Disclosure of Invention
Based on the above, it is necessary to provide a light source assembly, a manufacturing method thereof and a transparent display screen aiming at the problem of poor fixing effect of an LED bearing film in a transparent LED display product.
According to one aspect of the present application, there is provided a light source assembly for a display screen including a substrate, the light source assembly comprising: the bearing film is provided with a first surface and a second surface which are opposite, and a plurality of LED luminous sources are arranged on the first surface; the bonding blocks are arranged on the second surface and are used for fixing the bearing film on the substrate; wherein, the orthographic projection of the bonding block on the second surface is overlapped with the orthographic projection of the LED luminous source on the second surface at least partially.
In some embodiments, a plurality of LED light sources are arranged on the first surface at intervals, and a plurality of adhesive blocks are arranged on the second surface; the number of the LED light-emitting sources is equal to that of the bonding blocks, and the LED light-emitting sources and the bonding blocks are arranged in one-to-one correspondence.
In some embodiments, the forward projection shape of the bonding block on the second surface is the same as the forward projection shape of the LED light source on the second surface.
In some embodiments, the orthographic projection of the bonding pad on the second surface is entirely within the orthographic projection of the LED light source on the second surface; or the orthographic projection part of the bonding block on the second surface extends to the outside of the orthographic projection of the LED light-emitting source on the second surface, and in the extending direction, the orthographic projection extension length of the bonding block on the second surface is smaller than or equal to 0.3mm.
According to another aspect of the present application, there is also provided a method for manufacturing a light source assembly, including the steps of: providing a carrier film having opposed first and second surfaces; arranging a plurality of LED luminous sources on the first surface; a plurality of bonding blocks are arranged on the second surface and are used for fixing the bearing film on a substrate; wherein, the orthographic projection of the bonding block on the second surface is overlapped with the orthographic projection of the LED luminous source on the second surface at least partially.
In some embodiments, the disposing a plurality of bonding pads on the second surface comprises: gluing on the second surface to form an adhesive block on the second surface; wherein the glued area at least partially overlaps with the orthographic projection of the LED light source on the second surface.
In some embodiments, the method further comprises: providing a transfer film, wherein a plurality of adhesive blocks are arranged on the transfer film; the disposing a plurality of bonding blocks on the second surface includes: attaching the transfer film to the bearing film; wherein, one side of the transfer film provided with the adhesive block is arranged opposite to the second surface of the bearing film; and applying pressure to the transfer film towards the bearing film so as to transfer the bonding block to the bearing film.
In some embodiments, the attaching the transfer film to the carrier film comprises: providing an alignment jig, wherein a plurality of positioning columns are arranged on the alignment jig; a plurality of first positioning holes are formed in the bearing film, and a plurality of second positioning holes are formed in the transfer film; the first positioning holes and the positioning columns are arranged in one-to-one correspondence, and the second positioning holes and the positioning columns are arranged in one-to-one correspondence; aligning the first positioning hole with the positioning column, inserting the positioning column into the first positioning hole, and attaching the bearing film to the alignment jig; and aligning the second positioning hole with the positioning column, inserting the positioning column into the second positioning hole, and attaching the positioning column to the bonding block on the transfer film and the second surface of the bearing film.
In some embodiments, the attaching the transfer film to the carrier film comprises: setting a first positioning mark on the bearing film and setting a second positioning mark on the transferring film; and aligning the first positioning mark with the second positioning mark, and enabling the transfer film to be close to the bearing film.
According to another aspect of the present application, there is also provided a transparent display screen, including: a substrate; and the light source component is characterized in that the bearing film is fixed on the substrate through the bonding block; wherein, the base plate and the bearing film are transparent.
The application provides a light source subassembly sets up the bonding piece on being used for carrying the carrier film of LED luminous source, it is fixed with carrier film and base plate to utilize the bonding piece, and bonding piece and LED luminous source are located the opposite both sides of carrier film respectively, the orthographic projection of bonding piece on the second surface overlaps with the orthographic projection of LED luminous source at least partially at the second surface, the region that the bonding piece occupy on the carrier film and the region that the LED luminous source occupy overlap at least partially, so, the setting of guaranteeing bonding piece does not block light transmission of light source subassembly or under the less circumstances of influence to light transmission of light source subassembly, increased the bonding area, thereby promote the fixed effect of carrier film and base plate.
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.
In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
The liquid crystal display panel is widely applied to display products such as outdoor display screens, televisions, notebook computers, desktop displays, vehicle displays, wearable devices, mobile phones and the like. Among them, transparent LED displays are rapidly developing. In the current transparent LED display, the LED film with the LED light source arranged is usually fixed on the glass substrate by using a semitransparent adhesive tape, and in order to prevent the adhesive tape from affecting the transparent display effect, the adhesive tape is usually adhered to the four vertex angles of the LED film, so that the fixing effect of the adhering mode is poor, and the LED film is easy to fall from the glass substrate after the adhering is completed.
However, if the whole surface rubberizing mode is adopted to paste the LED film on the glass substrate, on one hand, the whole surface adhesive layer can produce large-area shielding for the glass substrate, thereby influencing the transparent display effect; on the other hand, after the whole surface of the LED film is stuck, the adhesive layer overflowed from the edge is required to be cut off, so that the process steps are increased, and the LED film is easy to damage.
In order to solve the problems, the application provides a light source assembly, including bearing the weight of the membrane, one side surface that bears the weight of the membrane is equipped with a plurality of LED light emitting sources, the position that corresponds the LED light emitting source on the opposite side surface is equipped with the bonding piece, based on this, when the light source assembly is applied to transparent display product, can be according to the quantity and the region that the position adjustment of LED light emitting source was bonded, make full use of LED light emitting source has produced the region that shelters from, with do not increase and shelter from the area or increase the less circumstances of range, increase bonding area as far as possible, thereby ensure good fixed effect, can not influence transparent display effect again simultaneously.
Fig. 1 shows a schematic structural diagram of a light source assembly according to an embodiment of the present application. Fig. 2 shows a schematic view of the light source assembly of fig. 1 from another perspective. Fig. 3 shows a schematic view of the light source assembly of fig. 1 from another view.
Referring to fig. 1 to 3, a light source assembly according to an embodiment of the present application is used for a display screen, and the display screen includes a substrate. The light source assembly comprises a carrier film 10 and a number of adhesive blocks 20. The bearing film 10 is provided with a first surface 11 and a second surface 12 which are opposite, and a plurality of LED luminous sources 13 are arranged on the first surface 11; the plurality of bonding blocks 20 are arranged on the second surface 12, and the bonding blocks 20 are used for fixing the carrier film 10 on the substrate; wherein the front projection of the adhesive patch 20 on the second surface 12 at least partially overlaps the front projection of the LED light source 13 on the second surface 12.
In the light source assembly provided in this embodiment, the adhesive block 20 is disposed on the carrier film 10 for carrying the LED light source 13, the carrier film 10 is fixed to the substrate by using the adhesive block 20, and the adhesive block 20 and the LED light source 13 are respectively located on two opposite sides of the carrier film 10, where the orthographic projection of the adhesive block 20 on the second surface 12 and the orthographic projection of the LED light source 13 on the second surface 12 at least partially overlap, that is, the area occupied by the adhesive block 20 on the carrier film 10 and the area occupied by the LED light source 13 at least partially overlap, so that the adhesive area is increased under the condition that the setting of the adhesive block 20 does not block the light propagation of the light source assembly or has less influence on the light propagation of the light source assembly, thereby improving the fixing effect of the carrier film 10 and the substrate.
The light source assembly provided in this embodiment can be used for a transparent display screen or a non-transparent display screen, when the light source assembly is applied to the transparent display screen, because the bonding block 20 and the LED light source 13 are respectively located at two opposite sides of the carrier film 10, and the orthographic projection of the bonding block 20 on the second surface 12 and the orthographic projection of the LED light source 13 on the second surface 12 are at least partially overlapped, the setting of the bonding block 20 can not increase the shielding area or increase the width less, thereby ensuring good transparent display effect, and meanwhile, the bonding area can be fully increased according to the number and the positions of the LED light sources 13, thereby ensuring good fixing effect.
The adhesive block 20 may be made of a water-based adhesive (emulsion type), an oil-based adhesive (solvent type), etc., such as a Hot Melt Pressure Sensitive Adhesive (HMPSA), an Acrylic adhesive (Acrylic), a Silicone adhesive (Silicone), or a rubber type double sided adhesive.
Alternatively, the thickness of the single adhesive block 20 is smaller than that of the LED light source 13, and thus, the thickness of the light source assembly can be made smaller.
In some embodiments, the first surface 11 is provided with a plurality of LED light sources 13 at intervals, and the second surface 12 is provided with a plurality of adhesive blocks 20; the number of the LED light sources 13 is equal to that of the bonding blocks 20, and the plurality of LED light sources 13 are arranged in one-to-one correspondence with the plurality of bonding blocks 20. In this way, the occupied area of the LED light source 13 can be fully utilized, and the bonding area of the bonding block 20 can be increased, so that the fixing effect can be improved while the display effect is not affected.
In other embodiments, the number of LED light sources 13 is less than the number of adhesive blocks 20. Thus, the material used for the adhesive block 20 can be saved while the adhesive area is ensured to be large. Further, one LED light source 13 may be provided with a plurality of adhesive blocks 20 correspondingly.
Optionally, the orthographic projection shape of the adhesive block 20 on the second surface 12 is the same as the orthographic projection shape of the LED light source 13 on the second surface 12. Accordingly, the adhesion area can be maximized without increasing the shielding area for transparent display.
In an alternative embodiment, the front projection of the adhesive patch 20 on the second surface 12 is entirely within the front projection of the LED light source 13 on the second surface 12. It will be appreciated that the orthographic projection of the bonding pad 20 on the second surface 12 is entirely within the orthographic projection of the LED light source 13 on the second surface 12, including that the orthographic projection area of the bonding pad 20 on the second surface 12 is equal to the orthographic projection area of the LED light source 13 on the second surface 12, and that the orthographic projection area of the bonding pad 20 on the second surface 12 is smaller than the orthographic projection area of the LED light source 13 on the second surface 12. By arranging the adhesive block 20 in the orthographic projection of the second surface 12, all the adhesive blocks are positioned in the orthographic projection of the LED light source 13 on the second surface 12, the arrangement of the adhesive block 20 can be ensured not to increase the shielding area for transparent display. On the basis, when the orthographic projection area of the bonding block 20 on the second surface 12 is equal to the orthographic projection area of the LED light emitting source 13 on the second surface 12, the bonding area can be maximized; when the orthographic projection area of the bonding block 20 on the second surface 12 is smaller than the orthographic projection area of the LED light source 13 on the second surface 12, a certain space can be provided for the shape of the bonding block 20, so as to prevent the bonding block 20 from overflowing the orthographic projection range of the LED light source 13 on the second surface 12 after being subjected to the extrusion force.
In another alternative embodiment, the forward projection of the adhesive 20 on the second surface 12 extends beyond the forward projection of the LED light source 13 on the second surface 12, and in this direction of extension, the forward projection of the adhesive 20 on the second surface 12 extends for a length of less than or equal to 0.3mm. Illustratively, the orthographic projection of the bonding block 20 on the second surface 12 is a first quadrangle, the orthographic projection of the LED light emitting source 13 on the second surface 12 is a second quadrangle, the length of the first quadrangle is a1, the width of the first quadrangle is b1, the length of the second quadrangle is a2, the width of the second quadrangle is b2, a2-a1 is less than or equal to 0.6mm, and b2-b1 is less than or equal to 0.6mm. In this way, the shielding area of the adhesive block 20 can be reduced.
Based on the same purpose, the application also provides a manufacturing method of the light source assembly.
Fig. 4 is a schematic operation diagram of a method for manufacturing a light source assembly according to an embodiment of the present application. Fig. 5 is a schematic operation diagram of a method for manufacturing a light source assembly according to another embodiment of the present application.
Referring to fig. 4 and 5, in an embodiment of the present application, a method for manufacturing a light source assembly includes the following steps:
providing a carrier film 10, the carrier film 10 having opposite first and second surfaces 11, 12;
a plurality of LED light sources 13 are arranged on the first surface 11;
a plurality of bonding blocks 20 are arranged on the second surface 12, and the bonding blocks 20 are used for fixing the carrier film 10 on the substrate; wherein the front projection of the adhesive patch 20 on the second surface 12 at least partially overlaps the front projection of the LED light source 13 on the second surface 12.
According to the manufacturing method of the light source assembly, the LED light emitting sources 13 and the bonding force are respectively arranged on the two opposite sides of the bearing film 10, and the orthographic projection of the bonding block 20 on the second surface 12 and the orthographic projection of the LED light emitting sources 13 on the second surface 12 are at least partially overlapped, so that the shielding area is not increased or the increasing amplitude is small in the arrangement of the bonding block 20, a good transparent display effect is ensured, and meanwhile, the bonding area can be fully increased according to the number and the positions of the LED light emitting sources 13, so that a good fixing effect is ensured.
Referring to fig. 4, in some embodiments, disposing the plurality of adhesive blocks 20 on the second surface 12 includes: gluing the second surface 12 to form an adhesive block 20 on the second surface 12; wherein the glued areas at least partly overlap with the orthographic projection of the LED light source 13 on the second surface 12. Illustratively, the accuracy of the spray area may be controlled by the nozzle bore design of the spray gun by spraying the glue material on the second surface 12 using the spray gun. The adhesive block 20 is formed by gluing the second surface 12, which is convenient and quick to operate.
Referring to fig. 5, in some embodiments, the method for manufacturing a light source module further includes providing a transfer film 30, where a plurality of adhesive blocks 20 are disposed on the transfer film 30; providing a plurality of adhesive blocks 20 on the second surface 12 includes attaching the transfer film 30 to the carrier film 10; wherein, the side of the transferring film 30 provided with the adhesive block 20 is arranged opposite to the second surface 12 of the bearing film 10; pressure is applied to the transfer film 30 toward the carrier film 10 to transfer the adhesive block 20 to the carrier film 10. Illustratively, the transfer film 30 may be a release film, and the release film may be peeled off as required after the adhesive block 20 is transferred to the carrier film 10. The arrangement of the plurality of adhesive blocks 20 can be completed quickly by adopting a transfer manner, thereby improving the working efficiency.
Alternatively, the pressure applied to the transfer film 30 toward the carrier film 10 may be applied by soft roller rolling, so that the pressure applied area is flexibly adjusted, and each area can be well attached.
Referring to fig. 5, in some embodiments, attaching transfer film 30 to carrier film 10 includes: providing an alignment jig 40, wherein a plurality of positioning columns 41 are arranged on the alignment jig 40; a plurality of first positioning holes 10a are provided in the carrier film 10, and a plurality of second positioning holes 30a are provided in the transfer film 30; wherein, the plurality of first positioning holes 10a are arranged in one-to-one correspondence with the plurality of positioning columns 41, and the plurality of second positioning holes 30a are arranged in one-to-one correspondence with the plurality of positioning columns 41; aligning the first positioning hole 10a with the positioning column 41, inserting the positioning column 41 into the first positioning hole 10a, and attaching the carrier film 10 to the alignment jig 40; the second positioning hole 30a is aligned with the positioning column 41, and the positioning column 41 is inserted into the second positioning hole 30a and is attached to the adhesive block 20 on the transfer film 30 and the second surface 12 of the carrier film 10. By the alignment jig 40, alignment between the carrier film 10 and the transfer film 30 is achieved, and the adhesive block 20 on the transfer film 30 can be transferred to a preset position on the carrier film 10, so that the accuracy of the position setting of the adhesive block 20 is improved.
In an exemplary embodiment, the alignment jig 40, the carrier film 10 and the transfer film 30 are all rectangular, two positioning columns 41 are disposed at intervals on the edge of the alignment jig 40, the number and positions of the first positioning holes 10a on the carrier film 10 correspond to those of the positioning columns 41, and the number and positions of the second positioning holes 30a on the transfer film 30 correspond to those of the positioning columns 41. In another exemplary embodiment, the alignment jig 40, the carrier film 10 and the transfer film 30 are all rectangular, four positioning columns 41 are arranged at intervals on the edge of the alignment jig 40, the four positioning columns 41 are respectively located at four top corners of the alignment jig 40, the number and positions of the first positioning holes 10a on the carrier film 10 correspond to those of the positioning columns 41, and the number and positions of the second positioning holes 30a on the transfer film 30 correspond to those of the positioning columns 41. Accordingly, the accuracy of alignment between the carrier film 10 and the transfer film 30 can be improved.
Alternatively, the shape of the positioning column 41 is a cylindrical shape, a triangular prism shape, a quadrangular prism shape, a pentagonal prism shape, or a combination of at least two thereof, and the shape of the first positioning hole 10a and the shape of the second positioning hole 30a are the same as the shape of the positioning column 41.
Fig. 6 is a schematic diagram illustrating alignment of the transfer film and the carrier film in an embodiment of the present application.
Referring to fig. 6, in some embodiments, attaching transfer film 30 to carrier film 10 includes: a first positioning mark 10b is provided on the carrier film 10, and a second positioning mark 30b is provided on the transfer film 30; the first positioning mark 10b is aligned with the second positioning mark 30b, and the transfer film 30 is brought close to the carrier film 10. The alignment between the carrier film 10 and the transfer film 30 is realized by the first positioning mark 10b and the second positioning mark 30b, so that the adhesive block 20 on the transfer film 30 can be transferred to the preset position on the carrier film 10, thereby improving the accuracy of the position setting of the adhesive block 20. In the process of aligning the first positioning mark 10b with the second positioning mark 30b, the alignment accuracy can be improved by means of CCD optical alignment.
Alternatively, the number and positional arrangement of the first positioning marks 10b and the second positioning marks 30b may refer to the number and positional arrangement of the positioning posts 41.
Fig. 7a to fig. 7g respectively show structural diagrams of the first positioning mark, the second positioning mark and the alignment state thereof in the embodiments of the present application (the diagrams of the first positioning mark, the second positioning mark, the alignment state of the first positioning mark and the second positioning mark are sequentially shown from left to right in the figures).
Referring to fig. 7a to 7g, alternatively, the shape of the first positioning mark 10b is a circle, square, prism, rectangle, cross, and the shape of the second positioning mark 30b is the same as or matches the shape of the first positioning mark 10 b. The first positioning mark 10b may be disposed on the carrier film 10 by using an ink printing method, and the second positioning mark 30b may be disposed on the transfer film 30 by using an ink printing method or a half-cut score line of a punch press.
Illustratively, when the shape of the first positioning mark 10b is a circle, the shape of the second positioning mark 30b may be set to be a circle or a ring; the shape of the first positioning mark 10b is polygonal, and the shape of the second positioning mark 30b may be provided in a polygonal ring shape; the first positioning mark 10b has a quadrilateral shape, and the second positioning mark 30b has a "" shape or "" shape.
Based on the same purpose, the application also provides a transparent display screen, which comprises a substrate and the light source assembly in the embodiment, wherein the bearing film of the light source assembly is fixed on the substrate through an adhesive block; wherein, the substrate and the carrier film are transparent. Based on this, can be according to the quantity and the regional that the bonding piece was bonded of position adjustment of LED luminous source, make full use of LED luminous source has produced the region that shelters from to under the circumstances that does not increase and shelter from the area or increase the range less, increase the bonding area as far as possible, thereby ensure good fixed effect, can not influence transparent display effect again simultaneously.
In some embodiments, the transparent display further comprises a circuit board, and the LED light source is electrically connected to the circuit board. Optionally, the transparent display screen further comprises a flexible circuit board, and the LED light-emitting source is connected with the circuit board through the flexible circuit board.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.