CN115558432A - Directional conductive film based on liquid metal, and preparation and use methods thereof - Google Patents
Directional conductive film based on liquid metal, and preparation and use methods thereof Download PDFInfo
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- CN115558432A CN115558432A CN202211258013.XA CN202211258013A CN115558432A CN 115558432 A CN115558432 A CN 115558432A CN 202211258013 A CN202211258013 A CN 202211258013A CN 115558432 A CN115558432 A CN 115558432A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/02—Copolymers with acrylonitrile
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2423/00—Presence of polyolefin
- C09J2423/005—Presence of polyolefin in the release coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/005—Presence of halogenated polymer in the release coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
Abstract
The invention discloses a directional conductive film based on liquid metal, and a preparation method and a use method thereof in the field of electronic packaging materials. The directional conductive film is conductive in a pressure direction and is insulated in a direction perpendicular to the pressure direction. The conductive particles are liquid metal gallium and alloys thereof. The preparation method aims at uniformly dispersing liquid metal, and different from the traditional solid conductive particles, the liquid metal in the preparation method is dispersed in an insulating colloid in a fluid form through different blending and stirring steps to form the directional conductive film with stable performance. The directional conductive film is mainly applied to the electronic packaging industry such as microelectronic packaging, chip packaging and the like.
Description
Technical Field
The invention particularly relates to a directional conductive film based on liquid metal and a preparation method thereof, belonging to the technical field of electronic packaging such as microelectronic packaging, chip packaging and the like.
Background
The directional conductive film is researched in the flip chip technology, is used for replacing the traditional tin-lead solder, and has the characteristics of unidirectional conductivity, fine pitch (Fine pitch) connection, good cohesiveness, low interconnection temperature, environmental protection, no lead and the like. The directional conductive film has different interconnections according to the effect of the packing density: the high connection density can be used for chip-to-glass substrate interconnection (COG) and chip-to-flexible substrate interconnection (COF), and the low connection density can be used for flexible substrate-to-glass substrate interconnection (FOG) and flexible substrate interconnection (FOF). The directional conductive film generally includes an insulating paste, conductive particles distributed in the insulating paste, and is uniformly coated between insulating substrates, which are upper and lower protective films of the directional conductive film. The existing directional conductive film follows the steps of particle mixing, coating, pre-pressing, bonding and the like, the pre-curing degree of the directional conductive film can influence the storage effect and the mechanical property after bonding, so the polymerization temperature during pre-curing and curing can influence the dispersion, the conductive effect, the physical property and other factors of the conductive particles. At present, the conventional directional conductive film mainly adopts solid conductive particles, such as tin, nickel, gold, silver microspheres or the metal-coated polymer microspheres. The solid conductive particles have high cost, high hardness and high requirements on hot pressing pressure and dispersion uniformity. Therefore, the traditional microelectronic directional conductive film has high cost, strict equipment requirements and complex operation.
Disclosure of Invention
The invention provides a directional conductive film based on liquid metal, and a preparation method and a use method thereof.
Therefore, the directional conductive film based on the liquid metal comprises a substrate and a directional conductive film formed on the surface of one side of the substrate, wherein the directional conductive film comprises an insulating colloid and conductive particles distributed in the insulating colloid, the conductive particles are liquid metal, the liquid metal is simple substance gallium or gallium-based alloy containing one or more elements of aluminum, copper, zinc, gold, silver, nickel, titanium, cadmium, tin, dysprosium and indium, the melting point is lower than 110 ℃, and the volume content of the liquid metal in the directional conductive film is 1-30%.
The insulating colloid at least comprises an adhesive polymer and a curing agent or a modifying agent.
The adhesive polymer is selected from at least one of epoxy resin, phenolic resin, acrylic resin, nitrile rubber and silicon rubber.
The curing agent comprises aliphatic amine curing agents, hydrazide curing agents, dicyandiamide curing agents, amido amine curing agents and imidazole curing agents.
The modifier may be one or more of butadiene rubber, acrylate, phenolic-epoxy resin, polyurethane, modified urea, pyrrolidone, or silane coupling agent.
The substrate is an upper layer and a lower layer protective film of the directional conductive film and can be made of polytetrafluoroethylene, polyester or polyolefin materials. Including but not limited to polytetrafluoroethylene, polyester, or polyolefin.
The preparation method of the directional conductive film based on the liquid metal comprises the following steps:
1) Providing a substrate;
2) Providing the liquid metal;
3) Providing the insulating colloid, and uniformly mixing the liquid metal and the insulating colloid to form a mixed colloid;
4) Uniformly coating the mixed colloid mixed with the liquid metal on a substrate, pressing the mixed colloid between two layers of substrates, and precuring the mixed colloid at 40-110 ℃ to form a liquid metal-based directional conductive film which is solid at normal temperature and has the thickness of 1-300 micrometers and still has fluidity;
5) And (3) refrigerating and storing the pre-cured directional conductive film based on the liquid metal in the step 4) at the temperature of-18-5 ℃, wherein the curing process is basically stopped at the refrigerating temperature, and the insulating colloid is kept to have fluidity.
Further, the substrate serves as an upper layer and a lower layer protective film of the directional conductive film; the liquid metal is mixed with the insulating colloid in a fluid form, and the volume content of the liquid metal in the mixture is 1-30%.
The insulating colloid is mixed by a banburying blending method and a mechanical stirring method.
The invention also provides a using method of the directional conductive film based on the liquid metal, which is used for manufacturing the directional conductive film device, and the specific method is that the refrigerated directional conductive film based on the liquid metal is taken out and unfrozen, the film substrate is torn, the torn surface is attached between the upper electrode plate and the lower electrode plate, pressure is applied to adhere the upper electrode plate and the lower electrode plate at the curing temperature of 100-200 ℃, the liquid metal flows along with the pressure, so that the upper electrode plate and the lower electrode plate are connected and are conductive in the pressure direction, the insulating state is kept in the direction vertical to the pressure, and the applied pressure is removed after the insulating colloid is cured. The curing pressure is 0.2-10 MPa, the curing time is 1-30 s, and the directional conductive film device with electrodes, good conductivity and resistance value below 200m omega can be formed.
Compared with the prior art, the directional conductive film based on the liquid metal has the following beneficial effects: the directional conductive film has excellent unidirectional conductivity in the pressure direction, the upper surface and the lower surface of the directional conductive film are extruded in a heating and pressurizing mode, and liquid metals uniformly distributed in the insulating colloid are contacted with each other in the pressure direction, so that conduction is realized; at the same time, the liquid metal is not sufficiently concentrated in the direction perpendicular to the pressure to form a passage, thereby avoiding an overall short circuit. The method can be used in the technical field of electronic packaging such as microelectronic packaging and chip packaging.
Detailed Description
The directional conductive film based on the liquid metal comprises a substrate and a directional conductive film formed on one side surface of the substrate, wherein the directional conductive film comprises an insulating colloid and the liquid metal distributed in the insulating colloid.
The substrate is used as a carrier of the directional conductive film and is a release film prepared by melting and stretching common thermoplastic macromolecules of polytetrafluoroethylene, polyester or polyolefin and functional additives.
The conductive particles are liquid metal, the liquid metal is simple substance gallium or gallium-based alloy containing one or more elements of aluminum, copper, zinc, gold, silver, nickel, titanium, cadmium, tin, dysprosium and indium, the melting point is lower than 110 ℃, and the volume content of the liquid metal in the directional conductive film is 1-30%.
The main components of the insulating colloid are thermosetting resin and special rubber, and the whole insulating colloid is composed of adhesive polymer, curing agent, modifier and the like.
Classes of adhesive polymers include, but are not limited to, epoxy, phenolic, acrylic, nitrile or silicone rubbers.
The curing agent includes, but is not limited to, latent curing agents such as aliphatic amine curing agents, hydrazide curing agents, dicyandiamide curing agents, amido amine curing agents, and imidazole curing agents.
The class of modifiers includes, but is not limited to, one or more of butadiene rubber, acrylates, phenolic-epoxy resins, polyurethanes, modified ureas, pyrrolidones, or silane coupling agents. The modifier can be used as a leveling agent, an anti-settling agent, a diluent, a coupling agent, a toughening agent or a filler and the like, for example, acrylate can be used as the leveling agent, modified urea solution or pyrrolidone can be used as the anti-settling agent, butadiene rubber or polyurethane can be used as the toughening agent, and phenolic-epoxy resin is used as the modifier to be beneficial to improving the mechanical property, the high temperature resistance and the like of the conductive film. Fillers may also be added in the present invention, for example powdered nitrile rubber, which is different from the liquid nitrile rubber in the adhesive polymer, the powdered nitrile rubber being used only as filler.
The preparation method of the directional conductive film based on the liquid metal comprises the following steps:
1) Providing a substrate; the substrate is a release film made of PET insulating material and is used as a carrier for pressing the film during the medium-low temperature pre-curing of the insulating colloid.
2) Providing the liquid metal; the liquid metal is simple substance gallium or gallium-based alloy containing one or more elements of aluminum, copper, zinc, gold, silver, nickel, titanium, cadmium, tin, dysprosium and indium, and the melting point is lower than 110 ℃. The liquid metal is prior art.
3) Providing the insulating colloid, and uniformly mixing the liquid metal and the insulating colloid to form a mixed colloid; the liquid metal is mixed with the insulating colloid in a fluid form, and the volume content of the liquid metal in the mixture is 1-30%.
4) Uniformly coating the mixed colloid mixed with the liquid metal on a substrate, pressing the mixed colloid between two layers of substrates, and precuring the mixed colloid at 40-110 ℃ to form the liquid metal-based directional conductive film which is solid at normal temperature and has the thickness of 1-300 micrometers and still has fluidity
5) And (3) refrigerating and storing the pre-cured directional conductive film based on the liquid metal in the step 4) at the temperature of-18-5 ℃, wherein the curing process is basically stopped at the refrigerating temperature, and the insulating colloid is kept to have fluidity.
Unlike conventional solid conductive particles, the present invention primarily mixes liquid metal in a fluid form with an insulating colloid. The colloid mixing mode is banburying and blending method and mechanical stirring method. Because the liquid metal is liquid at room temperature, the dispersion of the liquid metal drops in the insulating glue matrix is realized by fully stirring and shearing the insulating glue. The liquid metal is formed into small microspheres of 5-35 microns by fully stirring, shearing and dispersing. After the dispersion is finished, the dispersed medium-low temperature pre-cured mixed colloid is pressed into a film with the thickness of 1-300 microns. In order to facilitate dispersion of the liquid metal, the liquid metal may be mixed with an insulating resin material such as bisphenol a epoxy resin, bisphenol F epoxy resin, aliphatic epoxy resin, phenol resin, acrylic resin, or the like, and ground and stored for later use. The liquid metal or a blending colloid which can be ground and dispersed in insulating resin materials such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, aliphatic epoxy resin, phenolic resin, acrylic resin and the like and partial modifiers such as butadiene rubber, nitrile rubber, silicon rubber, polyurethane, silicon-containing polymer and the like is stored for later use. Wherein the blending colloid can be blended at normal temperature or melted and blended at 50-180 ℃ due to the interaction of groups.
When the insulating colloid is mixed with the curing agent, the curing agent is easily influenced by temperature, and the mixing conditions are as follows: controlling the temperature within the range of 40-110 ℃, and shearing and blending at a high speed for 5-90min; the curing agent in the insulating colloid has slight curing phenomenon, and is more beneficial to the solid state of the directional conductive film at normal temperature. According to the reaction temperature and the storage period of the curing agent, the curing agent needs to contain at least one of latent curing agents such as aliphatic amine curing agents, hydrazide curing agents, dicyandiamide curing agents, amido amine curing agents, imidazole curing agents and the like.
The insulating colloid and the liquid metal are mixed and stirred uniformly, and the conditions are as follows: the temperature is controlled within the range of 40-110 ℃, and defoaming treatment is carried out after blending for a period of time, so that the influence of bubbles on the unidirectional conductivity of the unidirectional conductive film is avoided.
And 4) uniformly coating the mixed colloid of the insulating colloid and the liquid metal between the substrates in the step 4), pre-curing the mixed colloid, and keeping the mixed colloid in a micro-flowing state so as to coat the mixed colloid into a film, wherein the film thickness is controlled to be 1-300 micrometers, preferably 10-45 micrometers.
The present invention will be described in further detail below with reference to specific examples.
Example 1
A directional conductive film based on liquid metal, the substrate of which is made of polyester material:
the volume dosage of the raw material components of the directional conductive film is as follows:
1. adhesive polymer:
epoxy resin 100 parts
5 parts of phenolic resin
Acrylic resin 10 parts
2. Curing agent:
50 parts of aliphatic amine curing agent
3. Modifying agent:
1 part of butadiene rubber
0.2 part of acrylic ester
15 portions of phenolic aldehyde-epoxy resin
1.5 parts of modified urea
4. 1.83 parts of liquid metal (volume content in the mixture is 1%).
Example 2
A directional conductive film based on liquid metal, the substrate of which is made of polytetrafluoroethylene material:
the volume dosage of the raw material components of the directional conductive film is as follows:
1. adhesive polymer:
epoxy resin 100 parts
50 parts of nitrile rubber
Silicon rubber 10 parts
2. Curing agent:
40 parts of aliphatic amine curing agent
10 parts of hydrazide curing agent
Imidazole curing agent 5 parts
3. Modifying agent:
0.3 part of acrylic ester
Phenolic-epoxy resin 12 parts
4 parts of silane coupling agent
Modified urea 1 part
Pyrrolidone 0.5 part
4. 14.3 parts of liquid metal (6% by volume in the mixture).
Example 3
A liquid metal based directional conductive film, the substrate of which is made of a polyolefin material:
the volume dosage of the raw material components of the directional conductive film is as follows:
1. adhesive polymer:
50 portions of phenolic resin
Acrylic resin 10 parts
50 parts of nitrile rubber
Silicon rubber 10 parts
2. Curing agent:
10 parts of dicyandiamide curing agent
15 parts of amido amine curing agent
Imidazole curing agent 20 parts
3. Modifying agent:
2 portions of butadiene rubber
0.2 part of acrylic ester
5 parts of polyurethane
Modified urea 1.5 parts
1.5 parts of pyrrolidone
4. 31.8 parts of liquid metal (15% by volume in the mixture).
Example 4
A liquid metal based directional conductive film, the substrate of which is made of polyester material:
the volume dosage of the raw material components of the directional conductive film is as follows:
1. adhesive polymer:
50 parts of epoxy resin
5 parts of phenolic resin
50 parts of nitrile rubber
2. Curing agent:
50 parts of imidazole curing agent
3. Modifying agent:
15 parts of phenolic-epoxy resin
4 portions of polyurethane
Pyrrolidone 3 parts
4. 54 parts of liquid metal (the volume content in the mixture is 22%).
Example 5
A liquid metal based directional conductive film, the substrate of which is made of polyester material:
the volume dosage of the raw material components of the directional conductive film is as follows:
1. adhesive polymer:
epoxy resin 100 parts
2. Curing agent:
amide amine curing agent 80 parts
3. Modifying agent:
powdered nitrile rubber (filler) 15 parts
Acrylic ester 1 part
15 parts of phenolic-epoxy resin
4 portions of polyurethane
2 parts of modified urea
Pyrrolidone 2 parts
4. 93.8 parts of liquid metal (30% by volume in the mixture).
The components described in the examples 1-5 are mixed and dispersed according to the experimental steps, the dispersion temperature before adding the curing agent is 50-180 ℃ and the dispersion temperature after adding the curing agent is 40-110 ℃ according to the initial reaction speed temperature of the curing agent, the mixed colloid is uniformly dispersed and then defoamed, and the mixed colloid is pre-cured at a medium and low temperature to be pressed into a film, and is refrigerated at the low temperature of-18-5 ℃.
The directional conductive film based on liquid metal obtained in examples 1 to 5 is used for manufacturing a directional conductive film device by taking out and thawing the refrigerated directional conductive film based on liquid metal, tearing the film substrate, attaching the torn surface between the upper and lower electrode plates, applying pressure at a curing temperature of 100 to 200 ℃ to bond the upper and lower electrodes, flowing the liquid metal with pressure to connect the upper and lower electrodes and conduct electricity in a pressure direction while maintaining an insulating state in a direction perpendicular to the pressure, and removing the applied pressure after the insulating gel is cured. The curing pressure is 0.2-10 MPa, the curing time is 1-30 s, and the directional conductive film device with electrodes, good conductivity and resistance value below 200m omega can be formed.
And (3) carrying out performance tests such as adhesive force, conductive performance and the like on the directional conductive film on the product, wherein the measurement results are shown in the table I.
| Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | |
| Curing temperature/. Degree.C | 100 | 150 | 180 | 180 | 200 |
| Curing time/s | 30 | 15 | 20 | 1 | 9 |
| Adhesion (N/m) | 1000 | 800 | 750 | 580 | 600 |
| Resistance/m omega | 200 | 110 | 145 | 160 | 180 |
According to the directional conductive film, the liquid metal is distributed in the insulating colloid in a fluid form, and the directional conductive film has good dispersibility and excellent conductivity. In the embodiment, the insulating colloid and the liquid metal are blended step by step, and different stirring temperatures are controlled at various stages during blending, so that better dispersion and solidification effects are realized. And secondly, compared with the traditional solid conductive particles, the liquid metal has the advantages of low cost, simple manufacturing process, easier dispersion, good conductive effect, contribution to the conductivity and cost of the directional conductive adhesive film and long-term development prospect.
The invention relates to a directional conductive film prepared on the basis of the special property of liquid metal with fluidity, which is a special technical idea of the invention, and a person skilled in the art can change and modify the directional conductive film within the technical scope of the invention without departing from the technical idea, and the directional conductive film is within the protection scope of the invention.
Claims (10)
1. A directional conductive film based on liquid metal, characterized in that: the directional conductive film comprises an insulating colloid and conductive particles distributed in the insulating colloid, the conductive particles are liquid metal, the liquid metal is simple substance gallium or gallium-based alloy containing one or more elements of aluminum, copper, zinc, gold, silver, nickel, titanium, cadmium, tin, dysprosium and indium, the melting point is lower than 110 ℃, and the volume content of the liquid metal in the directional conductive film is 1-30%.
2. A directional conductive film based on liquid metal according to claim 1, wherein: the insulating colloid at least comprises an adhesive polymer and a curing agent or a modifying agent.
3. A directional conductive film based on liquid metal as claimed in claim 2, wherein: the adhesive polymer comprises at least one of epoxy resin, phenolic resin, acrylic resin, nitrile rubber or silicon rubber.
4. A directional conductive film based on liquid metal as claimed in claim 2, wherein: the curing agent comprises aliphatic amine curing agents, hydrazide curing agents, dicyandiamide curing agents, amido amine curing agents or imidazole curing agents.
5. A directional conductive film based on liquid metal as claimed in claim 2, wherein: the modifier comprises one or more of butadiene rubber, acrylate, phenolic-epoxy resin, polyurethane, modified urea, pyrrolidone and silane coupling agent.
6. A directional conductive film based on liquid metal as claimed in claim 1, wherein: the substrate is an upper layer protective film and a lower layer protective film of the directional conductive film and is made of polytetrafluoroethylene, polyester or polyolefin materials.
7. The method of claim 1, comprising the steps of:
1) Providing a substrate;
2) Providing the liquid metal;
3) Providing the insulating colloid, and uniformly mixing the liquid metal and the insulating colloid to form a mixed colloid;
4) Uniformly coating the mixed colloid mixed with the liquid metal on a substrate, pressing the mixed colloid between two layers of substrates, and precuring the mixed colloid at 40-110 ℃ to form a liquid metal-based directional conductive film which is 1-300 microns thick, is solid at normal temperature and still has fluidity;
5) And (5) refrigerating and storing the pre-cured directional conductive film based on the liquid metal in the step 4) at the temperature of-18-5 ℃.
8. The method of claim 7, wherein the step of forming the directional conductive film comprises: the substrate is used as an upper layer and a lower layer protective film of the directional conductive film; the liquid metal is mixed with the insulating colloid in a fluid form, and the volume content of the liquid metal in the mixture is 1-30%.
9. The method of claim 7, wherein the step of forming the directional conductive film comprises: the insulating colloid is mixed by a banburying blending method and a mechanical stirring method.
10. The method of using a directional conductive film based on liquid metal as claimed in claim 1, wherein: the refrigerated directional conductive film based on the liquid metal is taken out and unfrozen, the film substrate is torn, the torn surface is attached between the upper electrode plate and the lower electrode plate, pressure is applied to adhere the upper electrode plate and the lower electrode plate at the curing temperature of 100-200 ℃, the liquid metal flows along with the pressure, so that the upper electrode plate and the lower electrode plate are connected and conduct electricity in the pressure direction, the insulation state is kept in the direction vertical to the pressure, and the applied pressure is removed after the insulation colloid is cured.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010146812A1 (en) * | 2009-06-16 | 2010-12-23 | バンドー化学株式会社 | Electrically conductive ink and process for production of base material having electrically conductive coating film attached thereto using same |
| CN109852281A (en) * | 2019-02-01 | 2019-06-07 | 东南大学 | A kind of preparation method of the anisotropy conductiving glue based on liquid metal |
| CN110527468A (en) * | 2019-08-15 | 2019-12-03 | 东南大学 | A kind of preparation and application causing conducting resinl based on one-dimensional, two-dimensional material power |
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2022
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010146812A1 (en) * | 2009-06-16 | 2010-12-23 | バンドー化学株式会社 | Electrically conductive ink and process for production of base material having electrically conductive coating film attached thereto using same |
| CN109852281A (en) * | 2019-02-01 | 2019-06-07 | 东南大学 | A kind of preparation method of the anisotropy conductiving glue based on liquid metal |
| CN110527468A (en) * | 2019-08-15 | 2019-12-03 | 东南大学 | A kind of preparation and application causing conducting resinl based on one-dimensional, two-dimensional material power |
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