CN113183566A - Photoelectric glass with film-pasted circuit and production process - Google Patents

Photoelectric glass with film-pasted circuit and production process Download PDF

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Publication number
CN113183566A
CN113183566A CN202110447094.7A CN202110447094A CN113183566A CN 113183566 A CN113183566 A CN 113183566A CN 202110447094 A CN202110447094 A CN 202110447094A CN 113183566 A CN113183566 A CN 113183566A
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layer
glass
circuit
photoelectric
conducting
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CN113183566B (en
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曹海波
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Hefei Dashi Photoelectric Technology Co ltd
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Hefei Dashi Photoelectric Technology Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B32B3/085—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts spaced apart pieces on the surface of a layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses photoelectric glass with a film pasting circuit and a production process thereof, wherein the photoelectric glass comprises a glass layer and a photoelectric layer, wherein the photoelectric layer is arranged in the glass layer; the photoelectric layer comprises a first conducting layer and a second conducting layer, the first conducting layer is fixedly connected with the upper surface of the lower glass layer, and the second conducting layer is fixedly connected with the bottom wall of the upper glass layer. According to the photoelectric glass packaging method, the film pasting circuit is adopted for packaging, so that the photoelectric glass can be packaged effectively according to the ultrathin and high-transparency effect of the film pasting circuit, the packaging process is simple, the low-efficiency process means such as traditional direct laser engraving or printing on the glass is solved, the cost is saved, the energy consumption in the production process is reduced, the product yield is improved, the film pasting circuit is not easy to damage, and the visual effect of a finished product is good.

Description

Photoelectric glass with film-pasted circuit and production process
Technical Field
The invention belongs to the technical field of photoelectric glass production, and particularly relates to photoelectric glass with a film pasting circuit and a production process.
Background
Along with the rapid development of market economy, the market platform is continuously upgraded and reformed, people continuously promote the consumption concept, the taste is gradually increased, the traditional black display screen is turned to the transparent display screen, and the display effect of the traditional black display screen, which is large in energy consumption, heavy in size, unstable in safety and low in end, is turned to the display picture, which is energy-saving, environment-friendly, light, exquisite, high in stability and novel in high end, of the traditional transparent display screen to be rapidly changed. After the traditional black display screen has large energy consumption, heavy body shape, unstable safety and the low-end display effect is changed to a higher-end transparent display screen, many defects of the transparent display screen are gradually exploded, for example, a grid transparent screen is rigid and clumsy, a structure cannot be fused with glass to occupy a large space, the installation mode is complex and the like; for example, the glass transparent screen cannot be maintained, the body is heavy, the production process is complex, the display effect is poor, a large amount of resources are wasted, and the like; for example, the assembly precision of the film-coated transparent screen is poor, the display effect is seriously affected by a large amount of bubbles deposited after the film-coated transparent screen is adhered to glass, the cost is greatly wasted in installation and maintenance, and the like. The photoelectric glass is widely applied to aspects such as display application.
However, the photovoltaic glass has the following disadvantages in the production process:
(1) the circuit is easy to damage in the pressing process due to the fact that the circuit protrudes, and the rate of finished products is affected;
(2) the circuit board inside the existing photoelectric glass is thicker and has poorer light transmittance, so that the photoelectric glass is more complex to process in the production process, and the transparency is lower after the photoelectric glass is finished, thereby influencing the visual effect;
(3) the photoelectric glass is heavy in the production process, and the existing equipment is not enough to support the enlarged bonding work, so that the size of the manufactured photoelectric glass is small, and the application range of the product is limited;
(4) the interval of lamp pearl is great among the current photoelectric glass, and the picture becomes the aberration to far away from power transmission end, the lamp pearl luminance at rear can weaken gradually, and luminance is inconsistent, influences visual effect.
Therefore, it is necessary to invent a photovoltaic glass with a film-attached circuit and a production process thereof to solve the above problems.
Disclosure of Invention
Aiming at the problems, the invention provides photoelectric glass with a film-pasted circuit and a production process thereof, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the photoelectric glass with the film pasting circuit comprises a glass layer and a photoelectric layer, wherein the photoelectric layer is arranged in the glass layer;
the glass layer comprises an upper glass layer and a lower glass layer, the photoelectric layer comprises a first conductive layer and a second conductive layer, the first conducting layer is fixedly connected with the upper surface of the lower glass layer, the second conducting layer is fixedly connected with the bottom wall of the upper glass layer, the first conductive layer and the second conductive layer respectively comprise a base layer, a transparent PET layer and a transparent PVB glue water layer, the transparent PVB glue layer is bonded with the glass layer, the base layer is connected with the transparent PVB glue layer through the transparent PET layer, the surface of basic unit is provided with the impression groove, the impression inslot portion is filled there is the circuit layer, first conducting layer top align to grid has the first lamp pearl of a plurality of, and second conducting layer bottom align to grid has a plurality of second lamp pearl, two the position that the circuit layer removed first lamp pearl and second lamp pearl has all been scribbled the printing ink layer, be provided with PVB film layer between first conducting layer and the second conducting layer.
Furthermore, the two ends of the glass layer and the two ends of the photoelectric layer are both provided with stainless steel ladle frames, two control panels are arranged inside the stainless steel ladle frames, and the four control panels are connected with base wires of the photoelectric layer.
Furthermore, the glass layer is made of common glass or photoelectric glass materials, the thickness of the upper glass layer is equal to that of the lower glass layer, and the thickness dimension is 1-20 mm.
Furthermore, the base layer is made of a conductive UC adhesive material, and the thickness of the base layer is 0.05-3 mm.
Furthermore, the circuit layer is made of conductive paste materials, the thickness of the circuit layer is 6-30um, the circuit layer line interval is 30-1000um, and the circuit layer line width is 6-200 um.
Furthermore, the first lamp beads on the surface of the first conductive layer and the second lamp beads on the surface of the second conductive layer are arranged in a staggered mode at equal intervals, the interval between every two adjacent lamp beads in each row is 10-100mm, and the interval between every two adjacent lamp beads in each column is 10-100 mm.
Furthermore, the bottom both sides of first lamp pearl are provided with first tin solder layer, and with the circuit layer electric welding of first conducting layer, the both sides parcel of second lamp pearl has second tin solder layer, and the top of second tin solder layer and the circuit layer electric welding of second conducting layer.
Furthermore, first lamp pearl and second lamp pearl all adopt LED pad pasting lamp pearl or ordinary LED lamp pearl setting that contains microprocessor, and the luminous direction of first lamp pearl and second lamp pearl is same orientation setting, and its orientation is upwards or sets up downwards.
The invention also discloses a production process of the photoelectric glass with the film pasting circuit, which comprises the following steps:
s1: firstly, brushing PVB glue and PET glue on the surfaces of an upper glass layer and a lower glass layer to form a transparent PVB glue layer and a transparent PET layer, then coating a layer of conductive UC glue on the surface of the transparent PET layer, solidifying to form a base layer with extremely high flatness, then engraving a circuit diagram to be embossed on the surface of a mold, displaying the engraved circuit diagram as a bulge, then embossing the surface of the base layer to form circuit lines, forming an embossing groove, filling prepared conductive slurry into the circuit lines in the embossing groove, scraping excessive conductive slurry, and drying to form the circuit layer;
s2: respectively welding a first tin welding layer of a first lamp bead and a second tin welding layer of a second lamp bead with a first conducting layer and a second conducting layer according to the arrangement interval and the welding position to prepare the first conducting layer and the second conducting layer containing the lamp beads, and then coating ink on the rest positions of the circuit layer to form an ink layer;
s3: firstly, electrically welding a control board inside a stainless steel ladle frame with a base layer respectively, then putting solid insulating PVB glue between a first conducting layer of a lower glass layer and a second conducting layer of an upper glass layer, softening the solid insulating PVB glue, then pressing and covering the second conducting layer of the upper glass layer on the surface of the first conducting layer of the lower glass layer, enabling the first lamp beads and the second lamp beads to be staggered and corresponding to each other, after the softened solid insulating PVB is gelled and solidified, attaching and fixing the upper glass layer and the lower glass layer to form a PVB glue layer, and cutting the extruded solid insulating PVB glue to prepare a semi-finished product of the photoelectric glass;
s4: and encapsulating one end of the glass layer and one end of the photoelectric layer by using a stainless steel ladle frame to prepare the photoelectric glass.
The invention has the technical effects and advantages that:
1. according to the photoelectric glass packaging method, the film pasting circuit is adopted for packaging, so that the photoelectric glass can be packaged effectively according to the ultrathin and high-transparency effect of the film pasting circuit, the packaging process is simple, the low-efficiency process means such as traditional direct laser engraving or printing on the glass is solved, the cost is saved, the energy consumption in the production process is reduced, the product yield is improved, the film pasting circuit is not easy to damage, and the visual effect of a finished product is good.
2. The film-pasted circuit layer is prepared in an imprinting mode, the circuit is directly imprinted into the substrate layer, and the circuit is prevented from protruding out of the substrate layer, so that the circuit is prevented from being damaged in the packaging process of the film-pasted circuit layer, and the efficiency of a photoelectric glass finished product is prevented from being influenced.
3. According to the invention, the lines are respectively printed in the upper glass layer and the lower glass layer, and the lamp beads are crossed and combined, so that the density among the lamp beads is effectively increased, the luminous density of the photoelectric glass is increased, and the visual effect of a finished product is increased.
4. The LED lamp beads with processing drive are adopted for installation, and the defect that the brightness of the original film-pasted LED lamp beads is gradually weakened is overcome, so that the brightness of the produced photoelectric glass is consistent from beginning to end, the service life of the photoelectric glass is prolonged, and the visual effect is improved.
5. The invention is beneficial to directly combining the circuit with the glass by brushing and coating the PVB glue, the PET glue and the conductive UC glue on the surface of the glass, can bond the two glass surfaces without using larger pressing force in the subsequent bonding process, thereby increasing the area of the glass, and does not need to use special glass, thereby manufacturing photoelectric glass products with different sizes, and the application range is wide.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 shows a schematic view of the structure of the photovoltaic glass of the present invention;
FIG. 2 shows a schematic view of the first and second beads of the present invention;
FIG. 3 shows a production flow diagram of the photovoltaic glass of the present invention;
in the figure: 1. a glass layer; 101. an upper glass layer; 102. a lower glass layer; 2. a photovoltaic layer; 201. a first conductive layer; 202. a second conductive layer; 203. a base layer; 204. embossing grooves; 205. a circuit layer; 206. an ink layer; 207. a first lamp bead; 208. a second lamp bead; 209. a first tin solder layer; 210. a second tin solder layer; 211. a transparent PET layer; 212. a transparent PVB glue layer; 3. a PVB film layer; 4. a stainless steel frame; 5. and a control panel.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
the invention provides photoelectric glass with a film pasting circuit, as shown in figures 1-3, a photoelectric layer 2 is arranged in a glass layer 1, and the photoelectric glass is packaged by adopting the film pasting circuit, so that the photoelectric glass is effectively packaged according to the ultrathin and high-transparency effects of the film pasting circuit, the packaging process is simple, the traditional low-efficiency process means such as direct laser engraving or printing on the glass is solved, the cost is saved, the energy consumption in the production process is reduced, the product yield is improved, the film pasting circuit is not easy to damage, and the visual effect of a finished product is good;
the glass layer 1 comprises an upper glass layer 101 and a lower glass layer 102, the photoelectric layer 2 comprises a first conducting layer 201 and a second conducting layer 202, the first conducting layer 201 is fixedly connected with the upper surface of the lower glass layer 102, the second conducting layer 202 is fixedly connected with the bottom wall of the upper glass layer 101, lamp beads are crossed and combined through respective imprinting lines in the upper glass layer 101 and the lower glass layer 102, the density between the lamp beads is effectively increased, the luminous density of the photoelectric glass is increased, and the visual effect of a finished product is improved, the first conducting layer 201 and the second conducting layer 202 respectively comprise a base layer 203, a transparent PET layer 211 and a transparent PVB glue layer 212, the transparent PVB glue layer 212 is bonded with the glass layer 1, the base layer 203 and the transparent PVB glue layer 212 are connected through the transparent PET layer 211, the surface of the base layer 203 is provided with an imprinting groove 204, and the circuit layer 205 is filled in the imprinting groove 204, first conducting layer 201 top align to grid has first lamp pearl 207 of a plurality of, and align to grid has a plurality of second lamp pearl 208 in second conducting layer 202 bottom, two circuit layer 205 removes the position of first lamp pearl 207 and second lamp pearl 208 and has all been scribbled printing ink layer 206, be provided with PVB film layer 3 between first conducting layer 201 and the second conducting layer 202, prepare through the mode that adopts the impression, directly impression the circuit to the substrate layer inside, prevent the outstanding substrate layer of circuit to prevent that pad pasting circuit layer from leading to the circuit to damage at the in-process of encapsulation, influence photoelectricity glass finished product efficiency.
The two ends of the glass layer 1 and the photoelectric layer 2 are respectively provided with a stainless steel ladle frame 4, the two stainless steel ladle frames 4 are respectively internally provided with two control panels 5, the four control panels 5 are respectively connected with a base layer 203 of the photoelectric layer 2 through electric wires, and the LED lamp beads driven by self-carrying processing are adopted for installation, so that the defect that the brightness of the original film-pasted LED lamp beads is gradually weakened is overcome, the brightness of the produced photoelectric glass is consistent from head to tail, the service life of the photoelectric glass is prolonged, and the visual effect is improved, the glass layer 1 is made of common glass or photoelectric glass materials, the thicknesses of the upper glass layer 101 and the lower glass layer 102 are equal, the thickness dimension is 1mm, the base layer 203 is made of conductive UC, the thickness of the base layer 203 is 0.05mm, the circuit layer 205 is made of conductive paste materials, the thickness of the circuit layer 205 is 6um, and the line spacing of the circuit layer 205 is 30um, the line width of the circuit layer 205 is 6um, the first lamp beads 207 on the surface of the first conducting layer 201 and the second lamp beads 208 on the surface of the second conducting layer 202 are arranged in an equidistant and staggered mode, the distance between every two adjacent lamp beads in each row is 10mm, and the distance between every two adjacent lamp beads in each column is 10 mm; the first lamp bead 207 and the second lamp bead 208 are both arranged by using LED film-pasting lamp beads or common LED lamp beads containing a microprocessor, the light emitting directions of the first lamp bead 207 and the second lamp bead 208 are both arranged in the same direction, the light emitting directions are arranged upwards or downwards, the purpose is to increase the display density, the staggered arrangement method cannot be realized because the distance between pixels is limited by the pressure difference of a conductive material, the PVB glue, the PET glue and the conductive UC glue are coated and brushed on the surface of glass, the direct combination of a circuit and the glass is facilitated, the two-side glass can be laminated without using a large pressing force in the subsequent laminating process, the area of the glass is increased, special glass is not required, photoelectric glass products with different sizes are manufactured, and the application range is wide.
Example 2:
the invention provides photoelectric glass with a film pasting circuit, as shown in figures 1-3, a photoelectric layer 2 is arranged in a glass layer 1, and the photoelectric glass is packaged by adopting the film pasting circuit, so that the photoelectric glass is effectively packaged according to the ultrathin and high-transparency effects of the film pasting circuit, the packaging process is simple, the traditional low-efficiency process means such as direct laser engraving or printing on the glass is solved, the cost is saved, the energy consumption in the production process is reduced, the product yield is improved, the film pasting circuit is not easy to damage, and the visual effect of a finished product is good;
the glass layer 1 comprises an upper glass layer 101 and a lower glass layer 102, the photoelectric layer 2 comprises a first conducting layer 201 and a second conducting layer 202, the first conducting layer 201 is fixedly connected with the upper surface of the lower glass layer 102, the second conducting layer 202 is fixedly connected with the bottom wall of the upper glass layer 101, lamp beads are crossed and combined through respective imprinting lines in the upper glass layer 101 and the lower glass layer 102, the density between the lamp beads is effectively increased, the luminous density of the photoelectric glass is increased, and the visual effect of a finished product is improved, the first conducting layer 201 and the second conducting layer 202 respectively comprise a base layer 203, a transparent PET layer 211 and a transparent PVB glue layer 212, the transparent PVB glue layer 212 is bonded with the glass layer 1, the base layer 203 and the transparent PVB glue layer 212 are connected through the transparent PET layer 211, the surface of the base layer 203 is provided with an imprinting groove 204, and the circuit layer 205 is filled in the imprinting groove 204, first conducting layer 201 top align to grid has first lamp pearl 207 of a plurality of, and align to grid has a plurality of second lamp pearl 208 in second conducting layer 202 bottom, two circuit layer 205 removes the position of first lamp pearl 207 and second lamp pearl 208 and has all been scribbled printing ink layer 206, be provided with PVB film layer 3 between first conducting layer 201 and the second conducting layer 202, prepare through the mode that adopts the impression, directly impression the circuit to the substrate layer inside, prevent the outstanding substrate layer of circuit to prevent that pad pasting circuit layer from leading to the circuit to damage at the in-process of encapsulation, influence photoelectricity glass finished product efficiency.
The two ends of the glass layer 1 and the photoelectric layer 2 are respectively provided with a stainless steel ladle frame 4, the two stainless steel ladle frames 4 are respectively internally provided with two control panels 5, the four control panels 5 are respectively connected with a base layer 203 of the photoelectric layer 2 through electric wires, and the LED lamp beads driven by self-carrying processing are adopted for installation, so that the defect that the brightness of the original film-pasted LED lamp beads is gradually weakened is overcome, the brightness of the produced photoelectric glass is consistent from head to tail, the service life of the photoelectric glass is prolonged, and the visual effect is improved, the glass layer 1 is made of common glass or photoelectric glass materials, the thicknesses of the upper glass layer 101 and the lower glass layer 102 are equal, the thickness dimension is 20mm, the base layer 203 is made of conductive UC, the thickness of the base layer 203 is 3mm, the circuit layer 205 is made of conductive paste materials, the thickness of the circuit layer 205 is 30um, and the line spacing of the circuit layer 205 is 1000um, the line width of the circuit layer 205 is 200um, the first lamp beads 207 on the surface of the first conducting layer 201 and the second lamp beads 208 on the surface of the second conducting layer 202 are arranged in an equidistant and staggered mode, the distance between every two adjacent lamp beads in each row is 100mm, and the distance between every two adjacent lamp beads in each column is 100 mm; the first lamp bead 207 and the second lamp bead 208 are both arranged by using LED film-pasting lamp beads or common LED lamp beads containing a microprocessor, the light emitting directions of the first lamp bead 207 and the second lamp bead 208 are both arranged in the same direction, the light emitting directions are arranged upwards or downwards, the purpose is to increase the display density, the staggered arrangement method cannot be realized because the distance between pixels is limited by the pressure difference of a conductive material, the PVB glue, the PET glue and the conductive UC glue are coated and brushed on the surface of glass, the direct combination of a circuit and the glass is facilitated, the two-side glass can be laminated without using a large pressing force in the subsequent laminating process, the area of the glass is increased, special glass is not required, photoelectric glass products with different sizes are manufactured, and the application range is wide.
Example 3:
the invention also discloses a production process of the photoelectric glass with the film pasting circuit, which comprises the following steps:
s1: firstly, brushing PVB glue and PET glue on the surfaces of an upper glass layer 101 and a lower glass layer 102 to form a transparent PVB glue layer 212 and a transparent PET layer 211, then coating a layer of conductive UC glue on the surface of the transparent PET layer 211, solidifying to form a base layer 203 with extremely high flatness, then engraving a circuit diagram to be embossed on the surface of a mold, enabling the engraved circuit diagram to be shown in a convex manner, then embossing the surface of the base layer 203 to form circuit lines, forming an embossing groove 204, filling prepared conductive paste into the circuit lines in the embossing groove 204, scraping the excessive conductive paste, and drying to form a circuit layer 205;
s2: respectively welding a first tin welding layer 209 of a first lamp bead 207 and a second tin welding layer 210 of a second lamp bead 208 with a first conducting layer 201 and a second conducting layer 202 according to the arrangement distance and the welding positions to prepare the first conducting layer 201 and the second conducting layer 202 containing the lamp beads, and then coating ink on the rest positions of a circuit layer 205 to form an ink layer 206;
s3: firstly, electrically welding a control board inside a stainless steel ladle frame 4 with a base layer respectively, then putting solid insulating PVB glue between a first conducting layer 201 of a lower glass layer 102 and a second conducting layer 202 of an upper glass layer 101, softening the solid insulating PVB glue, then pressing and covering the second conducting layer 202 of the upper glass layer 101 on the surface of the first conducting layer 201 of the lower glass layer 102, enabling a first lamp bead 207 and a second lamp bead 208 to be staggered and corresponding to each other, after the softened solid insulating PVB is gelled and solidified, adhering and fixing the upper glass layer 101 and the lower glass layer 102 to form a PVB film layer 3, and cutting the extruded solid insulating PVB glue to prepare a semi-finished product of the photoelectric glass;
s4: and (3) encapsulating one ends of the glass layer 1 and the photoelectric layer 2 by using a stainless steel ladle frame 4 to prepare the photoelectric glass.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (9)

1. Photoelectric glass with film pasting circuit comprises a glass layer (1) and a photoelectric layer (2), and is characterized in that: the photoelectric layer (2) is arranged inside the glass layer (1);
the glass layer (1) comprises an upper glass layer (101) and a lower glass layer (102), the photoelectric layer (2) comprises a first conducting layer (201) and a second conducting layer (202), the first conducting layer (201) is fixedly connected with the upper surface of the lower glass layer (102), the second conducting layer (202) is fixedly connected with the bottom wall of the upper glass layer (101), the first conducting layer (201) and the second conducting layer (202) respectively comprise a base layer (203), a transparent PET layer (211) and a transparent PVB glue layer (212), the transparent PVB glue layer (212) is bonded with the glass layer (1), the base layer (203) and the transparent PVB glue layer (212) are connected through the transparent PET layer (211), an impression groove (204) is formed in the surface of the base layer (203), a circuit layer (205) is filled in the impression groove (204), and a plurality of first lamp beads (207) are uniformly arranged at the top of the first conducting layer (201), a plurality of second lamp beads (208) are uniformly arranged at the bottom of the second conducting layer (202), two ink layers (206) are coated at positions of the circuit layer (205) except the first lamp beads (207) and the second lamp beads (208), and a PVB film layer (3) is arranged between the first conducting layer (201) and the second conducting layer (202).
2. The photoelectric glass with the film-pasted circuit as claimed in claim 1, wherein: the photoelectric layer is characterized in that stainless steel ladle frames (4) are arranged at two ends of the glass layer (1) and the photoelectric layer (2), two control panels (5) are arranged inside the stainless steel ladle frames (4), and the four control panels (5) are connected with a base layer (203) of the photoelectric layer (2) through wires.
3. The photoelectric glass with the film-pasted circuit as claimed in claim 1, wherein: the glass layer (1) is made of common glass or photoelectric glass materials, the thickness of the upper glass layer (101) is equal to that of the lower glass layer (102), and the thickness dimension is 1-20 mm.
4. The photoelectric glass with the film-pasted circuit as claimed in claim 1, wherein: the base layer (203) is made of a conductive UC glue material, and the thickness of the base layer (203) is 0.05-3 mm.
5. The photoelectric glass with the film-pasted circuit as claimed in claim 1, wherein: the circuit layer (205) adopts the conductive paste material to make, and the thickness of circuit layer (205) is 6-30um, and circuit layer (205) line interval is 30-1000um, and circuit layer (205) line width is 6-200 um. Remarking: the circuit is formed by pressing a circuit groove out through a well opened roller die and then scraping the conductive material back and forth for multiple times through physics.
6. The photoelectric glass with the film-pasted circuit as claimed in claim 1, wherein: the first lamp beads (207) on the surface of the first conducting layer (201) and the second lamp beads (208) on the surface of the second conducting layer (202) are arranged in a staggered mode at equal intervals, the interval between every two adjacent lamp beads in each row is 10-100mm, and the interval between every two adjacent lamp beads in each column is 10-100 mm.
7. The photoelectric glass with the film-pasted circuit and the production process thereof according to claim 1, wherein the production process comprises the following steps: the bottom both sides of first lamp pearl (207) are provided with first tin solder layer (209), and with circuit layer (205) electric welding of first conducting layer (201), the both sides parcel of second lamp pearl (208) has second tin solder layer (210), and the top of second tin solder layer (210) and circuit layer (205) electric welding of second conducting layer (202).
8. The photoelectric glass with the film-pasted circuit and the production process thereof according to claim 1, wherein the production process comprises the following steps: the first lamp bead (207) and the second lamp bead (208) are both arranged by adopting LED film-pasted lamp beads or common LED lamp beads containing a microprocessor, and the light-emitting directions of the first lamp bead (207) and the second lamp bead (208) are both arranged in the same direction, and the directions are arranged upwards or downwards.
9. A process for producing an electro-optical glass with a film-attached circuit using any one of claims 1 to 8, characterized in that: the method comprises the following steps:
s1: firstly, brushing PVB glue and PET glue on the surfaces of an upper glass layer (101) and a lower glass layer (102) to form a transparent PVB glue layer (212) and a transparent PET layer (211), then coating a layer of conductive UC glue on the surface of the transparent PET layer (211), solidifying to form a flat base layer (203), then engraving a circuit diagram to be embossed on the surface of a mold, enabling the engraved circuit diagram to be displayed in a protruding mode, then embossing the surface of the base layer (203), embossing circuit grains to form an embossing groove (204), filling prepared conductive slurry into the circuit grains in the embossing groove (204), scraping excessive conductive slurry, and drying to form a circuit layer (205);
s2: respectively welding a first tin welding layer (209) of a first lamp bead (207) and a second tin welding layer (210) of a second lamp bead (208) with a first conducting layer (201) and a second conducting layer (202) according to the arrangement distance and the welding positions to prepare the first conducting layer (201) and the second conducting layer (202) containing the lamp beads, and then coating ink on the rest positions of a circuit layer (205) to form an ink layer (206);
s3: firstly, electrically welding a control board inside a stainless steel ladle frame (4) with a base layer respectively, then putting solid-state insulating PVB glue between a first conducting layer (201) of a lower glass layer (102) and a second conducting layer (202) of an upper glass layer (101), softening the solid-state insulating PVB glue, then pressing the second conducting layer (202) of the upper glass layer (101) on the surface of the first conducting layer (201) of the lower glass layer (102), enabling a first lamp bead (207) and a second lamp bead (208) to be staggered and corresponding to each other, after the softened solid-state insulating PVB is gelled and solidified, attaching and fixing the upper glass layer (101) and the lower glass layer (102) to form a PVB glue layer (3), and cutting off the extruded solid-state insulating PVB glue to prepare a photoelectric glass semi-finished product;
s4: and (3) encapsulating one end of the glass layer (1) and one end of the photoelectric layer (2) by using a stainless steel wrapping frame (4) to prepare the photoelectric glass.
CN202110447094.7A 2021-04-25 2021-04-25 Photoelectric glass with film-pasted circuit and production process Active CN113183566B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115576136A (en) * 2022-10-28 2023-01-06 陈旺寿 Glass-based backlight plate for Mini LED display and manufacturing method
CN116072014A (en) * 2023-01-16 2023-05-05 业成科技（成都）有限公司 Light source assembly, manufacturing method thereof and transparent display screen

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080284330A1 (en) * 2004-07-28 2008-11-20 Shinsuke Tachibana Light Emitting Module, and Method for Producing the Same
WO2012045949A1 (en) * 2010-09-27 2012-04-12 Saint-Gobain Glass France Method for providing electrical connection(s) in an encapsulated organic light-emitting diode device, and such an oled device
CN105541135A (en) * 2015-12-28 2016-05-04 太仓耀华玻璃有限公司 Double-layer vacuum LED (light-emitting diode) glass and preparation method thereof
CN105599398A (en) * 2015-12-28 2016-05-25 太仓耀华玻璃有限公司 LED (Light Emitting Diode) light-emitting laminated glass and preparations method of LED light-emitting laminated glass
CN207845494U (en) * 2018-02-09 2018-09-11 谊美吉斯光电科技（福建）有限公司 A kind of LED fluorescent glasses
CN209433749U (en) * 2018-09-29 2019-09-24 杭州亿奥光电有限公司 A kind of transparency LED glass display screen

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080284330A1 (en) * 2004-07-28 2008-11-20 Shinsuke Tachibana Light Emitting Module, and Method for Producing the Same
WO2012045949A1 (en) * 2010-09-27 2012-04-12 Saint-Gobain Glass France Method for providing electrical connection(s) in an encapsulated organic light-emitting diode device, and such an oled device
CN105541135A (en) * 2015-12-28 2016-05-04 太仓耀华玻璃有限公司 Double-layer vacuum LED (light-emitting diode) glass and preparation method thereof
CN105599398A (en) * 2015-12-28 2016-05-25 太仓耀华玻璃有限公司 LED (Light Emitting Diode) light-emitting laminated glass and preparations method of LED light-emitting laminated glass
CN207845494U (en) * 2018-02-09 2018-09-11 谊美吉斯光电科技（福建）有限公司 A kind of LED fluorescent glasses
CN209433749U (en) * 2018-09-29 2019-09-24 杭州亿奥光电有限公司 A kind of transparency LED glass display screen

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115576136A (en) * 2022-10-28 2023-01-06 陈旺寿 Glass-based backlight plate for Mini LED display and manufacturing method
CN115576136B (en) * 2022-10-28 2023-04-14 陈旺寿 Glass-based backlight plate for Mini LED display and manufacturing method
CN116072014A (en) * 2023-01-16 2023-05-05 业成科技（成都）有限公司 Light source assembly, manufacturing method thereof and transparent display screen

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