CN114200707A

CN114200707A - Preparation method of display panel and display panel

Info

Publication number: CN114200707A
Application number: CN202111517972.4A
Authority: CN
Inventors: 蔡佳君
Original assignee: Interface Optoelectronics Shenzhen Co Ltd; Interface Technology Chengdu Co Ltd; General Interface Solution Ltd
Current assignee: Interface Optoelectronics Shenzhen Co Ltd; Interface Technology Chengdu Co Ltd; General Interface Solution Ltd
Priority date: 2021-12-13
Filing date: 2021-12-13
Publication date: 2022-03-18

Abstract

The invention relates to a display panel and a preparation method thereof. The preparation method of the display panel comprises the following steps: a. providing an array substrate, wherein the array substrate is provided with a conductive terminal area and a display area; b. forming a protective layer covering the conductive terminal area on the array substrate; c. arranging a color film substrate on the array substrate, and forming a liquid crystal layer between the array substrate and the color film substrate to obtain a combined plate; wherein, the liquid crystal layer covers the display area; d. removing the protective layer; e. and binding the conductive terminal area with the circuit board. Therefore, the protective layer is formed on the conductive terminal area of the array substrate and covers the conductive terminal area, so that the conductive circuit of the conductive terminal area is prevented from being directly exposed in the air environment, the conductive circuit is prevented from being polluted by foreign matters, corroded, scratched, electrically broken down and the like to generate defects, and the product yield is favorably improved. And the protective layer is removed prior to bonding with the circuit board so as not to interfere with the bonding of the circuit board with the conductive terminal areas.

Description

Preparation method of display panel and display panel

Technical Field

The invention relates to the technical field of display, in particular to a display panel and a preparation method thereof.

Background

The display panel is provided with a conductive terminal area which is used for being bound with the circuit board. The conductive terminal area has a conductive circuit, and the material of the conductive circuit is generally copper, titanium and other metals. In the process of manufacturing the display panel, the conductive terminal area has the risks of scratching and corrosion, so that the yield is low.

Disclosure of Invention

Therefore, it is necessary to provide a method for manufacturing a display panel and a display panel that improve the above defects, in order to solve the problem of low yield caused by the risk of scratching and corrosion of the conductive terminal area in the prior art.

A method of manufacturing a display panel, comprising:

a. providing an array substrate, wherein the array substrate is provided with a conductive terminal area and a display area;

b. forming a protective layer covering the conductive terminal area on the array substrate;

c. arranging a color film substrate on the array substrate, and forming a liquid crystal layer between the array substrate and the color film substrate to obtain a combined plate; wherein the liquid crystal layer covers the display region;

d. removing the protective layer;

e. and binding the conductive terminal area with a circuit board.

In one embodiment, the array substrate comprises a plurality of display units, each of the display units comprises the conductive terminal area and the display area;

the method also comprises the following steps between the step c and the step d:

and cutting the combined board along the separation line between every two adjacent display units to form a plurality of single combined boards.

In one embodiment, step d specifically includes:

and cleaning each single combined board by adopting a plasma cleaning mode, and degrading the protective layer.

In one embodiment, the step of cutting the composite board along the dividing line between every two adjacent display units to form a plurality of single composite boards further comprises:

and sucking residual materials on each single combined board.

In one embodiment, the protective layer is made of an organic material.

In one embodiment, step b specifically includes:

and forming the protective layer on the conductive terminal area by adopting an ink-jet printing process.

In one embodiment, the method further comprises, after the step of forming the protective layer on the conductive terminal region by an inkjet printing process:

and curing the protective layer.

In one embodiment, the method further comprises the following steps between the step a and the step b:

and forming an alignment layer on the array substrate, wherein the alignment layer covers the display area.

In one embodiment, step c specifically includes:

forming a rubber frame on the array substrate, wherein the rubber frame is arranged around the display area;

and arranging the color film substrate on the rubber frame, and filling the rubber frame with a liquid crystal material for forming the liquid crystal layer.

A display panel is prepared by the preparation method in any embodiment.

According to the preparation method of the display panel and the display panel, the protective layer is formed on the conductive terminal area of the array substrate and covers the conductive terminal area, so that the conductive circuit of the conductive terminal area is prevented from being directly exposed in the air environment, the conductive circuit is prevented from being polluted by foreign matters, corroded, scratched, subjected to electric breakdown and the like to generate defects, and the product yield is improved. And the protective layer is removed before bonding with the circuit board so as not to affect the bonding of the circuit board with the conductive terminal areas.

Drawings

FIG. 1 is a flowchart illustrating a method for fabricating a display panel according to an embodiment of the present invention;

FIG. 2 is a flowchart of the steps specifically included in step S20 of the preparation method shown in FIG. 1;

FIG. 3 is a flowchart of the steps specifically included in step S30 of the preparation method shown in FIG. 1;

FIG. 4 is a schematic diagram illustrating an alignment layer formed on an array substrate to cover a display region;

FIG. 5 is a diagram illustrating a protective layer formed on the array substrate to cover the conductive terminal areas;

FIG. 6 is a rubber frame surrounding the display region formed on the alignment layer;

fig. 7 is a schematic diagram illustrating a color film substrate disposed on a frame and a liquid crystal layer formed thereon;

FIG. 8 is a view illustrating the combination board being cut to form a plurality of single combination boards;

FIG. 9 is a top view of the composite deck shown in FIG. 8;

FIG. 10 is a cross-sectional view of a single composite board;

FIG. 11 shows the protection layer on a single composite board being removed.

Reference numerals:

S10-S50: steps S20a, S20 b: step (ii) of

S30a, S30 b: step 10: array substrate

11: terminal region 12: display area

13: the display unit 20: protective layer

30: color film substrate 40: liquid crystal layer

50: the rubber frame 60: alignment layer

100: the combination board 101: single combined board

102: residual material a: separation line

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1, an embodiment of the invention provides a method for manufacturing a display panel, including the following steps:

s10, providing an array substrate 10 (see fig. 4), the array substrate 10 having conductive terminal areas 11 and display areas 12. The conductive terminal area 11 has a conductive circuit (not shown) for bonding with a circuit board, and the display area 12 is for displaying. Further, the display region 12 is adjacent to the conductive terminal region 11, and the conductive terminal region 11 is located at an edge of the array substrate 10.

Specifically, the array substrate 10 includes, for example, a transparent glass substrate (not shown), a TFT array layer (not shown) on the glass substrate, a pixel electrode layer (not shown), a common electrode layer (not shown), and the like. The TFT array layer includes, for example, a plurality of TFTs, scan lines, data lines, and the like. The pixel electrode layer includes a plurality of pixel electrodes (not shown). Corresponding to each sub-pixel region, the array substrate 10 is provided with a TFT and a pixel electrode electrically connected to the TFT. The pixel electrode and the common electrode layer are used for driving liquid crystal molecules in the liquid crystal layer 40 to rotate under the action of an electric field to perform image display.

S20, forming a protective layer 20 on the array substrate 10 to cover the conductive terminal area 11 (see fig. 5). Therefore, the conductive circuit of the conductive terminal area 11 is protected by the protection layer 20, the conductive circuit is prevented from being directly exposed in the air environment, and the conductive circuit is prevented from being polluted by foreign matters, corroded, scratched, electrically broken down and the like to generate defects, so that the product yield is favorably improved.

S30, disposing the color filter substrate 30 on the array substrate 10, and forming the liquid crystal layer 40 before the array substrate 10 and the color filter substrate 30 to obtain the composite board 100 (see fig. 7). Wherein, the liquid crystal layer 40 covers the display region 12 of the array substrate 10.

Specifically, the color filter substrate 30 includes, for example, a transparent glass substrate (not shown), a color filter layer (not shown) on the glass substrate, a Black Matrix (BM) (not shown), an overcoat layer, and the like. The color filter layers include, for example, a red filter layer located in the red sub-pixel region, a green filter layer located in the green sub-pixel region, and a blue filter layer located in the blue sub-pixel region. The black matrix is positioned between adjacent sub-pixels to prevent crosstalk of primary light emitted by the adjacent sub-pixels.

S40, the protective layer 20 (see fig. 11) is removed, so that the conductive terminal areas 11 are re-exposed for bonding.

S50, bonding the conductive terminal area 11 with the circuit board. Specifically, the Circuit Board is a pcba (printed Circuit Board assembly) Circuit Board.

According to the manufacturing method of the display panel, the protective layer 20 is formed on the conductive terminal area 11 of the array substrate 10, and the protective layer 20 covers the conductive terminal area 11, so that the conductive circuit of the conductive terminal area 11 is prevented from being directly exposed in an air environment, the conductive circuit is prevented from being polluted by foreign matters, corroded, scratched, subjected to electric breakdown and the like to generate defects, and the product yield is favorably improved. And the protective layer 20 is removed before bonding with the circuit board so as not to affect the bonding of the circuit board with the conductive terminal areas 11.

Alternatively, the material of the protection layer 20 may be an organic material, so that the inert property of the organic material is utilized to prevent the organic material from reacting with the material of the conductive terminal region 11 to generate a defect.

In an embodiment, the step between the step S10 and the step S20 further includes:

s11, forming an alignment layer 60 (see fig. 4) on the array substrate 10, the alignment layer 60 covering the display region 12. In this way, the liquid crystal molecules in the liquid crystal layer 40 are uniformly aligned in one direction (i.e., the liquid crystal molecules have a certain initial twist angle) by van der waals force between the molecules of the alignment layer 60 and the molecules of the liquid crystal layer 40.

Alternatively, PI (Polyimide) may be used as the material of the alignment layer 60. The step S11 may specifically include a Printing step (PI Printing), a Pre-curing step (PI Pre-curing), a curing step (PI main-curing), an alignment step (PI rubbing), and the like, and is not limited herein.

Referring to fig. 3, fig. 6 and fig. 7, in an embodiment, the step S30 specifically includes:

s30a, forming a glue frame 50 (see fig. 6) on the array substrate 10, wherein the glue frame 50 is disposed around the display region 12. Alternatively, the glue frame 50 may be formed using a coating process.

S30b, the color filter substrate 30 is disposed on the rubber frame 50, and the rubber frame 50 is filled with the liquid crystal material for forming the liquid crystal layer 40, so that the liquid crystal material is sealed in the rubber frame 50 between the array substrate 10 and the color filter substrate 30 (see fig. 7).

In order to improve production efficiency, a plurality of display panels are prepared at one time and subsequently cut into individual display panels. In the present embodiment, the array substrate 10 includes a plurality of display units 13 (see fig. 8), and each display unit 13 includes the above-described conductive terminal area 11 and the display area 12. Referring to fig. 8, 9 and 10, steps between steps S30 and S40 further include:

s31, the combined panel 100 is cut along the separation line a between each adjacent two display units 13 to form a plurality of single combined panels 101 separated from each other. It is understood that each single composite board 101 is a semi-finished product of a display panel. Each unit composite plate 100 includes the cut array substrate 10, the alignment layer 60, the color filter substrate 30, the cut liquid crystal layer 40 in the color filter substrate 50, and the like.

Referring to fig. 10 and fig. 11, step S40 specifically includes:

each of the single assemblable plates 101 is cleaned by plasma cleaning and the protective layer 20 is degraded. In this way, the protective layer 20 is degraded and removed by using plasma (plasma) while the single assembled board 101 is cleaned, that is, the protective layer 20 is removed in the step of cleaning the single assembled board 101, and the process flow is simplified without additionally increasing the process step of removing the protective layer 20.

Further, step S31 is followed by the steps of:

s32, the residual material 102 on each single composite board 101 is sucked (see fig. 8). In this manner, since the residual material 102 such as chips may be generated on the assemblable plate 100 when the assemblable plate 100 is cut, step S32 is provided to remove the residual material 102. It is understood that after the residual material 102 on each single buildup board 101 is extracted, step 40 is performed.

Referring to fig. 2, in an embodiment, step S20 specifically includes:

s20a, forming a protective layer 20 on the conductive terminal area 11 of the array substrate 10 by using an inkjet printing process.

Further, after step S21, the method further includes the steps of:

s20b, curing the protective layer 20 formed by inkjet printing, so that the protective layer 20 firmly covers the conductive terminal area 11 on the one hand, and the protective layer 20 has mechanical strength of movement on the other hand, thereby further improving the protective effect on the conductive terminal area 11.

Based on the preparation method of the display panel, the invention also provides the display panel. The display panel is prepared by the preparation method described in any one of the above embodiments.

According to the display panel and the preparation method of the display panel, the protective layer 20 is formed to cover the conductive terminal area 11 of the array substrate 10, so that the protective layer 20 protects the conductive circuit of the conductive terminal area 11, the conductive circuit is prevented from being polluted by foreign matters, corroded, scratched, electrically broken down and the like to generate defects, and the product yield is improved;

the protective layer 20 is removed before bonding with the circuit board so as not to affect the bonding of the circuit board with the conductive terminal areas 11;

while the single assembled board 101 is cleaned, the protective layer 20 is degraded and removed by using plasma (plasma), that is, the protective layer 20 is removed in the step of cleaning the single assembled board 101, and the process step of removing the protective layer 20 is not required to be additionally added, thereby simplifying the process flow.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A method for manufacturing a display panel, comprising:

d. removing the protective layer;

e. and binding the conductive terminal area with a circuit board.

2. The method for manufacturing a display panel according to claim 1, wherein the array substrate includes a plurality of display units, each of the display units including the conductive terminal area and the display area;

3. The method for manufacturing a display panel according to claim 2, wherein the step d specifically comprises:

4. The method of manufacturing a display panel according to claim 2, further comprising, after the step of cutting the composite sheet along a dividing line between each adjacent two of the display units to form a plurality of single composite sheets:

and sucking residual materials on each single combined board.

5. The method of claim 1, wherein the protective layer is made of an organic material.

6. The method for manufacturing a display panel according to any one of claims 1 to 5, wherein the step b specifically comprises:

7. The method for manufacturing a display panel according to claim 6, further comprising, after the step of forming the protective layer on the conductive terminal area by an inkjet printing process, the steps of:

and curing the protective layer.

8. The method for manufacturing a display panel according to any one of claims 1 to 5, further comprising, between step a and step b, the steps of:

9. The method for manufacturing a display panel according to any one of claims 1 to 5, wherein the step c specifically comprises:

10. A display panel produced by the production method as set forth in any one of claims 1 to 9.