CN111435697A - Conductive plate for display device - Google Patents
Conductive plate for display device Download PDFInfo
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- CN111435697A CN111435697A CN201910653016.5A CN201910653016A CN111435697A CN 111435697 A CN111435697 A CN 111435697A CN 201910653016 A CN201910653016 A CN 201910653016A CN 111435697 A CN111435697 A CN 111435697A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application discloses a conductive plate for a display device. The light emitting device comprises an electric insulating substrate, a plurality of light emitting source electrode connecting areas and at least one patterned conductive circuit layer. The light-emitting source electrode connection areas are formed above the electric insulation substrate, are electrically isolated from each other and are configured into an array, and each light-emitting source electrode connection area is provided with a common electrode connection subarea and a plurality of single electrode connection subareas. The patterned conductive circuit layer is formed above the electric insulation substrate and at least provided with a plurality of conductive circuits electrically connected with the common electrode connection subareas of the light-emitting source electrode connection areas on the same row, and the patterned conductive circuit layer comprises conductive powder particles with the particle size of less than 200 microns.
Description
Technical Field
The application belongs to the technical field of display, and particularly relates to a current-conducting plate for a display device.
Background
Light emitting diodes (L lighting diode; L ED) are electronic components using semiconductor materials as luminescent materials, which have the advantages of power saving, environmental protection, long life, small volume and fast response compared to incandescent lamps and Cold cathode fluorescent lamps (CCF L). since L ED is becoming mature as a display technology of a self-luminous source, small and medium-sized L CD displays, which are mainstream products in the display market, are gradually replaced by L ED displays, which are flat, thin and lightweight, on the other hand, L ED display panels are also evolving towards large sizes and are intended to be new players for multimedia information display media.
In the manufacturing of a L ED display panel, a small-sized or medium-sized display panel with a L ED bead array is usually manufactured, and then a plurality of small-sized or medium-sized display panels are combined into a large-sized L ED display panel, in order to enable each L ED bead in the L ED bead array to be lit, the electrical conductivity between the substrate carrying the L ED bead array and the L ED bead array must be good, in addition, in order to enable each L ED bead in the L ED bead array to operate for a long time, the substrate carrying the L ED bead array must also have high thermal conductivity, on the other hand, in order to enable each L ED bead in the L ED bead array to be lit, the display effect required by various applications, the manufacturing of the conductive circuits on the substrate carrying the L ED bead array must be capable of meeting the requirements of various different designs and can be completed quickly, therefore, how to enable the substrate carrying L ED bead array to have both high electrical conductivity and high thermal conductivity, and to meet the requirements of various applications.
Disclosure of Invention
In view of the above problems, the present inventors propose a conductive plate for a display device.
One embodiment of the present application provides a conductive plate for a display device. In one embodiment, the conductive plate for a display device includes an electrically insulating substrate, a plurality of light-emitting electrode connection areas, and a first patterned conductive trace layer. The light-emitting source electrode connecting areas are formed above the electric insulation substrate, are electrically isolated from each other and are configured into an array, each light-emitting source electrode connecting area is used for electrically connecting an external control device and is used for electrically connecting a common electrode of a light-emitting source and a plurality of single electrodes, and each light-emitting source electrode connecting area is provided with a common electrode connecting partition used for electrically connecting the common electrode of the light-emitting source correspondingly and a plurality of single electrode connecting partitions respectively used for electrically connecting the single electrodes of the light-emitting source correspondingly. The first patterning conducting circuit layer is formed above the electric insulation substrate and at least provided with a plurality of first conducting circuits, and each first conducting circuit is electrically connected with the common electrode connecting partition in the light-emitting source electrode connecting areas on the same row. The first patterned conductive circuit layer includes conductive powder particles having a particle size of less than 200 microns selected from the group consisting of copper, silver, nickel, silver-clad copper, and carbon.
In one embodiment, the first patterned conductive circuit layer of the conductive plate for a display device further has a plurality of electrode pads electrically isolated from each other, the electrode pads being respectively formed in the common electrode connection region and the single electrode connection region of the light-emitting source electrode connection region, and the conductive plate for a display device further includes a metal conductive layer formed on the electrode pads and made of copper. In one embodiment, the conductive plate for a display device further includes a passivation layer formed on the metal conductive layer and made of one of nickel gold, nickel palladium gold, tin, silver and Organic Solderability Preservative (OSP).
In one embodiment, the first patterned conductive circuit layer of the proposed conductive plate for a display device further has a plurality of electrode pads electrically isolated from each other, the electrode pads being respectively formed in the common electrode connection division and the single electrode connection division of the light-emitting source electrode connection region, and the proposed conductive plate for a display device further includes a solder layer formed on each of the electrode pads and made of nano-silver or nano-copper.
In one embodiment, the conductive plate for a display device further includes a plurality of first single electrode connection lines, a transparent insulating layer, and a second patterned conductive trace layer. The first single electrode connection lines extend from the single electrode connection sections in a part of the light-emitting source electrode connection regions, respectively. The transparent insulating layer is located above the electrically insulating substrate. The second patterned conductive circuit layer is formed above the electrically insulating substrate and has a plurality of second single electrode connection lines extending from the single electrode connection partitions in the other part of the light-emitting source electrode connection region, respectively, and a part of the second single electrode connection lines and a part of the first single electrode connection lines are separated by a transparent insulating layer and electrically insulated from each other.
In one embodiment, the first patterned conductive circuit layer of the conductive plate for a display device further has a plurality of first electrically-dividing external electrical connection pads respectively connected to the first single electrode connection lines, and the second patterned conductive circuit layer further has a plurality of second electrically-dividing external electrical connection pads respectively connected to the second single electrode connection lines, the second electrically-dividing external electrical connection pads and the first electrically-dividing external electrical connection pads are spaced apart from each other and disposed above the adjacent surface of one side of the electrically-insulating substrate, and the arrangement direction of the second electrically-dividing external electrical connection pads is parallel to the arrangement direction of the first electrically-dividing external electrical connection pads.
In one embodiment, a portion of the second single electrode connection line and a portion of the first single electrode connection line of the conductive plate for a display device are located between the light emitting source electrode connection regions of two adjacent rows, which are separated by the transparent insulating layer.
In one embodiment, the second single electrode connection line of the conductive plate for the display device is made of one of a nano silver wire, a carbon nanotube, a conductive polymer, Indium Tin Oxide (ITO), fluorine-doped tin oxide (FTO), zinc oxide (ZnO), and Aluminum Zinc Oxide (AZO).
In one embodiment, the material of the first patterned conductive trace layer of the conductive board for a display device further includes a material selected from the group consisting of formaldehyde, urea, melamine, benzoguanamine, and alcohol compounds, or a material selected from the group consisting of Thermoplastic Polyurethane (TPU), epoxy resin, polymethyl methacrylate (PMMA), and ethyl cellulose.
In one embodiment, the electrically insulating substrate of the conductive plate for the display device is a transparent substrate.
Another embodiment of the present application also provides a conductive plate for a display device. In one embodiment, the conductive plate for a display device includes an electrically insulating substrate, a transparent conductive layer, a plurality of light-emitting electrode connection areas, and a patterned conductive trace layer. The transparent conductive layer is formed above the electric insulation substrate and is contacted with the electric insulation substrate. The light-emitting source electrode connecting areas are positioned on the transparent conducting layer, are electrically isolated from each other and are configured into an array, each light-emitting source electrode connecting area is used for electrically connecting an external control device and is used for electrically connecting a common electrode of a light-emitting source and a plurality of single electrodes, and each light-emitting source electrode connecting area is provided with a common electrode connecting partition used for electrically connecting the common electrode of the light-emitting source correspondingly and a plurality of single electrode connecting partitions respectively used for electrically connecting the single electrodes of the light-emitting source correspondingly. The patterning conducting circuit layer is formed on the transparent conducting layer, is in contact with the transparent conducting layer and at least comprises a plurality of conducting circuits, each conducting circuit is electrically connected with a common electrode connecting partition which is arranged on the light-emitting source electrode connecting area on the same column, and the patterning conducting circuit layer comprises conducting powder particles with the particle size of less than 200 micrometers.
Advantageous effects
Compared with the conventional L ED conductive plate, the conductive plate for the display device provided by the embodiments of the present application has the characteristics of high compactness, high electrical conductivity and high thermal conductivity of the patterned conductive wire formed thereon, thereby improving L ED display performance, and having the advantage of short process time, and being suitable for mass production and reducing the manufacturing cost.
Drawings
Fig. 1 is a schematic plan view of a partial region of a conductive plate for a display device according to an embodiment of the present application.
Fig. 2 is a plan sectional view of a conductive plate for a display device according to an embodiment of the present application, taken along a section in the direction a-a of fig. 1.
Fig. 3A is a plan sectional view of a conductive plate for a display device according to another embodiment of the present application, taken along a section in the direction B-B of fig. 1.
Fig. 3B is a plan sectional view of a conductive plate for a display device according to still another embodiment of the present application, taken along a section in a B-B direction of fig. 1.
Fig. 4 is a schematic plan view of a conductive plate for a display device according to another embodiment of the present application.
Fig. 5 is a schematic plan view of an external electrical connection flexible board of a conductive board for a display device according to an embodiment of the present application.
Fig. 6 is a schematic plan view of an external electrical connection flexible board of a conductive board for a display device according to another embodiment of the present application.
Fig. 7 is a schematic plan view of an external electrical connection flexible board of a conductive board for a display device according to still another embodiment of the present application.
Detailed Description
The present application discloses a conductive plate for a display device, which is not fully drawn according to actual dimensions and is not limited to the present application, but is previously stated, with reference to the accompanying drawings, which are referred to hereinafter for the purpose of expressing the meanings of the features associated with the present application. In addition, in the following description, the meaning of a technical term described in the following text shall be defined as the meaning of the technical term described in the text, unless the meaning of the technical term is different from the meaning of a general technical term in the art.
Fig. 1 is a schematic plan view of a partial area of a conductive plate for a display device according to an embodiment of the present application, fig. 2 is a cross-sectional plan view of the conductive plate for the display device according to an embodiment of the present application taken along a-a direction of fig. 1, in one embodiment, as shown in fig. 1 and 2, the conductive plate 10 for the display device has an electrically insulating substrate 101, a plurality of light-emitting-source electrode connection areas 11, a first patterned conductive circuit layer 103, and a transparent conductive layer 102. in the present embodiment, the transparent conductive layer 102 is formed over the electrically insulating substrate 101 and is in contact with the electrically insulating substrate 101, a plurality of grooves 1021 are formed in the transparent conductive layer 102, each groove 1021 exposes the surface of the electrically insulating substrate 101, and a plurality of electrically isolated transparent conductive areas are formed, a plurality of light-emitting-source electrode connection areas 11 are formed over the electrically insulating substrate 101, the transparent conductive areas are defined on the transparent conductive layer 102, and are electrically isolated from each other and arranged in array through a portion of the grooves 1021, and each of the plurality of the light-emitting-source electrode connection areas 11 are electrically connected to an external control device 12 and to a light-emitting source electrode, such as a common-emitting-source electrode sub-bulb, a plurality of light-emitting sources, such as a green-emitting-source electrode sub-emitting.
In another embodiment, the conductive plate 10 for a display device has an electrically insulating substrate 101, a plurality of light-emitting electrode connection areas 11 and a first patterned conductive trace layer 103, but does not have a transparent conductive layer 102. At this time, the plurality of light-emitting source electrode connecting regions 11 are directly defined on the electrically insulating substrate 101, separated and electrically isolated from each other, and arranged in an array, and the partitions of the electrodes of the plurality of corresponding light-emitting sources in each light-emitting source electrode connecting region 11 are separated and electrically isolated from each other, and the purpose and the rest of the structure of the light-emitting source electrode connecting region 11 are the same as those described above, and are not described again.
In one embodiment, the first patterned conductive trace layer 103 is formed on the electrically insulating substrate 101 and has at least a plurality of first conductive traces 1031 and a plurality of common electrically connected external electrical connection pads 1032. All the paths of the first conductive traces 1031 are shifted from the paths of the grooves 1021 separating the respective light-emission source electrode connection regions 11 from each other, and all the paths of the first conductive traces 1031 are parallel to each other. Each of the first conductive lines 1031 is electrically connected to these light-emitting source electrode connection regions 11 located on the same column, and particularly to a common electrode connection division corresponding to a common electrode of the light-emitting sources in each of the light-emitting source electrode connection regions 11 located on the same column. Each common external electrical connection pad 1032 is connected to one of the first conductive traces 1031, and each common external electrical connection pad 1032 is formed on an adjacent surface of the electrically insulating substrate 101 near one side 1011 and disposed apart from each other. The common external electrical connection pad 1032 is electrically connected to the external control device 12. In the case where the conductive plate 10 for a display device is used in a building, the thickness of the entire conductive plate 10 for a display device is at least 6mm, and the electrically insulating substrate 101 is made of glass, thereby providing sufficient structural strength.
With reference to fig. 1, each light-emitting source electrode connecting region 11 is used for electrically connecting a plurality of electrodes of one light-emitting source. In one embodiment, as shown in fig. 1, each of the light-emitting source electrode connection regions 11 may be used to electrically connect a common electrode and three single electrodes of a light-emitting source, and the transparent conductive layer 102 further has electrode connection lines 111, 112, 113, and 114 formed thereon and extending from respective partitions (e.g., a common electrode connection partition and three single electrode connection partitions) of the light-emitting source electrode connection regions 11 corresponding to the respective electrodes of the light-emitting source, respectively, and the first conductive line 1031 is electrically connected to the common electrode connection partition via the electrode connection line 111 extending from the common electrode connection partition in the light-emitting source electrode connection region 11.
In another embodiment, the conductive plate for the display device may not have the transparent conductive layer 102, and the electrode connecting lines 111, 112, 113 and 114 are directly formed on the electrically insulating substrate 101 and contact the electrically insulating substrate 101, and the purpose and the remaining structure of the electrode connecting lines 111, 112, 113 and 114 are the same as those described above, and are not repeated.
Referring to fig. 2, the electrically insulating substrate 101 is made of glass, ceramic, aluminum nitride ceramic, polycarbonate, polyethylene terephthalate, polyimide, BT resin, glass fiber, or cyclic olefin copolymer, and in one embodiment, the electrically insulating substrate 101 may be a transparent substrate to form a transparent display device. The transparent conductive layer 102 contacting and located on the electrically insulating substrate 101 is, for example, an Indium Tin Oxide (ITO) film, a fluorine-doped tin oxide (FTO) film, a zinc oxide (ZnO) film, or an Aluminum Zinc Oxide (AZO) film formed by sputtering or evaporation. The first patterned conductive circuit layer 103 is formed by, for example, screen printing or spray printing, the first patterned conductive circuit layer 103 is in contact with and located on the electrically insulating substrate 101, or in contact with and located on the transparent conductive layer 102, so as to enhance the heat dissipation effect through the transparent conductive layer 102, the first patterned conductive circuit layer 103 (including the first conductive circuit 1031) may be made of a cured silver paste, a cured copper paste, or a cured conductive powder paste, and the conductive powder paste includes conductive powder particles of copper, silver, nickel, silver-coated copper, or carbon having a particle size of less than 200 μm, and the conductive powder paste may be used to directly perform electroless plating on the first patterned conductive circuit layer 103 without any pretreatment such as reduction or catalysis. The conductive powder slurry is prepared by mixing 10-95% of conductive powder with a particle size of less than 200 μm, 1-40% of binder and 5-70% of solvent, and then mechanically grinding. The formed conductive powder slurry has good adhesion on glass, ceramic, polyethylene terephthalate, polyimide, BT resin or glass fiber base materials. The conductive powder is a powder having conductivity, such as silver powder, copper powder, silver-coated copper powder, nickel powder, or carbon powder, and the particle shape of the conductive powder may be a flake shape, a spherical shape, a microcrystalline shape, or an irregular shape. The binder is, for example, a substance obtained by condensation polymerization of formaldehyde, urea, melamine, benzoguanamine and an alcohol compound, and is mixed with Thermoplastic Polyurethane (TPU), epoxy resin, polymethyl methacrylate (PMMA) or ethyl cellulose. The solvent is, for example, one of ester compounds, alcohol compounds, ether compounds and ketone compounds, and is mixed with terpineol, ethanol, ethyl acetate, dibasic acid ester mixture (DBE), ethylene glycol ethyl ether acetate (CAC), isophorone or ethylene glycol butyl ether acetate. In addition, in order to improve the electrical and thermal conductivity of each first conductive wire 1031, a metal conductive layer 104 including copper may be plated on each first conductive wire 1031.
Fig. 3A is a plan sectional view of a conductive plate for a display device according to another embodiment of the present application, taken along a section in the direction B-B of fig. 1. Referring to fig. 1 and fig. 3A, in another embodiment of the present invention, the first patterned conductive trace layer 103 further has a plurality of electrode pads 1033, the electrode pads 1033 are electrically isolated from each other and are respectively formed in the common electrode connection sub-area and the single electrode connection sub-area of the light-emitting source electrode connection area 11 for being connected to the electrodes of the light-emitting source, and the electrode pads 1033 can be in contact with the transparent conductive layer 102 to enhance the heat dissipation effect through the transparent conductive layer 102, and the material of each electrode pad 1033 includes the cured silver paste, the copper paste or the silver-clad copper paste, or the cured conductive powder paste. In addition, in order to improve the electrical conductivity and the thermal conductivity of each electrode pad 1033, a metal conductive layer 104 including copper may be plated on each electrode pad 1033, a protective layer 105 may be further formed on the metal conductive layer 104, and the material of the protective layer 105 may be nickel gold, nickel palladium gold, tin, silver or Organic Solderability Preservative (OSP) for improving the oxidation resistance and the solderability of Surface Mount Technology (SMT) of the metal conductive layer 104.
Fig. 3B is a plan sectional view of a conductive plate for a display device according to still another embodiment of the present invention, taken along the direction B-B of fig. 1, as shown in fig. 1 and 3B, in still another embodiment of the present invention, unlike the embodiment of fig. 3A, each of the electrode pads 1033 is not plated with the metal conductive layer 104 including copper, instead, a solder layer 106 made of nano silver or nano copper is formed on each of the electrode pads 1033, so that each electrode of the light emitting source is fixedly connected to the electrode pad 1033, whereby the soldering with the solder layer 106 and L ED bead can be directly performed without using a conventional solder paste.
In another embodiment, the conductive plate for the display device may not have the transparent conductive layer 102, and the electrode pads 1033 are directly formed on the electrically insulating substrate 101 and contact the electrically insulating substrate 101, and the purpose and the rest of the structure of the electrode pads 1033 are the same as those described above, and are not repeated.
Fig. 4 is a schematic plan view of a conductive plate for a display device according to another embodiment of the present application. As shown in fig. 4, in the present embodiment, a transparent conductive layer 202, a plurality of light-emitting source electrode connection areas 21a, 21b and 21c and a first patterned conductive circuit layer are formed on an electrically insulating substrate 201 of a conductive plate 20 for a display device, the transparent conductive layer 202 is in contact with the electrically insulating substrate 201, the first patterned conductive circuit layer has a plurality of first conductive circuits 2031, a plurality of common external electrical connection pads 2032 and a plurality of first electrical connection pads 2034, and the transparent conductive layer 202 is in contact with the electrically insulating substrate 201. In addition, a plurality of light-emitting source electrode connection regions 21a, 21b and 21c electrically isolated from each other and arranged in an array are defined on the transparent conductive layer 202. In this embodiment, the conductive plate for a display device further has a plurality of common electrode connection lines 211 and a plurality of first single electrode connection lines 212, 213, 214. The common electrode connection lines 211 extend from common electrode connection segments of the light-emitting source electrode connection regions 21a, 21b, and 21c, respectively, and the first single electrode connection lines 212, 213, 214 extend from a single electrode connection segment of a portion of the light-emitting source electrode connection regions 21a and 21b (i.e., the light-emitting source electrode connection region closer to a side 2011 of the electrically insulating substrate 201). The common electrode connection lines 211 are respectively connected to the first conductive traces 2031, the common electrical external connection pads 2032 are respectively connected to the first conductive traces 2031, and the first electrical external connection pads 2034 are respectively connected to the first single electrode connection lines 212, 213, and 214. Unlike fig. 1, the conductive plate 20 for the display device of the present embodiment further has a transparent insulating layer 22 and a second patterned conductive trace layer 23. The transparent insulating layer 22 is disposed above the electrically insulating substrate 201, for example, formed on a portion of the transparent conductive layer 202. The second patterned conductive trace layer 23 is formed on the electrically insulating substrate 201, and has a plurality of second single electrode connecting lines 232, 233, and 234, the second single electrode connecting lines 232, 233, and 234 respectively extend from one of another portion of the light-emitting source electrode connecting region 21c (i.e., the light-emitting source electrode connecting region farther from a side 2011 of the electrically insulating substrate 201), and a portion of the second single electrode connecting lines 232, 233, and 234 and a portion of the first single electrode connecting lines 212, 213, and 214 are separated by the transparent insulating layer 22 and electrically insulated from each other. In addition, the second patterned conductive trace layer 23 further includes a plurality of second electrically-disconnected external connecting pads 235, the second electrically-disconnected external connecting pads 235 are respectively connected to the second single electrode connecting lines 232, 233, and 234, the second electrically-disconnected external connecting pads 235 and the first electrically-disconnected external connecting pads 2034 are disposed on the surface of the electrically-insulating substrate 201 close to one side 2011 thereof at intervals, and the arrangement direction of the second electrically-disconnected external connecting pads 235 is parallel to the arrangement direction of the first electrically-disconnected external connecting pads 2034. In this way, the single electrode connection line and the sub-electric connection external connection pad on the conductive plate 20 for the display device can perform double-layer bridging, thereby increasing the arrangement density of the light-emitting source electrode connection region 11 and increasing the available pixels of the display panel.
In one embodiment, the transparent insulating layer 22 may be formed above a portion of the first single electrode connection lines 212, 213, and 214 and below a portion of the second single electrode connection lines 232, 233, and 234 by screen printing, spray coating, or film coating. In addition, a portion of the second single electrode connection lines 232, 233, and 234 and a portion of the first single electrode connection lines 212, 213, and 214, which are separated by the transparent insulating layer 22, are positioned between the light emission source electrode connection regions of two adjacent columns. In other words, any two adjacent light-emitting source electrode connection region rows do not have light-emitting source electrode connection regions, and thus can serve as a single-layer or double-layer arrangement space for the first and second single electrode connection lines. In one embodiment, the first single electrode connecting lines 212, 213 and 214 may be transparent conductive lines electrically isolated by a plurality of grooves formed by cutting the transparent conductive layer 202, the plurality of grooves may be formed by laser etching, and the second single electrode connecting lines 232, 233 and 234 may be solidified silver paste, copper paste or silver-clad copper paste further formed on the transparent conductive lines isolated by the plurality of grooves, or solidified conductive powder paste, or the second patterned conductive circuit layer 23 is formed by screen printing or spraying, and the second single electrode connecting lines 232, 233 and 234 of the second patterned conductive circuit layer 23 formed in this way may be, for example, nano silver wires, nano carbon tubes or conductive Polymer (PEDOT).
In another embodiment, instead of forming the transparent insulating layer 22 on the first single electrode connecting lines 212, 213, and 214 which are transparent conductive lines by sputtering or evaporation, and forming a portion of the second patterned conductive trace layer 23 on the transparent insulating layer 22 by sputtering or evaporation coating and laser etching, the second single electrode connecting lines 232, 233, and 234 of the portion of the second patterned conductive trace layer 23 formed in this way may be made of a transparent conductive material such as an Indium Tin Oxide (ITO) film, a fluorine-doped tin oxide (FTO) film, a zinc oxide (ZnO) film, or an Aluminum Zinc Oxide (AZO) film.
In another embodiment, the conductive plate 20 for a display device may not have the transparent conductive layer 202, and the material of the first single electrode connection lines 212, 213, and 214 may be a cured silver paste, a cured copper paste, or a cured silver-clad copper paste, or a cured conductive powder paste, the first single electrode connection lines 212, 213, and 214 are directly formed on the electrically insulating substrate 201 and contact the electrically insulating substrate 201, and the transparent insulating layer 22 is located between a portion of the first single electrode connection lines 212, 213, and 214 and a portion of the second single electrode connection lines 232, 233, and 234. The purpose and the rest of the structure of the first single electrode connecting wires 212, 213 and 214 of this embodiment are the same as those of the previous embodiments, and are not described again.
Fig. 5 is a schematic plan view of an external electrical connection flexible board of a conductive board for a display device according to an embodiment of the present application. Referring to fig. 5, two rows of spaced electrical connection pads 131 and 132 are disposed on a surface of the external electrical connection Flexible Printed Circuit (FPC) or the flat cable 13 near one side 130a, the electrical connection pads 131 or 132 in the same row are aligned with each other, and the electrical connection pads 131 and 132 in different rows are not aligned with each other and are disposed in a staggered manner. In this configuration, the conductive line 1311 led from the connecting pad 131 to the other side 130b and the conductive line 1321 led from the connecting pad 132 to the other side 130b do not intersect with each other, and short circuit between the conductive line 1311 and the conductive line 1321 can be prevented. In one embodiment, when the first electrically connecting sub-pad 2034 and the second electrically connecting sub-pad 235 of the double layer cross-over in fig. 4 are located in the same row and aligned with each other and the different rows are staggered from each other as the electrical connection pads 131 and 132 of fig. 5, the single layer non-cross-over external electrical connection flexible board 13 of fig. 5 can be used to connect the first electrically connecting sub-pad 2034 and the second electrically connecting sub-pad 235 of the double layer cross-over on the conductive plate 20 of the display device of fig. 4.
Fig. 6 is a schematic plan view of an external electrical connection flexible board of a conductive board for a display device according to another embodiment of the present application. Referring to fig. 6, two rows of spaced electrical connection pads 141 and 142 are disposed on a surface of the external electrical connection Flexible Printed Circuit (FPC) or the flat cable 14 near one side 140a, the electrical connection pads 141 or 142 in the same row are aligned with each other, and the electrical connection pads 141 and 142 in different rows are also aligned with each other. In this way, in order to avoid the short circuit caused by the contact between the wire 1411 led out from the pad 141 to the other side 140b and the wire 1421 led out from the pad 142 to the other side 140b, after the wire 1421 is formed, an electrical insulation layer 300 is formed on a local area including a part of the path of all the wires 1421, and then the wire 1411 led out from the pad 141 passes through the local area covered by the electrical insulation layer 300 and reaches the other side 140 b. Therefore, in another embodiment, when the first electrically connected external connection pad 2034 and the second electrically connected external connection pad 235 of the double-layer cross-over in fig. 4 are located in the same row and different rows as the electrical connection pads 141 and 142 in fig. 6, the external electrical connection soft board 14 of the double-layer cross-over in fig. 6 can be used to correspondingly connect the first electrically connected external connection pad 2034 and the second electrically connected external connection pad 235 of the double-layer cross-over on the conductive board 20 for the display device in fig. 4.
Fig. 7 is a schematic plan view of an external electrical connection flexible board of a conductive board for a display device according to still another embodiment of the present application. Referring to fig. 7, two rows of spaced electrical connection pads 151 and 152 are disposed on a surface of the external electrical connection Flexible Printed Circuit (FPC) or the flat cable 15 near one side 150a, the electrical connection pads 151 or 152 in the same row are aligned with each other, and the electrical connection pads 151 and 152 in different rows are also aligned with each other. In this way, in order to avoid the short circuit caused by the contact between the conductive wire 1511 led out from the electrical connection pad 151 to the other side 150b and the conductive wire 1521 led out from the electrical connection pad 152 to the other side 150b, after the conductive wire 1511 is formed, an electrical insulation layer 400 is formed on a partial area including a part of the path of all the conductive wires 1511, and then the conductive wire 1521 led out from the electrical connection pad 152 passes through the partial area covered by the electrical insulation layer 400 and reaches the other side 150 b. Therefore, in another embodiment, when the first electrically connected external connection pad 2034 and the second electrically connected external connection pad 235 of the double-layer cross-over in fig. 4 are located in the same row and different rows as the electrical connection pads 151 and 152 in fig. 7, the external electrical connection soft board 15 of the double-layer cross-over in fig. 7 can be used to correspondingly connect the first electrically connected external connection pad 2034 and the second electrically connected external connection pad 235 of the double-layer cross-over on the conductive board 20 for the display device in fig. 4.
The conductive plate for a display device according to embodiments of the present disclosure may be regarded as the patterned conductive circuit layer of the present disclosure as long as the formed conductive circuit layer has the specific conductive circuit pattern, and the formation method is not limited thereto.
While the preferred embodiments of the present application have been described, the embodiments disclosed are not intended to limit the scope of the claims of the present application; also, the above description should be understood and implemented by those skilled in the art, and therefore, other equivalent changes and modifications based on the embodiments should be included in the scope of the claims of the present application, unless they depart from the spirit of the invention disclosed in the present application.
Claims (11)
1. A conductive sheet for a display device, comprising:
an electrically insulating substrate;
a plurality of light-emitting source electrode connection areas, which are located above the electrically insulating substrate, are electrically isolated from each other and are arranged in an array, each light-emitting source electrode connection area is used for electrically connecting an external control device and is used for electrically connecting a common electrode of a light-emitting source and a plurality of single electrodes, and each light-emitting source electrode connection area is provided with a common electrode connection partition used for correspondingly and electrically connecting the common electrode of the light-emitting source and a plurality of single electrode connection partitions used for correspondingly and electrically connecting the single electrodes of the light-emitting source respectively; and
a first patterned conductive trace layer formed above the electrically insulating substrate and having at least a plurality of first conductive traces, each of the first conductive traces being electrically connected to the common electrode connection partition located in the light-emitting source electrode connection region in the same row, the first patterned conductive trace layer including conductive powder particles having a particle size of less than 200 μm selected from the group consisting of copper, silver, nickel, silver-clad copper, and carbon.
2. The conductive plate for a display device according to claim 1, wherein the first patterned conductive wiring layer further has a plurality of electrode pads electrically isolated from each other, the electrode pads being respectively formed in the common electrode connection division and the single electrode connection division of the light emission source electrode connection region, and the conductive plate for a display device further comprises:
and the metal conducting layer is formed on the electrode pad and made of copper.
3. A conductive sheet for a display device according to claim 2, further comprising:
and the protective layer is formed on the metal conducting layer, and the material of the protective layer comprises one of nickel gold, nickel palladium gold, tin, silver and an organic solderability preservative film.
4. The conductive plate for a display device according to claim 1, wherein the first patterned conductive wiring layer further has a plurality of electrode pads electrically isolated from each other, the electrode pads being respectively formed in the common electrode connection division and the single electrode connection division of the light emission source electrode connection region, and the conductive plate for a display device further comprises:
and the welding layer is formed on each electrode pad, and the material of the welding layer comprises one of nano silver and nano copper.
5. A conductive sheet for a display device according to claim 1, further comprising:
a plurality of first single electrode connection lines respectively extending from the single electrode connection partitions in a portion of the light-emitting source electrode connection regions;
a transparent insulating layer located above the electrically insulating substrate; and
a second patterned conductive trace layer formed on the electrically insulating substrate and having a plurality of second electrode connecting wires extending from the other portion of the single electrode connecting regions, wherein a portion of the second electrode connecting wires and a portion of the first electrode connecting wires are separated by the transparent insulating layer and electrically insulated from each other.
6. The conductive plate for a display device according to claim 5, wherein the first patterned conductive circuit layer further has a plurality of first electrically-dividing external electrical connection pads connected to the first single electrode connection lines, respectively, and the second patterned conductive circuit layer further has a plurality of second electrically-dividing external electrical connection pads connected to the second single electrode connection lines, respectively, the second electrically-dividing external electrical connection pads and the first electrically-dividing external electrical connection pads being disposed above an adjacent surface of one side of the electrically insulating substrate at a distance from each other, an arrangement direction of the second electrically-dividing external electrical connection pads being parallel to an arrangement direction of the first electrically-dividing external electrical connection pads.
7. An electrically conductive sheet for a display device according to claim 5, wherein said portion of said second single electrode connection line and said portion of said first single electrode connection line separated by said transparent insulating layer are located between said light-emitting source electrode connection regions of two adjacent columns.
8. The conductive plate for a display device according to claim 5, wherein the second single electrode connection line is made of one of a nano silver wire, a carbon nanotube, a conductive polymer, indium tin oxide, fluorine-doped tin oxide, zinc oxide, and aluminum zinc oxide.
9. A conductive plate for a display device as claimed in claim 1, wherein the material of the first patterned conductive trace layer further comprises a material selected from the group consisting of formaldehyde, urea, melamine, benzoguanamine and alcohol compounds and a material selected from the group consisting of thermoplastic polyurethane, epoxy resin, polymethyl methacrylate and ethyl cellulose.
10. An electrically conductive sheet for a display device as claimed in claim 1, wherein said electrically insulating substrate is a transparent substrate.
11. A conductive sheet for a display device, comprising:
an electrically insulating substrate;
a transparent conductive layer formed over and in contact with the electrically insulating substrate;
a plurality of light-emitting source electrode connection areas, located on the transparent conductive layer, electrically isolated from each other and arranged in an array, each of the light-emitting source electrode connection areas being electrically connected to an external control device and electrically connected to a common electrode of a light-emitting source and a plurality of single electrodes, each of the light-emitting source electrode connection areas having a common electrode connection sub-area for electrically connecting the common electrode of the light-emitting source correspondingly and a plurality of single electrode connection sub-areas for electrically connecting the single electrodes of the light-emitting source correspondingly; and
and the patterning conducting circuit layer is formed above the transparent conducting layer and is in contact with the transparent conducting layer, the patterning conducting circuit layer at least comprises a plurality of conducting circuits, each conducting circuit is electrically connected with the common electrode connecting subarea which is arranged on the light-emitting source electrode connecting areas in the same column, and the patterning conducting circuit layer comprises conducting powder particles with the particle size of less than 200 microns.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962792575P | 2019-01-15 | 2019-01-15 | |
| US62/792575 | 2019-01-15 |
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| CN111435697A true CN111435697A (en) | 2020-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910653016.5A Pending CN111435697A (en) | 2019-01-15 | 2019-07-19 | Conductive plate for display device |
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| TW (1) | TWI711352B (en) |
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| US9395589B2 (en) * | 2012-03-20 | 2016-07-19 | Apple Inc. | Electronic device with inverted liquid crystal display |
| CN102945845B (en) * | 2012-11-13 | 2015-01-21 | 佛山市国星光电股份有限公司 | LED (Light Emitting Diode) device for display screen and display module |
| CN103313509B (en) * | 2013-04-24 | 2016-08-17 | 上舜电子科技（中国）有限公司 | A kind of Metal Substrate conducting wire plate and preparation method thereof |
| CN106502441B (en) * | 2015-09-07 | 2020-02-07 | 宸盛光电有限公司 | Touch panel and manufacturing method thereof |
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| TWI711352B (en) | 2020-11-21 |
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Effective date of registration: 20220228 Address after: No. 19 Lane 17 lane, Guangming Road, Hsinchu, Taiwan, China 19 Applicant after: Fan Wenchang Address before: 11 / F, No.71, Dazhong South Street, West District, Taichung, Taiwan, China Applicant before: Xinchen Technology Co.,Ltd. |