CN115504783A - 一种knn基无铅压电陶瓷及其制备方法 - Google Patents
一种knn基无铅压电陶瓷及其制备方法 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 59
- 238000002360 preparation method Methods 0.000 title abstract description 11
- 239000000126 substance Substances 0.000 claims abstract description 16
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 3
- 238000000498 ball milling Methods 0.000 claims description 27
- 230000010287 polarization Effects 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 16
- 229910020068 MgAl Inorganic materials 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 14
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 14
- 238000005245 sintering Methods 0.000 claims description 14
- 239000011734 sodium Substances 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 8
- 239000010955 niobium Substances 0.000 claims description 8
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 7
- 238000005469 granulation Methods 0.000 claims description 7
- 230000003179 granulation Effects 0.000 claims description 7
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 claims description 7
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 7
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 7
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 7
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 229910001936 tantalum oxide Inorganic materials 0.000 claims description 7
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 7
- 239000012752 auxiliary agent Substances 0.000 claims description 4
- 229920002545 silicone oil Polymers 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229910052746 lanthanum Inorganic materials 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 238000010304 firing Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910010293 ceramic material Inorganic materials 0.000 abstract description 5
- 238000004321 preservation Methods 0.000 description 12
- 239000000243 solution Substances 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000005303 weighing Methods 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 239000004372 Polyvinyl alcohol Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920002451 polyvinyl alcohol Polymers 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
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Abstract
本发明涉及陶瓷材料领域,具体为一种KNN基无铅压电陶瓷及其制备方法,其化学结构式如下所示:(Na0.5K0.5)Nbx(TayZr1‑y)1‑xO3‑αLMnO3‑βMgAl2O4‑γ氧化物助剂,其中,x、y为摩尔比;α、β、γ为摩尔分数;x为0.85‑0.95,y为0.5‑0.67,α为0.2‑0.6%,β为0.5‑1%,γ为1‑5%;L为稀土元素,本发明所制备的KNN基无铅压电陶瓷具有较大的体积密度,各项性能优良,可以满足压电陶瓷器件应用的要求。
Description
技术领域
本发明涉及陶瓷材料领域,具体涉及一种KNN基无铅压电陶瓷及其制备方法。
背景技术
压电陶瓷是一种能够将机械能和电能转换的具有压电效应的功能材料,广泛应用于电子、机械等各种领域,目前大规模使用的压电陶瓷材料体系主要是铅基压电陶瓷。铅基压电陶瓷具有优异的压电性能,并且可以通过掺杂取代来调节其性能以满足不同需求,但是这些陶瓷材料中含有大量对人体和环境有害的铅,目前环境保护问题日益引起人们的关注,压电陶瓷材料将最终实现无铅化,因而环境友好型无铅压电陶瓷成为研究的热点。
其中铌酸钾钠基无铅压电陶瓷以其相对优越的压电性能和较高的居里温度倍受关注,但是由于自身存在采用传统陶瓷工艺难烧结致密等问题。为了解决该缺陷、优化其性能、拓宽其应用范围,对其进行成分调控改性成为目前国内外科研工作者的研究热点。
发明内容
发明目的:针对现有技术的缺陷或改进需求,本发明提供了一种KNN基无铅压电陶瓷及其制备方法。
本发明所采用的技术方案如下:
一种KNN基无铅压电陶瓷,其化学结构式如下所示:
(Na0.5K0.5)Nbx(TayZr1-y)1-xO3-αLMnO3-βMgAl2O4-γ氧化物助剂
其中,x、y为摩尔比;
α、β、γ为摩尔分数;
x为0.85-0.95,y为0.5-0.67,α为0.2-0.6%,β为0.5-1%,γ为1-5%;
L为稀土元素。
进一步地,x为0.9-0.95,y为0.5-0.6。
进一步地,x为0.95,y为0.52。
进一步地,α为0.3-0.5%,β为0.8-1%,γ为2-3%。
进一步地,α为0.5%,β为0.8%,γ为2.5%
进一步地,L为La、Y、Er、Ho、Tm、Lu、Yb中的任意一种或多种。
进一步地,所述氧化物助剂为CuO、ZnO、MnO、CoO、Cr2O3、Li2O中的任意一种或多种。
本发明还提供了一种KNN基无铅压电陶瓷的制备方法:
按照化学结构式称量干燥后的碳酸钠、碳酸钾、五氧化二铌、氧化钽、氧化锆、LMnO3、MgAl2O4、氧化物助剂混合后球磨并烘干,得到混合物料,混合物料预烧后再次球磨并烘干,加入粘结剂造粒,采用模压法压制成坯,所得坯体在620-650℃保温排胶30-60min后,升温至1100-1150℃保温烧结1-2h,将烧结后的陶瓷两侧表面被银并高压极化。
进一步地,预烧温度为750-800℃,预烧时间为1-2h。
进一步地,高压极化在110-120℃的硅油中进行,极化电压为3-4kV/mm,极化时间为20-30min。
有益效果:
本发明提供了一种KNN基无铅压电陶瓷,KNN陶瓷中B位由Ta和Zr取代,在KNN基陶瓷中建立了类似PZT中的MPB,从而增强了陶瓷的性能,而且产生晶格畸变有利于晶胞自发极化转向,从而改善其极化特点,最终提高其压电活性,LMnO3和氧化物助剂在固相烧结中可与主晶相形成固溶体促进缺陷增加,促进颗粒重排,提高了晶界迁移率,使气孔充分排出,促进晶粒的发育,提高坯体的致密度,降低烧结温度并抑制Na和K在烧结过程中的挥发,近年来,研究者通过掺杂尖晶石第二相来改善钙钛矿结构陶瓷的介电性能,发明人尝试将尖晶石型MgAl2O4对KNN基陶瓷进行掺杂,第二相的钉扎作用影响了烧结时的传质过程和晶界迁移,抑制了大晶粒生长,使晶粒尺寸趋于均匀致密,获得较好的压电、介电性能,经测试,本发明所制备的KNN基无铅压电陶瓷具有较大的体积密度,各项性能优良,可以满足压电陶瓷器件应用的要求。
附图说明
图1为本发明实施例1所制备KNN基无铅压电陶瓷的表面SEM图。
具体实施方式
实施例中未注明具体条件者,按照常规条件或制造商建议的条件进行。所用试剂或仪器未注明生产厂商者,均为可以通过市售购买获得的常规产品。
实施例1:
一种KNN基无铅压电陶瓷,其化学结构式如下所示:
(Na0.5K0.5)Nb0.95(Ta0.52Zr0.48)0.05O3-0.5%LaMnO3-0.8%MgAl2O4-2.5%CuO
上述KNN基无铅压电陶瓷的制备方法如下:
按照化学结构式称量干燥后的碳酸钠、碳酸钾、五氧化二铌、氧化钽、氧化锆、LaMnO3、MgAl2O4、CuO混合后加入行星球磨机中,以无水乙醇为球磨介质,球磨16h,球磨转速为160r/min,球磨后50℃烘干,得到混合物料,混合物料780℃预烧1.5h后再次球磨8h并烘干,加入质量分数8%的聚乙烯醇溶液造粒,采用模压法压制成坯,压制压力为200MPa,所得坯体在650℃保温排胶50min后,升温至1135℃保温烧结1.5h,将烧结后的陶瓷两侧表面被银,在120℃的硅油中进行高压极化,极化电压为3kV/mm,极化时间为25min。
实施例2:
一种KNN基无铅压电陶瓷,其化学结构式如下所示:
(Na0.5K0.5)Nb0.95(Ta0.52Zr0.48)0.05O3-0.5%LaMnO3-0.8%MgAl2O4-2.5%CuO
上述KNN基无铅压电陶瓷的制备方法如下:
按照化学结构式称量干燥后的碳酸钠、碳酸钾、五氧化二铌、氧化钽、氧化锆、LaMnO3、MgAl2O4、CuO混合后加入行星球磨机中,以无水乙醇为球磨介质,球磨16h,球磨转速为160r/min,球磨后50℃烘干,得到混合物料,混合物料800℃预烧2h后再次球磨8h并烘干,加入质量分数8%的聚乙烯醇溶液造粒,采用模压法压制成坯,压制压力为200MPa,所得坯体在650℃保温排胶60min后,升温至1150℃保温烧结2h,将烧结后的陶瓷两侧表面被银,在120℃的硅油中进行高压极化,极化电压为4kV/mm,极化时间为30min。
实施例3:
一种KNN基无铅压电陶瓷,其化学结构式如下所示:
(Na0.5K0.5)Nb0.95(Ta0.52Zr0.48)0.05O3-0.5%LaMnO3-0.8%MgAl2O4-2.5%CuO
上述KNN基无铅压电陶瓷的制备方法如下:
按照化学结构式称量干燥后的碳酸钠、碳酸钾、五氧化二铌、氧化钽、氧化锆、LaMnO3、MgAl2O4、CuO混合后加入行星球磨机中,以无水乙醇为球磨介质,球磨16h,球磨转速为160r/min,球磨后50℃烘干,得到混合物料,混合物料750℃预烧1h后再次球磨8h并烘干,加入质量分数8%的聚乙烯醇溶液造粒,采用模压法压制成坯,压制压力为200MPa,所得坯体在620℃保温排胶30min后,升温至1100℃保温烧结1h,将烧结后的陶瓷两侧表面被银,在110℃的硅油中进行高压极化,极化电压为3kV/mm,极化时间为20min。
实施例4:
一种KNN基无铅压电陶瓷,其化学结构式如下所示:
(Na0.5K0.5)Nb0.95(Ta0.52Zr0.48)0.05O3-0.5%LaMnO3-0.8%MgAl2O4-2.5%CuO
上述KNN基无铅压电陶瓷的制备方法如下:
按照化学结构式称量干燥后的碳酸钠、碳酸钾、五氧化二铌、氧化钽、氧化锆、LaMnO3、MgAl2O4、CuO混合后加入行星球磨机中,以无水乙醇为球磨介质,球磨16h,球磨转速为160r/min,球磨后50℃烘干,得到混合物料,混合物料800℃预烧1h后再次球磨8h并烘干,加入质量分数8%的聚乙烯醇溶液造粒,采用模压法压制成坯,压制压力为200MPa,所得坯体在650℃保温排胶30min后,升温至1150℃保温烧结1h,将烧结后的陶瓷两侧表面被银,在120℃的硅油中进行高压极化,极化电压为3kV/mm,极化时间为30min。
实施例5:
一种KNN基无铅压电陶瓷,其化学结构式如下所示:
(Na0.5K0.5)Nb0.95(Ta0.52Zr0.48)0.05O3-0.5%LaMnO3-0.8%MgAl2O4-2.5%CuO
上述KNN基无铅压电陶瓷的制备方法如下:
按照化学结构式称量干燥后的碳酸钠、碳酸钾、五氧化二铌、氧化钽、氧化锆、LaMnO3、MgAl2O4、CuO混合后加入行星球磨机中,以无水乙醇为球磨介质,球磨16h,球磨转速为160r/min,球磨后50℃烘干,得到混合物料,混合物料750℃预烧2h后再次球磨8h并烘干,加入质量分数8%的聚乙烯醇溶液造粒,采用模压法压制成坯,压制压力为200MPa,所得坯体在620℃保温排胶60min后,升温至1150℃保温烧结2h,将烧结后的陶瓷两侧表面被银,在110℃的硅油中进行高压极化,极化电压为4kV/mm,极化时间为20min。
对比例1
与实施例1基本相同,区别在于,没有用Ta和Zr取代Nb,KNN基无铅压电陶瓷的化学结构式如下所示:
(Na0.5K0.5)NbO3-0.5%LaMnO3-0.8%MgAl2O4-2.5%CuO
对比例2
与实施例1基本相同,区别在于,不含LaMnO3。
对比例3
与实施例1基本相同,区别在于,不含MgAl2O4。
对比例4
与实施例1基本相同,区别在于,不含CuO。
性能测试:
以本发明实施例1-5及对比例1-4中所制备的KNN基无铅压电陶瓷作为样品进行性能测试;
根据阿基米德原理测试并计算得到的样品的体积密度;
采用ZJ-3AN型准静态d33测试仪测量样品的压电常数;
采用精密阻抗分析仪(Agilent HP4294A)分析试样的机电耦合系数kp及机械品质因数Qm,其中,压电应变常数d33越大表示压电性能越高,机械品质因数Qm越大表示压电陶瓷在共振振动时的损失越小;
机电耦合系数kp表示压电振子在振动过程中,将机械能转变为电能,或将电能转变为机械能的能效比例;
用Tonghui 2817测量陶瓷介电性能,测试温度为室温至400℃,测试频率1kHz。
测试结果如下表1所示:
表1:
由上表1可知,本发明所制备的KNN基无铅压电陶瓷具有较大的体积密度,各项性能优良,可以满足压电陶瓷器件应用的要求。
以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。
Claims (10)
1.一种KNN基无铅压电陶瓷,其特征在于,其化学结构式如下所示:
(Na0.5K0.5)Nbx(TayZr1-y)1-xO3-αLMnO3-βMgAl2O4-γ氧化物助剂
其中,x、y为摩尔比;
α、β、γ为摩尔分数;
x为0.85-0.95,y为0.5-0.67,α为0.2-0.6%,β为0.5-1%,γ为1-5%;
L为稀土元素。
2.如权利要求1所述的KNN基无铅压电陶瓷,其特征在于,x为0.9-0.95,y为0.5-0.6。
3.如权利要求1所述的KNN基无铅压电陶瓷,其特征在于,x为0.95,y为0.52。
4.如权利要求1所述的KNN基无铅压电陶瓷,其特征在于,α为0.3-0.5%,β为0.8-1%,γ为2-3%。
5.如权利要求1所述的KNN基无铅压电陶瓷,其特征在于,α为0.5%,β为0.8%,γ为2.5%。
6.如权利要求1所述的KNN基无铅压电陶瓷,其特征在于,L为La、Y、Er、Ho、Tm、Lu、Yb中的任意一种或多种。
7.如权利要求1所述的KNN基无铅压电陶瓷,其特征在于,所述氧化物助剂为CuO、ZnO、MnO、CoO、Cr2O3、Li2O中的任意一种或多种。
8.一种如权利要求1-7中任一项所述的KNN基无铅压电陶瓷的制备方法,其特征在于,按照化学结构式称量干燥后的碳酸钠、碳酸钾、五氧化二铌、氧化钽、氧化锆、LMnO3、MgAl2O4、氧化物助剂混合后球磨并烘干,得到混合物料,混合物料预烧后再次球磨并烘干,加入粘结剂造粒,采用模压法压制成坯,所得坯体在620-650℃保温排胶30-60min后,升温至1100-1150℃保温烧结1-2h,将烧结后的陶瓷两侧表面被银并高压极化。
9.如权利要求8所述的KNN基无铅压电陶瓷,其特征在于,预烧温度为750-800℃,预烧时间为1-2h。
10.如权利要求8所述的KNN基无铅压电陶瓷,其特征在于,高压极化在110-120℃的硅油中进行,极化电压为3-4kV/mm,极化时间为20-30min。
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