CN205231116U - LED photoelectricity display module - Google Patents
LED photoelectricity display module Download PDFInfo
- Publication number
- CN205231116U CN205231116U CN201521081743.2U CN201521081743U CN205231116U CN 205231116 U CN205231116 U CN 205231116U CN 201521081743 U CN201521081743 U CN 201521081743U CN 205231116 U CN205231116 U CN 205231116U
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- China
- Prior art keywords
- display module
- led
- conducting wire
- photoelectricity
- base material
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Illuminated Signs And Luminous Advertising (AREA)
Abstract
The utility model is suitable for a photoelectricity shows and the lighting technology field, provides a LED photoelectricity display module, can show glass, photoelectricity demonstration plastics, photoelectricity demonstration film etc. For photoelectricity, including substrate and panel, the substrate upper surface is an alligatoring face, the printing of alligatoring face has transparent conducting wire and transparent electrode, transparent electrode with the conducting wire switch -on, transparent electrode surface point has the conducting resin, then the face -down bonding has LED wafer and a driver chip nude film, power and signal line have been drawn forth to the conducting wire, the printing is served to the drawing of power and signal line has the conductive silver paste, then the leaded formation of high temperature pressfitting control port, space intussuseption between substrate and the board is filled with anti -oxidant glue. The utility model discloses directly print transparent circuit on the substrate, then flip -chip LED wafer and driver chip nude film for whole product thickness is thinner, and the transparency is high, shows abundant in contently, need not technologies such as etching, and specially adapted photoelectricity shows the glass manufacturing.
Description
Technical field
The utility model belongs to photoelectric display and lighting technical field, particularly relates to a kind of LED photovoltaic display module.
Background technology
Along with Conventional glass goods are at the extensive application in field and the developments of LED technology such as building curtain wall, decoration, the window displaying of all kinds of kitchens, house decorations, Conventional glass goods and LED technology combined, makes photoelectric display glass, become market demand trend.
The general the following two kinds method of processing method of LED photovoltaic glass:
First, conduction plated film (ITO) glass plate etches by the mode of etching the circuit designed, by LED, power supply and signal lead by the laminating of conducting resinl high temperature on the line, then cover face glass and photoelectric glass is made in two pieces of glass clampings, the method equipment investment is large, and emission is seriously polluted, employing be that plated film electro-conductive glass production efficiency low cost is high;
Second, first on transparent conductive film, carve by the mode of etching the circuit designed, LED and lead-in wire are fitted on transparent membrane, then with two pieces of Conventional glass, film-clamp is synthesized photoelectric glass, the method equipment investment is large, will etch seriously polluted equally, high to the requirement of clamping glass, the restriction discomfort by conductive film is fit to do large scale fluorescent glass.
But these processing method input costs are high, and need to etch, contaminated environment is serious.
Utility model content
In view of the above problems, the purpose of this utility model is to provide a kind of LED photovoltaic display module, and this Product processing is simple, cost is lower, displaying contents is abundant.
The utility model adopts following technical scheme:
Described LED photovoltaic display module comprises base material and panel, described base material upper surface is the alligatoring face of hydrophily flat even, described alligatoring face is printed with transparent conducting wire and transparency electrode, described transparency electrode and described conducting wire are connected, described transparency electrode surface point has conducting resinl, then correspondence position flip chip bonding is connected to LED wafer and driving chip nude film, described conducting wire leads to power supply and holding wire, the exit of described power supply and holding wire is printed with conductive silver paste, then the leaded formation control port of high-temperature laminating, described control port is used for being connected with control system, anti-oxidant glue is filled with in space between described base material and panel.
The beneficial effects of the utility model are: this product adopts inkjet technology, the graphics circuitry that directly printing and making is transparent on the substrate through roughening treatment, comprise electrically conducting transparent circuit and transparency electrode, then LED wafer and driving chip nude film on flip chip bonding, the utility model is in conjunction with LED High Efficiency Luminescence, the feature of low-carbon energy-saving, interiors of products is sent and dazzles beautiful brilliance, this product is specially adapted to Conventional glass goods, and mix LED control system, not only can replace traditional LED display and brightening product and not affect the attractive in appearance of building, also can change the unicity of Conventional glass goods on using, at glass curtain wall, glass partition, escalator handrail, showcase realizes character and graphic, the quiet dynamic combination such as video image, the multiple display modes that color is beautiful, present perfect decorative effect, product has broad application prospects in building decoration advertisement media industry.
Accompanying drawing explanation
Fig. 1 is the sectional view of the LED photovoltaic display module that the utility model embodiment provides;
Fig. 2 is the position relationship of LED wafer, driving chip nude film and transparency electrode;
Fig. 3 is the vertical view of the LED photovoltaic display module that the utility model embodiment provides;
Fig. 4 is FPC winding displacement pressing schematic diagram.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
In order to technical scheme described in the utility model is described, be described below by specific embodiment.
Fig. 1 shows the structure of the LED photovoltaic display module that the utility model embodiment provides, and illustrate only the part relevant to the utility model embodiment for convenience of explanation.
As Figure 1-3, the LED photovoltaic display module that the present embodiment provides comprises base material 1 and panel 2, described base material upper surface is the alligatoring face 3 of hydrophily flat even, described alligatoring face is printed with transparent circuitry, comprise transparent conducting wire 4 and transparency electrode 5, described transparency electrode 5 is connected with described conducting wire 4, described transparency electrode 5 surface point has conducting resinl 6, then flip chip bonding is connected to LED wafer 7 and driving chip nude film 8, described conducting wire 4 leads to power supply and holding wire 9, the exit of described power supply and holding wire 9 is printed with conductive silver paste 10, then the leaded 11 formation control ports of high-temperature laminating, described control port is used for being connected with control system, anti-oxidant glue 12 is filled with in space between described base material 1 and panel 2.Wherein said lead-in wire is preferably FPC winding displacement, and FPC winding displacement quantity and position are not limit, and according to actual cabling needs, can put and arrange suitable quantity at the correct position of module edge.
In the present embodiment, described base material is identical with panel material, can be transparent or semitransparent simple glass plate, plastic plate or film, is specially adapted to processing LED photovoltaic display glass.With the glass plate of routine for base material, and show to carry out roughening treatment at base material, then nanometer conductive material (such as Nano Silver, Nanometer Copper) is made special conductive ink, combine the dull and stereotyped mode printed with inkjet technology and print pre-designed transparent circuitry on Conventional glass plate, comprise conducting wire, transparency electrode etc.; Or employing nanometer conductive material, make special electrically conductive ink, pass through silk-screen printing technique, on the glassware of routine, print pre-designed transparent circuitry, through high temperature or photocuring, make transparent conductive silver paste or copper slurry rapid curing capable become silver foil or Copper Foil, thus obtain required circuit at Conventional glass product surface.The conducting wire obtained like this is conductive nano circuit, and transparency electrode is nanometer transparent electrode.Described transparency electrode is used for face-down bonding LED wafer and driving chip nude film, described transparent conducting wire connects described transparency electrode, and draw formation power supply and holding wire in side, described power supply and holding wire, as a part for conducting wire, are equally also printed by conductive ink or electrically conductive ink to form.
It should be noted that, the present embodiment is that the electric ink/ink such as Nano Silver or Nanometer Copper is printed to transparent circuitry, in order to ensure caking property, needing to need to carry out roughening treatment at the upper surface of described base material, obtaining the alligatoring face of hydrophily flat even.Circuit has been printed and after solidifying, after then adopting reverse installation process the transparency electrode of electrode alignment correspondence position to be fitted LED wafer, driving chip nude film, then has been welded and solidify.LED wafer is the core component of LED chip internal illumination, generally when producing LED chip, the electrode of LED wafer upward, then support is drawn out to downwards with wire, finally be packaged into LED, pin down, therefore be all at present directly using LED as display elementary cell, but in the present embodiment, in order to reduce product thickness, increase transparency and display density, directly LED chip is inverted, by the electrode welding of LED wafer on the transparent electrodes, need during welding to put conducting resinl on the transparent electrodes, such as conductive silver glue.Same corresponding driving chip, only takes out nude film wherein, very thin thickness, by driving chip nude film reversing welding on the transparent electrodes.It is very thin that such integrated circuit can do, and be all transparent, do not affect sight line.In the present embodiment, described LED wafer can be monochromatic or polychrome, arranges according to actual displayed demand.
In addition, as a kind of preferred implementation, when outdoor application, panel upper surface can accumulate some dust, impurity etc., affect LED luminescence display effect, for this reason, in this optimal way, at the upper surface of described panel 2, one deck is also set for self-cleaning coating 21,, when impurity, dust etc. run into titanium dioxide film, can degradation reaction be there is in such as titanium dioxide film, ensure that the clean degree of panel surface, do not affect LED photovoltaic display effect.
Composition graphs 4, adopting the mode of silk screen printing to be coated with in silver slurry is imprinted on the power supply of glazing substrates and the exit of signal, namely on the exit of power supply and holding wire 9, conductive silver paste 10 is printed, by paster pressing machine, FPC winding displacement 11 is pasted on a glass, formed the control port that can be connected with external control system by high-temperature laminating in glass plate both sides, provide power supply and control signal by this control port to LED photovoltaic display glass; Then above described glass plate and circuit-line, anti-oxidant glue 12 is smeared, circuit surface is sealed, air is stoped to enter the oxidation preventing circuit, LED chip, IC, finally cover face glass again, two blocks of glass clamp synthesis photoelectric display glass, the utility model processing method does not need expensive equipment, does not also need glass pre-metallization and etching, and technique is advanced, simple to operate, pollution-free, cost is low, be easy to realize industrialization.
Can also double glazing be made in addition, concrete, use high strength air-tightness compound binding agent upper and lower two sheet glass and the aluminium alloy sealed parting strip 13 including drier to be bondd formation double glazing.
Certainly LED photovoltaic display polymethyl methacrylate, LED photovoltaic display Ya Like plate, LED photovoltaic display film etc. can also be processed according to said method.
To sum up, LED wafer combines with some Common transparent or translucent material by the utility model, some LED photovoltaic display modules can be made into, be particularly suitable for combining closely with Conventional glass, utilize the performances such as Conventional glass goods printing opacity, heat radiation, insulation as the carrier of LED, overcome common pcb board, the weak heat-dissipating of aluminium base, opaque shortcoming; Both can retain the advantage of glass, and change the unicity of current Conventional glass goods on using, the special-effect of Conventional glass goods internal illumination can be increased again.Conventional glass goods can be made after installing LED control system additional to show picture and text change and the video effect of multicolour, promote diversity in practical application of Conventional glass goods and artistry, make both fashion novel, the photoelectric display glass of energy-conserving and environment-protective again, the application making it wider and building and ornament materials and novel advertisement media field, have good social value and commercial value.The utility model is compared with existing correlation technique, and advanced technology, technique are simple, energy-conserving and environment-protective, and equipment investment is few; And easy to process, easy industrialization, products application prospect is widely.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (7)
1. a LED photovoltaic display module, it is characterized in that, comprise base material and panel, described base material upper surface is the alligatoring face of hydrophily flat even, described alligatoring face is printed with transparent conducting wire and transparency electrode, described transparency electrode and described conducting wire are connected, described transparency electrode surface point has conducting resinl, then correspondence position flip chip bonding is connected to LED wafer and driving chip nude film, described conducting wire leads to power supply and holding wire, the exit of described power supply and holding wire is printed with conductive silver paste, then the leaded formation control port of high-temperature laminating, described control port is used for being connected with control system, anti-oxidant glue is filled with in space between described base material and panel.
2. LED photovoltaic display module as claimed in claim 1, is characterized in that, be also provided with aluminium alloy sealed parting strip between described base material and face plate edge.
3. LED photovoltaic display module as claimed in claim 1, it is characterized in that, described base material and panel are glass, plastic plate or film.
4. LED photovoltaic display module as described in any one of claim 1-3, is characterized in that, described panel upper surface is also provided with one deck for self-cleaning coating.
5. LED photovoltaic display module as claimed in claim 4, it is characterized in that, described coating is TiO
2film.
6. LED photovoltaic display module as claimed in claim 1, it is characterized in that, described lead-in wire is FPC flexible PCB winding displacement.
7. LED photovoltaic display module as claimed in claim 1, it is characterized in that, described conducting wire is nanometer transparent conducting wire, and described transparency electrode is nanometer transparent electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521081743.2U CN205231116U (en) | 2015-12-22 | 2015-12-22 | LED photoelectricity display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521081743.2U CN205231116U (en) | 2015-12-22 | 2015-12-22 | LED photoelectricity display module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205231116U true CN205231116U (en) | 2016-05-11 |
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ID=55906162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521081743.2U Expired - Fee Related CN205231116U (en) | 2015-12-22 | 2015-12-22 | LED photoelectricity display module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205231116U (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105913775A (en) * | 2016-06-29 | 2016-08-31 | 深圳市联建光电股份有限公司 | Novel LED (light-emitting diode) transparent display screen and manufacturing method thereof |
| CN106683579A (en) * | 2016-12-01 | 2017-05-17 | 长沙信元电子科技有限公司 | Integrated LED display panel |
| CN107547042A (en) * | 2017-09-30 | 2018-01-05 | 丁文兰 | A kind of energy-saving circuit system and intelligent building glass |
| CN108374509A (en) * | 2018-04-18 | 2018-08-07 | 深圳中润光电技术股份有限公司 | A kind of novel and multifunctional glass curtain wall |
| CN109270716A (en) * | 2018-11-22 | 2019-01-25 | 京东方科技集团股份有限公司 | A kind of binding method of display device, display panel and display device |
| CN109461386A (en) * | 2019-01-04 | 2019-03-12 | 京东方科技集团股份有限公司 | Display device |
| CN109904295A (en) * | 2019-03-21 | 2019-06-18 | 京东方科技集团股份有限公司 | A kind of LED component and preparation method thereof, display panel |
| CN109973838A (en) * | 2019-04-04 | 2019-07-05 | 固安翌光科技有限公司 | A kind of LED atmosphere lamp |
| CN110415620A (en) * | 2019-08-19 | 2019-11-05 | 厦门福相科技有限公司 | A kind of transparence display mould group and its manufacturing method |
| CN110459142A (en) * | 2019-08-19 | 2019-11-15 | 厦门福相科技有限公司 | A kind of transparence display mould group and its manufacturing method |
| WO2020147212A1 (en) * | 2019-01-16 | 2020-07-23 | 深圳市华星光电半导体显示技术有限公司 | Led display screen module and display device |
| CN111863833A (en) * | 2019-04-30 | 2020-10-30 | 云谷（固安）科技有限公司 | Driving backboard structure, display panel and manufacturing method of driving backboard structure |
| CN112562529A (en) * | 2020-12-24 | 2021-03-26 | 赵泽宇 | Manufacturing process of transparent glass display screen |
| JP2021518586A (en) * | 2018-03-27 | 2021-08-02 | シモニックス ゲーエムベーハー | Transparent display device |
-
2015
- 2015-12-22 CN CN201521081743.2U patent/CN205231116U/en not_active Expired - Fee Related
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105913775A (en) * | 2016-06-29 | 2016-08-31 | 深圳市联建光电股份有限公司 | Novel LED (light-emitting diode) transparent display screen and manufacturing method thereof |
| CN105913775B (en) * | 2016-06-29 | 2019-06-18 | 深圳市联建光电股份有限公司 | A kind of novel LED transparent display screen and preparation method thereof |
| CN106683579A (en) * | 2016-12-01 | 2017-05-17 | 长沙信元电子科技有限公司 | Integrated LED display panel |
| CN107547042A (en) * | 2017-09-30 | 2018-01-05 | 丁文兰 | A kind of energy-saving circuit system and intelligent building glass |
| CN107547042B (en) * | 2017-09-30 | 2023-11-07 | 丁文兰 | Energy-saving circuit system and intelligent building glass |
| JP7079854B2 (en) | 2018-03-27 | 2022-06-02 | シモニックス ゲーエムベーハー | Transparent display device |
| JP2021518586A (en) * | 2018-03-27 | 2021-08-02 | シモニックス ゲーエムベーハー | Transparent display device |
| CN108374509A (en) * | 2018-04-18 | 2018-08-07 | 深圳中润光电技术股份有限公司 | A kind of novel and multifunctional glass curtain wall |
| CN109270716A (en) * | 2018-11-22 | 2019-01-25 | 京东方科技集团股份有限公司 | A kind of binding method of display device, display panel and display device |
| CN109461386A (en) * | 2019-01-04 | 2019-03-12 | 京东方科技集团股份有限公司 | Display device |
| WO2020147212A1 (en) * | 2019-01-16 | 2020-07-23 | 深圳市华星光电半导体显示技术有限公司 | Led display screen module and display device |
| CN109904295B (en) * | 2019-03-21 | 2020-06-09 | 京东方科技集团股份有限公司 | LED device, manufacturing method thereof and display panel |
| CN109904295A (en) * | 2019-03-21 | 2019-06-18 | 京东方科技集团股份有限公司 | A kind of LED component and preparation method thereof, display panel |
| CN109973838A (en) * | 2019-04-04 | 2019-07-05 | 固安翌光科技有限公司 | A kind of LED atmosphere lamp |
| CN111863833A (en) * | 2019-04-30 | 2020-10-30 | 云谷（固安）科技有限公司 | Driving backboard structure, display panel and manufacturing method of driving backboard structure |
| CN111863833B (en) * | 2019-04-30 | 2024-03-29 | 成都辰显光电有限公司 | Driving back plate structure, display panel and manufacturing method of driving back plate structure |
| CN110459142A (en) * | 2019-08-19 | 2019-11-15 | 厦门福相科技有限公司 | A kind of transparence display mould group and its manufacturing method |
| CN110415620A (en) * | 2019-08-19 | 2019-11-05 | 厦门福相科技有限公司 | A kind of transparence display mould group and its manufacturing method |
| CN112562529A (en) * | 2020-12-24 | 2021-03-26 | 赵泽宇 | Manufacturing process of transparent glass display screen |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160511 Termination date: 20161222 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |