CN115494666B - Method for manufacturing liquid crystal module - Google Patents
Method for manufacturing liquid crystal module Download PDFInfo
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- CN115494666B CN115494666B CN202211367364.4A CN202211367364A CN115494666B CN 115494666 B CN115494666 B CN 115494666B CN 202211367364 A CN202211367364 A CN 202211367364A CN 115494666 B CN115494666 B CN 115494666B
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- liquid crystal
- circuit board
- step part
- release film
- flexible circuit
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 85
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims description 31
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 230000001681 protective effect Effects 0.000 claims abstract description 54
- 239000000853 adhesive Substances 0.000 claims abstract description 49
- 230000001070 adhesive effect Effects 0.000 claims abstract description 49
- 239000002390 adhesive tape Substances 0.000 claims abstract description 45
- 238000005507 spraying Methods 0.000 claims abstract description 24
- 238000007639 printing Methods 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims 1
- 239000012466 permeate Substances 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 73
- 238000010586 diagram Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 230000000149 penetrating effect Effects 0.000 description 6
- 239000000084 colloidal system Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 241001417494 Sciaenidae Species 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F1/00—Preventing the formation of electrostatic charges
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application relates to a manufacturing method of a liquid crystal module, which comprises the following steps: printing ink on the other side of the liquid crystal panel opposite to the first step part and the second step part along the first direction, and printing ink on the two sides of the liquid crystal panel along the second direction; the first direction and the second direction are perpendicular to each other; arranging the buffer piece on the first step part so that the release film arranged on the buffer piece completely covers the second step part; spraying a first protective adhesive on the printing ink, and removing the release film; and attaching one side of the antistatic adhesive tape to the second step part, and attaching the other side of the antistatic adhesive tape to one side of the array substrate, which is away from the color film substrate. The manufacturing method of the liquid crystal module can avoid the phenomenon that the antistatic adhesive tape floats due to the fact that the first protective adhesive permeates into the second step part, and therefore the risk of damage caused by excessive electric stress is reduced.
Description
Technical Field
The present application relates to the field of liquid crystal modules, and more particularly, to a method for manufacturing a liquid crystal module.
Background
The liquid crystal panel comprises an array substrate, a color film substrate and a polaroid which are sequentially stacked. Through with the one end electric connection of drive chip and flexible circuit board in array substrate, with the other end electric connection of flexible circuit board in printed circuit board, thereby form the LCD module and realize the display function. However, the existing liquid crystal module has the phenomenon that the anti-static adhesive tape floats and even falls off, so that the risk of excessive electric stress damage of electronic components or integrated circuit systems in the liquid crystal module due to electrostatic discharge is increased.
Disclosure of Invention
Accordingly, it is necessary to provide a method for manufacturing a liquid crystal module to avoid the phenomenon of floating of the anti-static adhesive tape in the liquid crystal module, thereby reducing the risk of damage caused by excessive electric stress.
The embodiment of the application provides a manufacturing method of a liquid crystal module, which comprises the following steps:
Printing ink on the other side of the liquid crystal panel opposite to the first step part and the second step part along the first direction, and printing ink on the two sides of the liquid crystal panel along the second direction; the first direction and the second direction are perpendicular to each other;
Arranging a buffer piece on the first step part, so that a release film arranged on the buffer piece completely covers the second step part;
Spraying a first protective adhesive on the printing ink, and removing the release film;
And attaching one side of the antistatic adhesive tape to the second step part, and attaching the other side of the antistatic adhesive tape to one side of the array substrate, which is away from the color film substrate.
In one embodiment, the release film is configured as a transparent release film;
The first protective adhesive is sprayed on the printing ink, and before the release film is removed, the method further comprises the following steps:
And identifying alignment marks on two sides of the liquid crystal panel along the second direction to determine a spraying path of the first protective adhesive on the liquid crystal panel.
In one embodiment, before the buffer member is disposed on the first step portion, the release film disposed on the buffer member completely covers the second step portion, the method further includes:
one end of the flexible circuit board is electrically connected to the first step part, and the other end of the flexible circuit board is electrically connected to the printed circuit board.
In one embodiment, the electrically connecting one end of the flexible circuit board to the first step portion and electrically connecting the other end of the flexible circuit board to the printed circuit board specifically includes:
attaching one end of the flexible circuit board to the first step part through conductive adhesive;
And attaching the other end of the flexible circuit board to the printed circuit board through conductive adhesive.
In one embodiment, after the one end of the flexible circuit board is electrically connected to the first step portion and the other end of the flexible circuit board is electrically connected to the printed circuit board, the method further includes:
And coating a second protective adhesive on the first step part.
In one embodiment, the second protective glue is configured as a tambour glue, a shadowless glue or a silicone gel.
In one embodiment, the release film has a width equal to a distance between the edge of the polarizer and the edge of the array substrate in the first direction.
In one embodiment, in the second direction, an edge of the release film exceeds an edge of the array substrate.
In one embodiment, the front projection of the buffer element on the first step part falls completely within the range of the first step part.
In one embodiment, the first protective glue is configured as a shadowless glue.
In the manufacturing method of the liquid crystal module, the release film is additionally arranged on the basis of the existing buffer piece, and the buffer piece setting step is moved forward to the first protective adhesive spraying step, so that after the buffer piece is set, the release film just can completely cover the position to be attached on one side of the antistatic adhesive tape, namely the second step part of the color film substrate, and the first protective adhesive is prevented from penetrating into the second step part during spraying. And after the first protective adhesive is sprayed, removing the release film to expose the second step part, and then performing an antistatic adhesive tape attaching step. The manufacturing method of the liquid crystal module can avoid the phenomenon that the antistatic adhesive tape floats due to the fact that the first protective adhesive permeates into the second step part, and therefore the risk of damage caused by excessive electric stress is reduced.
Drawings
FIG. 1 is a schematic diagram of a structure of a liquid crystal module before an antistatic adhesive tape is disposed in an embodiment of the related art;
FIG. 2 is a schematic view of the LCD module shown in FIG. 1 at another viewing angle;
FIG. 3 is a schematic diagram of the LCD module shown in FIG. 2 after the antistatic adhesive tape is disposed;
FIG. 4 is a flow chart of a method for fabricating a liquid crystal module according to an embodiment of the related art;
FIG. 5 is a schematic diagram of a first step of spraying a protective paste according to an embodiment of the related art;
FIG. 6 is a flow chart of a method for fabricating a liquid crystal module according to an embodiment of the application;
FIG. 7 is a schematic diagram of a structure of a liquid crystal module before an antistatic adhesive tape is disposed in an embodiment of the application;
FIG. 8 is a schematic diagram of the LCD module shown in FIG. 7 at another viewing angle;
FIG. 9 is a flow chart of a method for fabricating a liquid crystal module according to another embodiment of the application;
Fig. 10 is a partial enlarged view at a in fig. 1.
Reference numerals illustrate:
10: a liquid crystal panel 40: printed circuit board with improved heat dissipation
11: Array substrate 50: antistatic adhesive tape
11A: the first step 60: printing ink
12: Color film substrate 70: first protective adhesive
12A: second step 80: buffer member
13: Polarizer 85: release film
20: The driving chip 90: second protective adhesive
30: Flexible circuit board
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Along with the development of the thin film transistor liquid crystal display technology, COG (Chip On Glass) technology is widely used. The COG technology is to directly encapsulate the driving chip on the array substrate through the anisotropic conductive adhesive, so as to realize that the conductive bumps of the driving chip are interconnected and encapsulated with the ITO (indium tin oxide) transparent conductive pads on the array substrate, thereby realizing the control of lighting the screen. Specifically, in the manufacturing process of the liquid crystal panel, the mounting position of the driving chip needs to be reserved for liquid crystal driving, so that the TFT (Thin Film Transistor, array substrate) with the circuit is made slightly larger (usually larger than 1 mm) than the CF (Color Filter, color film substrate) on the upper layer, so that the circuit of the mounting position of the driving chip is exposed. In the related art, after the driving chip and the flexible circuit board are arranged, an antistatic adhesive tape is further arranged in the frame area of the liquid crystal panel, so that the problem that electronic components or integrated circuit systems in the liquid crystal module are damaged due to excessive electric stress generated by electrostatic discharge in the subsequent assembly, test, storage, transportation and other processes is prevented.
Fig. 1 is a schematic structural diagram of a liquid crystal module before an antistatic adhesive tape is disposed in an embodiment of the related art; FIG. 2 is a schematic diagram showing the structure of the LCD module shown in FIG. 1 at another viewing angle; fig. 3 is a schematic structural diagram of the liquid crystal module shown in fig. 2 after the antistatic adhesive tape is disposed.
Referring to fig. 1 and 2, the liquid crystal module includes a liquid crystal panel 10, a driving chip 20, a flexible circuit board 30, and a printed circuit board 40. The liquid crystal panel 10 includes an array substrate 11, a color film substrate 12, and a polarizer 13 stacked together, the array substrate 11 having a first step portion 11a extending beyond an edge of the color film substrate 12 in a first direction (x direction in the drawing), and the color film substrate 12 having a second step portion 12a extending beyond an edge of the polarizer 13 in the first direction. One end of the driving chip 20 and one end of the flexible circuit board 30 are electrically connected to the first step portion 11a, and the other end of the flexible circuit board 30 is electrically connected to the printed circuit board 40, so that liquid crystal driving is facilitated, and a display function is realized. Referring to fig. 3, the liquid crystal module further includes an antistatic adhesive tape 50, one side of the antistatic adhesive tape 50 is attached to the second step portion 12a, and the other side of the antistatic adhesive tape 50 is attached to one side of the array substrate 11 facing away from the color film substrate 12, so as to protect electronic components or integrated circuit systems in the liquid crystal module and prevent the problem of excessive electrical stress damage caused by electrostatic discharge. However, the liquid crystal module shown in this embodiment has a phenomenon that the antistatic adhesive tape 50 floats or even falls off in use, increasing the risk of damage due to excessive electric stress.
FIG. 4 is a flow chart showing a method for manufacturing a liquid crystal module according to an embodiment of the related art; fig. 5 shows a schematic diagram of a first protective paste spraying step in an embodiment of the related art.
The inventors of the present application further studied a method of manufacturing a liquid crystal module of this embodiment, see fig. 4, which includes the steps of:
S101, printing ink on the other side of the liquid crystal panel opposite to the first step part and the second step part along the first direction, and printing ink on the two sides of the liquid crystal panel along the second direction; the first direction and the second direction are perpendicular to each other.
Referring to fig. 1 and 5, in particular, in the liquid crystal panel 10, edges of the array substrate 11 and the color film substrate 12 in the second direction (y direction in the drawing) are flush, edges of the array substrate 11 and the color film substrate 12 partially exceed edges of the polarizer 13 in the second direction, and the ink 60 wraps three sides of the array substrate 11 and the color film substrate 12 except the first step portion 11a and the second step portion 12a, thereby improving a light transmission phenomenon of a frame region of the liquid crystal panel 10.
S102, spraying the first protective adhesive on the printing ink.
With continued reference to fig. 5, the ink 60 is printed with a first protective paste 70, which is sprayed on the ink 60 after the ink 60 is printed, due to poor weatherability of the ink 60, so as to reduce the influence of the external environment on the performance of the ink 60. Referring to fig. 1, the spraying path of the first protective glue 70 is from ① to ④ in the drawing, wherein ① and ④ correspond to two ends of the side of the color film substrate 12, which is close to the first step portion 11a, in the second direction, and ② and ③ correspond to two ends of the side of the liquid crystal panel 10, which is far from the first step portion 11a, in the second direction.
S103, arranging the buffer member on the first step part.
Referring to fig. 1 and 2, in particular, the buffer 80 is located at an edge of the first stepped portion 11a in the first direction. The thickness H1 of the buffer member 80 is greater than the thickness H2 of the driving chip 20 and is smaller than or equal to the thickness H3 of the color film substrate 12, so that the driving chip 20 is protected during subsequent assembly, testing, storage, transportation and other processes, and the driving chip 20 is prevented from being knocked and damaged.
And S104, attaching one side of the antistatic adhesive tape to the second step part, and attaching the other side of the antistatic adhesive tape to one side of the array substrate, which is away from the color film substrate.
The inventor of the present application has found through the study of the manufacturing method that the reason why the antistatic adhesive tape 50 floats is that, during the process of spraying the first protective adhesive 70 along the spraying path by the spray head in step S102, the first protective adhesive 70 easily penetrates into the two ends of the second step portion 12a along the second direction because the first protective adhesive 70 at ① and ④ correspond to the two ends of the side of the color film substrate 12 near the first step portion 11a in the second direction, respectively, so that the portion of the antistatic adhesive tape 50 attached to the two ends of the second step portion 12a floats or even falls off, thereby increasing the risk of excessive electrical stress damage.
In view of the above problems in the related art, an embodiment of the present application provides a method for manufacturing a liquid crystal module, so as to avoid a phenomenon that an antistatic adhesive tape floats in the liquid crystal module, thereby reducing the risk of excessive electrical stress damage.
FIG. 6 is a flow chart illustrating a method for fabricating a liquid crystal module according to an embodiment of the application; FIG. 7 is a schematic diagram showing a structure of a liquid crystal module before an antistatic adhesive tape is provided in an embodiment of the application; fig. 8 is a schematic structural diagram of the liquid crystal module shown in fig. 7 at another viewing angle.
In some embodiments, referring to fig. 6 to 8, the embodiment of the application provides a manufacturing method of a liquid crystal module, the liquid crystal module includes a liquid crystal panel 10 and a driving chip 20, and the liquid crystal panel 10 includes an array substrate 11, a color film substrate 12 and a polarizer 13 which are stacked. The array substrate 11 has a first step 11a beyond the edge of the color film substrate 12 in the first direction, and the color film substrate 12 has a second step 12a beyond the edge of the polarizer 13 in the first direction. The driving chip 20 is electrically connected to the first step portion 11a. The method comprises the following steps:
S201, printing ink on the other side of the liquid crystal panel opposite to the first step part and the second step part along the first direction, and printing ink on the two sides of the liquid crystal panel along the second direction; the first direction and the second direction are perpendicular to each other.
For the description of the printing position and function of the ink 60, reference is made to the contents of the embodiments in the related art, and a detailed description thereof will be omitted. Alternatively, the ink 60 may be black ink.
S202, arranging the buffer piece on the first step part, so that the release film arranged on the buffer piece completely covers the second step part.
For the description of the location, size and function of the buffer 80, reference may be made to the contents of the related art embodiment, and the description thereof will be omitted. Referring to fig. 7 and 8, the present application adds a release film 85 on the buffer 80, the release film 85 is disposed on the liquid crystal panel 10 in synchronization with the buffer 80, and the release film 85 can completely cover the second step portion 12a when the buffer 80 is disposed on the first step portion 11 a. In this way, the release film 85 can shield the second step portion 12a in the subsequent spraying process of the first protective adhesive 70, so as to avoid the first protective adhesive 70 from penetrating into two ends of the second step portion 12a along the second direction. Specifically, the added release film 85 does not affect the existing operation mode of the buffer 80 setting step, that is, the buffer 80 setting step can be implemented by using existing equipment and procedures for the buffer 80 to which the release film 85 is added, so that the improvement cost of the process flow is reduced to the greatest extent.
Alternatively, the buffer 80 may be configured as a buffer tape including a gel and a plastic layer attached to one side of the gel, and the buffer 80 is attached to the first stepped portion 11a by means of the other side of the gel. The colloid can be temple 7641#25, and the plastic layer can be PET (polyethylene terephthalate). Further, the release film 85 has adhesion to the surface facing the second step portion 12a, and after the buffer member 80 is disposed on the first step portion 11a, pressure can be applied to the release film 85 from the surface of the release film 85 facing away from the second step portion 12a, so that the release film 85 can be attached to the second step surface 12a with a certain adhesion force, and the shielding of the release film 85 to the second step portion 12a is more reliable.
S203, spraying the first protective adhesive on the printing ink, and removing the release film.
For the description of the spraying path and the effect of the first protective paste 70, reference may be made to the contents of the embodiments in the related art, and the description thereof will not be repeated here. Referring to fig. 7 and 8, since the release film 85 has a shielding effect on the second step portion 12a, when the first protective adhesive 70 is sprayed on the nozzle near ① and ④, the excessive first protective adhesive 70 may fall to both ends of the release film 85 along the second direction. With the release film 85 removed, the second step portion 12a is exposed, so that the subsequent attaching step of the antistatic adhesive tape 50 is facilitated. Optionally, the first protective glue 70 is configured as a shadowless glue (UV glue).
S204, attaching one side of the antistatic adhesive tape to the second step part, and attaching the other side of the antistatic adhesive tape to one side of the array substrate, which is away from the color film substrate.
In the spraying process of the first protective adhesive 70, the shielding of the release film 85 on the second step portion 12a ensures that the two ends of the second step portion 12a cannot be attached by the first protective adhesive 70, and after the release film 85 is removed, the antistatic adhesive tape 50 can be flatly and tightly attached to the second step portion 12a, so that the phenomenon that the antistatic adhesive tape 50 floats and even falls off is effectively avoided, and the risk of excessive electric stress damage is reduced. Alternatively, the antistatic adhesive tape 50 includes a colloid and a metal layer attached to one side of the colloid, thereby functioning as an electrostatic shield. The colloid can be temple 631S, and the metal layer can be aluminum foil colloid.
In this way, in the manufacturing method of the liquid crystal module provided by the application, the release film 85 is additionally arranged on the basis of the current buffer 80, and the buffer 80 is arranged before the first protective adhesive 70 is sprayed, so that after the buffer 80 is arranged, the release film 85 can just completely cover the position to be attached on one side of the antistatic adhesive tape 50, namely the second step part 12a of the color film substrate 12, thereby preventing the first protective adhesive 70 from penetrating into the second step part 12a during spraying. After the spraying of the first protective adhesive 70 is completed, the release film 85 is removed to expose the second step portion 12a, and then the step of attaching the antistatic adhesive tape 50 is performed. The method for manufacturing the liquid crystal module can avoid the phenomenon that the antistatic adhesive tape 50 floats up due to the penetration of the first protective adhesive 70 into the second step part 12a, thereby reducing the risk of excessive electric stress damage.
Fig. 9 is a flow chart illustrating a method for manufacturing a liquid crystal module according to another embodiment of the application.
Referring to fig. 9, an embodiment of the present application provides a method for manufacturing a liquid crystal module, which includes the following steps:
s301, one end of the flexible circuit board is electrically connected to the first step portion, and the other end of the flexible circuit board is electrically connected to the printed circuit board.
The driving chip 20 is electrically connected with the printed circuit board 40 by means of the flexible circuit board 30, so that liquid crystal driving is facilitated, and a display function is realized. Referring to fig. 1 or 7, the driving chip 20 is disposed at a middle portion of the first stepped portion 11a in the first direction, and the flexible circuit board 30 is disposed at an edge of the first stepped portion 11a in the first direction. Since the buffer member 80 only plays a role in protecting the driving chip 20, and there is no electrical connection relationship with the first step portion 11a, the buffer member 80 is generally disposed after the flexible circuit board 30 is disposed, and the buffer member 80 can be partially attached to the surface of the flexible circuit board 30, so as to facilitate operation.
In some embodiments, electrically connecting one end of the flexible circuit board to the first step portion and electrically connecting the other end of the flexible circuit board to the printed circuit board specifically includes: one end of the flexible circuit board 30 is attached to the first step portion 11a through conductive adhesive, and the other end of the flexible circuit board 30 is attached to the printed circuit board 40 through conductive adhesive, so that the operation is convenient, the connection is reliable, and the conductive effect is good.
S302, coating the second protective glue on the first step part.
Referring to fig. 1 or 7, after the driving chip 20 and the flexible circuit board 30 are disposed on the first step portion 11a of the array substrate 11, the circuit on the first step portion 11a can be protected from corrosion, scratch, foreign matter contamination, etc. due to the fact that the second protective adhesive 90 is coated on the first step portion 11 a. Optionally, the second protective glue 90 is configured as a tambour glue, a shadowless glue or a silicone gel.
S303, printing ink on the other side of the liquid crystal panel opposite to the first step part and the second step part along the first direction, and printing ink on the two sides of the liquid crystal panel along the second direction; the first direction and the second direction are perpendicular to each other.
S304, arranging the buffer piece on the first step part, so that the release film arranged on the buffer piece completely covers the second step part.
For the description of the above steps, reference may be made to the content of the foregoing embodiments, and details are not repeated here.
S305, identifying alignment marks on two sides of the liquid crystal panel along the second direction to determine a spraying path of the first protective adhesive on the liquid crystal panel.
Referring to fig. 7, in some embodiments, the release film 85 is configured as a transparent release film, and alignment marks (not shown) are disposed on two sides of the liquid crystal panel 10 along the second direction, so that the device determines the spraying path of the first protective adhesive 70 on the liquid crystal panel 10 by identifying the alignment marks on two sides of the liquid crystal panel 10 along the second direction to position ①、②、③、④ positions in fig. 7. By configuring the release film 85 as a transparent release film, the apparatus is enabled to recognize the alignment mark through the release film 85. In this way, without changing the original positioning mode of the device, the existing device and procedure can still be used to implement the step of setting the first protective adhesive 70 for the liquid crystal panel 10 provided with the release film 85, thereby minimizing the improvement cost of the process flow.
Specifically, the positioning operation of the driving chip 20 and the flexible circuit board 30 on the liquid crystal panel 10 can also be performed by the alignment mark.
S306, spraying the first protective adhesive on the printing ink, and removing the release film.
S307, one side of the antistatic adhesive tape is attached to the second step part, and the other side of the antistatic adhesive tape is attached to one side of the array substrate, which is away from the color film substrate.
For the description of the above steps, reference may be made to the content of the foregoing embodiments, and details are not repeated here.
In some embodiments, referring to fig. 7, the width B of the release film 85 is equal to the distance between the edge of the polarizer 13 and the edge of the array substrate 11 in the first direction. In this way, when the buffer member 80 is disposed at the edge of the first step portion 11a, the release film 85 can be ensured to completely cover the second step portion 12a, so as to prevent the first protective adhesive 70 from penetrating into the second step portion 12a to affect the attaching effect of the subsequent antistatic adhesive tape 50.
In some embodiments, with continued reference to fig. 7, in the second direction, the edge of the release film 85 extends beyond the edge of the array substrate 11. In this way, the shielding effect of the release film 85 on the second step portion 12a can be improved, and the first protective adhesive 70 is prevented from penetrating into the gap between the release film 85 and the two ends of the second step portion 12a along the second direction, so that the attaching effect of the antistatic adhesive tape 50 is further ensured. Specifically, the dimension L1 of the portion of the edge of the release film 85 beyond the array substrate 11 is 10mm or more.
Fig. 10 shows a partial enlarged view at a in fig. 1.
In some embodiments, referring to fig. 10, the front projection of the bumper 80 onto the first step 11a falls entirely within the range of the first step 11 a. That is, the buffer 80 does not protrude beyond the edge of the liquid crystal panel 10. In this way, it is possible to ensure that the buffer 80 does not affect the processes of assembling, testing, etc. the liquid crystal panel 10 while protecting the driving chip 20. Specifically, a distance L2 between the edge of the buffer 80 and the edge of the array substrate 11 in the first direction is 0to 0.5 mm, and a distance L3 between the edge of the buffer 80 and the edge of the array substrate 11 in the second direction is 0.5 to 1.5 mm.
In summary, in the method for manufacturing a liquid crystal module according to the present application, the release film 85 is added on the basis of the current buffer 80, and the buffer 80 is set before the first protective adhesive 70 is sprayed, so that after the buffer 80 is set, the release film 85 just can completely cover the position to be attached on one side of the antistatic adhesive tape 50, that is, the second step portion 12a of the color film substrate 12, so as to prevent the first protective adhesive 70 from penetrating into the second step portion 12a during spraying. After the spraying of the first protective adhesive 70 is completed, the release film 85 is removed to expose the second step portion 12a, and then the step of attaching the antistatic adhesive tape 50 is performed. The method for manufacturing the liquid crystal module can avoid the phenomenon that the antistatic adhesive tape 50 floats up due to the penetration of the first protective adhesive 70 into the second step part 12a, thereby reducing the risk of excessive electric stress damage.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the patent. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the protection scope of this patent shall be subject to the appended claims.
Claims (10)
1. The manufacturing approach of a liquid crystal module, the said liquid crystal module includes liquid crystal faceplate and driving chip, the said liquid crystal faceplate includes array base plate, color film base plate and polaroid that the lamination sets up; the array substrate is provided with a first step part exceeding the edge of the color film substrate along a first direction, and the color film substrate is provided with a second step part exceeding the edge of the polaroid along the first direction; the driving chip is electrically connected to the first step part;
The manufacturing method is characterized by comprising the following steps:
Printing ink on the other side of the liquid crystal panel opposite to the first step part and the second step part along the first direction, and printing ink on the two sides of the liquid crystal panel along the second direction; the first direction and the second direction are perpendicular to each other;
Arranging a buffer piece on the first step part, so that a release film arranged on the buffer piece completely covers the second step part;
Spraying a first protective adhesive on the printing ink, and removing the release film;
And attaching one side of the antistatic adhesive tape to the second step part, and attaching the other side of the antistatic adhesive tape to one side of the array substrate, which is away from the color film substrate.
2. The method of manufacturing according to claim 1, wherein the release film is configured as a transparent release film;
The first protective adhesive is sprayed on the printing ink, and before the release film is removed, the method further comprises the following steps:
And identifying alignment marks on two sides of the liquid crystal panel along the second direction to determine a spraying path of the first protective adhesive on the liquid crystal panel.
3. The method of manufacturing according to claim 1, wherein the step of disposing a buffer member on the first step portion such that a release film disposed on the buffer member completely covers the second step portion further comprises:
one end of the flexible circuit board is electrically connected to the first step part, and the other end of the flexible circuit board is electrically connected to the printed circuit board.
4. The method of manufacturing as claimed in claim 3, wherein electrically connecting one end of the flexible circuit board to the first step portion and electrically connecting the other end of the flexible circuit board to the printed circuit board comprises:
attaching one end of the flexible circuit board to the first step part through conductive adhesive;
And attaching the other end of the flexible circuit board to the printed circuit board through conductive adhesive.
5. The method of manufacturing as claimed in claim 3, wherein after electrically connecting one end of the flexible circuit board to the first step portion and electrically connecting the other end of the flexible circuit board to the printed circuit board, further comprising:
And coating a second protective adhesive on the first step part.
6. The method of manufacturing according to claim 5, wherein the second protective glue is configured as tamfei glue, shadowless glue or silicone gel.
7. The method of manufacturing according to any one of claims 1 to 6, wherein the release film has a width equal to a distance between an edge of the polarizer and an edge of the array substrate in the first direction.
8. The method of any one of claims 1-6, wherein in the second direction, an edge of the release film extends beyond an edge of the array substrate.
9. The manufacturing method according to any one of claims 1 to 6, wherein an orthographic projection of the buffer member on the first step portion falls entirely within a range of the first step portion.
10. The method of manufacturing according to any one of claims 1-6, wherein the first protective glue is configured as a shadowless glue.
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