CN115494666A - Method for manufacturing liquid crystal module - Google Patents
Method for manufacturing liquid crystal module Download PDFInfo
- Publication number
- CN115494666A CN115494666A CN202211367364.4A CN202211367364A CN115494666A CN 115494666 A CN115494666 A CN 115494666A CN 202211367364 A CN202211367364 A CN 202211367364A CN 115494666 A CN115494666 A CN 115494666A
- Authority
- CN
- China
- Prior art keywords
- liquid crystal
- circuit board
- step part
- manufacturing
- release film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 89
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims description 31
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 230000001681 protective effect Effects 0.000 claims abstract description 50
- 239000000853 adhesive Substances 0.000 claims abstract description 42
- 230000001070 adhesive effect Effects 0.000 claims abstract description 42
- 239000002390 adhesive tape Substances 0.000 claims abstract description 33
- 239000003292 glue Substances 0.000 claims abstract description 32
- 238000005507 spraying Methods 0.000 claims abstract description 29
- 238000007639 printing Methods 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000013464 silicone adhesive Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 61
- 230000003139 buffering effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F1/00—Preventing the formation of electrostatic charges
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application relates to a manufacturing method of a liquid crystal module, which comprises the following steps: printing ink on the other side of the liquid crystal panel opposite to the first step part and the second step part along the first direction, and printing ink on the two sides of the liquid crystal panel along the second direction; the first direction and the second direction are perpendicular to each other; arranging a buffer piece on the first step part, so that the release film arranged on the buffer piece completely covers the second step part; spraying the first protective glue on the printing ink, and removing the release film; and attaching one side of the anti-static adhesive tape to the second step part, and attaching the other side of the anti-static adhesive tape to one side of the array substrate, which is far away from the color film substrate. The manufacturing method of the liquid crystal module can avoid the phenomenon that the anti-static adhesive tape floats because the first protective adhesive penetrates into the second step part, thereby reducing the risk of damage caused by excessive electrical stress.
Description
Technical Field
The present disclosure relates to a liquid crystal module, and more particularly, to a method for manufacturing a liquid crystal module.
Background
The liquid crystal panel comprises an array substrate, a color film substrate and a polarizer which are sequentially stacked. One ends of the driving chip and the flexible circuit board are electrically connected to the array substrate, and the other end of the flexible circuit board is electrically connected to the printed circuit board, so that the liquid crystal module is formed, and the display function is realized. However, the phenomenon that the anti-static tape floats or even falls off exists in the existing liquid crystal module, and the risk of damage of electronic components or integrated circuit systems in the liquid crystal module due to excessive electrical stress generated by electrostatic discharge is increased.
Disclosure of Invention
Accordingly, there is a need for a method for manufacturing a liquid crystal module, so as to prevent the anti-static tape from floating in the liquid crystal module, thereby reducing the risk of damage due to excessive electrical stress.
The embodiment of the application provides a manufacturing method of a liquid crystal module, which comprises the following steps:
printing ink on the other side of the liquid crystal panel, opposite to the first step part and the second step part, along the first direction and on two sides of the liquid crystal panel along the second direction; the first direction and the second direction are perpendicular to each other;
arranging a buffer on the first step part, so that a release film arranged on the buffer completely covers the second step part;
spraying a first protective adhesive on the printing ink, and removing the release film;
attaching one side of an anti-static adhesive tape to the second step part, and attaching the other side of the anti-static adhesive tape to one side of the array substrate, which is far away from the color film substrate.
In one embodiment, the release film is configured as a transparent release film;
the method comprises the following steps of spraying a first protective adhesive on the printing ink and removing the release film:
and identifying alignment marks on two sides of the liquid crystal panel along the second direction so as to determine a spraying path of the first protective adhesive on the liquid crystal panel.
In one embodiment, the step of disposing a buffer on the first step portion, before the step of disposing a release film on the buffer completely covers the second step portion, further includes:
and electrically connecting one end of a flexible circuit board to the first step part, and electrically connecting the other end of the flexible circuit board to the printed circuit board.
In one embodiment, the electrically connecting one end of the flexible circuit board to the first stepped portion and the electrically connecting the other end of the flexible circuit board to the printed circuit board specifically include:
attaching one end of the flexible circuit board to the first step part through a conductive adhesive;
and attaching the other end of the flexible circuit board to the printed circuit board through a conductive adhesive.
In one embodiment, the electrically connecting one end of the flexible circuit board to the first stepped portion and the electrically connecting the other end of the flexible circuit board to the printed circuit board further include:
and coating a second protective adhesive on the first step part.
In one embodiment, the second protective glue is configured as taffy glue, shadowless glue or silicone glue.
In one embodiment, the width of the release film is equal to the distance between the edge of the polarizer and the edge of the array substrate in the first direction.
In one embodiment, in the second direction, an edge of the release film exceeds an edge of the array substrate.
In one embodiment, an orthographic projection of the buffer member on the first step portion completely falls within a range of the first step portion.
In one embodiment, the first protective glue is configured as a shadowless glue.
In the manufacturing method of the liquid crystal module, the release film is additionally arranged on the basis of the conventional buffer piece, and the setting step of the buffer piece is moved forward to the front of the spraying step of the first protective glue, so that after the buffer piece is set, the release film just can completely cover the position to which one side of the anti-static adhesive tape is attached, namely the second step part of the color film substrate, and the first protective glue is prevented from permeating into the second step part during spraying. After the spraying of the first protective glue is finished, the release film is removed to expose the second step part, and then carrying out an anti-static adhesive tape attaching step. The manufacturing method of the liquid crystal module can avoid the phenomenon that the anti-static adhesive tape floats because the first protective adhesive penetrates into the second step part, thereby reducing the risk of damage caused by excessive electrical stress.
Drawings
FIG. 1 is a schematic structural diagram of a liquid crystal module before an anti-static tape is disposed in an embodiment of the related art;
FIG. 2 is a schematic view of the liquid crystal module shown in FIG. 1 at another viewing angle;
FIG. 3 is a schematic structural view of the liquid crystal module shown in FIG. 2 after an anti-static adhesive tape is disposed thereon;
FIG. 4 is a schematic flow chart illustrating a method for fabricating a liquid crystal module according to an embodiment of the related art;
FIG. 5 is a schematic diagram illustrating a first step of spraying a protective paste according to an embodiment of the related art;
FIG. 6 is a schematic flow chart illustrating a method for fabricating a liquid crystal module according to an embodiment of the present disclosure;
FIG. 7 is a schematic structural diagram of a liquid crystal module before an anti-static tape is disposed thereon according to an embodiment of the present disclosure;
FIG. 8 is a schematic view of the liquid crystal module shown in FIG. 7 at another viewing angle;
FIG. 9 is a schematic flow chart illustrating a method for fabricating a liquid crystal module according to another embodiment of the present application;
fig. 10 is a partially enlarged view of a portion a in fig. 1.
Description of reference numerals:
10: liquid crystal panel 40: printed circuit board
11: array substrate 50: antistatic adhesive tape
11a: first step portion 60: printing ink
12: color film substrate 70: first protective adhesive
12a: second step portion 80: buffer piece
13: polarizer 85: release film
20: the driving chip 90: second protective adhesive
30: flexible circuit board
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
With the development of thin film transistor liquid crystal display technology, COG (Chip On Glass) technology is widely used. The COG technology is that a driving chip is directly packaged on an array substrate through anisotropic conductive adhesive, so that the conductive bumps of the driving chip and ITO (indium tin oxide) transparent conductive pads on the array substrate are interconnected and packaged together, and the control of lighting a screen is realized. Specifically, in the manufacturing process of the liquid crystal panel, the mounting position of the driving chip needs to be reserved for the requirement of liquid crystal driving, and the current practice is to make the TFT (Thin Film Transistor, array substrate) with the line slightly larger (usually larger than 1 mm) than the CF (Color Filter, color Film substrate) on the upper layer, and expose the line of the mounting position of the driving chip. In the related art, after the driving chip and the flexible circuit board are arranged, the anti-static adhesive tape is arranged in the frame area of the liquid crystal panel, so that the problem that electronic components or an integrated circuit system in the liquid crystal module are damaged due to excessive electrical stress caused by electrostatic discharge in the subsequent assembling, testing, storing, carrying and other processes is solved.
FIG. 1 is a schematic structural diagram of a liquid crystal module before an antistatic adhesive tape is disposed in an embodiment of the related art; FIG. 2 is a schematic view of the liquid crystal module shown in FIG. 1 at another viewing angle; fig. 3 is a schematic structural view of the liquid crystal module shown in fig. 2 after an antistatic adhesive tape is disposed thereon.
Referring to fig. 1 and 2, the liquid crystal module includes a liquid crystal panel 10, a driving chip 20, a flexible circuit board 30, and a printed circuit board 40. The liquid crystal panel 10 includes an array substrate 11, a color filter substrate 12, and a polarizer 13, which are stacked, the array substrate 11 has a first step portion 11a that exceeds an edge of the color filter substrate 12 along a first direction (x direction in the figure), and the color filter substrate 12 has a second step portion 12a that exceeds an edge of the polarizer 13 along the first direction. One ends of the driving chip 20 and the flexible circuit board 30 are electrically connected to the first step portion 11a, and the other end of the flexible circuit board 30 is electrically connected to the printed circuit board 40, so that the liquid crystal driving is facilitated and the display function is realized. Referring to fig. 3, the liquid crystal module further includes an anti-static tape 50, one side of the anti-static tape 50 is attached to the second step portion 12a, and the other side of the anti-static tape 50 is attached to the side of the array substrate 11 away from the color film substrate 12, so as to protect electronic components or integrated circuit systems in the liquid crystal module and prevent the problem of excessive electrical stress damage caused by electrostatic discharge. However, the liquid crystal module shown in this embodiment has the phenomenon that the anti-static tape 50 floats up or even falls off during use, which increases the risk of damage due to excessive electrical stress.
FIG. 4 is a flow chart illustrating a method for manufacturing a liquid crystal module according to an embodiment of the related art; fig. 5 is a schematic diagram showing a first protective paste spraying step in one embodiment of the related art.
The inventors of the present application further studied a method for manufacturing a liquid crystal module of this embodiment, referring to fig. 4, which comprises the steps of:
s101, printing ink on the other side, opposite to the first step part and the second step part, of the liquid crystal panel along the first direction, and printing ink on two sides of the liquid crystal panel along the second direction; the first direction and the second direction are perpendicular to each other.
Referring to fig. 1 and 5, in the liquid crystal panel 10, edges of the array substrate 11 and the color filter substrate 12 in the second direction (y direction in the drawing) are flush, edges of the array substrate 11 and the color filter substrate 12 partially exceed an edge of the polarizer 13 in the second direction, and the ink 60 wraps three sides of the array substrate 11 and the color filter substrate 12 except for the first step portion 11a and the second step portion 12a, so as to improve a phenomenon of light transmission in a frame region of the liquid crystal panel 10.
S102, spraying the first protective glue on the printing ink.
With continued reference to fig. 5, due to the poor weather resistance of the ink 60, the first protective paste 70 is further sprayed on the ink 60 after the ink 60 is printed, thereby reducing the influence of the external environment on the performance of the ink 60. Referring to fig. 1, the spraying path of the first protective adhesive 70 is from (1) to (4), where (1) and (4) respectively correspond to two ends of the side of the color film substrate 12 close to the first step portion 11a in the second direction, and (2) and (3) respectively correspond to two ends of the side of the liquid crystal panel 10 away from the first step portion 11a in the second direction.
And S103, arranging the buffer material on the first step part.
Referring to fig. 1 and 2, specifically, the buffer 80 is located at an edge of the first stepped portion 11a in the first direction. The thickness H1 of the buffer 80 is greater than the thickness H2 of the driver chip 20, and is less than or equal to the thickness H3 of the color film substrate 12, so that the driver chip 20 is protected in the subsequent assembling, testing, storing, carrying and other processes, and the driver chip 20 is prevented from being collided and damaged.
And S104, attaching one side of the anti-static adhesive tape to the second step part, and attaching the other side of the anti-static adhesive tape to the side of the array substrate, which is far away from the color film substrate.
The inventor of the present application finds, through research on the manufacturing method, that the reason why the anti-static adhesive tape 50 floats is that, in the process of spraying the first protective adhesive 70 along the spraying path by the nozzle in step S102, the (1) position and the (4) position respectively correspond to two ends of the side of the color film substrate 12 close to the first step portion 11a in the second direction, so that the first protective adhesive 70 easily penetrates into two ends of the second step portion 12a in the second direction, and a portion of the anti-static adhesive tape 50 attached to two ends of the second step portion 12a floats and even falls off, thereby increasing the risk of damage due to excessive electrical stress.
In view of the above problems in the related art, embodiments of the present application provide a method for manufacturing a liquid crystal module, so as to avoid a floating phenomenon of an anti-static tape in the liquid crystal module, thereby reducing a risk of damage due to an excessive electrical stress.
FIG. 6 is a schematic flow chart illustrating a method for fabricating a liquid crystal module according to an embodiment of the present disclosure; FIG. 7 is a schematic structural diagram of a liquid crystal module before an antistatic adhesive tape is disposed in an embodiment of the present application; FIG. 8 is a schematic view of the liquid crystal module shown in FIG. 7 at another viewing angle.
In some embodiments, referring to fig. 6 to 8, an embodiment of the present application provides a method for manufacturing a liquid crystal module, where the liquid crystal module includes a liquid crystal panel 10 and a driving chip 20, and the liquid crystal panel 10 includes an array substrate 11, a color filter substrate 12, and a polarizer 13, which are stacked. The array substrate 11 has a first step portion 11a extending beyond the edge of the color filter substrate 12 along the first direction, and the color filter substrate 12 has a second step portion 12a extending beyond the edge of the polarizer 13 along the first direction. The driving chip 20 is electrically connected to the first step portion 11a. The method comprises the following steps:
s201, printing ink on the other side, opposite to the first step part and the second step part, of the liquid crystal panel along the first direction, and printing ink on two sides of the liquid crystal panel along the second direction; the first direction and the second direction are perpendicular to each other.
For the description of the printing position and the function of the ink 60, reference may be made to the content of the embodiments in the related art, and the description thereof is omitted here. Alternatively, the ink 60 may employ a black ink.
S202, the buffer piece is arranged on the first step portion, so that the release film arranged on the buffer piece completely covers the second step portion.
For the description of the position, size and function of the buffer 80, reference may be made to the content of the embodiments in the related art, and the description thereof is omitted here. Referring to fig. 7 and 8, in the present application, a release film 85 is additionally disposed on the buffer 80, the release film 85 is disposed on the liquid crystal panel 10 along with the buffer 80, and when the buffer 80 is disposed on the first step portion 11a, the release film 85 can completely cover the second step portion 12a. Like this, from type membrane 85 can shelter from second step portion 12a in subsequent first protection glue 70 spraying process to avoid first protection glue 70 to permeate into the both ends of second step portion 12a along the second direction. Particularly, the added release film 85 does not affect the existing operation mode of the step of setting the buffer 80, that is, the step of setting the buffer 80 can still be realized by the existing equipment and program for the buffer 80 with the added release film 85, so that the improvement cost of the process flow is reduced to the maximum extent.
Alternatively, the buffering member 80 may be configured as a buffering tape, the buffering tape includes a glue body and a plastic layer attached to one side of the glue body, and the buffering member 80 is attached to the first step portion 11a by the other side of the glue body. The colloid can be temple 7641#25, and the plastic layer can be made of PET (polyethylene terephthalate). Further, the surface of the release film 85 facing the second step portion 12a has adhesiveness, and after the cushion member 80 is disposed on the first step portion 11a, pressure can be applied to the release film 85 from the surface of the release film 85 away from the second step portion 12a, so that the release film 85 can be attached to the second step portion 12a with a certain adhesive force, and the shielding of the release film 85 on the second step portion 12a is more reliable.
S203, spraying the first protective glue on the printing ink, and removing the release film.
For the description of the spraying path and the function of the first protective glue 70, reference may be made to the content of the embodiments in the related art, and the description thereof is omitted here. Referring to fig. 7 and 8, since the release film 85 shields the second step portion 12a, when the nozzle sprays the first protective adhesive 70 near the (1) and the (4), the redundant first protective adhesive 70 may fall to two ends of the release film 85 along the second direction. With the removal of the release film 85, the second step portion 12a is exposed, which facilitates the subsequent step of attaching the anti-static tape 50. Optionally, the first protective glue 70 is configured as a shadowless glue (UV glue).
And S204, attaching one side of the anti-static adhesive tape to the second step part, and attaching the other side of the anti-static adhesive tape to the side, away from the color film substrate, of the array substrate.
In the spraying process of first protective adhesive 70, the shielding of the release film 85 from the second step portion 12a ensures that the two ends of the second step portion 12a are not adhered to by the first protective adhesive 70, after the release film 85 is removed, the anti-static adhesive tape 50 can be smoothly and tightly attached to the second step portion 12a, the phenomenon that the anti-static adhesive tape 50 floats or even falls off is effectively avoided, and the risk of excessive electrical stress damage is reduced. Alternatively, the antistatic tape 50 includes a gel and a metal layer attached to one side of the gel, thereby functioning as an electrostatic shield. The colloid can be temple 631S, and the metal layer can be aluminum foil glue.
Therefore, in the method for manufacturing the liquid crystal module, the release film 85 is additionally arranged on the basis of the existing buffer 80, and the step of arranging the buffer 80 is moved forward to the step of spraying the first protective adhesive 70, so that after the buffer 80 is arranged, the release film 85 can just completely cover the position to which the anti-static adhesive tape 50 is attached on one side, namely, the second step part 12a of the color film substrate 12, and thus the first protective adhesive 70 is prevented from permeating into the second step part 12a during spraying. After the spraying of the first protective adhesive 70 is finished, the release film 85 is removed to expose the second step portion 12a, and then the step of attaching the anti-static adhesive tape 50 is performed. The method for manufacturing the liquid crystal module can avoid the phenomenon that the anti-static adhesive tape 50 floats due to the first protective adhesive 70 permeating into the second step part 12a, thereby reducing the risk of damage caused by excessive electrical stress.
Fig. 9 is a schematic flow chart illustrating a method for manufacturing a liquid crystal module according to another embodiment of the present disclosure.
Referring to fig. 9, an embodiment of the present application provides a method for manufacturing a liquid crystal module, including the steps of:
s301, one end of the flexible circuit board is electrically connected to the first step portion, and the other end of the flexible circuit board is electrically connected to the printed circuit board.
The driving chip 20 is electrically connected to the printed circuit board 40 via the flexible circuit board 30, so as to facilitate liquid crystal driving and achieve a display function. Referring to fig. 1 or 7, the driving chip 20 is disposed at a middle portion of the first stepped portion 11a in the first direction, and the flexible circuit board 30 is disposed at an edge of the first stepped portion 11a in the first direction. Since the buffering member 80 only protects the driving chip 20 and is not electrically connected to the first step portion 11a, the buffering member 80 is usually disposed after the flexible circuit board 30 is disposed, and the buffering member 80 can be partially attached to the surface of the flexible circuit board 30, which is convenient for operation.
In some embodiments, electrically connecting one end of the flexible circuit board to the first stepped portion, and electrically connecting the other end of the flexible circuit board to the printed circuit board specifically includes: one end of the flexible circuit board 30 is attached to the first step portion 11a through the conductive adhesive, and the other end of the flexible circuit board 30 is attached to the printed circuit board 40 through the conductive adhesive, so that the operation is convenient, the connection is reliable, and the conductive effect is good.
S302, coating the second protective glue on the first step portion.
Referring to fig. 1 or 7, after the driving chip 20 and the flexible circuit board 30 are disposed on the first step portion 11a of the array substrate 11, the second protective adhesive 90 is coated on the first step portion 11a, so that the circuit on the first step portion 11a can be protected, and the circuit is prevented from being exposed to the outside and being corroded, scratched, contaminated by foreign matters, and the like. Optionally, the second protective glue 90 is configured as taffy glue, shadowless glue or silicone glue.
S303, printing ink on the other side of the liquid crystal panel opposite to the first step part and the second step part along the first direction, and printing ink on two sides of the liquid crystal panel along the second direction; the first direction and the second direction are perpendicular to each other.
S304, the buffer piece is arranged on the first step portion, so that the release film arranged on the buffer piece completely covers the second step portion.
For the related description of the above steps, reference may be made to the contents of the foregoing embodiments, which are not repeated herein.
S305, identifying the alignment marks on the two sides of the liquid crystal panel along the second direction to determine a spraying path of the first protective glue on the liquid crystal panel.
Referring to fig. 7, in some embodiments, the release film 85 is configured as a transparent release film, the two sides of the liquid crystal panel 10 along the second direction are provided with alignment marks (not shown), and the device positions (1), (2), (3), and (4) of fig. 7 by recognizing the alignment marks on the two sides of the liquid crystal panel 10 along the second direction, so as to determine a spraying path of the first protective adhesive 70 on the liquid crystal panel 10. By configuring the release film 85 as a transparent release film, the apparatus can recognize the alignment mark through the release film 85. Thus, the original positioning mode of the equipment does not need to be changed, and the step of arranging the first protective adhesive 70 can still be realized by adopting the existing equipment and procedures for the liquid crystal panel 10 provided with the release film 85, so that the improvement cost of the process flow is reduced to the maximum extent.
In particular, the positioning operation of the driving chip 20 and the flexible circuit board 30 on the liquid crystal panel 10 may be performed by the positioning mark.
S306, spraying the first protective glue on the printing ink, and removing the release film.
And S307, attaching one side of the anti-static adhesive tape to the second step part, and attaching the other side of the anti-static adhesive tape to the side, away from the color film substrate, of the array substrate.
For the related description of the above steps, reference may be made to the contents of the foregoing embodiments, which are not repeated herein.
In some embodiments, referring to fig. 7, the width B of the release film 85 is equal to the distance between the edge of the polarizer 13 and the edge of the array substrate 11 in the first direction. Thus, when the buffering member 80 is disposed at the edge of the first step portion 11a, the release film 85 can be ensured to completely cover the second step portion 12a, and the first protective adhesive 70 is prevented from penetrating into the second step portion 12a to affect the attaching effect of the subsequent antistatic adhesive tape 50.
In some embodiments, with continued reference to fig. 7, in the second direction, an edge of the release film 85 exceeds an edge of the array substrate 11. So, can improve the effect of sheltering from type membrane 85 to second step portion 12a, avoid first protection glue 70 infiltration to follow the gap between the second direction both ends from type membrane 85 and second step portion 12a to further guarantee antistatic tape 50's attached effect. Specifically, the dimension L1 of the edge of the release film 85 beyond the array substrate 11 is 10 mm or more.
Fig. 10 shows a partial enlarged view at a in fig. 1.
In some embodiments, referring to fig. 10, the orthographic projection of the buffer 80 on the first step portion 11a completely falls within the range of the first step portion 11a. That is, the buffer member 80 does not go beyond the edge of the liquid crystal panel 10. Thus, the buffer 80 can protect the driving chip 20 and simultaneously does not affect the processes of assembling and testing the liquid crystal panel 10. Specifically, a distance L2 between the edge of the buffer 80 and the edge of the array substrate 11 in the first direction is 0 to 0.5 mm, and a distance L3 between the edge of the buffer 80 and the edge of the array substrate 11 in the second direction is 0.5 to 1.5 mm.
To sum up, in the method for manufacturing a liquid crystal module according to the present application, the release film 85 is additionally arranged on the basis of the existing buffer 80, and the step of setting the buffer 80 is moved forward to the step of spraying the first protective adhesive 70, so that after the buffer 80 is set, the release film 85 can just completely cover the position to which the anti-static adhesive tape 50 is attached, that is, the second step portion 12a of the color film substrate 12, so as to prevent the first protective adhesive 70 from penetrating into the second step portion 12a during spraying. After the spraying of the first protective adhesive 70 is finished, the release film 85 is removed to expose the second step portion 12a, and then the step of attaching the anti-static adhesive tape 50 is performed. The method for manufacturing the liquid crystal module can avoid the phenomenon that the anti-static adhesive tape 50 floats due to the first protective adhesive 70 permeating into the second step part 12a, thereby reducing the risk of damage caused by excessive electrical stress.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several implementation modes of the present application, and the description thereof is specific and detailed, but not construed as limiting the scope of the patent. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of this patent shall be subject to the appended claims.
Claims (10)
1. The manufacturing method of the liquid crystal module comprises a liquid crystal panel and a driving chip, wherein the liquid crystal panel comprises an array substrate, a color film substrate and a polarizer which are arranged in a laminated mode; the array substrate is provided with a first step part which exceeds the edge of the color film substrate along a first direction, and the color film substrate is provided with a second step part which exceeds the edge of the polarizer along the first direction; the driving chip is electrically connected to the first step part;
characterized in that the manufacturing method comprises:
printing ink on the other side of the liquid crystal panel opposite to the first step part and the second step part along the first direction, and printing ink on two sides of the liquid crystal panel along the second direction; the first direction and the second direction are perpendicular to each other;
arranging a buffer on the first step part, so that a release film arranged on the buffer completely covers the second step part;
spraying a first protective adhesive on the printing ink, and removing the release film;
attaching one side of an anti-static adhesive tape to the second step part, and attaching the other side of the anti-static adhesive tape to the side of the array substrate, which is far away from the color film substrate.
2. The manufacturing method according to claim 1, wherein the release film is configured as a transparent release film;
the method comprises the following steps of spraying a first protective adhesive on the printing ink and removing the release film:
and identifying alignment marks on two sides of the liquid crystal panel along the second direction so as to determine a spraying path of the first protective adhesive on the liquid crystal panel.
3. The manufacturing method according to claim 1, wherein before the step of providing the buffer to the first step portion so that the release film provided on the buffer completely covers the second step portion, the method further comprises:
and electrically connecting one end of the flexible circuit board to the first step part, and electrically connecting the other end of the flexible circuit board to the printed circuit board.
4. The manufacturing method according to claim 3, wherein the electrically connecting one end of the flexible circuit board to the first stepped portion and the electrically connecting the other end of the flexible circuit board to the printed circuit board specifically include:
attaching one end of the flexible circuit board to the first step part through a conductive adhesive;
and attaching the other end of the flexible circuit board to the printed circuit board through a conductive adhesive.
5. The method of manufacturing according to claim 3, wherein electrically connecting one end of the flexible circuit board to the first stepped portion and electrically connecting the other end of the flexible circuit board to the printed circuit board further comprises:
and coating a second protective adhesive on the first step part.
6. The manufacturing method according to claim 5, wherein the second protective adhesive is configured as a taffy adhesive, a shadowless adhesive, or a silicone adhesive.
7. The manufacturing method according to any one of claims 1 to 6, wherein a width of the release film is equal to a distance between an edge of the polarizer and an edge of the array substrate in the first direction.
8. The manufacturing method according to any one of claims 1 to 6, wherein an edge of the release film exceeds an edge of the array substrate in the second direction.
9. The manufacturing method according to any one of claims 1 to 6, wherein an orthographic projection of the cushion member on the first stepped portion falls entirely within a range of the first stepped portion.
10. The manufacturing method according to any one of claims 1 to 6, wherein the first protective glue is configured as a shadowless glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211367364.4A CN115494666B (en) | 2022-11-02 | 2022-11-02 | Method for manufacturing liquid crystal module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211367364.4A CN115494666B (en) | 2022-11-02 | 2022-11-02 | Method for manufacturing liquid crystal module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115494666A true CN115494666A (en) | 2022-12-20 |
| CN115494666B CN115494666B (en) | 2024-05-17 |
Family
ID=85115365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211367364.4A Active CN115494666B (en) | 2022-11-02 | 2022-11-02 | Method for manufacturing liquid crystal module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115494666B (en) |
Citations (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08288090A (en) * | 1995-04-12 | 1996-11-01 | Hitachi Chem Co Ltd | Static charge preventing method for liquid crystal substrate |
| JPH11223827A (en) * | 1998-02-09 | 1999-08-17 | Nec Corp | Liquid crystal display and manufacture thereof |
| JP2000155532A (en) * | 1998-11-20 | 2000-06-06 | Hitachi Ltd | Display device and liquid crystal display device |
| JP2002184999A (en) * | 2000-12-14 | 2002-06-28 | Toshiba Corp | Manufacturing method of array substrate for display |
| JP2004101833A (en) * | 2002-09-09 | 2004-04-02 | Chi Mei Electronics Corp | Equipment and method for manufacturing liquid crystal display |
| US20070222911A1 (en) * | 2006-03-23 | 2007-09-27 | Epson Imaging Devices Corporation | Liquid crystal device, method for manufacturing liquid crystal device, and electronic apparatus |
| JP2012140008A (en) * | 2010-12-28 | 2012-07-26 | Youl Chon Chemical Co Ltd | Release film having excellent static electricity proofness, and method of manufacturing same |
| KR101187228B1 (en) * | 2012-04-27 | 2012-10-02 | 주)두성하이텍 | Tape cushion and the manufacturing method for proceting lcd panel |
| JP2014059378A (en) * | 2012-09-14 | 2014-04-03 | Hosiden Corp | Release tape, liquid crystal panel including the same, and liquid crystal module |
| CN103913881A (en) * | 2012-12-31 | 2014-07-09 | 厦门天马微电子有限公司 | Liquid crystal display with anti-static structure and manufacturing method thereof |
| US20140211134A1 (en) * | 2013-01-28 | 2014-07-31 | Xiamen Tianma Micro_Electronics Co., Ltd. | Liquid crystal display panel and method for manufacturing the same |
| JP2014211568A (en) * | 2013-04-19 | 2014-11-13 | 三菱電機株式会社 | Optical film member for liquid display device, liquid display device, and manufacturing method of liquid display device |
| KR20150001468A (en) * | 2013-06-27 | 2015-01-06 | 엘지디스플레이 주식회사 | In-plane switching mode liquid crystal display device |
| JP2015084017A (en) * | 2013-10-25 | 2015-04-30 | 株式会社ジャパンディスプレイ | Liquid crystal display device |
| KR20150079284A (en) * | 2013-12-31 | 2015-07-08 | 엘지디스플레이 주식회사 | Liquid crystal display device |
| WO2016010256A1 (en) * | 2014-07-18 | 2016-01-21 | 김재우 | Detachable sheet for protecting liquid crystal, and manufacturing method therefor |
| KR20170000649A (en) * | 2015-06-24 | 2017-01-03 | 최미영 | Removal sheet for protecting liquid crystal and manufacturing method thereof |
| WO2017008313A1 (en) * | 2015-07-10 | 2017-01-19 | 深圳市华星光电技术有限公司 | Liquid crystal display device |
| KR101748234B1 (en) * | 2016-01-21 | 2017-06-16 | 지에프 주식회사 | The etching method of curved liquid crystal display panel not being a copula poor and curved liquid crystal display panel manufactured by the method |
| KR20170116845A (en) * | 2016-04-12 | 2017-10-20 | 엘지디스플레이 주식회사 | Liquid crystal display and manufacturing method of the same |
| KR20170118356A (en) * | 2016-04-15 | 2017-10-25 | 엘지디스플레이 주식회사 | Liquid crystal display device |
| US20170329436A1 (en) * | 2014-11-20 | 2017-11-16 | Dongwoo Fine-Chem Co., Ltd. | Film touch sensor and manufacturing method therefor |
| US20180188587A1 (en) * | 2016-05-24 | 2018-07-05 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Liquid crystal panel and thin film transistor array substrate thereof |
| JP2018117131A (en) * | 2018-02-15 | 2018-07-26 | 三菱電機株式会社 | Flexible print circuit board |
| CN108682301A (en) * | 2018-08-02 | 2018-10-19 | 友达光电股份有限公司 | A kind of display panel module and preparation method thereof |
| CN108873421A (en) * | 2018-08-13 | 2018-11-23 | 武汉华星光电技术有限公司 | A kind of liquid crystal display device and preparation method thereof |
| CN208367376U (en) * | 2018-07-10 | 2019-01-11 | 信利光电股份有限公司 | A kind of liquid crystal display of novel static conductive |
| CN109188785A (en) * | 2018-09-25 | 2019-01-11 | 南京中电熊猫平板显示科技有限公司 | A kind of liquid crystal module and its manufacturing method |
| WO2019047151A1 (en) * | 2017-09-08 | 2019-03-14 | 华为技术有限公司 | Display module, display panel, display device and electronic device |
| US20190146262A1 (en) * | 2017-01-20 | 2019-05-16 | Wuhan China Star Optoelectronics Technology Co., L td. | Liquid crystal panel and thin film transistor array substrate thereof |
| US20190146267A1 (en) * | 2017-11-14 | 2019-05-16 | Sharp Kabushiki Kaisha | Display device |
| CN110596922A (en) * | 2019-09-23 | 2019-12-20 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN113707029A (en) * | 2021-09-08 | 2021-11-26 | 业成科技（成都）有限公司 | Flexible display module and manufacturing method thereof |
| CN114200707A (en) * | 2021-12-13 | 2022-03-18 | 业成科技（成都）有限公司 | Preparation method of display panel and display panel |
| CN216927956U (en) * | 2022-02-28 | 2022-07-08 | 信利光电仁寿有限公司 | Liquid crystal display screen |
| CN217689682U (en) * | 2022-05-10 | 2022-10-28 | 康惠（惠州）半导体有限公司 | Anti-static liquid crystal display module |
-
2022
- 2022-11-02 CN CN202211367364.4A patent/CN115494666B/en active Active
Patent Citations (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08288090A (en) * | 1995-04-12 | 1996-11-01 | Hitachi Chem Co Ltd | Static charge preventing method for liquid crystal substrate |
| JPH11223827A (en) * | 1998-02-09 | 1999-08-17 | Nec Corp | Liquid crystal display and manufacture thereof |
| JP2000155532A (en) * | 1998-11-20 | 2000-06-06 | Hitachi Ltd | Display device and liquid crystal display device |
| JP2002184999A (en) * | 2000-12-14 | 2002-06-28 | Toshiba Corp | Manufacturing method of array substrate for display |
| JP2004101833A (en) * | 2002-09-09 | 2004-04-02 | Chi Mei Electronics Corp | Equipment and method for manufacturing liquid crystal display |
| US20070222911A1 (en) * | 2006-03-23 | 2007-09-27 | Epson Imaging Devices Corporation | Liquid crystal device, method for manufacturing liquid crystal device, and electronic apparatus |
| JP2012140008A (en) * | 2010-12-28 | 2012-07-26 | Youl Chon Chemical Co Ltd | Release film having excellent static electricity proofness, and method of manufacturing same |
| KR101187228B1 (en) * | 2012-04-27 | 2012-10-02 | 주)두성하이텍 | Tape cushion and the manufacturing method for proceting lcd panel |
| JP2014059378A (en) * | 2012-09-14 | 2014-04-03 | Hosiden Corp | Release tape, liquid crystal panel including the same, and liquid crystal module |
| CN103913881A (en) * | 2012-12-31 | 2014-07-09 | 厦门天马微电子有限公司 | Liquid crystal display with anti-static structure and manufacturing method thereof |
| US20140211134A1 (en) * | 2013-01-28 | 2014-07-31 | Xiamen Tianma Micro_Electronics Co., Ltd. | Liquid crystal display panel and method for manufacturing the same |
| JP2014211568A (en) * | 2013-04-19 | 2014-11-13 | 三菱電機株式会社 | Optical film member for liquid display device, liquid display device, and manufacturing method of liquid display device |
| KR20150001468A (en) * | 2013-06-27 | 2015-01-06 | 엘지디스플레이 주식회사 | In-plane switching mode liquid crystal display device |
| JP2015084017A (en) * | 2013-10-25 | 2015-04-30 | 株式会社ジャパンディスプレイ | Liquid crystal display device |
| KR20150079284A (en) * | 2013-12-31 | 2015-07-08 | 엘지디스플레이 주식회사 | Liquid crystal display device |
| WO2016010256A1 (en) * | 2014-07-18 | 2016-01-21 | 김재우 | Detachable sheet for protecting liquid crystal, and manufacturing method therefor |
| US20170329436A1 (en) * | 2014-11-20 | 2017-11-16 | Dongwoo Fine-Chem Co., Ltd. | Film touch sensor and manufacturing method therefor |
| KR20170000649A (en) * | 2015-06-24 | 2017-01-03 | 최미영 | Removal sheet for protecting liquid crystal and manufacturing method thereof |
| WO2017008313A1 (en) * | 2015-07-10 | 2017-01-19 | 深圳市华星光电技术有限公司 | Liquid crystal display device |
| KR101748234B1 (en) * | 2016-01-21 | 2017-06-16 | 지에프 주식회사 | The etching method of curved liquid crystal display panel not being a copula poor and curved liquid crystal display panel manufactured by the method |
| KR20170116845A (en) * | 2016-04-12 | 2017-10-20 | 엘지디스플레이 주식회사 | Liquid crystal display and manufacturing method of the same |
| KR20170118356A (en) * | 2016-04-15 | 2017-10-25 | 엘지디스플레이 주식회사 | Liquid crystal display device |
| US20180188587A1 (en) * | 2016-05-24 | 2018-07-05 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Liquid crystal panel and thin film transistor array substrate thereof |
| US20190146262A1 (en) * | 2017-01-20 | 2019-05-16 | Wuhan China Star Optoelectronics Technology Co., L td. | Liquid crystal panel and thin film transistor array substrate thereof |
| WO2019047151A1 (en) * | 2017-09-08 | 2019-03-14 | 华为技术有限公司 | Display module, display panel, display device and electronic device |
| US20190146267A1 (en) * | 2017-11-14 | 2019-05-16 | Sharp Kabushiki Kaisha | Display device |
| JP2018117131A (en) * | 2018-02-15 | 2018-07-26 | 三菱電機株式会社 | Flexible print circuit board |
| CN208367376U (en) * | 2018-07-10 | 2019-01-11 | 信利光电股份有限公司 | A kind of liquid crystal display of novel static conductive |
| CN108682301A (en) * | 2018-08-02 | 2018-10-19 | 友达光电股份有限公司 | A kind of display panel module and preparation method thereof |
| CN108873421A (en) * | 2018-08-13 | 2018-11-23 | 武汉华星光电技术有限公司 | A kind of liquid crystal display device and preparation method thereof |
| CN109188785A (en) * | 2018-09-25 | 2019-01-11 | 南京中电熊猫平板显示科技有限公司 | A kind of liquid crystal module and its manufacturing method |
| CN110596922A (en) * | 2019-09-23 | 2019-12-20 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN113707029A (en) * | 2021-09-08 | 2021-11-26 | 业成科技（成都）有限公司 | Flexible display module and manufacturing method thereof |
| CN114200707A (en) * | 2021-12-13 | 2022-03-18 | 业成科技（成都）有限公司 | Preparation method of display panel and display panel |
| CN216927956U (en) * | 2022-02-28 | 2022-07-08 | 信利光电仁寿有限公司 | Liquid crystal display screen |
| CN217689682U (en) * | 2022-05-10 | 2022-10-28 | 康惠（惠州）半导体有限公司 | Anti-static liquid crystal display module |
Non-Patent Citations (2)
| Title |
|---|
| ZAHRA SHOJAEI: "Review of electrodeposition methods for the preparation of high-entropy alloys", INTERNATIONAL JOURNAL OF MINERALS, METALLURGY AND MATERIALS, 22 July 2022 (2022-07-22) * |
| 赵鸥, 赵劲松: "涂布层压法制备抗静电塑料", 塑料工业, no. 1, 31 December 2005 (2005-12-31) * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115494666B (en) | 2024-05-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105825773B (en) | Display device and method for manufacturing the same | |
| US11443989B2 (en) | Array substrate, display panel, method of fabricating display panel, and mother substrate | |
| JP4884586B2 (en) | Liquid crystal display | |
| US10473848B2 (en) | Display panel and display apparatus including the same | |
| KR102366313B1 (en) | Protective film, display module, display device, method of manufacturing display module and method of manufacturing display device | |
| JP2009086077A (en) | Liquid crystal display device equipped with touch panel and manufacturing method thereof | |
| KR101901253B1 (en) | Display Device integrating with Touch Screen and Method for Manufacturing the Same | |
| CN112114452B (en) | Display module | |
| CN114479704A (en) | Optical film with double-sided adhesive | |
| US20230104812A1 (en) | Display device | |
| US9674957B2 (en) | Display device and method of manufacturing the same | |
| JP2005043810A (en) | Display module and its manufacturing method | |
| CN110275355B (en) | Curved surface display panel and curved surface display device | |
| US11964464B2 (en) | Tape, vehicle-mounted display module and vehicle-mounted display device | |
| US7463326B2 (en) | Tape carrier package and liquid crystal display panel | |
| US20110239510A1 (en) | Display device | |
| CN115494666A (en) | Method for manufacturing liquid crystal module | |
| CN113411939B (en) | Display module | |
| JP2003330005A (en) | Protection structure of wiring board | |
| US6741315B1 (en) | Liquid crystal device and electronic apparatus | |
| KR20170116844A (en) | Liquid crystal display device and method for manufacturing thereof | |
| US20230125641A1 (en) | Display substrate, display panel and manufacturing method thereof | |
| US10962847B2 (en) | Display device having an inclined side surface | |
| KR20180062274A (en) | Foldable Display Device | |
| CN111402757A (en) | Display module, electronic equipment and manufacturing method of display module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20240115 Address after: 518109, Building E4, 101, Foxconn Industrial Park, No. 2 East Ring 2nd Road, Fukang Community, Longhua Street, Longhua District, Shenzhen City, Guangdong Province (formerly Building 1, 1st Floor, G2 District), H3, H1, and H7 factories in K2 District, North Shenchao Optoelectronic Technology Park, Minqing Road, Guangdong Province Applicant after: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Applicant after: Interface Technology (Chengdu) Co., Ltd. Applicant after: GENERAL INTERFACE SOLUTION Ltd. Address before: No.689 Hezuo Road, West District, high tech Zone, Chengdu City, Sichuan Province Applicant before: Interface Technology (Chengdu) Co., Ltd. Applicant before: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Applicant before: Yicheng Photoelectric (Wuxi) Co.,Ltd. Applicant before: GENERAL INTERFACE SOLUTION Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant |