KR101141688B1 - Substrate cutting method by chemical wet etching - Google Patents

Abstract

The present invention relates to a technique and a method of cutting a glass substrate having a desired shape by applying an ink protective film having a desired shape on a substrate such as glass of the present invention to etch the glass substrate in an uncoated area into a chemical. That is, by providing an ink as a chemical etching protective film on the glass substrate by inkjet method, screen printing method or transfer method on the glass substrate, a technique and method for cutting a substrate having a desired shape through wet etching of a substrate such as glass is provided. will be.
In the present invention, one-component resin-based inks such as PP, PES, and acrylic and two-component resin-based inks such as epoxy are applied to the glass substrate by the screen printing method with an etch-protection film so that they can withstand a long time in the etching solution. Cutting was possible. In another aspect of the present invention, an aqueous acrylic emulsion ink having a low viscosity as an inkjet method was applied to the etching protective film to cut the glass substrate.
In the present invention, bubbles generated when the resin-based ink is applied were improved by adding an antifoaming agent to the ink, and the etching protective film was removed by using a chemical using methyl chloride to remove the food protecting film after etching.
In the present invention, when etching the glass substrate in which the two substrates are combined, a chemical penetration protective film is formed directly below the cutting line of the two glass substrates to prevent the chemical from penetrating into the glass substrate. Improved.
When the glass substrate is cut using the technique and method of cutting the glass substrate according to the present invention, ink coating equipment is not only inexpensive, but the process is also simple and short by ink coating → curing → etching → ink removal, which greatly reduces the production cost. Can be.
In the present invention, when the two-component epoxy ink is used as an etch protective film, scratches of the protective film can be improved to improve the yield, and the resin-based ink curing temperature is low at 0 to 150 ° C., so that it can be applied to straight and curved cutting of displays. Do.
In the case of the aqueous acrylic emulsion ink devised in the present invention, since the viscosity is very low, the ink can be sprayed directly onto the glass substrate without using a mask through an inkjet device to coat the ink through a nozzle to reduce waste of ink.

Description

Substrate cutting method by chemical wet etching

Display or tempered glass used in cell phones, laptops and monitors is produced by mass production of several sheets at a time by forming several cells on one sheet of glass substrate and cutting them. Conventionally, in order to cut a glass substrate, the glass substrate was cut | disconnected by irradiating a diamond wheel or a laser beam. LCD, which is used as a typical flat panel display, is a combination of LCD cells partitioned on a color filter substrate and an array substrate. In the conventional method, a plurality of LCDs are cut by cutting a diamond filter substrate and an array substrate substrate using a diamond wheel. Separate the cells and make them. And, in the case of tempered glass made of a single substrate is cut into a square and then produced by processing the slope using a grinder.

The present invention relates to a method of cutting the glass of the ledger through a wet method in order to separate the display or tempered glass used in such mobile phones, laptops, monitors and TVs into unit cells. That is, the present invention cuts a panel composed of several unit cells or a tempered glass panel composed of several single window cells using an etching method using chemicals. In order to cut the panel into a plurality of unit cells, the substrate to be etched must be exposed to the chemical, and the portion to be etched is formed by forming a protective film to prevent etching, and then immersed in the chemical. After etching, the protective film is removed using a protective film removal solution.

The present invention relates to a method for cutting a substrate through chemical wet etching. More particularly, the present invention relates to a method of cutting a substrate such as a glass substrate or a flexible substrate by using a chemical, to form a protective film material and a protective film that can withstand chemicals, and Materials and methods for removing the protective film.

Flat panel display technologies such as LCDs and OLEDs require a variety of corresponding technologies depending on the application field. In the case of a monitor or a TV, a technique for large-sized and moving video is required, and in the case of a notebook or a mobile phone, a slimming technique of a glass substrate or a cutting technique of a thin glass substrate is important for improving portability. Of course, in the case of a TV or a monitor, as the thickness of the glass substrate increases, the weight thereof increases and the volume increases, so that the thinner the thickness of the substrate is advantageous to use. In particular, in the case of a mobile phone or a notebook, the thinner the glass substrate, the lighter the weight and the smaller volume is also the advantage of being easier to carry. Thus, when the substrate of a display becomes thin and it is necessary to manufacture several unit display (cell) or several tempered glass on one glass substrate, the cutting technology of a board becomes more important. In particular, when cutting the shape of a cover glass such as a display or a display into a curved shape, a substrate cutting technique using a conventional diamond wheel cutting method, a laser beam scanning method, or the like has a limitation. In addition, the mechanical glass cutting method and the grinding method for forming the curved surface for the conventional circular cutting are complicated and the productivity is very low. In the mask exposure method using a material such as PR to form a protective film by another conventional method, not only has to go through the complicated process of etching the substrate after the application, curing and exposure and development of the PR and curing, but also several ten minutes When the glass substrate is immersed in the etching chemical for a long time, the chemical penetrates the protective film, so that the defect easily occurs due to the lifting of the protective film.

Therefore, the present invention applies a glass cutting technique and method by an etching method by applying an inkjet or printing process using an ink instead of a mask process using a conventional PR for substrate cutting.

1 is a cross-sectional view of a general TFT-LCD. The structure of the LCD shows that a TFT array is formed on the glass substrate of the ledger to drive the pixels of the LCD (1-70), and red, green and blue color filter pigments (1) to color on the glass substrate of the opposite ledger. The color filter substrate 1-20 in which -30 was formed is arrange | positioned. These two substrates are encapsulated with the liquid crystal encapsulant 1-50, and the space 1-60 is distributed in a uniform distribution in order to maintain a constant gap inside the encapsulant. Liquid crystals used to control light are injected between these two substrates (1-40), and polarizing plates are attached to each of the two substrates to impart polarization of the light (1-10 and 1-). 80).

2 is a plan view of a unit display disposed on a substrate of the ledger. In general, the production of the display will place a plurality of unit displays (2-20) on the glass substrate (2-10) of the ledger. Here, the lowercase letters a, b, c, d and e represent cut lines for separating each unit display. In particular, the portable display is very small (2 ~ 3 ”diagonal), and hundreds of unit displays are simultaneously made on the ledger substrate. In addition, portable small displays require ultra-thin substrate thickness due to the demand for slimming. Thus, cutting a large amount of unit displays formed on the substrate of the mother led and attaching a polarizing plate becomes a factor in lowering yield and lowering productivity.

3 is a plan view of the unit display separated from the substrate of the ledger. The display cell is composed of a pixel portion 3-10 for displaying an image and a terminal portion 3-20 for connecting a drive IC to drive a cell. In the case of the LCD, as shown in FIG. 1, the unit display is made by combining two upper and lower substrates, so the cutting position should be cut at the upper and lower sides. Cutting the region where the array substrate is formed should cut a and c horizontally and d and e vertically. And the color filter substrate should cut a and b horizontally to expose a terminal part, and also cut c. Vertically, the unit cells are separated by cutting d and e.

4 is a cross-sectional view illustrating a diamond wheel cutting process on AA ′ in FIG. 3. In the case of LCD, as mentioned above, the display cells are composed of an array substrate 4-20, a color filter substrate 4-10, and an encapsulant 4-30 encapsulating liquid crystal. The unit cell formed in the ledger is cut mainly using a diamond wheel (Fig.-40). A diamond wheel is used to cut out the glass cutting lines a, b and c.

However, in the case of using the diamond wheel as described above, the thinner the thickness of the glass substrate, the more severe the glass cut surface state will occur. In particular, when the glass substrate of less than 0.3mm is used, the state of the cut surface is very unstable, and the breakdown strength, which is a reliability condition of the LCD, is greatly reduced, causing problems in quality. In addition, as the size becomes smaller, a large number of unit displays are arranged on the substrate of the ledger, so that the number of cutting of the diamond wheel increases, thereby decreasing productivity. In the case of cutting glass using a conventional wheel, only a straight cut is possible, and thus a curved cut is almost impossible to use.

Recently, laser cutting is used to cut curved surfaces and thin glass substrates. This is a method of cutting glass by quenching in a state where instantaneously high temperature is made in the local area where the laser beam is irradiated to the glass, but severe temperature deviation occurs in the shapes formed on the array and the color filter substrate, which causes breakage when cutting the glass. Causing a great restriction on cutting. In particular, foreign matter adhering to the glass is a cause of defects and laser equipment also has a disadvantage that is expensive.

In addition, a method of cutting a substrate using an etching method as a glass cutting method has been proposed. As a method of cutting glass using etching, a method of etching a glass substrate using a photo mask has been proposed. In the case of using a photo mask, after the PR is applied onto the glass substrate, the PR is cured and then an exposure process is performed by irradiating UV light using a mask on which the image is formed to image the image of the mask onto the PR on the glass substrate. do. Then, after developing the PR on the glass and curing it once again at about 200 ° C., the glass can be etched into the chemical in this state to obtain a display cell or glass substrate having a desired formation. Of course, after etching, the PR on the glass substrate is removed using chemicals.

Since the photo masking method used to obtain a glass substrate having a desired shape using PR is an exposure process, the photomasking method requires expensive exposure equipment and a developing process, and PR may not be able to withstand glass etching chemicals for a long time, causing defects. There are disadvantages.

In the present invention, to solve the conventional problems as described above, after arranging the printing mask plate on the glass substrate to be cut, the ink is poured into the plate and squeeze on the plate to apply the ink film in the shape of a desired shape to any curved surface We want to realize glass cutting. The ink film thus formed serves to prevent the etching of the substrate by the chemical during the glass substrate etching. After etching the glass with the glass etching chemical, a glass substrate having a desired shape can be obtained by removing the ink using a remover. Here, if the ink jet equipment is used as a method for applying ink, the desired purpose can be achieved without printing mask engraving.

In the case of etching the glass substrate by the screen printing method using the ink according to the present invention, after the glass substrate is etched immediately after the ink coating and curing, the ink can be removed immediately, so that a conventional PR coating and curing and UV mask process is performed. In addition, it is possible to greatly improve the photo development process through the PR development process and the curing, etching and removing process. In particular, in the printing method, the selection of ink is very important. In the case of alkali-free glass, ink is exposed to glass etching chemicals for several hours to etch 0.5 mm, and most materials have a problem that the ink film is peeled off during etching. However, in the present invention, the problem of exfoliation of the ink film can be simultaneously improved by using not only one-component resin ink but also two-component epoxy ink and additives.

In addition, in order for the glass substrate protective ink film to withstand chemicals for a long time, the thickness of the ink film should be formed thick. In the present invention, the peeling phenomenon of the underlying protective film is improved by forming the ink thickness of the screen printing plate.

In the case of cutting a display panel in which two glass substrates are bonded together, such as an LCD, after cutting both substrates, the chemical penetrates into the bonded portion and causes defects in the LCD. By forming a chemical penetration barrier layer to be etched before bonding the substrate to improve the problem caused by the chemical penetration.

In the case of the two-component ink, it is easily removed to chemicals such as anon before curing, but after curing, the two-component ink cannot be used as a conventional solvent such as BK, XY, and chemical. However, in the present invention, even in the case of the two-component ink, it is possible to remove the protective film remaining after the glass etching by using a remover that can easily remove the ink.

In the present invention, the glass substrate may be cut using an aqueous acrylic emulsion as the glass substrate etching protective film. In the case of the aqueous acrylic emulsion, the viscosity is low, so the coating solution by the printing method is thin, there is a problem in the coating, but it is possible to cut the glass substrate by the protective coating using an ink jet equipment that requires a low viscosity condition.

Therefore, the present invention can be used to cut straight lines, curved surfaces, and curved surfaces even when two glass substrates, such as an LCD, are bonded together without using glass cutting using a conventional diamond wheel or an etching process using a photo mask process. It is an object of the present invention to provide a substrate cutting method by printing having good cutting characteristics and excellent productivity.

The substrate cutting technique and method according to the etching method of the present invention for achieving the above object is to apply an ink protective film in a desired shape on a substrate such as glass to etch the glass substrate in the area where the ink is not applied to the chemical Cut the shaped glass substrate. At this time, since both surfaces of the glass substrate are exposed to the chemical, the ink may be cut on the front and back sides depending on the application, or only the front surface may be applied and the back surface may not be applied to the ink, thereby cutting the slimming of the glass substrate in parallel.

The glass substrate cutting by the ink coating method is an improvement of the complicated process of PR coating → drying → exposure → development → curing → etching → PR removal according to the conventional photo mask exposure method. Ink (etch protective film) coating → curing → etching → The glass substrate of the desired shape is cut by removing the ink (etch protective film).

When etching glass substrates, glass etching chemicals generally use less than 55% of hydrofluoric acid (HF) .An anti-etching protective film, such as conventional PR, cannot withstand prolonged exposure to hydrofluoric acid and the protective film is peeled off or inside the protective film. It is difficult to use for a long time because hydrofluoric acid penetrates and causes a defect of the glass surface. In the present invention, in order to solve such a defect, the defect was solved by using a resin-based ink. When etching within 1 hour in Foshan, it is possible to cut a glass substrate using a one-component resin series such as PP, PES and acrylic. However, such a resin has a disadvantage in that the adhesion to the glass surface is very low, so that it is easily peeled off or scratched even at a small external force in the process.

In order to solve this peeling problem, the present invention improved the adhesion between the glass and the ink by using a two-component epoxy resin, which is another ink material. In particular, in the case of the two-component epoxy ink, the glass substrate can be etched without the peeling of the protective film or the penetration of the chemical even during the etching of the protective film at a thickness of about 100 µm for 3 hours or more.

In the case of the resin-based ink, there is a disadvantage that it is not removed from solvents such as anon or BK and XY which are generally used after curing. In the present invention, in order to solve this problem, methyl chloride is used as a subject to remove resin-based inks such as epoxy.

When ink is used to form an etch protective film, bubbles inside the ink puncture the protective film to cause etching defects. In the present invention, bubbles are generated by adjusting the antifoaming agent to a concentration of 15% or less to remove the bubbles. Solved the problem.

In the present invention, in the case of the resin ink, the thickness of the protective film increases as the thickness of the protective film increases slightly. However, this problem may be improved by adding an additive such as graphite.

In a third method according to the invention, an aqueous acrylic emulsion material which enables coating at low viscosity was used as the glass etch protective ink material. Aqueous acrylic emulsions have a very low viscosity, making it suitable to coat the ink using inkjet equipment rather than screen printing.

The present invention relates to a method of cutting a substrate through chemical wet etching, and the method of applying ink includes various methods such as a method of directly forming an etch protective layer through ink jet equipment, a screen printing method using a screen printing machine, or a method of transferring ink. The ink of the desired shape can be printed onto the glass substrate directly.

As described above, the method of cutting the substrate through the chemical wet etching method of the present invention is to cut a glass substrate in which two sheets overlap, such as a single glass and a display, without using a conventional diamond wheel or a photo exposure mask process. A curved substrate can also be obtained by cutting. In particular, in the case of the photo exposure mask process, expensive PR coating equipment and exposure equipment should be used, and the process should also proceed with a complicated process of PR coating → drying → exposure → development → curing → etching → PR removal. In the case of cutting the glass substrate by using the ink coating equipment is not only inexpensive, but also the process is also simple and short by ink coating → curing → etching → ink removal can greatly reduce the production cost.

In the present invention, not only the glass substrate can be easily cut by applying various one-component inks such as PP, PES, and acrylic, but also when the two-component epoxy ink is used, the scratch defect can be improved, thereby improving the yield.

In addition, in the case of hydrofluoric acid resistant PR, the general curing temperature is high as 200 ° C, which causes a display defect when applied to the cutting of two overlapping glass substrates such as a display. In the case of a two-component epoxy, the curing temperature is 150 ° C or less at room temperature. It can be cured at low temperatures, so it can be applied to straight and curved cutting of displays.

In the case of the aqueous acrylic emulsion ink devised in the present invention, since the viscosity is very low, the ink can be sprayed directly onto the glass substrate without using a mask through an inkjet device to coat the ink through a nozzle to reduce waste of ink.

1 is a conventional general LCD cross-sectional structure,
2 is a plan view of unit displays arranged in a row on a substrate of a conventional ledger;
(a / b / c: horizontal cutting line, d / e: vertical cutting line)
3 is a plan view showing a cutting position of a conventional LCD,
(a / b / c: horizontal cutting line, d / e: vertical cutting line)
4 is a cross-sectional view illustrating a diamond wheel cutting process on AA ′ of FIG. 3;
(a / b / c: Shear separation process after horizontal cutting)
Where (b) / (c) correspond to neighboring LCD positions
5 is a cross-sectional view of an ink mask formed on a mesh of screen printing according to the present invention;
6 is a cross-sectional view of the etching protection ink film applied on the glass substrate according to the present invention,
7 is a cross-sectional view of the etching protection ink film applied on the front and back glass substrate according to the present invention,
8 is a cross-sectional view of the etching protection ink film and the glass substrate after etching the glass substrate according to the present invention;
9 is a cross-sectional view of a chemical penetration prevention film formed below a cutting line in order to prevent chemical penetration between two sheets of substrates according to the present invention.

In the present invention was used as a glass etching protective film of a resin-based ink that can withstand the glass etching chemical for a long time. Resin-based inks are very strong on chemicals and can be used for a long time in hydrofluoric acid. In the present invention, a relatively high viscosity resin protective film may be applied to one-component ink such as PP, PES, acrylic, urethane, rubber, etc. The thickness of the protective film is 20 μm at a temperature of 25 ° C. and 30% of HF concentration. It was confirmed that the etching protection film was maintained without peeling for about 2 hours. In the case of one-component resin ink, the curing temperature can be from 0 ° C to 150 ° C, and the higher the temperature, the harder the ink can be with a short curing time. Usually, at 100 degreeC, when it hardens about 1 hour, an ink will fully harden.

Another etching protective film ink according to the present invention was confirmed that the two-component epoxy ink is maintained without peeling the protective film for 1 hour to 5 hours at a temperature of 25 ℃ and HF concentration of 30% at a thickness of 10㎛ ~ 100㎛. The curing temperature of the epoxy can be from 0 ℃ to 150 ℃ and the higher the temperature can cure the ink with a short curing time. Usually, at 100 degreeC, when it hardens about 1 hour, an ink will fully harden.

In order to print, the viscosity of the resin film is important. In order to control the viscosity, a solvent such as ananone, BK, or XY can be added to suit the concentration to obtain an appropriate viscosity. In addition, many bubbles are generated in the ink, which is solved by adding about 3% of an antifoaming agent.

In the present invention, in the case of the resin-based ink, the thickness of the protective film is increased as the thickness of the protective film is slightly increased. This problem is improved by adding an additive such as carbon (graphite).

In the case of a glass substrate for display or tempered glass, the original painting should remove the ink after etching the substrate. In the present invention, in order to remove the protective film of the resin-based ink, a chemical containing methyl chromide is used to include an epoxy. PP, PES, acrylic resin ink can be removed.

In the third method according to the present invention, an aqueous acrylic emulsion enabling coating at low viscosity was used as the ink material of the glass etch protective film. Its very low viscosity makes it suitable to coat ink using inkjet equipment rather than screen printing.

Inkjet is suitable as a glass etch protective film because a low viscosity aqueous acrylic emulsion is required because the ink is jetted through a nozzle of 1 mm or less, requiring a low viscosity ink. In the case of the aqueous acrylic emulsion, the curing can be cured at a temperature of 0 ° C to 150 ° C, and the higher the temperature, the shorter the curing time the ink can be cured. Usually, at 100 degreeC, when it hardens about 1 hour, an ink will fully harden.

In the case of the aqueous acrylic emulsion, the glass substrate should be removed after cutting, and in the present invention, it can be removed using chemicals such as MEK, toluene and acetone.

5 is a cross-sectional view of a plate making used in screen printing for implementing a substrate cutting technique and method by an etching method according to an embodiment of the present invention, showing a cross-sectional view of the ink mask formed on the mesh. That is, the mask ink 5-20 is formed on the screen mesh 5-10 through a general plate making process. This mask ink region is an area where ink is not applied when ink is applied onto the glass substrate, and is a region that is etched by the chemical when the glass substrate is etched. Then, the printing ink forms an etch protective film on the glass substrate through the through regions 5-30, and the printing ink is a region where a glass substrate having a final desired shape is obtained.

6 is a cross-sectional view of forming an etching protection ink film on a glass substrate according to an embodiment of the present invention. An etching protective ink film 6-20 is applied to a portion of the glass substrate 6-10 that is not cut by ink jet equipment, screen printing, or transfer device, and an unprinted region having no ink on the portion to be etched (6- 30) do not apply ink. Of course, in the case of ink jet, the amount of ink is directly applied through the nozzle, and in the case of screen printing, the ink is poured onto the screen substrate mask mesh and pushed with a squeeze and the ink is applied onto the glass substrate as opposed to the image formed on the plate making. In the case of transfer, the ink is applied to the transfer plate to a certain thickness and then transferred onto a glass substrate to apply an etch protection ink film. When the glass substrate is etched in the state of FIG. 6, the glass is etched not only to the cutting line but also to the back side on which the ink layer is not formed. In this case, slimming can be performed at the same time as the cutting of the glass substrate, which is very effective. Of course, when the back side is not slimmed, a protective film is applied to the back side over the front side, only the cutting line is etched, and the unit cell having the desired shape is obtained while maintaining the original thickness.

7 is a cross-sectional view of an etch protection ink film coated with ink both above and below the glass substrate in order to prevent etching of the back glass substrate according to the present invention. First, the printing ink 7-20 is applied to the upper surface of the glass substrate 7-10 to cure the ink, and then the printing ink 7-3 is also applied to the lower surface. Of course, the glass substrate is cut by exposing the unprinted areas 7-40, which are portions for etching the glass, to the chemical. Etching the glass substrates by exposing both sides to the chemical allows one to obtain a single glass substrate with the desired shape while maintaining the original glass substrate thickness, and the glass can be cut at an etching rate that is twice as fast as the one-sided etching. There is an advantage that can affect less.

8 is a cross-sectional view after the glass long plate is etched after coating the etch protection ink film on both sides of the glass substrate to prevent etching of the back glass substrate according to the present invention. Here, the glass substrate 8-10 has the form which is intended to be obtained by the cutting line 8-30. Then, there is an etching protective ink film 8-20, and if the ink film is removed with a remover, a curved glass substrate can be obtained.

9 is a cross-sectional view of a chemical penetration prevention film formed under a cutting line in order to prevent chemical penetration between two substrates during chemical etching in a display such as an LCD or an OLED made by combining two sheets according to the present invention. .

In FIG. 9, (a) and (a ') represent one display cell, and (b) and (b) also represent another display cell, and a plurality of display cells may be disposed on a single glass substrate. Here, (C) corresponds to the part separated and separated after etching the glass substrate. In FIG. 9, the cell bonding encapsulant 9-30 and the chemical penetration preventing encapsulant 9-40 are inserted between the two glass substrates 9-10, all of which are simultaneously formed of the same material. The cell bonding encapsulant (9-30) encapsulates the display cells (a) and (b) and (b) .The encapsulant for chemical penetration (9-40) is a cutting line. (9-50) is formed after complete cutting to prevent penetration into the cell of the chemical. Here, the cut lines 9-50 are spaces without the ink layer 9-20, and the glass substrates are etched to allow separation of the cell units. Here, the glass substrate (C) cut | disconnected at the top is a part finally separated and discarded. By doing this, it is possible to prevent the chemical from penetrating into the display cell during the cutting of the bonded glass substrate and causing the defect.

In the present invention, when the etching protection film is formed by screen printing using the resin ink, the viscosity of the ink and the thickness and mesh of the screen net are related to each other, so that the thickness of the net is 30 to 100 μm. Carpenters were used to print from 50 to 500 necks.

Also, the thicker the ink, the longer the ink lasts without deformation in the glass etching chemical, so the thicker the glass substrate to be etched is 0.1t, 0.3t, 0.5t ... It is advantageous to form it thickly.

In the case of the screen mask, the thickness of the plate-making ink film coated on the screen net is important as a method for forming a thick thickness of the protective film. In the present invention, the thickness of the screen-making ink used was 5 to 500 µm.

In addition, the inkjet equipment sprays low-viscosity ink through the nozzle. In the present invention, the viscosity of the aqueous acrylic emulsion was 5 to 100,000 cps, and the coating film was coated with a thickness of 300 μm or less to be used as an etch protective film. .

Meanwhile, although specific embodiments of the present invention have been described and illustrated, modifications and variations can be made by those skilled in the art. Accordingly, the following claims are to be understood as including all modifications and variations as long as they fall within the true spirit and scope of the present invention.

1-10: Phase Polarizer 1-20: Color Filter Substrate
1-30: red-green-blue color filter pigment 1-40: liquid crystal
1-50: Liquid Crystal Encapsulant 1-60: Spacer
1-70: Array Substrate 1-80: Lower Polarizer
2-10: Ledger Substrates 2-20: Unit Display
3-10: pixel part 3-20: terminal part
4-10: color filter substrate 4-20: array substrate
4-30: Liquid Crystal Encapsulant 4-40: Diamond Wheel
5-10: Screen Mesh 5-20: Screen Mask Ink
5-30: Ink penetrating area for printing
6-10: Glass Substrate 6-20: Printing Ink
6-30: Unprinted area
7-10: Glass Substrate 7-20: Printing Ink
7-30: Ink for printing the back of the glass 7-40: Unprinted area
8-10: Glass Substrate 8-20: Etch Protection Ink Film
8-30: cutting line
9-10: Bonded glass substrate 9-20: Ink for cutting protection film
9-30, 9-31: Encapsulant for Display Cell Bonding
9:40: sealing agent for chemical penetration prevention 9:50: glass substrate cutting line

Claims (8)

Applying an etch protective film to at least one of the front and rear surfaces of the substrate by any one of an inkjet method, a print screen method, and a transfer printing method;
Curing the applied etch passivation layer;
Etching the substrate on which the etch protective film is cured; And
Removing the etching protective film using a protective film remover;
Substrate cutting method through the chemical wet etching comprising a.
The method of claim 1, wherein the etching protection film,
A method of cutting a substrate through chemical wet etching, which is one of a one-component resin, a two-component resin, and an aqueous acrylic emulsion resin.
The method of claim 2,
When using a one-component resin and a two-component resin, at least any one of a solvent, an antifoaming agent and carbon (graphite) is further added, the method of cutting substrates by chemical wet etching.
The method of claim 2,
The viscosity of the aqueous acrylic emulsion resin is a substrate cutting method through the chemical wet etching, characterized in that using a resin of 5 ~ 100,000 cps.
The method of claim 1, wherein the protective film removing agent,
A method of cutting a substrate through chemical wet etching, characterized in that the chemical is composed of any one of methyl chloride, MEK, toluene and acetone.
The etch protective film of claim 1,
The substrate cutting method through the chemical wet etching, characterized in that the thickness is 300㎛ or less.
The method of claim 6, wherein in the curing step,
Cure temperature is a substrate cutting method through the chemical wet etching, characterized in that less than 150 ℃.
The method according to any one of claims 1 to 5, wherein when etching the substrate formed by joining two,
A method of cutting a substrate through chemical wet etching, wherein a chemical penetration barrier is formed to prevent penetration of the protective film remover during an etching operation on a contact portion of the substrate that meets a cutting line through etching.

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