CN115543045A - 提供针对计算设备中的温度缓和的校准的电路和方法 - Google Patents
提供针对计算设备中的温度缓和的校准的电路和方法 Download PDFInfo
- Publication number
- CN115543045A CN115543045A CN202211223675.3A CN202211223675A CN115543045A CN 115543045 A CN115543045 A CN 115543045A CN 202211223675 A CN202211223675 A CN 202211223675A CN 115543045 A CN115543045 A CN 115543045A
- Authority
- CN
- China
- Prior art keywords
- computing device
- temperature
- operating frequency
- operating voltage
- ramp rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K3/00—Thermometers giving results other than momentary value of temperature
- G01K3/08—Thermometers giving results other than momentary value of temperature giving differences of values; giving differentiated values
- G01K3/10—Thermometers giving results other than momentary value of temperature giving differences of values; giving differentiated values in respect of time, e.g. reacting only to a quick change of temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
- G06F1/32—Means for saving power
- G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
- G06F1/3234—Power saving characterised by the action undertaken
- G06F1/3287—Power saving characterised by the action undertaken by switching off individual functional units in the computer system
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
- G06F1/32—Means for saving power
- G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
- G06F1/3234—Power saving characterised by the action undertaken
- G06F1/3296—Power saving characterised by the action undertaken by lowering the supply or operating voltage
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Computer Hardware Design (AREA)
- Computing Systems (AREA)
- Power Sources (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Indication And Recording Devices For Special Purposes And Tariff Metering Devices (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/205,678 | 2016-07-08 | ||
| US15/205,678 US10007310B2 (en) | 2016-07-08 | 2016-07-08 | Circuits and methods providing calibration for temperature mitigation in a computing device |
| CN201780041785.9A CN109416568B (zh) | 2016-07-08 | 2017-06-14 | 提供针对计算设备中的温度缓和的校准的电路和方法 |
| PCT/US2017/037502 WO2018009317A1 (en) | 2016-07-08 | 2017-06-14 | Circuits and methods providing calibration for temperature mitigation in a computing device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780041785.9A Division CN109416568B (zh) | 2016-07-08 | 2017-06-14 | 提供针对计算设备中的温度缓和的校准的电路和方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115543045A true CN115543045A (zh) | 2022-12-30 |
Family
ID=59216051
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780041785.9A Active CN109416568B (zh) | 2016-07-08 | 2017-06-14 | 提供针对计算设备中的温度缓和的校准的电路和方法 |
| CN202211223675.3A Pending CN115543045A (zh) | 2016-07-08 | 2017-06-14 | 提供针对计算设备中的温度缓和的校准的电路和方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780041785.9A Active CN109416568B (zh) | 2016-07-08 | 2017-06-14 | 提供针对计算设备中的温度缓和的校准的电路和方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10007310B2 (enExample) |
| EP (1) | EP3482274B1 (enExample) |
| JP (1) | JP6926185B2 (enExample) |
| KR (1) | KR102513430B1 (enExample) |
| CN (2) | CN109416568B (enExample) |
| ES (1) | ES2770108T3 (enExample) |
| HU (1) | HUE047310T2 (enExample) |
| WO (1) | WO2018009317A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11399720B2 (en) | 2016-04-05 | 2022-08-02 | Qulacomm Incorporated | Circuits and methods providing temperature mitigation for computing devices |
| US10402205B2 (en) * | 2017-03-02 | 2019-09-03 | Quanta Computer Inc. | System and method for dynamically optimizing hardware frequency for booting |
| KR102400977B1 (ko) * | 2020-05-29 | 2022-05-25 | 성균관대학교산학협력단 | 프로세서를 통한 페이지 폴트 처리 방법 |
| CN111966409B (zh) * | 2020-07-30 | 2021-04-02 | 深圳比特微电子科技有限公司 | 矿机快速搜频方法和装置以及矿机 |
| CN112462820B (zh) * | 2020-10-29 | 2022-03-22 | 广东禅信通科技有限公司 | 一种石墨烯发热材料的控温系统,方法以及存储介质 |
| KR102679433B1 (ko) * | 2020-11-25 | 2024-06-28 | (주)하이페리온테크 | 적응적 폴링 기반의 센서 데이터 처리 장치 및 방법 |
| US12379768B2 (en) | 2021-12-22 | 2025-08-05 | Samsung Electronics Co., Ltd. | Electronic device and method of controlling temperature associated with a semiconductor device using dynamic voltage frequency scaling (DVFS) |
| US12443254B2 (en) | 2023-01-30 | 2025-10-14 | Thomson Licensing | Apparatus and method for controlling temperature in an electronic device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5940785A (en) * | 1996-04-29 | 1999-08-17 | International Business Machines Corporation | Performance-temperature optimization by cooperatively varying the voltage and frequency of a circuit |
| CN1892194A (zh) * | 2005-06-28 | 2007-01-10 | 株式会社东芝 | 用于热感测的系统和方法 |
| CN101622588A (zh) * | 2007-03-29 | 2010-01-06 | 英特尔公司 | 动态功耗降低 |
| CN101923383A (zh) * | 2008-10-31 | 2010-12-22 | 英特尔公司 | 多处理器核心的功率管理 |
| CN102099761A (zh) * | 2008-05-30 | 2011-06-15 | 苹果公司 | 电子设备中的热管理技术 |
| US20150346798A1 (en) * | 2014-06-02 | 2015-12-03 | Advanced Micro Devices, Inc. | System and method for adjusting performance based on thermal conditions within a processor |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020087904A1 (en) * | 2000-12-28 | 2002-07-04 | Zhong-Ning (George) Cai | Method and apparatus for thermal sensitivity based dynamic power control |
| US6977646B1 (en) * | 2001-11-30 | 2005-12-20 | 3M Innovative Properties Co. | Touch screen calibration system and method |
| AU2003292454A1 (en) * | 2002-12-17 | 2004-07-09 | Koninklijke Philips Electronics N.V. | Temperature compensated r-c oscillator |
| US20040233930A1 (en) | 2003-05-19 | 2004-11-25 | Modular Computing & Communications Corporation | Apparatus and method for mobile personal computing and communications |
| US7461272B2 (en) | 2004-12-21 | 2008-12-02 | Intel Corporation | Device, system and method of thermal control |
| US8996330B2 (en) * | 2011-01-06 | 2015-03-31 | Qualcomm Incorporated | Method and system for managing thermal policies of a portable computing device |
| US8760217B2 (en) * | 2011-02-25 | 2014-06-24 | Qualcomm Incorporated | Semiconductor device having on-chip voltage regulator |
| KR101840852B1 (ko) | 2011-10-10 | 2018-03-22 | 삼성전자주식회사 | 모바일 장치의 표면 온도 관리 방법 및 멀티칩 패키지의 메모리 열관리 방법 |
| US9703336B2 (en) | 2013-02-21 | 2017-07-11 | Qualcomm Incorporated | System and method for thermal management in a multi-functional portable computing device |
| US9529397B2 (en) | 2013-03-01 | 2016-12-27 | Qualcomm Incorporated | Thermal management of an electronic device based on sensation model |
| US20150148981A1 (en) * | 2013-11-24 | 2015-05-28 | Qualcomm Incorporated | System and method for multi-correlative learning thermal management of a system on a chip in a portable computing device |
| US9632841B2 (en) | 2014-05-29 | 2017-04-25 | Mediatek Inc. | Electronic device capable of configuring application-dependent task based on operating behavior of application detected during execution of application and related method thereof |
| US20150346745A1 (en) | 2014-05-30 | 2015-12-03 | Qualcomm Incorporated | Thermally-adaptive voltage scaling for supply voltage supervisor power optimization |
| JP6275173B2 (ja) * | 2016-03-03 | 2018-02-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US10310572B2 (en) * | 2016-06-10 | 2019-06-04 | Microsoft Technology Licensing, Llc | Voltage based thermal control of processing device |
-
2016
- 2016-07-08 US US15/205,678 patent/US10007310B2/en active Active
-
2017
- 2017-06-14 CN CN201780041785.9A patent/CN109416568B/zh active Active
- 2017-06-14 EP EP17733279.8A patent/EP3482274B1/en active Active
- 2017-06-14 JP JP2019500296A patent/JP6926185B2/ja active Active
- 2017-06-14 KR KR1020187037655A patent/KR102513430B1/ko active Active
- 2017-06-14 ES ES17733279T patent/ES2770108T3/es active Active
- 2017-06-14 HU HUE17733279A patent/HUE047310T2/hu unknown
- 2017-06-14 CN CN202211223675.3A patent/CN115543045A/zh active Pending
- 2017-06-14 WO PCT/US2017/037502 patent/WO2018009317A1/en not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5940785A (en) * | 1996-04-29 | 1999-08-17 | International Business Machines Corporation | Performance-temperature optimization by cooperatively varying the voltage and frequency of a circuit |
| CN1892194A (zh) * | 2005-06-28 | 2007-01-10 | 株式会社东芝 | 用于热感测的系统和方法 |
| CN101622588A (zh) * | 2007-03-29 | 2010-01-06 | 英特尔公司 | 动态功耗降低 |
| CN102099761A (zh) * | 2008-05-30 | 2011-06-15 | 苹果公司 | 电子设备中的热管理技术 |
| CN101923383A (zh) * | 2008-10-31 | 2010-12-22 | 英特尔公司 | 多处理器核心的功率管理 |
| US20150346798A1 (en) * | 2014-06-02 | 2015-12-03 | Advanced Micro Devices, Inc. | System and method for adjusting performance based on thermal conditions within a processor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190025848A (ko) | 2019-03-12 |
| WO2018009317A1 (en) | 2018-01-11 |
| CN109416568B (zh) | 2022-09-06 |
| EP3482274A1 (en) | 2019-05-15 |
| ES2770108T3 (es) | 2020-06-30 |
| JP6926185B2 (ja) | 2021-08-25 |
| BR112019000012A2 (pt) | 2019-04-16 |
| EP3482274B1 (en) | 2019-11-27 |
| KR102513430B1 (ko) | 2023-03-22 |
| BR112019000012A8 (pt) | 2023-01-31 |
| US20180011520A1 (en) | 2018-01-11 |
| CN109416568A (zh) | 2019-03-01 |
| HUE047310T2 (hu) | 2020-04-28 |
| US10007310B2 (en) | 2018-06-26 |
| JP2019527412A (ja) | 2019-09-26 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |