TW202301500A - Air suspension type transferring platform and detecting system having the same - Google Patents

Abstract

An air suspension type detecting system includes an air suspension type transferring platform, a first image capturing module and a second image capturing module. The air suspension type transferring platform is adapted to transfer a work piece to a detecting position on the air suspension type transferring platform by air suspension manner, wherein a first slot is disposed on the air suspension type transferring platform and corresponding to the detecting position. The first image capturing module is disposed at one side of the air suspension type transferring platform for capturing an image of a front surface of the work piece at the detecting position. The second image capturing module is disposed at an opposite side of the air suspension type transferring platform for capturing an image of a rear surface of the work piece at the detecting position through the first slot.

Description

Air-floating conveying platform and its detection system

The present invention relates to a conveying platform and its semiconductor detection system, and in particular to an air-floating conveying platform for carrying semiconductor workpieces and its air-floating semiconductor detection system.

During the wafer manufacturing process, it is generally necessary to perform image inspection on the surface of the wafer to determine whether the quality of the wafer meets the standard. However, when the wafer is on the inspection platform, the upward side of the wafer needs to be inspected first, and then the wafer is turned over so that the other side of the wafer faces upward and can be inspected. This detection process is labor-intensive and time-consuming, which increases the cost of the wafer manufacturing process. In addition, in the process of performing image inspection on the wafer, the flatness of the wafer must be well maintained to ensure accurate image inspection results. However, the flatness cannot be precisely maintained only by clamping the wafer.

The invention provides an air-floating conveying platform and an air-floating semiconductor detection system thereof, which can efficiently detect wafers.

The air-floating conveying platform of the present invention includes a platform body, an airflow supply unit and a conveying device. The platform body has a first slot. The airflow supply unit is suitable for supplying airflow from the platform body to the workpiece, so that the workpiece is suspended above the platform body. The conveying device is suitable for conveying a workpiece to a detection position on the platform body. The first slot is arranged at the detection position, so that the external image capture device captures the back image of the workpiece through the first slot.

In an embodiment of the present invention, the above-mentioned conveying device includes a clamping mechanism adapted to clamp and move the workpiece between a non-detection position and a detection position on the platform body.

In an embodiment of the present invention, the above-mentioned conveying platform further includes a supporting unit, wherein the supporting unit is adapted to receive the workpiece at a non-detecting position on the platform body, and make the workpiece leave the platform body.

In an embodiment of the present invention, the above-mentioned supporting unit includes a plurality of contact ends, which are arranged on the platform body in a liftable manner; the types of the contact ends include soft suction cups, hard suction cups, hard bearing pins or soft bearing pins.

In an embodiment of the present invention, the above-mentioned platform body includes a second slot, at least part of the conveying device is located in the second slot and is suitable for moving along the second slot, the first slot and the second slot The intersection point of corresponds to the detection location.

In an embodiment of the present invention, the above-mentioned carrier body has a first surface and a second surface opposite to each other, the first groove runs through the first surface and the second surface, and the width of the first groove is from the first surface to the second surface. One surface gradually increases towards the second surface.

In an embodiment of the present invention, the aforementioned workpiece includes a semiconductor wafer, a semiconductor wafer, a printed circuit board or a display panel.

The air-floating detection system of the present invention includes an air-floating conveying platform, a first image capture module and a second image capture module. The air-floating conveying platform is suitable for air-floating conveying a workpiece to a detection position on the air-floating conveying platform, wherein a first slot is arranged on the air-floating conveying platform and corresponds to the detecting position. The first image capturing module is arranged on one side of the air-floating conveying platform to capture the frontal image of the workpiece on the detection position. The second image capture module is arranged on the opposite side of the air-floating conveying platform, through the first slot, to capture the back image of the workpiece at the detection position.

In an embodiment of the present invention, the above-mentioned air-floating conveying platform includes a platform body, an airflow supply unit and a conveying device. The airflow supply unit is suitable for supplying airflow from the platform body to the workpiece, so that the workpiece is suspended above the platform body. The conveying device is suitable for conveying the workpiece to the detection position on the platform body. The first slot is arranged at the detection position, so that the second image capture module captures the back image of the workpiece through the first slot.

In an embodiment of the present invention, the above-mentioned conveying device includes a clamping mechanism adapted to clamp and move the workpiece between a non-detection position and a detection position on the platform body.

In an embodiment of the present invention, the above-mentioned detection system further includes a supporting unit, wherein the supporting unit is adapted to receive the workpiece at a non-detecting position on the air-floating conveying platform, and make the workpiece leave the platform body.

In an embodiment of the present invention, the above-mentioned supporting unit includes a plurality of contact ends, which are arranged on the platform body in a liftable manner; The types of contact ends include soft suction cups, hard suction cups, hard bearing pins or soft bearing pins.

In an embodiment of the present invention, the above-mentioned platform body has a second slot, at least part of the conveying device is located in the second slot and is suitable for moving along the second slot, the first slot and the second slot The intersection point of corresponds to the detection location.

In an embodiment of the present invention, the above-mentioned carrier body has a first surface and a second surface opposite to each other, the first groove runs through the first surface and the second surface, and the width of the first groove is from the first surface to the second surface. One surface gradually increases towards the second surface.

In an embodiment of the present invention, the aforementioned workpiece includes a semiconductor wafer, a semiconductor wafer, a printed circuit board or a display panel.

In an embodiment of the present invention, the above-mentioned first image capture module includes a first lighting unit and a first image capture unit, the first lighting unit is suitable for providing illumination to the workpiece at the detection position, and the first The image capturing unit is suitable for capturing the image of the workpiece at the detection position.

In an embodiment of the present invention, the above-mentioned second image capture module includes a second lighting unit and a second image capture unit, and the second lighting unit is suitable for detecting the workpiece at the position through the first slot. Illumination is provided, and the second image capture unit is adapted to capture an image of the workpiece at the detection position through the first slot.

In an embodiment of the present invention, the above-mentioned detection system further includes a detection unit for visually detecting the workpiece according to the front image and the rear image of the workpiece.

Based on the above, in the air-floating semiconductor inspection system of the present invention, in addition to using the first image capture module to directly capture the image of the front of the workpiece, the second image capture module can be used to see through the first image of the platform body. A slot is used to capture the image of the back side of the workpiece. In this way, the front and back sides of the workpiece can be inspected at the same time, thereby greatly improving the inspection efficiency. In addition, the air-floating transport of the workpiece by the air-floating conveying platform can avoid the wear of the workpiece due to contact with the platform body, and can precisely maintain the flatness of the workpiece, so that the image detection result is accurate.

FIG. 1 is a schematic diagram of some components of an air-floating semiconductor detection system according to an embodiment of the present invention. FIG. 2 is a schematic partial side view of the air-floating semiconductor detection system shown in FIG. 1 . Please refer to FIG. 1 and FIG. 2 , the air-floating semiconductor inspection system 100 of this embodiment includes an air-floating conveying platform 110 , a first image capture module 120 and a second image capture module 130 . The air-floating conveying platform 110 includes a platform body 112 and a conveying device 114 . The platform body 112 has a first slot 112a. The air-floating conveying platform 110 can convey a workpiece W to a detection position P1 on the platform body 112 by means of the conveying device 114 as shown in FIG. 2 , and the first slot 112a corresponds to the detection position P1. The workpiece W may be a semiconductor wafer, a semiconductor wafer, a printed circuit board, or a display panel.

The first image capturing module 120 is disposed on one side of the air-floating conveying platform 110 , and the second image capturing module 130 is disposed on the opposite side of the air-floating conveying platform 110 . The detection position P1 where the workpiece W is shown in FIG. 2 is located between the first image capture module 120 and the platform body 112 , and the platform body 112 is located between the second image capture module 130 and the detection position P1 . In this state, the first image capture module 120 is adapted to capture an image of a front surface S1 of the workpiece W, and the second image capture module 130 is adapted to capture an image of the workpiece W through the first slot 112a. Image of S2 on the back. A detection unit 140 of the semiconductor inspection system 100 is suitable for image detection of the workpiece W based on the front image and the back image of the workpiece W captured by the first image capture module 120 and the second image capture module 130, so as to judge Whether the quality of workpiece W meets the standard. The detection unit 140 can be a computer device including memory and image detection software, which can be integrated into the semiconductor detection system 100 or externally connected to the semiconductor detection system 100 , and the present invention does not limit its form.

As mentioned above, in the air-floating semiconductor inspection system 100 of this embodiment, in addition to using the first image capture module 120 to directly capture the image of the front surface S1 of the workpiece W, the second image capture module can also be used to The group 130 captures an image of the back surface S2 of the workpiece W through the first slot 112 a of the platform body 112 . In this way, the front side S1 and the back side S2 of the workpiece W can be detected simultaneously, thereby greatly improving the detection efficiency.

In this embodiment, the first image capture module 120 includes a first lighting unit 122 and a first image capture unit 124 . The first lighting unit 122 is adapted to provide illumination to the workpiece W at the inspection position P1 , and the first image capture unit 124 is adapted to perform image capture on the workpiece W at the inspection position P1 . Similarly, the second image capture module 130 includes a second lighting unit 132 and a second image capture unit 134 . The second lighting unit 132 is adapted to provide illumination to the workpiece W at the detection position P1 through the first slot 112a, and the second image capture unit 134 is adapted to perform image capture on the workpiece W at the detection position P1 through the first slot 112a. Pick. Wherein, the first image capture unit 124 may include a charge coupled device (CCD) 1241 and a lens 1242 , and the second image capture unit 134 may include a charge coupled device 1341 and a lens 1342 . In other embodiments, the first image capture unit 124 and the second image capture unit 134 may be in other forms, and the present invention is not limited thereto.

In this embodiment, the platform body 112 has a first surface 112c and a second surface 112d opposite to each other, the first surface 112c is located between the detection position P1 and the second surface 112d, and the first slot 112a runs through the first surface 112c and the second surface 112d. As shown in FIG. 2 , in this embodiment, the width of the first groove 112a includes but is not limited to, it can gradually increase from the first surface 112c to the second surface 112d, or it can be the same width. The second illumination unit 132 provides illumination light to the workpiece W through the first slot 112 a, and enables the second image capture unit 134 to capture an image of the workpiece W smoothly through the first slot 112 a.

The conveying device 114 of this embodiment includes, but is not limited to, four clamping mechanisms 1141. The clamping mechanisms 1141 are suitable for clamping the workpiece W so as to move the workpiece W between a non-detection position P2 on the platform body 112 and the above-mentioned detection position. Between P1.

Fig. 3 is a schematic diagram of some components of an air-floating semiconductor detection system according to another embodiment of the present invention. Referring to FIG. 3 , the platform body 112 in an alternative embodiment may include a second slot 112b , passing through between the first surface 112c and the second surface 112d , and extending through the detection position P1 and the non-detection position P2 . The extension direction of the first slot 112a and the extension direction of the second slot 112b are, for example, perpendicular to each other, and the intersection point of the first slot 112a and the second slot 112b corresponds to the detection position P1. Part of the clamping mechanism 1141 (transport device 114 ) is located in the second slot 112b and is adapted to move along the second slot 112b. That is, the second slot 112b has the function of guiding the clamping mechanism 1141 to move between the detection position P1 and the non-detection position P2.

In addition, the air-floating transport platform 110 of the above embodiment further includes an airflow supply unit 116 (shown in FIG. 2 ). The airflow supply unit 116 is adapted to provide positive pressure airflow from the platform body 112 to the workpiece W, so that the workpiece W is suspended above the first surface 112 c of the platform body 112 . In addition, the airflow providing unit 116 can provide positive pressure airflow and negative pressure airflow at the same time, and the negative pressure airflow can assist in sucking the workpiece W so as to maintain a stable height between the workpiece W and the air-floating conveying platform 110 . Thereby, the workpiece W can be prevented from being worn due to contact with the first surface 112 c of the platform body 112 , and the positive pressure airflow can be used to accurately maintain the flatness of the workpiece W, so that the image detection result is accurate. In this embodiment, an airflow channel may be provided in the platform body 112 to connect to the airflow providing unit 116, and the platform body 112 may have a plurality of airflow outlets on its first surface 112c to communicate with the airflow channel, so that the airflow providing unit 116 The provided air flow can flow above the first surface 112c from the air outlet. In other embodiments, the airflow providing unit 116 may provide the workpiece W with a positive pressure airflow from bottom to top in other ways, which is not limited by the present invention.

Based on the above, the air-floating conveying platform 110 of the above-mentioned embodiment may further include a supporting unit 118. The supporting unit 118 includes a plurality of contact ends 1181. The types of the contact ends 1181 may include soft suction cups, hard suction cups, hard bearing pins or Soft bearing pins, etc. The contact ends 1181 of the supporting unit 116 are liftably disposed on the platform body 112 , and are suitable for receiving the workpiece W at the non-detection position P2 on the platform body 112 and propping the workpiece W away from the platform body 112 . Thereby, when the airflow providing unit 116 is not turned on, the workpiece W can be supported by the supporting unit 116 without directly contacting the first surface 112 c of the platform body 112 .

The inspection process of the semiconductor inspection system 100 of the above-mentioned embodiment will be described in detail below with reference to the drawings, wherein the platform body 112 including the second slot 112b shown in FIG. 3 is taken as an example for illustration. 4A to 4F are detection flowcharts of the semiconductor detection system shown in FIG. 3 . First, the robot arm 150 moves the workpiece W above the non-detection position P2 on the platform body 112 as shown in FIGS. 4A to 4B , wherein the robot arm 150 fixes the workpiece W thereon, for example, by vacuum suction. Next, the robot arm 150 descends as shown in FIGS. 4B to 4C , so that the workpiece W is received by the contact ends 1181 of the supporting unit 116 . Then, the robot arm 150 stops vacuuming the workpiece W, and moves away from the workpiece W as shown in FIGS. 4C to 4D . At this moment, the airflow supply unit 116 (shown in FIG. 2 ) is turned on, so that the positive pressure airflow provided by the airflow supply unit 116 can suspend the workpiece W above the first surface 112 c of the platform body 112 .

Then, as shown in FIGS. 4D to 4E , the contact ends 1181 of the supporting unit 116 descend below the first surface 112 c, and the clamping mechanism 1141 of the conveying device 114 clamps the workpiece W. Referring to FIG. As shown in FIG. 4E to FIG. 4F , the clamping mechanism 1141 of the conveying device 114 conveys the workpiece W to the detection position P1 on the platform body 112 , so that the workpiece W corresponds to the first slot 112 a. At this time, the first image capture module 120 and the second image capture module 130 (shown in FIG. 3 ) can simultaneously capture images of the workpiece W, and the detection unit 140 can detect the first image capture module accordingly. 120 and the image captured by the second image capture module 130 for detection.

After the first image capture module 120 and the second image capture module 130 complete the image capture of the workpiece W, the clamping mechanism 1141 of the transport device 114 transports the workpiece W to the The non-detection position P2 on the platform body 112 . Then, the clamping mechanism 1141 releases the workpiece W, and the contact ends 1181 of the supporting unit 116 rise above the first surface 112c to prop up the workpiece W as shown in FIGS. 4E to 4D . Then, the airflow supply unit 116 (shown in FIG. 2 ) is closed to stop providing positive pressure airflow, and the robot arm 150 moves to the position of the workpiece W as shown in FIG. 4D to FIG. 4C and performs vacuum adsorption on the workpiece W. The robotic arm 150 lifts the workpiece W as shown in FIGS. 4C to 4B , and moves the workpiece W away from the platform body 112 as shown in FIGS. 4B to 4A .

To sum up, in the semiconductor inspection system of the present invention, in addition to using the first image capture module to directly capture images of the front side of the wafer, the second image capture module can also be used to pass through the first image capture module of the platform body. A slot captures images of the backside of the wafer. In this way, the front and back sides of the wafer can be inspected at the same time, thereby greatly improving the inspection efficiency. In addition, the airflow supply unit can be used to provide positive pressure airflow from the platform body to the wafer, so that the wafer is suspended above the first surface of the platform body. Thereby, the wafer can be prevented from being worn due to contacting the first surface of the platform body, and the flatness of the wafer can be accurately maintained by using the airflow, so that the image detection result is accurate.

100: Air floatation semiconductor detection system 110:Air-floating conveying platform 112: Platform ontology 112a: First slot 112b: Second slot 112c: first surface 112d: second surface 114: Conveyor 1141: clamping mechanism 116: airflow supply unit 118: top support unit 1181: contact end 120: The first image capture module 122: The first lighting unit 124: the first image capture unit 1241, 1341: charge coupled device 1242, 1342: Lens 130: The second image capture module 132: Second lighting unit 134: the second image capture unit 140: detection unit 150: Mechanical arm P1: detection position P2: Non-detection position S1: front S2: back W: Workpiece

FIG. 1 is a schematic diagram of some components of an air-floating semiconductor detection system according to an embodiment of the present invention. FIG. 2 is a schematic partial side view of the air-floating semiconductor detection system shown in FIG. 1 . Fig. 3 is a schematic diagram of some components of an air-floating semiconductor detection system according to another embodiment of the present invention. 4A to 4F are detection flowcharts of the air-floating semiconductor detection system shown in FIG. 3 .

100: Air floatation semiconductor detection system

110:Air-floating semi-transportation platform

112: Platform ontology

112a: First slot

112c: first surface

112d: second surface

114: Conveyor

1141: clamping mechanism

118: top support unit

1181: contact end

120: The first image capture module

122: The first lighting unit

124: the first image capture unit

1241, 1341: charge coupled device

1242, 1342: Lens

130: The second image capture module

132: Second lighting unit

134: the second image capture unit

140: detection unit

P1: detection position

P2: Non-detection position

W: Workpiece

Claims (18)

An air-floating conveying platform, comprising: a platform body having a first slot; an airflow supply unit, adapted to supply airflow from the platform body to the workpiece, so that the workpiece is suspended above the platform body; A conveying device, suitable for conveying a workpiece to a detection position on the platform body; Wherein the first slot is set at the detection position, so that the external image capture device captures the back image of the workpiece through the first slot. The air-floating conveying platform as claimed in claim 1, wherein the conveying device includes a clamping mechanism adapted to clamp and move the workpiece between a non-detecting position and the detecting position on the platform body. The air-floating conveying platform as described in Claim 1 further comprises a supporting unit, wherein the supporting unit is suitable for receiving the workpiece at a non-detection position on the platform body, and makes the workpiece leave the platform body. The air-floating conveying platform as described in claim 3, wherein the support unit includes a plurality of contact ends, which are liftably arranged on the platform body; The types of the contact end include soft suction cups, hard suction cups, hard bearing pins or soft bearing pins. The air-floating conveying platform according to claim 1, wherein the platform body includes a second slot, at least part of the conveying device is located in the second slot and is suitable for moving along the second slot, the first The intersection point of a slot and the second slot corresponds to the detection position. The air-floating conveying platform according to claim 1, wherein the carrier body has a first surface and a second surface opposite to each other, the first slot runs through the first surface and the second surface, and the The width of the first groove gradually increases from the first surface to the second surface. The air-floating transport platform as claimed in claim 1, wherein the workpiece includes a semiconductor wafer, a semiconductor wafer, a printed circuit board or a display panel. An air flotation detection system comprising: An air-floating conveying platform, suitable for air-floating conveying a workpiece to a detection position on the air-floating conveying platform, wherein a first slot is arranged on the air-floating conveying platform and corresponds to the detecting position; a first image capturing module, configured on one side of the air-floating conveying platform, to capture the frontal image of the workpiece at the detection position; and A second image capture module is arranged on the opposite side of the air-floating conveying platform, through the first slot, to capture the back image of the workpiece at the detection position. The air-floating detection system as described in claim 8, wherein the air-floating conveying platform includes: a platform body; an airflow supply unit, adapted to supply airflow from the platform body to the workpiece, so that the workpiece is suspended above the platform body; and a conveying device, suitable for conveying the workpiece to the detection position on the platform body; Wherein the first slot is set at the detection position, so that the second image capture module captures the back image of the workpiece through the first slot. The air-floating inspection system as claimed in claim 9, wherein the conveying device includes a clamping mechanism adapted to clamp and move the workpiece between a non-detection position and the detection position on the platform body. The air-floating detection system as described in Claim 9 further comprises a supporting unit, wherein the supporting unit is suitable for receiving the workpiece at a non-detecting position on the air-floating conveying platform, and makes the workpiece leave the Platform ontology. The air-floating detection system as claimed in claim 11, wherein the support unit includes a plurality of contact ends, which are liftably arranged on the platform body; The types of the contact end include soft suction cups, hard suction cups, hard bearing pins or soft bearing pins. The air-floating detection system according to claim 9, wherein the platform body has a second slot, at least part of the conveying device is located in the second slot and is suitable for moving along the second slot, the first The intersection point of a slot and the second slot corresponds to the detection position. The air-floating detection system according to claim 9, wherein the stage body has a first surface and a second surface opposite to each other, the first slot runs through the first surface and the second surface, and the The width of the first groove gradually increases from the first surface to the second surface. The air-floating inspection system as claimed in claim 8, wherein the workpiece includes a semiconductor wafer, a semiconductor wafer, a printed circuit board or a display panel. The air-floating detection system as described in claim 8, wherein the first image capture module includes a first lighting unit and a first image capture unit, and the first lighting unit is suitable for the detection position The workpiece provides illumination, and the first image capturing unit is suitable for capturing an image of the workpiece at the detection position. The air-floating detection system as described in claim 8, wherein the second image capture module includes a second lighting unit and a second image capture unit, and the second lighting unit is suitable for passing through the first slot Illumination is provided for the workpiece at the detection position, and the second image capturing unit is adapted to capture an image of the workpiece at the detection position through the first slot. The air-floating inspection system as described in claim 8 further includes a detection unit for visually inspecting the workpiece according to the front image and the back image of the workpiece.

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