 12-inch display screen, can control tens of thousands of lamp beads on an X-Y axis, and can realize independent control of hundreds of control partitions.
Comparative example 1
The present comparative example provides a glass-based backlight for Mini LED display, comprising only one glass circuit board; the front surface and the back surface of the glass circuit board are both circuit surfaces, one of the circuit surfaces is a control circuit surface, and the control circuit surface is attached with a Mini LED chip; the glass circuit board is internally provided with a through hole lead used for electrically connecting the front circuit surface and the back circuit surface; the two circuit surfaces of the glass circuit board are formed by manufacturing circuit patterns on metal layers formed on the two surfaces of the glass bearing body; the metal layer comprises a first metal film layer, a second copper film layer and a third metal film layer from the glass bearing body to the outside in sequence; the circuit surface of the glass circuit board comprises a plurality of uniformly distributed circuit units, the width of the circuit units on the two circuit surfaces of the glass circuit board is equal, and the distribution positions are corresponding.
The manufacturing method of the glass-based backlight plate in the comparative example comprises the following steps:
(1) sequentially forming a first metal film layer, a second copper film layer and a third metal film layer on two sides of a glass bearing body to obtain a glass circuit board with two metal layers on two sides; the first metal film layer is made of copper-nickel alloy (copper content is 50 wt%), is 10nm thick and is sputtered by a magnetron sputtering processPlating is formed under the following process conditions: the total power of the sputtering power supply is 2kW, the argon pressure is 0.6Pa, and the temperature of the glass bearing body is 150 ℃; the second copper film layer is made of copper, has the thickness of 25 mu m and is formed by an acid electroplating method, and the process conditions are as follows: cuSO 4 The concentration is 75g/L, H 2 SO 4 Concentration 240g/L, chloride ion (Cl) - ) The concentration is 50ppm and the temperature is 30 ℃; the third metal film layer is made of silver, has the thickness of 5 mu m and is formed by an acid electroplating process and an electroplating method, and the process conditions are as follows: agSO 4 Concentration of 75g/L, H 2 SO 4 Concentration 240g/L, chloride ion (Cl) - ) The concentration was 50ppm and the temperature was 30 ℃.
(2) And manufacturing circuit patterns on the glass circuit board with two metal layers on two sides, and arranging through holes on the glass circuit board.
(3) Dispensing and injecting conductive paste (copper paste) into through holes in the glass-based circuit board, curing to obtain a glass-based backlight board for Mini LED display, and attaching a Mini LED chip to a control circuit surface of the glass circuit board by an SMT technology; the through hole lead of the glass-based backlight plate is formed by filling conductive paste into a through hole arranged in a glass circuit board and curing, when the through hole lead is formed, the conductive paste (copper paste) is filled in a dispensing injection mode, the pressure of dispensing injection is 0.15MPa, the curing temperature is 120 ℃, and the curing time is 3min.
When 1000 glass-based backlight plates for Mini LED display described in this comparative example were formed, the yield was 99.8%.
The glass-based backlight plate for Mini LED display in the comparative example can control tens of thousands of lamp beads on a 12-inch display screen, but cannot realize X-Y axis lamp bead control and accurate partition control.
Comparative example 2
Refer to chinese patent CN202010990249.7 to provide a display circuit board.
When 1000 display circuit boards in the comparative example are formed, due to the complex process, the problems of inaccurate alignment, need of windowing for each circuit layer, insulating layer and the like, relatively more holes are punched, high-temperature over-reflow soldering cannot be performed and the like exist in the production process, so that the yield is low and is only 93%; in addition, in the use process of the product in the comparative example, the insulating layer is not heat-resistant and ultraviolet irradiation, so that the circuit on the insulating layer can fall off and be scrapped after long-time use, and the service life of the product is relatively short.
The invention has not been described in detail and is not limited thereto.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (10)

1. A glass-based backlight board for MiniLED display is characterized in that:
the glass-based backlight board comprises two glass circuit boards, wherein both sides of each glass circuit board are provided with circuit surfaces, the two glass circuit boards are attached through an adhesive layer, the circuit surfaces, which are not attached, of the glass circuit boards are control circuit surfaces, and one control circuit surface is used for attaching a MiniLED chip in the control circuit surfaces included in the glass-based backlight board;
the glass-based backlight plate also comprises through hole leads, wherein the through hole leads comprise a first through hole lead which is arranged in the glass circuit board and used for electrically connecting two circuit surfaces of each glass circuit board and a second through hole lead which is arranged in the glass circuit board and used for electrically connecting the circuits of the two glass circuit boards;
the circuit surface of the glass circuit board is formed by manufacturing circuit patterns on a metal layer formed on the glass carrier; the metal layer comprises a first metal film layer, a second copper film layer and a third metal film layer from the glass bearing body to the outside in sequence.
2. The glass-based backlight panel of claim 1, wherein:
the bonding glue layer adopts one or more of RGB glue, BM glue, OC glue, PS glue and TFT glue; and/or
The thickness of the adhesive layer is 10-50 μm.
3. The glass-based backlight panel of claim 1, wherein:
the thickness of the first metal film layer is 10-200 nm;
the thickness of the second copper film layer is 5-100 mu m;
the thickness of the third metal film layer is 0.5-10 mu m;
the first metal film layer is made of copper or copper alloy, wherein the mass percentage of copper atoms in the copper alloy is 10-95%, and preferably, the copper alloy is one or more of copper-nickel alloy, copper-titanium alloy, copper-molybdenum alloy and copper-chromium alloy;
the second copper film layer is made of copper;
the third metal film layer is made of one or more of nickel, tin and silver; and/or
The first metal film layer is formed by a magnetron sputtering method, the second copper film layer is formed by an acid plating method, and the third metal film layer is formed by a magnetron sputtering method or an acid plating method.
4. The glass-based backlight panel of claim 1, wherein:
the circuit surface of the glass circuit board is also provided with a lead; and/or
The bonding between the two glass circuit boards is realized by arranging bonding glue between the two glass circuit boards and forming a bonding glue layer through curing, wherein the curing pressure is 0.15-0.3 MPa, the curing temperature is 80-200 ℃, and the curing time is 1-5 min.
5. The glass-based backlight panel of claim 1, wherein:
the first through hole lead and the second through hole lead are formed by filling conductive paste into a through hole formed in the glass circuit board and curing the conductive paste.
6. The glass-based backlight panel of claim 5, wherein:
when forming the first through hole lead and the second through hole lead, filling conductive slurry in a dispensing injection mode, wherein the pressure of dispensing injection is 0.15-0.3 MPa, the temperature for curing is 80-200 ℃, and the time for curing is 1-5 min; and/or
The conductive paste is one or more of copper paste, aluminum paste or silver paste.
7. The glass-based backlight panel of claim 1, wherein:
the thickness of each glass supporting body is 0.02-8.0 mm;
the thickness of the circuit surface on the glass circuit board is not less than 1 μm, preferably not less than 5 μm; and/or
The circuit surface on each glass circuit board comprises a plurality of uniformly distributed line elements, the width of each line element being not more than 5000 μm, preferably not more than 30 μm.
8. The glass-based backlight panel according to any one of claims 1 to 7, wherein:
each circuit surface of each glass circuit board comprises a plurality of uniformly distributed circuit units, and the width of each circuit unit included in the circuit surface for attaching is larger than that of each circuit unit included in the control circuit surface;
the width of a circuit unit included in the two circuit surfaces between the two control circuit surfaces is gradually reduced from the control circuit surface which is not used for attaching the Mini LED chip to the control circuit surface which is used for attaching the Mini LED chip;
the width of the line units included in the control circuit surface not used for attaching the Mini LED chip is larger than the width of the line units included in the control circuit surface used for attaching the Mini LED chip.
9. The method for manufacturing a glass-based backlight board for a Mini LED display according to any one of claims 1 to 8, wherein the manufacturing method comprises the following steps:
(1) Sequentially forming a first metal film layer, a second copper film layer and a third metal film layer on two sides of the two glass bearing bodies to obtain two glass circuit boards with two metal layers on two sides;
(2) Manufacturing circuit patterns on a glass circuit board with two metal layers on two sides, and arranging through holes on the glass circuit board;
(3) Aligning the two glass circuit boards, arranging a layer of adhesive layer between the two glass circuit boards, and curing to obtain a glass-based circuit board module;
(4) And dispensing and injecting conductive slurry into the through holes in the glass-based circuit board module, and curing to obtain the glass-based backlight plate for MiniLED display.
10. The method of manufacturing according to claim 9, wherein:
in the step (2), arranging a lead on the circuit surface of the glass circuit board; and/or
And (4) after the step (4), a step of attaching the Mini LED chip to a control circuit surface on one surface of the glass-based backlight plate for the Mini LED display through an SMT or a die bonder.
CN202211338672.4A 2022-10-28 2022-10-28 Glass-based backlight plate for Mini LED display and manufacturing method Active CN115576136B (en)

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