CN115515365A - Integrated high-power heat dissipation module - Google Patents
Integrated high-power heat dissipation module Download PDFInfo
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- CN115515365A CN115515365A CN202110634133.4A CN202110634133A CN115515365A CN 115515365 A CN115515365 A CN 115515365A CN 202110634133 A CN202110634133 A CN 202110634133A CN 115515365 A CN115515365 A CN 115515365A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 109
- 238000002791 soaking Methods 0.000 claims abstract description 48
- 238000010009 beating Methods 0.000 claims abstract description 5
- 238000001704 evaporation Methods 0.000 claims description 17
- 230000008020 evaporation Effects 0.000 claims description 17
- 238000009833 condensation Methods 0.000 claims description 14
- 230000005494 condensation Effects 0.000 claims description 14
- 239000000428 dust Substances 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
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- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 11
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 10
- 239000007788 liquid Substances 0.000 description 16
- 230000005855 radiation Effects 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
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- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
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- 239000011888 foil Substances 0.000 description 2
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- 229910052738 indium Inorganic materials 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
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- 230000008859 change Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
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- 230000006872 improvement Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an integrated high-power heat dissipation module, which comprises a heat dissipation fin arranged on one side edge of a base plate, an L-shaped soaking plate, a direct heat dissipation module, a horizontal plane heat pipe heat dissipation module and a vertical plane heat pipe heat dissipation module, wherein one end of the L-shaped soaking plate is fixed on the heat dissipation fin, the other end of the L-shaped soaking plate extends towards one side of a high-power component, the vertical edge of the L-shaped soaking plate is attached to the heat dissipation fin, the horizontal edge of the L-shaped soaking plate is positioned between the high-power component and the base plate, a heat dissipation fan is further arranged on the heat dissipation fin, a front plate is arranged on one side, away from the heat dissipation fin, of the base plate, a system fan and an air outlet are arranged on the front plate, the integrated high-power heat dissipation module further comprises a sheet metal cover sleeved on the peripheries of the heat dissipation fin, the base plate and the front plate, and the sheet metal cover is provided with an air inlet. Set up radiator fan on the fin and blow to the fin, set up the air outlet on the front bezel, the panel beating is covered and is opened there is the air intake, draws air from inside through the system fan to make high-power components and parts maintain stable operating temperature, this heat dissipation module heat transfer efficiency is high, and the radiating effect is good, and the effect is reliable and stable.
Description
Technical Field
The invention relates to the technical field of heat dissipation of electronic equipment, in particular to an integrated high-power heat dissipation module.
Background
Along with the continuous reduction of the structural size of electronic components, the continuous improvement of power and the increasing of the integration level of electronic equipment, the volume power density or the area power density of the electronic components and the equipment is increased, if the heat in the electronic components cannot be dissipated through an effective heat path, the junction temperature of the components is increased rapidly, and when the actual working junction temperature of the components exceeds the maximum allowable junction temperature of the components, the performance of the components is reduced, even the components are damaged due to failure. The performance degradation or damage of the electronic components will cause parameter variation or various disturbances in the circuit, such as power supply ripple increase, circuit self-oscillation, voltage variation, thermoelectric force variation, transmission delay time variation of the integrated circuit, and so on.
The heat pipe, the Vapor Chamber, and the heat sink are generally directly mounted on the high-power electronic component. Therefore, when the system has a plurality of components needing heat dissipation, the heat dissipation modules are dispersed, the number of system fans is large, the components are wasted, the heat dissipation efficiency is low, the heat dissipation effect is poor, local hot spots exist, the space is wasted, and the volume of the system is large, so that the integrated heat dissipation technology is very important for high-power equipment.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides an integrated high-power heat dissipation module with a heat collection pipe, a soaking plate and a heat dissipation fin, which has the characteristics of small structural volume, high heat transfer efficiency, good heat dissipation effect, stable and reliable effect and the like.
In order to solve the technical problem, the technical scheme of the invention is as follows: the utility model provides a high-power heat dissipation module of integrated form for to high-power components and parts and dispel the heat, high-power components and parts are installed on the bottom plate, including locating the fin of one of them side of bottom plate to and wherein one end is fixed in on the fin, L type soaking plate, direct heat dissipation module, horizontal plane heat pipe heat dissipation module and the perpendicular heat pipe heat dissipation module that the other end extends to high-power components and parts one side, the vertical side subsides of L type soaking plate are located on the fin, the horizontal limit is located between high-power components and the bottom plate, still be equipped with radiator fan on the fin, one side that the fin was kept away from to the bottom plate is equipped with the front bezel, be equipped with system's fan and air outlet on the front bezel, still locate including the cover the panel beating lid of fin, bottom plate and front bezel periphery, the panel beating is covered and is equipped with the air intake.
Furthermore, the bottom plate is also provided with a fixing plate for fixing the high-power component, and the horizontal edge of the L-shaped soaking plate is limited between the fixing plate and the high-power component.
Furthermore, the vertical limit that L type soaking plate and fin correspond is the condensation segment, be equipped with on the fin with the first recess of condensation segment adaptation, the condensation segment spacing in the first recess, the horizontal limit that L type soaking plate and high-power components and parts correspond is the evaporation zone, be equipped with on the fixed plate with the second recess of evaporation zone adaptation, the evaporation zone spacing in the second recess.
Furthermore, heat conducting fins are arranged between the direct heat radiation module, the horizontal heat pipe heat radiation module and the vertical heat pipe heat radiation module and the heat radiating fins.
Furthermore, heat conducting fins are arranged between the L-shaped soaking plate and the radiating fins, between the L-shaped soaking plate and the fixing plate and between the L-shaped soaking plate and the high-power component.
Further, the heat conducting sheet can be a heat conducting silver glue layer, heat conducting silicone grease or indium foil.
Furthermore, the horizontal heat pipe radiating module comprises a radiating surface, a heat pipe and a horizontal heat conducting surface which are sequentially connected, the vertical heat pipe radiating module comprises a radiating surface, a heat pipe and a vertical heat conducting surface which are sequentially connected, the radiating surface is fixed on the radiating fin, and the number of the horizontal heat conducting surface and the vertical heat conducting surface is at least 2.
Furthermore, the horizontal heat pipe radiating module, the vertical radiating module and the L-shaped soaking plate are made of red copper.
Furthermore, a plurality of fins are arranged in the radiating fin, the fins are parallel to the bottom plate, and a plurality of openings perpendicular to the fins are formed in the fins.
Furthermore, dust screens are installed on the air inlet and the air outlet.
The invention provides an integrated high-power heat dissipation module which comprises a heat dissipation sheet arranged on one side edge of a bottom plate, an L-shaped soaking plate, a direct heat dissipation module, a horizontal plane heat pipe heat dissipation module and a vertical plane heat pipe heat dissipation module, wherein one end of the L-shaped soaking plate is fixed on the heat dissipation sheet, the other end of the L-shaped soaking plate extends to one side of a high-power component, the vertical edge of the L-shaped soaking plate is attached to the heat dissipation sheet, the horizontal edge of the L-shaped soaking plate is positioned between the high-power component and the bottom plate, a heat dissipation fan is further arranged on the heat dissipation sheet, a front plate is arranged on one side, far away from the heat dissipation sheet, of the bottom plate, a system fan and an air outlet are arranged on the front plate, a sheet metal cover sleeved on the peripheries of the heat dissipation sheet, the bottom plate and the front plate is further provided with an air inlet. The heat of the high-power component is led out to the radiating fin through the L-shaped soaking plate, the heat of the component near the radiating fin is directly led out to the radiating fin through the direct radiating module, and the heat of the component far away from the radiating fin is led out to the radiating fin through the heat pipe radiating module. The heat on the radiating fins is forced to be cooled by a radiating fan fixed on the radiating fins. The system fan is fixed on the front plate and is provided with an air outlet, the metal plate cover is provided with an air inlet, and the fan draws air from the inside and takes away the heat in the system. The horizontal plane heat pipe radiating module, the vertical plane heat pipe radiating module and the L-shaped soaking plate are in phase-change heat transfer, so that the heat conduction efficiency is high, the system maintains relatively stable working temperature through the mutual matching of the three, the radiating fins, the radiating fan and the system fan, the influence on normal work caused by overhigh heat is avoided, the integrated radiating module is high in heat conduction efficiency, good in radiating effect, stable and reliable in effect, and the working stability and the service life of the system are improved.
Drawings
Fig. 1 is an overall assembly view of an integrated high-power heat dissipation module according to an embodiment 1 of the present invention;
fig. 2 is an internal assembly view of the integrated high-power heat dissipation module according to an embodiment 1 of the present invention;
fig. 3 is a schematic diagram of an L-shaped soaking plate structure in an embodiment 1 of the invention;
fig. 4 is a schematic structural diagram of a sheet metal cover in an embodiment 1 of the present invention;
FIG. 5 is a schematic structural diagram of a horizontal heat pipe heat dissipation module according to an embodiment 1 of the present invention;
fig. 6 is a schematic structural diagram of a vertical-surface heat pipe heat dissipation module in embodiment 1 of the present invention;
fig. 7 is an internal assembly view of the integrated high-power heat dissipation module according to an embodiment 2 of the present invention;
shown in the figure: 1. a high-power component; 101. a high power small device; 102. a high-power circuit board; 2. a fixing plate; 3. a base plate; 4. a vertical plane heat pipe radiating module; 401. a heat dissipating surface; 402. a heat pipe; 403. a vertical heat conducting surface; 404. a horizontal heat conducting surface; 5. a heat sink; 6. an L-shaped soaking plate; 7. a heat radiation fan; 8. a horizontal heat pipe heat dissipation module; 9. a direct heat dissipation module; 10. a system fan; 11. a front plate; 12. a sheet metal cover; 1201. and an air inlet.
Detailed Description
The invention is described in detail below with reference to the attached drawing figures:
example 1
As shown in fig. 1, 2, and 3, the integrated high-power heat dissipation module provided by the present invention is configured to dissipate heat of a high-power component 1, where the high-power component 1 is installed on a bottom plate 3, the heat dissipation module includes a heat dissipation plate 5 disposed on one side of the bottom plate 3, and an L-shaped soaking plate 6, a direct heat dissipation module 9, a horizontal heat pipe heat dissipation module 8, and a vertical heat pipe heat dissipation module 4, where one end of the heat dissipation plate 5 is fixed on the heat dissipation plate 5, and the other end of the heat dissipation plate extends toward one side of the high-power component 1, a vertical side of the L-shaped soaking plate 6 is attached to the heat dissipation plate 5, a horizontal side of the L-shaped soaking plate 6 is located between the high-power component 1 and the bottom plate 3, the heat dissipation plate 5 is further provided with a heat dissipation fan 7 for forced air cooling, a front plate 11 is disposed on one side of the bottom plate 3 away from the heat dissipation plate 5, a system fan 10 and an air outlet are disposed on the front plate 11, and a cover 12 is disposed on the metal plate 5, the bottom plate 3 and the front plate 11, and the heat dissipation plate 5, the front plate 11 are disposed together with the cover 12, so as to prevent the heat dissipation plate 5, the bottom plate 3, and the front plate 11 from being affected by external environment, and the high-power component 1. The metal plate cover is provided with the air inlet 1201, the system fan 10 draws air from the inside and takes away heat inside the system, the system maintains relatively stable working temperature through mutual matching of the modules, normal work is prevented from being influenced due to overhigh heat, the integrated heat dissipation module is high in heat transfer efficiency, good in heat dissipation effect, stable and reliable in effect, and the working stability and the service life of the system are improved.
Preferably, as shown in fig. 5 and 6, the vertical heat pipe heat dissipation module 4 includes a heat dissipation surface 401, a heat pipe 402, and a vertical heat conduction surface 403, which are sequentially connected, and the horizontal heat pipe heat dissipation module 8 includes a heat dissipation surface 401, a heat pipe 402, and a horizontal heat conduction surface 404, which are sequentially connected, where the heat dissipation surface 401 is fixed on the heat dissipation plate 5, and the number of the horizontal heat conduction surfaces 404 and the number of the vertical heat conduction surfaces 403 are at least 2. The horizontal heat conducting surface 404 and the vertical heat conducting surface 403 are respectively welded with an evaporation end of a corresponding heat pipe 402, the heat radiating surface 401 is welded with a condensation end of the corresponding heat pipe 402, when the temperature of the horizontal heat conducting surface 404 or the vertical heat conducting surface 403 reaches the vaporization temperature of liquid filled in the heat pipe 402, the liquid at the evaporation end of the heat pipe 402 is rapidly vaporized, vapor flows to the condensation end along a capillary structure of a pipe wall, flows back to the evaporation end along the capillary structure after being cooled and liquefied by the heat radiating surface 401, and circulates to conduct heat from the horizontal heat conducting surface 404 or the vertical heat conducting surface 403 to the heat radiating surface 401 until the temperatures at the two ends of the heat pipe are equal. In this embodiment, the heat pipe 402, the horizontal heat-conducting surface 404, the vertical heat-conducting surface 403, and the heat-dissipating surface 401 are made of red copper with good heat-conducting property. The heat pipe 402 is mainly circular, and the capillary structure of the inner core mainly comprises a single-layer or multi-layer mesh core, an axial channel type tube core, a sintered powder tube core and the like. In the invention, the heat pipe 402 is flattened and then bent, so that the heat pipe can be conveniently welded with the horizontal heat conducting surface 404, the vertical heat conducting surface 403 and the radiating surface 401. In this embodiment, there are three horizontal heat-conducting surfaces 404, and there are 2 vertical heat-conducting surfaces 403, respectively, and certainly, in the actual application process, the number of the horizontal heat-conducting surfaces 404, the number of the vertical heat-conducting surfaces 403, and the number of the heat pipes 402 may be increased or decreased according to the number of components inside the actual system.
Preferably, as shown in fig. 3, the vertical edge of the L-shaped soaking plate 6 corresponding to the heat sink 5 is a condensation section, the heat sink 5 is provided with a first groove adapted to the condensation section, the condensation section is limited in the first groove, the horizontal edge of the L-shaped soaking plate 6 corresponding to the high-power component 1 is an evaporation section, the fixing plate 2 is provided with a second groove adapted to the evaporation section, and the evaporation section is limited in the second groove. The second groove is formed in the fixing plate 2, so that the L-shaped soaking plate 6 cannot bear too large pressure when the high-power component 1 is pressed and fastened with the fixing plate 2, and the situation that the high-power component cannot collapse and deform is guaranteed. Meanwhile, the fixing plate 2 is tightly contacted with the bottom plate 3 and fixed by screws, so that the heat dissipation area is increased. As shown in fig. 1, the high power component 1 includes a high power small device 101 and a high power circuit board 102. The heat of the high-power component 1 is transferred to the evaporation section of the L-shaped soaking plate 6, when the temperature of the evaporation section reaches the vaporization temperature of the filling liquid, the internal liquid is rapidly vaporized, the vapor moves upwards along the porous liquid absorption core to the condensation section, is cooled and liquefied through the radiating fins 5, and then flows back to the evaporation section along the porous liquid absorption core, and the heat evaporation end is circularly led to the condensation section till the temperatures of the two sections are equal. Meanwhile, the L-shaped soaking plate 6 can eliminate local hot spots, the temperature is uniform, the performance of the high-power component 1 is guaranteed, and the service life of the equipment is prolonged. In this embodiment, the L-shaped vapor chamber 6 is bent into an L-shape by using a flat vapor chamber, so that under the combined action of gravity and capillary suction provided by the porous liquid absorption core, the liquid working medium in the condensation section flows back, so that the evaporation section has sufficient phase change of the liquid working medium, thereby improving the heat transfer performance of the L-shaped vapor chamber and shortening the starting time of the L-shaped vapor chamber.
Preferably, the heat pipe 402 and the inside of the L-shaped soaking plate are pumped into a negative pressure state and filled with a proper liquid, the liquid has a low boiling point and is easy to volatilize, the liquid utilizes the heat conduction principle and the rapid heat transfer property of the phase-change medium, the heat of the heating object is rapidly transferred to the heat dissipation end through the heat pipe 402 and the L-shaped soaking plate, and the heat conduction capability of the liquid exceeds the heat conduction capability of any known metal.
Preferably, the direct heat dissipation module 9, the horizontal heat pipe heat dissipation module 8, and the vertical heat pipe heat dissipation module 4 are suitable for the surfaces of components with small heating areas, such as capacitors, chips, inductors, and the like. The L-shaped soaking plate 6 is suitable for high-power and large-area heating components and parts and can be a laser, a pumping module, a photodiode package heat radiation, a plurality of high-power LEDs, an IGBT module and the like.
Preferably, heat conduction silicone grease or heat conduction silver colloid can be used between the direct heat dissipation module 9, the horizontal heat pipe heat dissipation module 8, the vertical heat pipe heat dissipation module 4 and the heat dissipation fins 5 and between the components, so that the heat conduction efficiency is high, the heat conduction speed is high, and the heat dissipation surface and the heat conduction surface are small in area and convenient to paint. Indium foils are selected among the L-shaped soaking plate 6, the radiating fins 5 and the high-power component 1, the heat conductivity coefficient of the indium foils is high, and the L-shaped soaking plate 6 is large in area and convenient to install.
Preferably, the fins of the heat sink 5 are parallel to the width direction of the base plate, which is beneficial to heat dissipation at two ends of the heat sink, and meanwhile, a plurality of notches perpendicular to the fins are formed on the fins to cut the fins into a plurality of short parts, so that although the heat dissipation area is reduced, the heat conduction coefficient of the fins is increased, the wind pressure is increased, the fluid disturbance is increased, and the convection heat transfer coefficient between the heat dissipation teeth is improved. In this case, the heat dissipation fan 7 is installed perpendicular to the heat conduction surface of the heat dissipation fins, so that the wind pressure is large, and the heat convection coefficient between the heat dissipation fins is also improved.
Preferably, in the scheme, an air outlet of the system fan 10 is formed in the front plate 11 of the system, an air inlet 1201 is formed in the system sheet metal cover 12, the system fan 10 draws air from the inside to take away heat in the system, and a vortex area generated by the system fan 10 blowing air to the inside can be prevented from occurring in the system. The number of air inlets can be increased according to the heat dissipation requirement. Dust screens are arranged on the air inlet 1201 and the air outlet, so that dust can be prevented from entering to influence the normal work and the service life of the high-power component.
Preferably, the heat of the high-power component 1 is transmitted to the radiating fin 5 through the direct radiating module 9, the horizontal plane heat pipe radiating module 8, the vertical plane heat pipe radiating module 4 and the L-shaped soaking plate 6, so that the number of radiating fans is reduced, the overall height of the system is greatly reduced, the overall size is reduced, the system structure is more compact, the radiating is centralized, the radiating efficiency is improved, and the radiating effect is good.
Example 2
Unlike embodiment 1, in this case, as shown in fig. 7, the heat sink 5 is fixed to the upper portion parallel to the base plate 3, and the heat sink 5 and the base plate 3 are connected and fixed by 4 front plates 11. The soaking plate is flat without bending and is arranged in the groove of the radiating fin 5. The high-power component 1 is directly in close contact with the hot surface of the soaking plate, and the radiating fin is in close contact with the cold surface of the soaking plate. The heat of other components is conducted to the flat vapor chamber by the direct heat radiation module 9, the horizontal heat pipe heat radiation module 8 and the vertical heat pipe heat radiation module 4. In this case, when the hot surface of the vapor chamber is heated and the temperature reaches the vaporization temperature of the liquid in the vapor chamber, the liquid is vaporized, the vapor moves upward to the cold surface of the vapor chamber, is cooled and liquefied by the heat sink 5, and flows back to the hot surface under the combined action of gravity and the capillary suction force provided by the porous liquid absorption core. Therefore, the circulating path is short, the heat transfer efficiency is high, and the heat dissipation effect is good.
Although the embodiments of the present invention have been described in the specification, these embodiments are merely provided as a hint, and should not limit the scope of the present invention. Various omissions, substitutions, and changes may be made without departing from the spirit of the invention and are intended to be included within the scope of the invention.
Claims (10)
1. The utility model provides a high-power heat dissipation module of integrated form for dispel the heat to high-power components and parts, high-power components and parts are installed on the bottom plate, a serial communication port, high-power heat dissipation module of integrated form is including locating the fin of one of them side of bottom plate, and wherein one end is fixed in on the fin, L type soaking board, direct radiating module, horizontal plane heat pipe radiating module and the perpendicular heat pipe radiating module of the other end extension to high-power components and parts one side, the vertical side subsides of L type soaking board are located on the fin, the horizontal limit is located between high-power components and the bottom plate, still be equipped with radiator fan on the fin, one side that the fin was kept away from to the bottom plate is equipped with the front bezel, be equipped with system fan and air outlet on the front bezel still including the cover locate the panel beating lid of fin, bottom plate and front bezel periphery, the panel beating is covered and is equipped with the air intake.
2. The integrated high-power heat dissipation module according to claim 1, wherein a fixing plate for fixing the high-power component is further disposed on the bottom plate, and a horizontal edge of the L-shaped soaking plate is limited between the fixing plate and the high-power component.
3. The integrated high-power heat dissipation module according to claim 2, wherein the vertical edge of the L-shaped soaking plate corresponding to the heat sink is a condensation section, the heat sink is provided with a first groove adapted to the condensation section, the condensation section is limited in the first groove, the horizontal edge of the L-shaped soaking plate corresponding to the high-power component is an evaporation section, the fixing plate is provided with a second groove adapted to the evaporation section, and the evaporation section is limited in the second groove.
4. The integrated high-power heat dissipation module according to claim 1, wherein heat conducting fins are disposed between the direct heat dissipation module, the horizontal heat pipe heat dissipation module, and the vertical heat pipe heat dissipation module, and the heat dissipation fins.
5. The integrated high-power heat dissipation module according to claim 1, wherein heat conducting fins are respectively disposed between the L-shaped soaking plate and the heat dissipation fins, between the fixing plate and between the L-shaped soaking plate and the high-power component.
6. The integrated high power heat dissipation module according to claim 4 or 5, wherein the heat conductive sheet is a heat conductive silver paste layer, a heat conductive silicone grease or an indium foil.
7. The integrated high-power heat dissipation module according to claim 1, wherein the horizontal heat pipe module comprises a heat dissipation surface, a heat pipe and a horizontal heat conduction surface, and the vertical heat pipe module comprises a heat dissipation surface, a heat pipe and a vertical heat conduction surface, the heat dissipation surfaces are fixed on the heat dissipation plate, and the number of the horizontal heat conduction surface and the vertical heat conduction surface is at least 2.
8. The integrated high-power heat dissipation module according to claim 1, wherein the horizontal heat pipe heat dissipation module, the vertical heat dissipation module and the L-shaped vapor chamber are made of red copper.
9. The integrated high power heat dissipating module according to claim 1, wherein the heat sink has a plurality of fins parallel to the base plate, and the fins have a plurality of slits perpendicular to the fins.
10. The integrated high power heat dissipation module according to claim 9, wherein dust screens are installed on both the air inlet and the air outlet.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110634133.4A CN115515365A (en) | 2021-06-07 | 2021-06-07 | Integrated high-power heat dissipation module |
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| CN202110634133.4A CN115515365A (en) | 2021-06-07 | 2021-06-07 | Integrated high-power heat dissipation module |
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| CN115515365A true CN115515365A (en) | 2022-12-23 |
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