CN115527906A - Air-floating type conveying platform and detection system thereof - Google Patents
Air-floating type conveying platform and detection system thereof Download PDFInfo
- Publication number
- CN115527906A CN115527906A CN202210606119.8A CN202210606119A CN115527906A CN 115527906 A CN115527906 A CN 115527906A CN 202210606119 A CN202210606119 A CN 202210606119A CN 115527906 A CN115527906 A CN 115527906A
- Authority
- CN
- China
- Prior art keywords
- workpiece
- air
- slot
- platform
- platform body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)
Abstract
The invention provides an air-floating type conveying platform and an air-floating type detection system. The air-floating type conveying platform is suitable for conveying a workpiece to a detection position on the air-floating type conveying platform in an air-floating manner, wherein the first open slot is arranged on the air-floating type conveying platform and corresponds to the detection position. The first image acquisition module is configured at one side of the air floating type conveying platform so as to acquire a front image of the workpiece at the detection position. The second image acquisition module is configured on the opposite side of the air floating type conveying platform and passes through the first slot to acquire a back image of the workpiece on the detection position. The air-floating type conveying platform and the air-floating type detection system can be used for efficiently detecting the wafer.
Description
Technical Field
The present invention relates to a transfer platform and a semiconductor inspection system thereof, and more particularly to an air-floating transfer platform for carrying semiconductor workpieces and an air-floating semiconductor inspection system thereof.
Background
In the wafer manufacturing process, image inspection is generally performed on the surface of the wafer to determine whether the quality of the wafer meets the standard. However, when the wafer is located on the inspection platform, one side of the wafer facing upward needs to be inspected first, and then the wafer is turned over, so that the other side of the wafer faces upward and is inspected. Such a detection process is time and labor consuming, which increases the cost of the wafer process. In addition, in the process of image inspection of the wafer, the flatness of the wafer must be well maintained so that the image inspection result is accurate. However, the flatness of the wafer cannot be precisely maintained only by clamping the wafer.
Disclosure of Invention
The invention aims at an air-floating type conveying platform and an air-floating type semiconductor detection system thereof, which can be used for efficiently detecting wafers.
According to an embodiment of the present invention, an air floating transport platform comprises a platform body, an air flow providing unit and a transport device. The platform body is provided with a first slot. The airflow providing unit is suitable for supplying airflow to the workpiece from the platform body so that the workpiece is suspended above the platform body. The conveying device is suitable for conveying the workpiece to the detection position on the platform body. The first slot is arranged at the detection position, so that an external image capturing device can acquire the back image of the workpiece through the first slot.
In an embodiment according to the invention, the transport device comprises a clamping mechanism adapted to clamp and move the workpiece between a non-inspection position and an inspection position on the table body.
In an embodiment according to the invention, the transport platform further comprises a jacking unit, wherein the jacking unit is adapted to receive the workpiece in a non-inspection position on the platform body and to move the workpiece away from the platform body.
In an embodiment of the present invention, the top supporting unit includes a plurality of contact ends, and is configured on the platform body in a liftable manner; the contact end includes soft sucker, hard bearing pin or soft bearing pin.
In an embodiment according to the invention, the platform body comprises a second slot, at least part of the transportation device is located in the second slot and is adapted to move along the second slot, and an intersection point of the first slot and the second slot corresponds to the detection position.
In an embodiment of the invention, the platform body has a first surface and a second surface opposite to each other, the first slot penetrates through the first surface and the second surface, and the width of the first slot increases from the first surface to the second surface.
In an embodiment according to the invention, the workpiece comprises a semiconductor wafer, a semiconductor chip, a printed circuit board or a display panel.
According to an embodiment of the invention, the air-floating detection system comprises an air-floating conveying platform, a first image acquisition module and a second image acquisition module. The air-floating type conveying platform is suitable for conveying a workpiece to a detection position on the air-floating type conveying platform in an air-floating manner, wherein the first open slot is arranged on the air-floating type conveying platform and corresponds to the detection position. The first image acquisition module is configured at one side of the air floating type conveying platform so as to acquire a front image of the workpiece at the detection position. The second image acquisition module is configured on the opposite side of the air floating type conveying platform and passes through the first slot to acquire a back image of the workpiece on the detection position.
In an embodiment according to the invention, an air floating transport platform comprises a platform body, an air flow providing unit and a transport device. The airflow providing unit is suitable for supplying airflow to the workpiece from the platform body so that the workpiece is suspended above the platform body. The conveying device is suitable for conveying the workpiece to the detection position on the platform body. The first slot is arranged at the detection position, so that the second image acquisition module acquires the back image of the workpiece through the first slot.
In an embodiment according to the invention, the transport device comprises a gripping mechanism adapted to grip and move the workpiece between a non-inspection position and an inspection position on the platform body.
In an embodiment according to the invention, the inspection system further comprises a jacking unit, wherein the jacking unit is adapted to receive the workpiece in a non-inspection position on the air-floating transport platform and to move the workpiece away from the platform body.
In an embodiment of the present invention, the top supporting unit includes a plurality of contact ends, and is configured on the platform body in a liftable manner;
the contact end is of a type including a soft sucker, a hard bearing pin or a soft bearing pin.
In an embodiment of the present invention, the platform body has a second slot, at least a portion of the transportation device is located in the second slot and is adapted to move along the second slot, and an intersection point of the first slot and the second slot corresponds to the detection position.
In an embodiment of the invention, the platform body has a first surface and a second surface opposite to each other, the first slot penetrates through the first surface and the second surface, and the width of the first slot increases from the first surface to the second surface.
In an embodiment according to the invention, the workpiece comprises a semiconductor wafer, a semiconductor chip, a printed circuit board or a display panel.
In an embodiment according to the invention, the first image acquisition module comprises a first illumination unit adapted to provide illumination to the workpiece at the inspection position and a first image acquisition unit adapted to perform image acquisition of the workpiece at the inspection position.
In an embodiment according to the invention, the second image acquisition module comprises a second illumination unit adapted to provide illumination to the workpiece at the inspection position through the first slot and a second image acquisition unit adapted to perform image acquisition to the workpiece at the inspection position through the first slot.
In an embodiment according to the invention, the inspection system further comprises an inspection unit for image-inspecting the workpiece based on the front side image and the back side image of the workpiece.
Based on the above, in the air-floating semiconductor detection system of the present invention, in addition to the first image acquisition module directly performing image acquisition on the front surface of the workpiece, the second image acquisition module may further perform image acquisition on the back surface of the workpiece through the first slot of the platform body. Therefore, the front and the back of the workpiece can be detected simultaneously, and the detection efficiency is greatly improved. In addition, the workpieces are transported in an air floating mode through the air floating type transporting platform, the workpieces can be prevented from being abraded due to the fact that the workpieces are in contact with the platform body, the flatness of the workpieces can be accurately kept, and therefore the image detection result is accurate.
Drawings
FIG. 1 is a schematic diagram of a portion of the components of an air-bearing semiconductor inspection system in accordance with one embodiment of the present invention;
FIG. 2 is a schematic partial side view of the air-floating semiconductor inspection system of FIG. 1;
FIG. 3 is a schematic diagram of a portion of the components of an air-floating semiconductor detection system in accordance with another embodiment of the present invention;
fig. 4A to 4F are inspection flow charts of the air-floating semiconductor inspection system of fig. 3.
Detailed Description
Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.
Fig. 1 is a schematic diagram of a part of components of an air-floating semiconductor detection system according to an embodiment of the present invention. Fig. 2 is a partial side view schematic diagram of the air-floating semiconductor inspection system of fig. 1. Referring to fig. 1 and fig. 2, the air-floating semiconductor inspection system 100 of the present embodiment includes an air-floating transportation platform 110, a first image capturing module 120, and a second image capturing module 130. The air floating transport platform 110 includes a platform body 112 and a transfer device 114. The platform body 112 has a first slot 112a. The air floating transport platform 110 can air-float the workpiece W to the detection position P1 on the platform body 112 through the transport device 114 as shown in fig. 2, and the first slot 112a corresponds to the detection position P1. The workpiece W may be a semiconductor wafer, a semiconductor chip, a printed circuit board, or a display panel.
The first image capturing module 120 is disposed on one side of the air floating transport platform 110, and the second image capturing module 130 is disposed on the opposite side of the air floating transport platform 110. The detection position P1 of the workpiece W shown in fig. 2 is located between the first image acquisition module 120 and the platform body 112, and the platform body 112 is located between the second image acquisition module 130 and the detection position P1. In this state, the first image acquisition module 120 is adapted to acquire an image of the front surface S1 of the workpiece W, and the second image acquisition module 130 is adapted to acquire an image of the back surface S2 of the workpiece W through the first slot 112a. The inspection unit 140 of the semiconductor inspection system 100 is adapted to image-inspect the workpiece W according to the front and back images of the workpiece W acquired by the first and second image acquisition modules 120 and 130, so as to determine whether the quality of the workpiece W meets the standard. The inspection unit 140 may be a computer device including a memory and image inspection software, which may be integrated with the semiconductor inspection system 100 or externally connected to the semiconductor inspection system 100, and the form of the present invention is not limited thereto.
As described above, in the air-floating semiconductor inspection system 100 of the present embodiment, in addition to the first image capturing module 120 directly capturing the image of the front surface S1 of the workpiece W, the second image capturing module 130 may further capture the image of the back surface S2 of the workpiece W through the first slot 112a of the stage body 112. Therefore, the front surface S1 and the back surface S2 of the workpiece W can be detected simultaneously, and the detection efficiency is greatly improved.
In the present embodiment, the first image capturing module 120 includes a first illuminating unit 122 and a first image capturing unit 124. The first illumination unit 122 is adapted to provide illumination to the workpiece W at the detection position P1, and the first image acquisition unit 124 is adapted to perform image acquisition to the workpiece W at the detection position P1. Similarly, the second image acquisition module 130 includes a second illumination unit 132 and a second image acquisition unit 134. The second illumination unit 132 is adapted to illuminate the workpiece W at the detection position P1 through the first slit 112a, and the second image acquisition unit 134 is adapted to perform image acquisition of the workpiece W at the detection position P1 through the first slit 112a. The first image capturing unit 124 may include a Charge Coupled Device (CCD) 1241 and a lens 1242, and the second image capturing unit 134 may include a CCD 1341 and a lens 1342. In other embodiments, the first image capturing unit 124 and the second image capturing unit 134 may be in other forms, and the invention is not limited thereto.
In the embodiment, the platform body 112 has a first surface 112c and a second surface 112d opposite to each other, the first surface 112c is located between the detection position P1 and the second surface 112d, and the first slot 112a penetrates between the first surface 112c and the second surface 112 d. As shown in fig. 2, in the present embodiment, the width of the first slot 112a includes, but is not limited to, increasing from the first surface 112c to the second surface 112d, or the same width. The second illuminating unit 132 provides illuminating light to the workpiece W through the first slit 112a, and allows the second image obtaining unit 134 to smoothly obtain an image of the workpiece W through the first slit 112a.
The conveying device 114 of the present embodiment includes, but is not limited to, four clamping mechanisms 1141, and the clamping mechanisms 1141 are adapted to clamp the workpiece W to move the workpiece W between the non-detection position P2 and the detection position P1 on the platen body 112.
Fig. 3 is a schematic diagram of a part of components of an air-floating semiconductor detection system according to another embodiment of the present invention. Referring to fig. 3, the platform body 112 of an alternative embodiment may include a second slot 112b penetrating between the first surface 112c and the second surface 112d and extending through the detecting position P1 and the non-detecting position P2. The extending direction of the first slot 112a is perpendicular to the extending direction of the second slot 112b, and the intersection point of the first slot 112a and the second slot 112b corresponds to the detection position P1. The partial gripper mechanism 1141 (conveyor 114) is located within the second slot 112b and is adapted to move along the second slot 112 b. That is, the second slot 112b has the function of guiding the clamping mechanism 1141 to move between the detecting position P1 and the non-detecting position P2.
In addition, the air floating transport platform 110 of the above embodiment further includes an air flow providing unit 116 (shown in fig. 2). The air flow providing unit 116 is adapted to provide a positive pressure air flow from the platen body 112 to the workpiece W so as to suspend the workpiece W above the first surface 112c of the platen body 112. In addition, the air flow providing unit 116 can provide a positive pressure air flow and a negative pressure air flow simultaneously, and the negative pressure air flow can assist in sucking the workpiece W, so that the workpiece W and the air floating transport platform 110 maintain a stable height. Therefore, the workpiece W can be prevented from being worn due to contact with the first surface 112c of the platen body 112, and the flatness of the workpiece W can be accurately maintained by using the positive pressure gas flow, so that the image detection result is accurate. In this embodiment, an airflow channel may be disposed in the platform body 112 and connected to the airflow providing unit 116, and the platform body 112 may have a plurality of airflow outlets on the first surface 112c thereof to communicate with the airflow channel, so that the airflow provided by the airflow providing unit 116 may flow from the airflow outlets to above the first surface 112c. In other embodiments, the air flow providing unit 116 may provide the positive pressure air flow from bottom to top to the workpiece W in other manners, which is not limited in the present invention.
In this regard, the air floating transport platform 110 of the above embodiment may further include a top supporting unit 118, the top supporting unit 118 includes a plurality of contact terminals 1181, and the types of the contact terminals 1181 may include a soft suction cup, a hard bearing pin, a soft bearing pin, or the like. The contact ends 1181 of the top supporting unit 116 are configured on the platform body 112 in a lifting manner, and are adapted to receive the workpiece W at the non-detection position P2 on the platform body 112 and support the workpiece W away from the platform body 112. Thus, when the airflow providing unit 116 is not yet opened, the workpiece W may pass through the top support of the top support unit 116 without directly contacting the first surface 112c of the platen body 112.
The inspection process of the semiconductor inspection system 100 according to the above embodiment is described in detail with reference to the drawings, in which the platform body 112 including the second slot 112b shown in fig. 3 is taken as an example. Fig. 4A to 4F are inspection flow charts of the semiconductor inspection system of fig. 3. First, the robot 150 moves the workpiece W to a position above the non-detection position P2 on the stage body 112 as shown in fig. 4A to 4B, wherein the robot 150 fixes the workpiece W thereon, for example, by vacuum suction. Next, the robot 150 is lowered as shown in fig. 4B to 4C, so that the workpiece W is received by the contact terminals 1181 of the top support unit 116. Then, the robot 150 stops vacuum-sucking the workpiece W and moves away from the position of the workpiece W as shown in fig. 4C to 4D. At this time, the gas flow providing unit 116 (shown in fig. 2) is turned on to suspend the workpiece W above the first surface 112c of the stage body 112 by the positive pressure gas flow provided by the gas flow providing unit.
Next, as shown in fig. 4D to 4E, the contact ends 1181 of the top support unit 116 are lowered below the first surface 112c, and the clamping mechanism 1141 of the conveying device 114 clamps the workpiece W. As shown in fig. 4E to 4F, the clamping mechanism 1141 of the conveying device 114 conveys the workpiece W to the detection position P1 on the table body 112, so that the workpiece W corresponds to the first slot 112a. At this time, the first image capturing module 120 and the second image capturing module 130 (shown in fig. 3) can simultaneously capture images of the workpiece W, and the detecting unit 140 detects the images captured by the first image capturing module 120 and the second image capturing module 130.
After the first image acquiring module 120 and the second image acquiring module 130 complete the image acquisition of the workpiece W, the clamping mechanism 1141 of the conveying device 114 conveys the workpiece W to the non-detection position P2 on the platform body 112 as shown in fig. 4F to 4E. Next, the clamping mechanism 1141 releases the workpiece W, and the contact ends 1181 of the top support unit 116 rise above the first surface 112c to support the workpiece W as shown in fig. 4E to 4D. Then, the air flow providing unit 116 (shown in fig. 2) is turned off to stop providing the positive pressure air flow, and the robot 150 moves to the position of the workpiece W and performs vacuum suction on the workpiece W as shown in fig. 4D to 4C. The robot 150 lifts the workpiece W as shown in fig. 4C to 4B and removes the workpiece W from the table body 112 as shown in fig. 4B to 4A.
In summary, in the semiconductor inspection system of the present invention, the first image capturing module can directly capture an image of the front surface of the wafer, and the second image capturing module can capture an image of the back surface of the wafer through the first opening of the platform body. Therefore, the front and the back of the wafer can be detected simultaneously, and the detection efficiency is greatly improved. In addition, the air flow providing unit can be used for providing positive pressure air flow from the platform body to the wafer so as to enable the wafer to be suspended above the first surface of the platform body. Therefore, the wafer can be prevented from being worn due to the fact that the wafer is in contact with the first surface of the platform body, and the flatness of the wafer can be accurately kept by utilizing the airflow, so that the image detection result is accurate.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (16)
1. An air-floating transport platform, comprising:
the platform body is provided with a first slot;
the air flow providing unit is suitable for supplying air flow to the workpiece from the platform body so that the workpiece is suspended above the platform body;
the conveying device is suitable for conveying the workpiece to a detection position on the platform body;
the first slot is arranged at the detection position, so that an external image capturing device acquires a back image of the workpiece through the first slot.
2. The air floating transport platform of claim 1, wherein said transfer device includes a gripper mechanism adapted to grip and move said workpiece between a non-inspection position and said inspection position on said platform body.
3. The air floating transport platform of claim 1, further comprising a jacking unit, wherein the jacking unit is adapted to receive the workpiece at a non-inspection position on the platform body and to move the workpiece away from the platform body,
the top support unit comprises a plurality of contact ends which are arranged on the platform body in a lifting way,
the contact end comprises a soft sucker, a hard bearing pin or a soft bearing pin.
4. The air-floating transfer platform of claim 1, wherein said platform body includes a second slot, at least a portion of said transfer device being located within and adapted to move along said second slot, an intersection of said first slot and said second slot corresponding to said detection location.
5. The air-floating transfer platform of claim 1, wherein the platform body has first and second opposing surfaces, the first slot extends through the first and second surfaces, and the width of the first slot increases from the first surface to the second surface.
6. The air floating transport platform of claim 1, wherein the workpiece comprises a semiconductor wafer, a semiconductor die, a printed circuit board, or a display panel.
7. An air-floating detection system, comprising:
the air-floating type conveying platform is suitable for air-floating conveying of workpieces to a detection position on the air-floating type conveying platform, wherein the first open slot is formed in the air-floating type conveying platform and corresponds to the detection position;
the first image acquisition module is configured at one side of the air floating type conveying platform to acquire a front image of the workpiece at the detection position; and
and the second image acquisition module is configured on the opposite side of the air-floating type conveying platform and is used for acquiring a back image of the workpiece at the detection position through the first slot.
8. The air-floating detection system of claim 7, wherein the air-floating transport platform comprises:
a platform body;
the air flow providing unit is suitable for supplying air flow to the workpiece from the platform body so as to suspend the workpiece above the platform body; and
the conveying device is suitable for conveying the workpiece to the detection position on the platform body;
the first slot is arranged at the detection position, so that the second image acquisition module acquires the back image of the workpiece through the first slot.
9. The air-float detection system of claim 8, wherein the transfer device includes a clamping mechanism adapted to clamp and move the workpiece between a non-detection position and the detection position on the platform body.
10. The air floating detection system of claim 8, further comprising a jacking unit, wherein the jacking unit is adapted to receive the workpiece at a non-detection position on the air floating transport platform and to move the workpiece away from the platform body,
the top supporting unit comprises a plurality of contact ends which are arranged on the platform body in a lifting way,
the contact end comprises a soft sucker, a hard bearing pin or a soft bearing pin.
11. The air-float detection system of claim 8, wherein the platform body has a second slot, at least a portion of the transport device being located within and adapted to move along the second slot, an intersection of the first slot and the second slot corresponding to the detection location.
12. The air-float detection system of claim 8, wherein the platform body has a first surface and a second surface opposite to the first surface, the first slot extends through the first surface and the second surface, and a width of the first slot increases from the first surface to the second surface.
13. The air floating detection system of claim 7, wherein the workpiece comprises a semiconductor wafer, a semiconductor die, a printed circuit board, or a display panel.
14. The air-float detection system of claim 7, wherein the first image acquisition module comprises a first illumination unit and a first image acquisition unit, the first illumination unit being adapted to provide illumination to the workpiece at the detection location, the first image acquisition unit being adapted to perform image acquisition of the workpiece at the detection location.
15. The air-float detection system of claim 7, wherein the second image acquisition module comprises a second illumination unit and a second image acquisition unit, the second illumination unit being adapted to provide illumination to the workpiece at the detection position through the first slot, the second image acquisition unit being adapted to perform image acquisition to the workpiece at the detection position through the first slot.
16. The air-float detection system of claim 7, further comprising a detection unit for image-detecting the workpiece based on the front image and the back image of the workpiece.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110123090A TW202301500A (en) | 2021-06-24 | 2021-06-24 | Air suspension type transferring platform and detecting system having the same |
| TW110123090 | 2021-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115527906A true CN115527906A (en) | 2022-12-27 |
Family
ID=84696001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210606119.8A Pending CN115527906A (en) | 2021-06-24 | 2022-05-31 | Air-floating type conveying platform and detection system thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115527906A (en) |
| TW (1) | TW202301500A (en) |
-
2021
- 2021-06-24 TW TW110123090A patent/TW202301500A/en unknown
-
2022
- 2022-05-31 CN CN202210606119.8A patent/CN115527906A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202301500A (en) | 2023-01-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110823922A (en) | Appearance detection device | |
| KR20140097968A (en) | Lower supporting pin layout determination apparatus and lower supporting pin layout determination method | |
| JP2007107941A (en) | Apparatus and method for transfer in inspection process | |
| TW516083B (en) | Optical sensor | |
| JP2011029456A (en) | Wafer prober for semiconductor inspection, and inspection method | |
| CN108364880B (en) | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device | |
| WO2016084407A1 (en) | Sorting device | |
| JP2006329714A (en) | Lens inspection apparatus | |
| KR102136084B1 (en) | System for inspecting edge area of wafer | |
| CN217788355U (en) | Wafer box and wafer carrying equipment | |
| KR200341202Y1 (en) | Automatic inspection system for industrial printed circuit board | |
| KR102624577B1 (en) | substrate treating apparatus and substrate treating method | |
| CN115527906A (en) | Air-floating type conveying platform and detection system thereof | |
| JP7164365B2 (en) | Electronic component conveying device and electronic component conveying method | |
| JPH0758175A (en) | Method and equipment for carrying wafer, and wafer inspecting equipment | |
| JP2000196223A (en) | Apparatus and method for inspecting board | |
| KR20100046601A (en) | Apparatus for transferring object for inspecting both sides of the object and inspection system by using the apparatus and method for manufacturing pcb by using the system | |
| WO2009096119A1 (en) | Electronic component handling apparatus and method for detecting position of electronic component | |
| JP5954969B2 (en) | Component supply apparatus and component position recognition method | |
| JP2000097670A (en) | Visual inspection system for printed board | |
| JP5511143B2 (en) | Mounting machine | |
| KR20210058392A (en) | Apparatus for probing semiconductor chip | |
| KR20190134275A (en) | System for inspecting edge area of wafer and method using the same | |
| CN109524319B (en) | Die table unit and die bonding device with same | |
| JP4298462B2 (en) | Component recognition device, component recognition method, surface mounter, and component test apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |