CN115519259A - High-frequency current assisted double-beam laser cutting method - Google Patents

High-frequency current assisted double-beam laser cutting method Download PDF

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Publication number
CN115519259A
CN115519259A CN202211297488.XA CN202211297488A CN115519259A CN 115519259 A CN115519259 A CN 115519259A CN 202211297488 A CN202211297488 A CN 202211297488A CN 115519259 A CN115519259 A CN 115519259A
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laser
cutting
laser cutting
frequency current
workpiece
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CN115519259B (en
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郭少锋
代小光
陈燧
郑文雷
康磊
徐志宏
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Changsha Dake Laser Technology Co ltd
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Changsha Dake Laser Technology Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention provides a high-frequency current assisted double-beam laser cutting method, which comprises the following steps of: step 1, providing a workpiece to be cut; step 2, providing a laser cutting system; step 3, providing a high-frequency current system; step 4, starting the laser cutting system and the high-frequency current system, outputting a first laser beam by the first laser cutting head, vertically irradiating the upper surface of the workpiece to be cut by the first laser beam, synchronously outputting a first cutting auxiliary gas, and performing laser cutting on the thick plate to obtain a rough cutting seam; step 5, moving the two roller type contact electrodes along the cutting direction at the bottom of the workpiece to be cut, feeding high-frequency current into the workpiece to be cut, outputting a second laser beam by a second laser cutting head, synchronously outputting second cutting auxiliary gas, and implementing high-frequency current auxiliary laser cutting to obtain a smooth cutting seam; and 6: and the first laser cutting head and the second laser cutting head move synchronously, and when the cutting end point is reached, the laser cutting system and the high-frequency current system are closed to finish the cutting process.

Description

High-frequency current assisted double-beam laser cutting method
Technical Field
The invention relates to a laser processing method, in particular to a high-frequency current assisted double-beam laser cutting method.
Background
As is known, laser cutting is the cutting of a workpiece by irradiating the workpiece with a focused high power density laser beam to rapidly melt, vaporize, ablate, or reach a point of ignition of the irradiated material, and simultaneously blowing off the molten material with the aid of a high velocity gas stream coaxial with the beam. Then, when the cut plate material is thick, the lower streaks of the laser cut surface are significantly coarse, and there is a problem of serious slag adhesion or the like.
The invention patent with the publication number of CN 102625429A and the patent name of laser cutting process for the thick metal plate, which is disclosed on 5, 20.2015, month 5 and month 20, discloses a laser cutting method for the thick metal plate, which uses high-power fiber laser to carry out negative defocusing energy perforation on the thick metal plate, increases the pressure of auxiliary gas and prolongs the laser perforation time; after the perforation is finished, adjusting the fiber laser to be a positive focal length, and adjusting the power to be applicable; and moving the laser cutting head to cut the thick metal plate by the optical fiber laser. The problem that the optical fiber laser is difficult to cut metal plates with the thickness of more than 20mm is solved. However, the technical scheme has the following problems: the perforating time is prolonged in the perforating stage, and the efficiency of fiber laser cutting is reduced.
Disclosure of Invention
The invention aims to solve the technical problem of providing a high-frequency current auxiliary double-beam laser cutting method.
The technical scheme adopted by the invention to solve the technical problem is as follows:
a high-frequency current assisted double-beam laser cutting method comprises the following steps:
step 1, providing a workpiece to be cut;
step 2, providing a laser cutting system, wherein the laser cutting system comprises a first laser generator, a second laser generator, a first transmission optical fiber, a second transmission optical fiber, a first laser cutting head, a second laser cutting head, a first cutting auxiliary gas and a second cutting auxiliary gas;
step 3, providing a high-frequency current system, wherein the high-frequency current system comprises a high-frequency power supply, a first roller type contact electrode and a second roller type contact electrode, the first roller type contact electrode and the second roller type contact electrode are positioned at the bottom of a workpiece to be cut and move synchronously with a first laser cutting head and a second laser cutting head in the cutting process;
step 4, starting the laser cutting system and the high-frequency current system, outputting a first laser beam by the first laser cutting head, vertically irradiating the upper surface of the workpiece to be cut by the first laser beam, synchronously outputting a first cutting auxiliary gas, and performing laser cutting on the thick plate to obtain a rough cutting seam;
step 5, moving the first roller type contact electrode and the second roller type contact electrode along the cutting direction at the bottom of the workpiece to be cut, feeding high-frequency current into the workpiece to be cut, outputting a second laser beam by a second laser cutting head, synchronously outputting second cutting auxiliary gas, and performing high-frequency current auxiliary laser cutting to obtain a smooth cutting seam;
and 6, synchronously moving the first laser cutting head and the second laser cutting head, and when the cutting end point is reached, sequentially closing the first laser generator and the second laser generator, and closing the laser cutting system and the high-frequency current system to finish the cutting process.
In one embodiment, the first laser generator and the second laser generator are both high brightness anti-high reflectance laser.
In one embodiment, the first roller type contact electrode and the second roller type contact electrode are symmetrically arranged on two sides of the cutting track, and the distance delta 1 between the first roller type contact electrode and the second roller type contact electrode is 10-30 mm.
In one embodiment, the distance δ 2 between the first roller contact electrode and the first laser cutting head is 10-30 mm, and the distance δ 3 between the second roller contact electrode and the second laser cutting head is 5-20 mm.
In one embodiment, the distance between the convergence point of the first cutting auxiliary gas and the upper surface of the workpiece to be cut is 3-8 mm, the pressure of the first cutting auxiliary gas is 0.3-1.5 bar, and the first cutting auxiliary gas is nitrogen or argon.
In one embodiment, the distance between the second cutting auxiliary gas convergence point and the lower surface of the workpiece to be cut is 10-15 mm, the pressure of the second cutting auxiliary gas is 0.1-1 bar, and the second cutting auxiliary gas is nitrogen or argon.
In one embodiment, the high frequency current fed into the workpiece to be cut has a frequency of 100 to 800kHz.
In one embodiment, the distance d1 between the tail end of the first laser cutting head and the upper surface of the workpiece to be cut is 2-3.5 mm; the distance d2 between the tail end of the second laser cutting head and the upper surface of the workpiece to be cut is 1-2 mm.
In one embodiment, the workpiece to be cut comprises stainless steel, aluminum alloy and copper alloy, and the thickness of the workpiece to be cut is 15-30 mm.
In one embodiment, the first laser cutting head has a focal length of 100 to 125mm; the second laser cutting head is a swinging laser cutting head, and the focusing focal length of the second laser cutting head is 200-300 mm.
Compared with the prior art, the invention has the following beneficial effects:
1. the laser cutting is divided into two procedures of rough cutting and joint-cutting finishing, and a conventional high-power laser beam is adopted to obtain a rough cutting joint; then feeding high-frequency current into the workpiece to be cut through high-frequency contact electrodes which are arranged at the bottom of the workpiece to be cut and symmetrically arranged along a cutting path, and generating resistance heat concentrated on the surface on the side surface of the rough cutting seam by utilizing the skin effect and the proximity effect of the high-frequency current, so that the temperature on the side surface of the rough cutting seam is greatly increased; and finally, swinging the long-focus single-mode fiber laser beam in the rough cutting seam, and synchronously applying cutting auxiliary airflow deep into the lower part of the rough cutting seam to realize the finishing treatment of the cutting section and obtain a smooth cutting seam.
2. According to the invention, the laser cutting is divided into two procedures of rough cutting and finishing cutting, and high-frequency current is fed into the bottom of the workpiece to be cut, so that the rough cutting can be carried out at a higher cutting speed, and then the laser power is reduced during finishing cutting, thereby greatly improving the thick plate cutting efficiency and reducing the laser energy input.
3. The high-frequency current-assisted double-beam laser cutting method provided by the invention utilizes a typical manufacturing process flow of rough machining and finish machining, and realizes the consideration of the laser cutting efficiency and quality of a thicker plate.
Drawings
FIG. 1 is a schematic diagram of an overall arrangement of high-frequency current assisted dual-beam laser dicing according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a high-frequency current assisted dual-beam laser cutting process according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of the lateral arrangement of the roller-type contact electrode according to the embodiment of the present invention;
FIG. 4 is a diagram illustrating a wobble track of a second laser beam according to an embodiment of the present invention.
In the figure, 1-a workpiece to be cut, 2-a first laser generator, 3-a second laser generator, 4-a first transmission optical fiber, 5-a second transmission optical fiber, 6-a first laser cutting head, 7-a second laser cutting head, 8-a first cutting auxiliary gas, 9-a second cutting auxiliary gas, 10-a first laser beam, 11-a second laser beam, 12-a high-frequency power supply, 13-a first roller type contact electrode, 14-a second roller type contact electrode, 15-a first cutting molten pool, 16-a rough cutting seam, 17-a second cutting molten pool, 18-a smooth cutting seam, 19-a first molten slag and 20-a second molten slag.
Detailed Description
The invention is further explained with reference to the drawings and the embodiments.
Example one
As shown in fig. 1 to 4, the high-frequency current assisted dual-beam laser cutting method of the present embodiment includes the following steps:
step 1, providing a workpiece 1 to be cut, wherein the workpiece 1 to be cut comprises stainless steel, aluminum alloy and copper alloy, and the thickness of the workpiece 1 to be cut is 15-30 mm;
step 2, providing a laser cutting system, wherein the laser cutting system comprises a first laser generator 2, a second laser generator 3, a first transmission optical fiber 4, a second transmission optical fiber 5, a first laser cutting head 6, a second laser cutting head 7, a first cutting auxiliary gas 8 and a second cutting auxiliary gas 9; the first laser generator 2 and the second laser generator 3 are both high-brightness high-reflection-resistance laser devices; the focusing focal length of the first laser cutting head 6 is 100-125 mm; the second laser cutting head 7 is a swinging laser cutting head, and the focusing focal length of the second laser cutting head 7 is 200-300 mm;
step 3, providing a high-frequency current system, wherein the high-frequency current system comprises a high-frequency power supply 12, a first roller type contact electrode 13 and a second roller type contact electrode 14, the first roller type contact electrode 13 and the second roller type contact electrode 14 are both positioned at the bottom of a workpiece to be cut and move synchronously with the first laser cutting head 6 and the second laser cutting head 7 in the cutting process; wherein, the first roller type contact electrode 13 and the second roller type contact electrode 14 are symmetrically arranged at two sides of the cutting track, and the distance delta 1 between the first roller type contact electrode 13 and the second roller type contact electrode 14 is 10-30 mm;
step 4, starting a laser cutting system and a high-frequency current system, outputting a first laser beam 10 by a first laser cutting head 6, vertically irradiating the upper surface of the workpiece 1 to be cut by the first laser beam 10, synchronously outputting a first cutting auxiliary gas 8, and performing thick plate laser cutting to obtain a rough cutting seam; the distance between the convergence point of the first cutting auxiliary gas 8 and the upper surface of the workpiece 1 to be cut is 3-8 mm, the pressure of the first cutting auxiliary gas 8 is 0.3-1.5 bar, and the first cutting auxiliary gas 8 is nitrogen or argon;
step 5, moving the first roller type contact electrode 13 and the second roller type contact electrode 14 at the bottom of the workpiece 1 to be cut along the cutting direction, feeding high-frequency current into the workpiece 1 to be cut, outputting a second laser beam 11 by the second laser cutting head 7, synchronously outputting a second cutting auxiliary gas 9, and performing high-frequency current auxiliary laser cutting to obtain a smooth cutting seam; wherein the frequency of the high-frequency current fed into the workpiece 1 to be cut is 100-800 kHz; the distance between the convergence point of the second cutting auxiliary gas 9 and the lower surface of the workpiece 1 to be cut is 10-15 mm, the pressure of the second cutting auxiliary gas 9 is 0.1-1 bar, and the second cutting auxiliary gas 9 is nitrogen or argon;
and 6, synchronously moving the first laser cutting head 6 and the second laser cutting head 7, and when the cutting end point is reached, sequentially closing the first laser generator 2 and the second laser generator 3, and closing the laser cutting system and the high-frequency current system to finish the cutting process.
Furthermore, the distance delta 2 between the first roller type contact electrode 13 and the first laser cutting head 6 is 10-30 mm, and the distance delta 3 between the second roller type contact electrode 14 and the second laser cutting head 7 is 5-20 mm.
Further, the distance d1 between the tail end of the first laser cutting head 6 and the upper surface of the workpiece 1 to be cut is 2-3.5 mm; the distance d2 between the tail end of the second laser cutting head 7 and the upper surface of the workpiece 1 to be cut is 1-2 mm.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the technical solutions of the present invention have been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that the technical solutions described in the foregoing embodiments can be modified or some technical features can be replaced equally; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A high-frequency current assisted double-beam laser cutting method is characterized in that: the method comprises the following steps:
step 1: providing a workpiece (1) to be cut;
step 2: providing a laser cutting system, wherein the laser cutting system comprises a first laser generator (2), a second laser generator (3), first transmission light (4), second transmission optical fiber (5), a first laser cutting head (6), a second laser cutting head (7), first cutting auxiliary gas (8) and second cutting auxiliary gas (9);
and 3, step 3: providing a high-frequency current system, wherein the high-frequency current system comprises a high-frequency power supply (12), a first roller type contact electrode (13) and a second roller type contact electrode (14), the first roller type contact electrode (13) and the second roller type contact electrode (14) are both positioned at the bottom of a workpiece to be cut and move synchronously with a first laser cutting head (6) and a second laser cutting head (7) in the cutting process;
and 4, step 4: starting a laser cutting system and a high-frequency current system, outputting a first laser beam (10) by a first laser cutting head (6), vertically irradiating the upper surface of a workpiece (1) to be cut by the first laser beam (10), synchronously outputting a first cutting auxiliary gas (8), and performing thick plate laser cutting to obtain a rough cutting slit;
and 5: the first roller type contact electrode (13) and the second roller type contact electrode (14) move along the cutting direction at the bottom of the workpiece (1) to be cut, high-frequency current is fed into the workpiece (1) to be cut, a second laser beam (11) is output by the second laser cutting head (7), second cutting auxiliary gas (9) is synchronously output, high-frequency current auxiliary laser cutting is implemented, and a smooth cutting seam is obtained;
and 6: first laser cutting head (6), second laser cutting head (7) synchronous motion, when reaching cutting end point, close first laser generator (2) and second laser generator (3) in proper order, close laser cutting system and high frequency current system, accomplish the cutting process.
2. The high-frequency current-assisted dual-beam laser cutting method according to claim 1, wherein: the first laser generator (2) and the second laser generator (3) are both high-brightness high-reflection-resistance fiber lasers.
3. The high-frequency current-assisted dual-beam laser cutting method according to claim 2, wherein: the first roller type contact electrode (13) and the second roller type contact electrode (14) are symmetrically arranged on two sides of a cutting track, and the distance delta 1 between the first roller type contact electrode (13) and the second roller type contact electrode (14) is 10-30 mm.
4. The high-frequency current-assisted dual-beam laser dicing method according to claim 3, wherein: the distance delta 2 between the first roller type contact electrode (13) and the first laser cutting head (6) is 10-30 mm, and the distance delta 3 between the second roller type contact electrode (14) and the second laser cutting head (7) is 5-20 mm.
5. The method according to claim 4, wherein the laser cutting device comprises: the distance between the convergence point of the first cutting auxiliary gas (8) and the upper surface of the workpiece to be cut is 3-8 mm, the pressure of the first cutting auxiliary gas (8) is 0.3-1.5 bar, and the first cutting auxiliary gas (8) is nitrogen or argon.
6. The high-frequency current-assisted dual-beam laser cutting method according to claim 5, wherein: the distance between the convergence point of the second cutting auxiliary gas (9) and the lower surface of the workpiece to be cut is 10-15 mm, the pressure of the second cutting auxiliary gas (9) is 0.1-1 bar, and the second cutting auxiliary gas (9) is nitrogen or argon.
7. The method according to claim 6, wherein the laser beam cutting device comprises: the frequency of the high-frequency current fed into the workpiece (1) to be cut is 100-800 kHz.
8. The high-frequency current-assisted dual-beam laser cutting method according to claim 7, wherein: the distance d1 between the tail end of the first laser cutting head (6) and the upper surface of the workpiece (1) to be cut is 2-3.5 mm; the distance d2 between the tail end of the second laser cutting head (7) and the upper surface of the workpiece (1) to be cut is 1-2 mm.
9. The high-frequency current-assisted dual-beam laser dicing method according to claim 8, wherein: the workpiece (1) to be cut comprises stainless steel, aluminum alloy and copper alloy, and the thickness of the workpiece (1) to be cut is 15-30 mm.
10. The high-frequency current-assisted dual-beam laser dicing method according to claim 9, wherein: the focusing focal length of the first laser cutting head (6) is 100-125 mm; the second laser cutting head (7) is a swinging laser cutting head, and the focusing focal length of the second laser cutting head (7) is 200-300 mm.
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