CN115487975A - Nozzle tip management device and coating device - Google Patents

Abstract

The invention relates to a nozzle tip management device which efficiently prevents the tip of a slit nozzle from being dried. A nozzle tip management device (10) is provided with: a storage tank (11) that surrounds the tip (21) of the slit nozzle (20) and stores a liquid (L) for preventing drying of the tip; and a porous block (121) that is provided in the storage tank (11), wherein the storage tank (11) stores the liquid (L) in such a manner that the inserted slit nozzle (20) is not in contact with the liquid (L), and wherein the porous block (121) is disposed in such a manner that the lower portion thereof is immersed in the liquid (L) and is separated from the slit nozzle (20) inserted into the storage tank (L).

Description

Nozzle tip management device and coating device

Technical Field

The present invention relates to a nozzle tip management device and a coating device.

Background

In order to form a thin film on a substrate such as a semiconductor or glass, a coating apparatus is used which discharges a predetermined coating liquid from a slit nozzle onto the substrate to form a thin film of the coating liquid on the substrate. In this coating apparatus, a nozzle tip management apparatus is known which prevents the drying of the tip of the slit nozzle while the coating on the substrate is not performed (for example, see patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 2019-118867

Disclosure of Invention

Technical problem to be solved by the invention

In the nozzle tip management device, when the tip of the slit nozzle is immersed in a predetermined liquid such as a solvent of the coating liquid, the liquid enters the inside of the slit nozzle from the tip due to capillary phenomenon. Therefore, when the coating liquid is applied to the substrate while maintaining this state, a predetermined liquid is mixed in the coating liquid, and thus coating unevenness may occur. In order to eliminate the coating unevenness, it is necessary to discharge a predetermined liquid that has intruded into the inside before coating on the substrate. In this case, the predetermined liquid must be discharged together with a large amount of the coating liquid, and the amount of the coating liquid used increases.

The invention aims to provide a nozzle tip management device and a coating device which can effectively prevent the drying of the tip of a slit nozzle.

Solution for solving the above technical problem

The present invention provides a nozzle tip management device including: a storage tank surrounding the front end of the slit nozzle and storing a predetermined liquid for preventing the front end from drying; and a porous block provided in the storage tank, the storage tank storing the predetermined liquid so that the inserted slit nozzle is not in contact with the predetermined liquid, the porous block being disposed so that a lower portion thereof is immersed in the predetermined liquid and is separated from the slit nozzle inserted into the storage tank.

The coating apparatus according to an aspect of the present invention includes a slit nozzle for applying a coating liquid to a substrate and the nozzle tip management apparatus according to the aspect.

Effects of the invention

According to the nozzle tip management device of the above aspect, since the storage tank includes the porous block, the predetermined liquid stored in the storage tank is evaporated from the surface thereof through the porous block. The porous block is configured to be separated from and in non-contact with the slit nozzle. As a result, the tip of the slit nozzle is covered with the atmosphere of the predetermined liquid evaporated from the surface of the porous block, and the drying of the tip of the slit nozzle can be efficiently prevented. Further, since the porous block is separated from the slit nozzle, the predetermined liquid can be prevented from entering the inside of the slit nozzle.

Further, according to the coating apparatus of the above aspect, since the nozzle tip management apparatus of the above aspect is provided, the predetermined liquid does not intrude into the slit nozzle during standby of the slit nozzle. As a result, when the coating liquid is discharged onto the substrate, the amount of the coating liquid discharged before being applied to the substrate can be reduced. Further, since the predetermined liquid does not intrude into the slit nozzle, it is possible to prevent the occurrence of coating unevenness when the coating liquid is applied to the substrate.

Drawings

Fig. 1 is a cross-sectional view showing an example of a nozzle tip management device according to embodiment 1.

Fig. 2 is a perspective view showing an example of the nozzle tip management device.

Fig. 3 is a perspective view showing an example of a nozzle tip management device with its main parts exploded.

Fig. 4 shows an example of the slit nozzle, in which fig. 4 (base:Sub>A) isbase:Sub>A view seen from the X direction, and fig. 4 (B) isbase:Sub>A cross-sectional view taken along the linebase:Sub>A-base:Sub>A of fig. 4 (base:Sub>A).

Fig. 5 is a cross-sectional view schematically showing an example of a configuration to which the nozzle tip management device is applied.

Fig. 6 is a plan view schematically showing an example of a configuration to which the nozzle tip management device is applied.

Fig. 7 is an enlarged view showing a part of the nozzle tip management device.

Fig. 8 is a diagram showing a state where liquid evaporates from the porous block.

Fig. 9 is a side view schematically showing an example of the coating apparatus of the embodiment.

Fig. 10 is a plan view schematically showing an example of the coating device.

Fig. 11 is a cross-sectional view showing another use scenario of the nozzle tip management device.

Fig. 12 (a) is a cross-sectional view showing an example of the nozzle tip management device according to embodiment 2, and fig. 12 (B) is a cross-sectional view showing an example of the nozzle tip management device according to embodiment 3.

Fig. 13 (a) is a cross-sectional view showing an example of the nozzle tip management device according to embodiment 4, and fig. 13 (B) is a cross-sectional view showing an example of the nozzle tip management device according to embodiment 5.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following description. In the drawings, parts are emphasized or simplified for easy understanding of the respective configurations, and may be different from actual configurations, shapes, scales, and the like. In the drawings, the directions in the drawings are explained using an XYZ coordinate system. One direction in the horizontal plane is marked as the X direction. In fig. 9 and 10, the X direction is a relative movement direction between the stage 30 and the slit nozzle 20, which will be described later. A direction orthogonal to the X direction in the horizontal plane is denoted as a Y direction. A direction perpendicular to a horizontal plane including the X direction and the Y direction is denoted as a Z direction. In the drawings, the direction indicated by an arrow in each of the X direction, the Y direction, and the Z direction is a + direction, and the direction opposite to the direction indicated by the arrow is a-direction.

[ embodiment 1 ]

Embodiment 1 will be explained. Fig. 1 is a cross-sectional view showing an example of a nozzle tip management device 10 according to embodiment 1. Fig. 2 is a perspective view showing an example of the nozzle tip management device 10. Fig. 3 is a perspective view showing an example of the nozzle tip management device 10 with its main portions exploded. The nozzle tip management device 10 prevents the tip 21 of the slit nozzle 20 described later from drying.

As shown in fig. 1, the nozzle tip management device 10 includes: a storage tank 11 that stores a liquid L (predetermined liquid); the porous structure 12 includes a porous block 121. The storage tank 11 includes a seal portion 111 and a recess 112. As shown in fig. 2 and 3, the storage tank 11 is provided in a box shape having an upper opening and a size (a size corresponding to the size and the shape of the slit nozzle 20) in which the porous structure 12 can be disposed. The material of the storage tank 11 is not particularly limited, and examples thereof include metal, resin, and glass. When the liquid L contains an organic solvent or the like, the material of the storage tank 11 is preferably made of metal, for example, in consideration of corrosion resistance or the like.

The seal portion 111 is formed on the upper end surface of the storage tank 11. The sealing portion 111 abuts against an abutment portion 22, which is a part of the slit nozzle 20 described later, and seals the inside of the storage tank 11. The seal portion 111 abuts against the abutment portion 22 so as to surround the tip 21 of the slit nozzle 20. The seal portion 111 has a rectangular ring shape when viewed from above (+ Z direction). When the contact portion 22 of the slit nozzle 20 is planar, the seal portion 111 is provided in a planar shape in conformity with the contact portion 22, and is in surface contact with the contact portion 22. The sealing portion 111 is not limited to a planar shape, and may be, for example, a curved surface or a hemispherical surface. In a state where the contact portion 22 is in contact with the seal portion 111, a space V sealed including the tip 21 of the slit nozzle 20 is formed in the storage tank 11. Further, a film, a sheet, or the like made of rubber or resin may be provided in the sealing portion 111. With this configuration, damage or the like to the contact portion 22 or the seal portion 111 can be prevented.

The recess 112 is provided in a part of the bottom 110 of the retention tank 11. The recess 112 is provided to partially store the liquid L fed into the storage tank 11 in the bottom portion 110 below the storage tank 11. The recess 112 is provided along the Y direction at substantially the center of the bottom 110 in the X direction. The width of the recess 112 in the X direction is arbitrary and is set to match the notch 121C of the porous block 121 described later. The concave portion 112 is provided over the entire length of the bottom portion 110 in the Y direction. For example, the liquid L is fed into the storage tank 11 from one of the + Y side end and the-Y side end of the concave portion 112, and the liquid L is discharged from the storage tank 11 from the other of the + Y side end and the-Y side end of the concave portion 112. Therefore, the concave portion 112 also serves as a flow path for the liquid L to flow. Whether or not the recess 112 is provided is arbitrary, and the recess 112 may not be provided.

The liquid L is used for the purpose of preventing the coating liquid (coating liquid Q1 described later) remaining at the tip 21 of the slit nozzle 20 from drying and adhering to the tip 21, for example. That is, the liquid L is selected in accordance with the coating liquid discharged from the slit nozzle 20 and with the purpose of preventing or suppressing evaporation of the solvent in the coating liquid. The liquid L may be the same as or different from the solvent in the coating liquid, for example. Examples of the liquid L include solvents for photoresists used in the fields of semiconductors and displays, such as Propylene Glycol Methyl Ether Acetate (PGMEA), propylene Glycol Methyl Ether (PGME), γ -butyrolactone, methoxybutyl acetate, cyclohexanone, and ethyl lactate; solvents for polyimide used in the field of flexible displays, such as N-methylpyrrolidone (NMP) and Dimethylsulfoxide (DMSO); and solvents for adhesives used in the field of semiconductor packaging, such as p-menthane and decalin. These liquids L are used in accordance with the coating liquid, and the space V is made to be an atmosphere of the liquid L by evaporation, thereby preventing the coating liquid remaining at the tip 21 of the slit nozzle 20 from drying.

The porous structure 12 is disposed in the storage tank 11, and the lower portion thereof is immersed in the liquid L stored in the storage tank 11. The porous structure 12 includes two porous blocks 121 and two block joint portions 122. The two porous blocks 121 have the same shape, face each other, and are connected to the ends on the + Y side and the-Y side by block connecting portions 122 in a state of being separated in the X direction. The porous block 121 and the block joint portion 122 are joined by, for example, sintering using an inorganic adhesive. As a result, the two porous blocks 121 and the two block joining portions 122 are integrated. The material of the block joint 122 is not particularly limited as long as it has resistance to the liquid L. The block joint 122 may be made of the same material as the porous block 121. The porous structure 12 is inserted into the storage tank 11, placed on the bottom 110 of the storage tank 11, and fixed to the storage tank 11. According to such a configuration, since a slight gap is formed between the porous block 121 and the storage tank 11, the liquid L also permeates into the porous block 121 through the gap, and the storage tank 11 can be easily attached to and detached from the porous structure 12. Further, the upper end of the porous block 121 is lower than the sealing portion 111 of the retention tank 11, thereby avoiding contact with the slit nozzle 20. A cover frame 123 is disposed on the upper end side of the porous structure 12. The details of the cover frame 123 will be described later.

The two porous blocks 121 have a plurality of air holes 121A, a surface 121B, and a cutout portion 121C, respectively. The plurality of air holes 121A communicate with each other in the porous block 121, and the liquid L can be sucked up to the surface 121B by capillary action. The details of the air hole 121A will be described later. The surface 121B is a surface facing a portion including the tip 21 of the slit nozzle 20. The surface 121B is formed in an arc shape or a curved surface shape from the upper end toward the lower side. In the two porous blocks 121, the surfaces 121B are opposed to each other. The surface 121B is provided to match the shape of the portion including the front end 21 of the slit nozzle 20. In the present embodiment, since the portion including the tip 21 of the slit nozzle 20 has an arc shape, the surface 121B is formed into an arc shape or a curved surface shape so as to match the portion. As a result, in a state where the contact portion 22 of the slit nozzle 20 is in contact with the seal portion 111 of the storage tank 11, the surface 121B is disposed at a constant or substantially constant distance D from the portion including the tip 21 of the slit nozzle 20.

Notch 121C is provided at a lower portion of surface 121B. The notch 121C is provided along the entire length of the recess 112 in the Y direction. That is, the two porous blocks 121 are disposed on both sides of the concave portion 112 in a state where the cutout portions 121C face each other.

The plurality of air holes 121A are provided to be the same or approximately the same in all the porous blocks 121. The porosity of the porous block 121 is set to 25% to 70%, for example. If the porosity is less than 25%, the amount of liquid L sucked up is reduced, and if the porosity exceeds 70%, the porous block 121 becomes fragile and easily broken. The porosity of the porous block 121 is preferably in the range of 35% to 60%. Within this range, the liquid L can be sufficiently sucked up, and a decrease in strength of the porous block 121 can be avoided. Further, the diameter of the pores in the plurality of pores 121A is, for example, 5 μm to 200 μm. If the pore diameter is less than 5 μm, the liquid L cannot be sufficiently sucked up, and if the pore diameter exceeds 200 μm, the porous block 121 becomes fragile. The diameter of the pores in the plurality of pores 121A is preferably set to a range of 50 μm to 100 μm. Within this range, the liquid L can be sufficiently sucked up, and a decrease in strength of the porous block 121 can be avoided.

The air permeability of the porous block 121 is, for example, 0.5 × 10 ^-13 m ² To 300X 10 ^-13 m ² . If the ventilation rate of the porous block 121 is less than 0.5X 10 ^-13 m ² When the air permeability exceeds 300X 10, the liquid L cannot be sufficiently sucked up ^-13 m ² The porous block 121 becomes weak. Preferably, the ventilation rate of the porous block 121 is set to 5 × 10 ^-13 m ² To 100X 10 ^-13 m ² The range of (1). Within this range, the liquid L can be sufficiently sucked up, and a decrease in strength of the porous block 121 can be avoided. For example, inorganic ceramics are used as the material of the porous block 121 in consideration of durability, workability, and the like. Examples of the inorganic ceramic include alumina-based and silicon carbide-based porous ceramics. Further, as long as the porous block 121 has resistance to the liquid L, a fluorine-based porous resin such as Polytetrafluoroethylene (PTFE) or Perfluoroalkoxyalkane (PFA) may be used.

The cover frame 123 is disposed so as to cover the porous structure 12 in a plan view. The cover frame 123 has a rectangular frame shape having a predetermined thickness, and is made of polypropylene glycol (PP), for example. The cover frame 123 is used for the purpose of avoiding contact of the porous block 121 with the slit nozzle 20. The thickness of the cover frame 123 is arbitrary, and the upper surface 123A may be the same height as the sealing portion 111 of the storage tank 11, or may exceed the thickness of the sealing portion 111. When the thickness of the cover frame 123 exceeds the sealing portion 111, the upper surface 123A of the cover frame 123 may abut against the abutting portion 22 of the slit nozzle 20 to seal the space V. Whether or not the cover frame 123 is disposed is arbitrary. The cover frame 123 may not be provided.

Fig. 4 shows an example ofbase:Sub>A slit nozzle 20 that can use the nozzle tip management device 10, where fig. 4 (base:Sub>A) isbase:Sub>A view seen from the X direction, and fig. 4 (B) isbase:Sub>A cross-sectional view taken along the linebase:Sub>A-base:Sub>A of fig. 4 (base:Sub>A). The slit nozzle 20 discharges a coating liquid Q1 (see fig. 9) for forming a predetermined thin film on the surface of the substrate S, for example, toward the substrate S. As shown in fig. 4 (a), the slit nozzle 20 includes a slit-shaped opening 23 along the Y direction at a tip 21 serving as a lower end. The seal portion 111 of the storage tank 11 is abutted by an abutting portion 22 provided via a flat surface portion of an arc surface continuous from the distal end 21.

As shown in fig. 4 (B), a passage 24 for allowing the coating liquid Q1 to flow to the opening 23 and a storage section 25 for storing the coating liquid Q1 on the upstream side of the passage 24 are provided inside the slit nozzle 20. A coating liquid supply device 50 (see fig. 9) described later is connected to the storage section 25. The coating liquid Q1 is conveyed from the coating liquid supply device 50 to the storage section 25 by a pump for liquid conveyance. The coating liquid Q1 in the reservoir 25 is discharged from the opening 23 through the passage 24 by the liquid feeding pressure of the pump.

Fig. 5 is a cross-sectional view schematically showing an example of a configuration to which the nozzle tip management device 10 is applied, and fig. 6 is a plan view schematically showing an example of a configuration to which the nozzle tip management device 10 is applied. Fig. 7 is an enlarged view of a part of the nozzle tip management device 10, and is an enlarged view of the lower part of the liquid level adjustment space 115 in fig. 5. As shown in fig. 5 and 6, the nozzle tip management device 10 is supported by the support body 16. The support body 16 includes a plurality of support columns 161 and supports the storage tank 11 in contact with the lower surface of the storage tank 11. The support post 161 is, for example, a spring-type support post, and when the slit nozzle 20 abuts against the seal portion 111, the slit nozzle 20 presses the seal portion 111 downward against the elastic force of the spring, thereby making the both more closely attached. The nozzle tip management device 10 includes a discharge pipe 113, an overflow pipe 114, a liquid level sensor 13, a liquid level management pipe 131, a liquid supply device 14, a supply pipe 141, and a control unit 15.

The storage tank 11 is provided with a liquid level adjustment space 115 formed inside, differently from the storage tank 11 of fig. 2. When the porous structure 12 is disposed in the storage tank 11, the liquid level adjustment space 115 is provided on the + Y side of the porous structure 12. In addition, a concave portion 112 is also provided in a portion of the liquid level adjustment space 115. The recess 112 allows the liquid level adjustment space 115 to communicate with the lower side of the porous structure 12 (porous block 121) via the recess 112. Therefore, when the liquid L is put into the storage tank 11, the liquid L flows not only into the lower portion of the porous structure 12 but also into the liquid level adjustment space 115 via the concave portion 112. Therefore, the liquid level of the liquid L in the porous structure 12 is the same as the liquid level of the liquid L in the liquid level adjustment space 115. A discharge pipe 113, an overflow pipe 114, and a liquid level control pipe 131 are connected to the lower side of the liquid level adjustment space 115.

The discharge pipe 113 is connected to the concave portion 112 of the storage tank 11 at the lower portion of the liquid level adjustment space 115. An opening/closing valve B1 is provided in a part of the discharge pipe 113. The opening/closing valve B1 is opened and closed according to an instruction from the control unit 15, for example. As shown in fig. 7, by opening the opening/closing valve B1, the liquid L in the storage tank 11 is discharged to the outside through the discharge pipe 113. By discharging the liquid L in the storage tank 11 through the discharge pipe 113, the height of the liquid level of the liquid L in the storage tank 11 can be adjusted, and the liquid L in the storage tank 11 can be replaced. The discharge pipe 113 is connected to, for example, a waste liquid tank, and stores the liquid L discharged from the storage tank 11 in the waste liquid tank. In addition, the inner diameter of the discharge pipe 113 can be set appropriately. Further, a flow meter or the like may be provided in a part of the discharge pipe 113.

The overflow pipe 114 is provided below the liquid level adjustment space 115 so as to penetrate the bottom 110 of the storage tank 11. The upper end of the overflow pipe 114 is disposed above the recess 112. The upper end of the overflow pipe 114 is set to the same height as the liquid level (liquid level) of the allowable storage limit of the liquid L in the storage tank 11. As shown in fig. 7, when the amount of the liquid L stored in the storage tank 11 exceeds the liquid level H0 at the allowable storage limit to become a liquid level H1, the liquid L flows in from the upper end of the overflow pipe 114 and is discharged to the outside. Further, the inner diameter of the overflow pipe 114 can be appropriately set. Further, a flow meter or the like may be provided in a part of the overflow pipe 114.

The liquid level sensor 13 is connected to the storage tank 11 via a liquid level control pipe 131. The liquid level control pipe 131 is provided to penetrate the bottom 110 of the storage tank 11, and the upper end thereof is disposed in the concave portion 112. The liquid level sensor 13 detects the height (e.g., liquid levels H2 and H3 shown in fig. 7) of the liquid level (liquid level) of the liquid L in the storage tank 11, for example, based on the pressure of the liquid L stored in the storage tank 11. The liquid level sensor 13 is disposed in the support body 16, for example, on the + Y side of the storage tank 11. The liquid level sensor 13 outputs data on the height of the liquid level of the liquid L to the control unit 15. The liquid level sensor 13 is not limited to the above-described embodiment, and any sensor that detects the height of the liquid level of the liquid L in a non-contact or contact manner may be used.

In the present embodiment, the discharge pipe 113, the overflow pipe 114, and the liquid level control pipe 131 are arranged in the liquid level adjustment space 115 in this order in the + Y direction, but the order of arrangement is arbitrary. In the drawings, the discharge pipe 113, the overflow pipe 114, and the liquid level control pipe 131 are shown as having the same inner diameter, but the inner diameters can be set to be respectively suitable for the purposes.

The liquid supply device 14 is connected to the storage tank 11 via a supply pipe 141. The liquid supply device 14 supplies the liquid L to the retention tank 11 through the supply pipe 141 in response to an instruction from the control unit 15. The supply pipe 141 is connected to the-Y side of the storage tank 11. That is, the supply pipe 141 is connected to the opposite side of the liquid level adjustment space 115 in the storage tank 11. An opening/closing valve B2 is provided in a part of the supply pipe 141. The opening/closing valve B2 is opened and closed according to an instruction from the control unit 15, for example. The liquid supply device 14 includes, for example, a liquid tank, not shown, that stores the liquid L. The liquid L is pumped from the liquid tank to the retention tank 11 by, for example, pressurized nitrogen gas or the like. The liquid supply device 14 may be configured to supply the liquid L from the liquid tank to the storage tank 11 using a liquid supply pump, for example.

The control unit 15 overall controls the nozzle tip management device 10. The control unit 15 controls each unit by a predetermined program or the like stored in advance in a storage unit or the like not shown. For example, the controller 15 drives the liquid supply device 14 and the on-off valve B2 to control the supply amount of the liquid L to the storage tank 11. The controller 15 drives the on-off valve B1 to control the discharge amount of the liquid L from the storage tank 11. Further, the controller 15 drives the liquid supply device 14 and the on-off valves B1 and B2 based on the output of the liquid level sensor 13, and controls the supply amount and the discharge amount of the liquid L so as to maintain the liquid level H2 (see fig. 7). The drive of part or all of the liquid supply device 14 and the opening/closing valves B1 and B2 is not limited to the control by the control unit 15, and may be manually operated by an operator.

The operation state of the nozzle tip management device 10 will be described. First, the controller 15 drives the liquid supply device 14, opens the on-off valve B2, and supplies the liquid L to the storage tank 11. At this time, the opening/closing valve B1 of the discharge pipe 113 is closed in advance. Further, the control unit 15 stops the driving of the liquid supply device 14 and closes the on-off valve B2 at a stage when the liquid L reaches the liquid level H2 (desired liquid level) based on the output of the liquid level sensor 13. As a result, the liquid L at the liquid level H2 is stored in the storage tank 11. The timing of supplying the liquid L to the storage tank 11 may be before the slit nozzle 20 is disposed in the storage tank 11, or may be after the slit nozzle 20 is disposed in the storage tank 11.

Fig. 8 is a diagram showing a state where the liquid L evaporates from the porous block 121. Further, fig. 8 shows the positional relationship of the slit nozzle 20 and the porous block 121. When the liquid L is supplied to the storage tank 11, the lower portion of the porous block 121 is immersed in the liquid L. As a result, the liquid L permeates upward (is sucked up) due to the capillary phenomenon of the plurality of air holes 121A communicating with the porous block 121, and evaporates from the surface 121B of the porous block 121 as indicated by the broken-line arrows in fig. 8. Therefore, the space V formed by the slit nozzle 20 and the storage tank 11 becomes an atmosphere of the evaporated liquid L.

Further, a constant gap of the distance D is provided between the slit nozzle 20 and the porous block 121, and the tip 21 of the slit nozzle 20 is disposed in the vicinity of the surface 121B of the porous block 121. Therefore, the tip 21 is disposed in a space where the concentration of the evaporated liquid L is high. As a result, the drying of the tip 21 of the slit nozzle 20 (the coating liquid Q1 in the opening 23) can be prevented with high efficiency. Further, since the contact portion 22 (see fig. 1) of the slit nozzle 20 contacts the seal portion 111 (see fig. 1) of the storage tank 11 to seal the space V, the concentration of the liquid L evaporated in the space V is prevented from decreasing. Further, since the slit nozzle 20 is not in contact with the porous block 121, the liquid L is prevented from adhering to the tip 21 of the slit nozzle 20 and from entering the passage 24 from the opening 23.

Since the liquid L evaporates, the liquid level of the liquid L in the retention tank 11 decreases. The controller 15 drives the liquid supply device 14 and the on-off valve B2 based on the output of the liquid level sensor 13 to appropriately supply the liquid L to the storage tank 11 so as to maintain the liquid L at the liquid level H2 (desired liquid level). Further, the control portion 15 can maintain the liquid level H2 and simultaneously perform the supply of the liquid L by the liquid supply device 14 and the discharge of the liquid L by the discharge pipe 113. In this case, the liquid L flows from the-Y side to the + Y side in the storage tank 11. Further, a configuration may be employed in which the liquid L discharged from the discharge pipe 113 is returned to the liquid supply device 14, and the liquid L is supplied to the retention tank 11 again, thereby circulating the liquid L. In this case, a filter may be provided in the circulation path in order to remove foreign matters from the discharged liquid L.

As described above, according to the nozzle tip management device 10 of the present embodiment, since the liquid L is evaporated from the porous block 121 provided in the storage tank 11, the tip 21 of the slit nozzle 20 which is not in contact with the porous block 121 is covered with the atmosphere of the evaporated liquid L, and the tip 21 of the slit nozzle 20 can be efficiently prevented from drying. Further, since the porous block 121 is separated from the slit nozzle 20, the liquid L can be prevented from entering the inside of the slit nozzle 20.

< coating apparatus >

Next, the coating apparatus 100 of the embodiment will be explained. The coating apparatus 100 includes the nozzle tip management apparatus 10. Fig. 9 is a side view schematically showing an example of the coating apparatus 100 according to the embodiment, and fig. 10 is a plan view schematically showing an example of the coating apparatus 100. The coating apparatus 100 coats a coating liquid Q1 for forming a thin film on the surface of the substrate S. As shown in fig. 9 and 10, the coating apparatus 100 includes a nozzle tip management apparatus 10, a slit nozzle 20, a stage 30, a moving apparatus 40, a coating liquid supply apparatus 50, and a control apparatus 60. In addition to the above configuration, the nozzle tip management device 10 further includes a wiper device 70.

The nozzle tip management device 10 is provided on the + X side of the stage 30 in the X direction, which is the relative movement direction of the stage 30 and the slit nozzle 20. However, the nozzle tip management device 10 may be provided on the-X side of the stage 30, or may be provided on the + Y side or the-Y side of the stage 30. The nozzle tip management device 10 may be provided to include a standby region R1 and a discharge cleaning region R2. That is, the standby area R1 is provided with the storage tank 11 as a part of the nozzle tip management device 10, and the discharge cleaning area R2 is provided with the wiper device 70 as a part of the nozzle tip management device 10. The standby region R1 is provided on the-X side with respect to the discharge cleaning region R2. That is, the standby region R1 is provided between the stage 30 and the discharge cleaning region R2. The standby region R1 is a region where the slit nozzle 20 stands by when the operation of applying the coating liquid Q1 to the substrate S is not performed in order to prevent drying of the slit nozzle 20. The storage tank 11 is disposed in the standby region R1. The discharge cleaning region R2 is a region for cleaning (wiping) the discharge of the coating liquid Q1 by Dummy Dispense (Dummy Dispense) and the coating liquid Q1 adhering to the tip 21 of the slit nozzle 20 before and after coating. A wiping device 70 is provided in the cleaning discharge region R2. The wiping device 70 includes, for example, a blade (blade), not shown, and moves in the Y direction while contacting the slit nozzle 20, thereby wiping off the coating liquid Q1 adhering to the tip 21 of the slit nozzle 20. The height of the nozzle tip management device 10 (the storage tank 11 and the wiping device 70) may be arbitrarily set, but if the distance of the vertical movement of the slit nozzle 20 is long, it takes time before coating (the tact time is slow), and therefore, it is preferable that the height be the same as the height of the stage 30 or be lower than the stage 30. By making the wiping device 70 lower than the table 30, it is possible to prevent mist of cleaning agent or the like for cleaning from adhering to the table from the wiping device 70.

The stage 30 has a mounting surface 31 on which the substrate S is mounted. The mounting surface 31 is set to a size capable of supporting the substrate S. The stage 30 may include an adsorption mechanism that adsorbs and holds the substrate S placed thereon. The mounting surface 31 mounts thereon a substrate S which is transported from the outside by a substrate transport device, not shown, for example. The substrate S coated with the coating liquid Q1 is carried out from the mounting surface 31 by, for example, a substrate conveyance device not shown. Further, the operator can manually carry the substrate S in and out of the stage 30.

The slit nozzle 20 is supported to be movable in the X direction and the Z direction. When coating liquid Q1 is applied to substrate S, slit nozzle 20 is disposed above stage 30. The slit nozzle 20 is movable between a standby position P1 set in the standby area R1, a discharge cleaning position P2 set in the discharge cleaning area R2, a coating start position P3 at the time of coating the coating liquid Q1 on the substrate S, and a coating end position P4 at which the coating of the coating liquid Q1 on the substrate S is ended. The application start position P3 and the application end position P4 are set according to the size or position of the substrate S placed on the placement surface 31. Since uneven coating due to drying occurs if the coating is not started early after the cleaning of the slit nozzle 20 in the discharge cleaning region R2, the coating start position P3 is set to a side closer to the nozzle tip management device 10 (i.e., the + X side of the stage 30).

The moving device 40 moves the slit nozzle 20 in the X direction and the Z direction. By moving the slit nozzle 20 in the X direction, the relative movement with the stage 30 can be performed. Further, by moving the slit nozzle 20 in the Z direction, the interval with respect to the substrate S can be adjusted. The slit nozzle 20 discharges the coating liquid Q1 while moving from the coating start position P3 to the coating end position P4 in the-X direction, thereby coating the coating liquid Q1 on the substrate S. Further, the moving device 40 can insert the tip 21 into the storage tank 11 by moving the slit nozzle 20 downward after moving the slit nozzle 20 to the standby position P1. Then, the slit nozzle 20 is moved upward, moved in the + X direction, and moved to the discharge cleaning position P2 which is above the wiper 70, and then the slit nozzle 20 is moved downward, whereby the tip 21 can be inserted into the wiper 70. The coating liquid Q1 adhering to the inserted tip 21 is scraped off by the wiping device 70. The moving device 40 may have any configuration, and for example, a linear motor, a ball screw mechanism, a cylinder device, or the like is used. In the above configuration, the slit nozzle 20 is moved, but the configuration is not limited to this configuration, and for example, a configuration in which the stage 30 and the nozzle tip management device 10 are moved relative to the slit nozzle 20 may be applied.

The coating liquid supply device 50 supplies the coating liquid Q1 to the slit nozzle 20. The coating liquid supply device 50 includes a tank, not shown, for storing the coating liquid Q1 and a pump, not shown, for supplying the coating liquid Q1 to the slit nozzle 20. The coating liquid supply device 50 drives the pump to transfer the coating liquid Q1 from the tank to the storage section 25 of the slit nozzle 20 (see fig. 4). The slit nozzle 20 discharges the coating liquid Q1 from the opening 23 (see fig. 4) onto the substrate S via the reservoir 25 and the passage 24 (see fig. 4). The dimension of the opening 23 of the slit nozzle 20 in the Y direction is smaller than the dimension of the substrate S on the mounting surface 31 in the Y direction, for example. However, the dimension of the opening 23 in the Y direction may be larger than the dimension of the substrate S in the Y direction. In this case, the opening 23 may be adjusted to match the dimension of the substrate S in the Y direction by closing a portion separated from the substrate S with a predetermined closing member or the like.

The controller 60 overall controls the coating device 100. The control unit 15 (see fig. 5 and 6) of the nozzle tip management device 10 may be a part of the control device 60, or may be provided separately from the control device 60. The controller 60 controls the movement of the moving device 40, the coating liquid supplier 50, and the nozzle tip management device 10. The control device 60 controls each unit based on a program, information, and the like stored in advance in a storage unit and the like, not shown.

The operation of the coating apparatus 100 will be described. When information that the substrate S is placed on the placement surface 31 of the stage 30 is acquired or when the start of the coating operation is input by the operator, the control device 60 drives the moving device 40 to move the slit nozzle 20 from the standby position P1 to the discharge cleaning position P2. Next, the control device 60 causes the slit nozzle 20 to perform dummy dispensing, and cleans the slit nozzle 20 by the wiping device 70. Next, the controller 60 drives the moving device 40 to move the slit nozzle 20 to the application start position P3. Next, the coating liquid supply device 50 is driven while the slit nozzle 20 is moved in the-X direction to the coating end position P4 by the moving device 40. The slit nozzle 20 discharges the coating liquid Q1 while moving in the-X direction on the substrate S, thereby forming a film formed of the coating liquid Q1 on the substrate S. When the film formation on the substrate S is completed, the discharge stop time of the coating liquid Q1 from the slit nozzle 20 may be increased for the replacement of the substrate S. Further, when the coating liquid Q1 is discharged to the next substrate S, the tip 21 of the slit nozzle 20 needs to be managed (cleaned).

In this case, the controller 60 drives the moving device 40 to move the slit nozzle 20 to the discharge cleaning position P2, cleans the slit nozzle 20 by the wiper 70, and then moves the slit nozzle 20 to the standby position P1 to insert the tip 21 into the storage tank 11. The controller 60 drives the nozzle tip management device 10 when the tip 21 is inserted into the storage tank 11 or before the tip 21 is inserted into the storage tank 11. The controller 60 drives the liquid supply device 14 (see fig. 5 and 6) to supply the liquid L to the storage tank 11. The liquid L supplied to the retention tank 11 moves to the upper portion of the porous block 121 (see fig. 8) as described above, and evaporates from the surface 121B. The tip 21 of the slit nozzle 20 is disposed in the vicinity of the surface 121B, and therefore is exposed to an atmosphere having a high concentration of the evaporated liquid L. As a result, the curing of the coating liquid Q1 at the tip 21 of the slit nozzle 20 is prevented, and the drying of the tip 21 is prevented until the next substrate S is coated.

The controller 60 maintains this state until the coating operation for the next substrate S is started. At this time, when the liquid L in the storage tank 11 decreases, the liquid supply device 14 is driven to appropriately supply the liquid L to the storage tank 11. Further, the control device 60 can continuously perform the operation of supplying the liquid L to the storage tank 11 by the liquid supply device 14 and discharging the liquid L from the discharge pipe 113. In this case, since a new liquid L is supplied to the storage tank 11, it is possible to avoid continuous use of the deteriorated liquid L. When coating is performed on the next substrate S, the controller 60 moves the slit nozzle 20 from the standby position P1 to the discharge cleaning position P2, cleans the tip 21 of the slit nozzle 20, and then moves the slit nozzle to the coating start position P3. The subsequent operation is repeated as described above. In the case where the coating on the substrate S is not performed, that is, in the case where the slit nozzle 20 is caused to stand by for a long time, the control device 60 may drive the moving device 40 to repeatedly move between the standby position P1 and the discharge cleaning position P2.

In the coating apparatus 100, 1 nozzle tip management device 10 is provided in the standby area R, but the present invention is not limited to this, and a plurality of nozzle tip management devices 10 may be provided in the standby area R. For example, different coating liquids Q1 and Q2 are discharged from the slit nozzle 20, and different nozzle tip management devices 10 may be used when discharging the coating liquid Q1 and when discharging the coating liquid Q2. In the case where the liquid L for preventing the drying of the coating liquid Q1 and the liquid L for preventing the drying of the coating liquid Q2 are different, different liquids L may be supplied to the plurality of nozzle tip management apparatuses 10. Further, it may be configured such that different liquids L can be supplied to 1 nozzle tip management device 10, and the liquid L is switched according to the coating liquid Q1.

In the above embodiment, the description has been given by taking the example where the contact portion 22 of the slit nozzle 20 contacts the seal portion 111 of the storage tank 11 in the nozzle tip management apparatus 10, but the present invention is not limited to this example. Fig. 11 is a sectional view showing another use of the nozzle tip management device 10. The abutment portion 22 of the slit nozzle 20 is preferably in close contact with the seal portion 111 of the storage tank 11, but the nozzle tip management device 10 may be used in a state where the abutment portion 22 of the slit nozzle 20 is separated from the seal portion 111 of the storage tank 11 as shown in fig. 11. The upper limit of the distance W between the contact portion 22 and the seal portion 111 is set to a range of about several hundreds μm. If the gap W is in this range, the leakage of the evaporated liquid L from the gap W to the outside can be reduced. Further, since the contact portion 22 does not contact the seal portion 111, the slit nozzle 20 or the storage tank 11 can be prevented from being damaged.

[ 2 nd embodiment ]

Embodiment 2 will be explained. Fig. 12 (a) is a cross-sectional view showing an example of the nozzle tip management device 210 according to embodiment 2. Note that the same components as those in embodiment 1 are denoted by the same reference numerals, and description thereof will be omitted or simplified. The shape of the porous block 221 of the nozzle tip management device 210 is different from the nozzle tip management device 10 according to embodiment 1, and other configurations are the same as those of the nozzle tip management device 10. In the present embodiment, the shape of the slit nozzle 20 is different from that of embodiment 1 in that it is V-shaped, unlike embodiment 1. Note that, in fig. 12 (a), the cover frame 123 is not shown. As shown in fig. 12 (a), the surface 221B of the porous block 221 provided in the porous structure 212 of the nozzle tip management device 210 is formed in a planar shape so as to extend along the V-shaped slit nozzle 20.

The porous structure 212 includes two porous blocks 221. The two porous blocks 221 are disposed on both sides of the recess 112 sandwiching the storage tank 11. The porous block 221 has a plurality of air holes 221A. Further, the surface 221B of the porous block 221 is separated from the front end 21 of the slit nozzle 20. In fig. 12 (a), the slit nozzle 20 is shown separated from the sealing portion 111, but the present invention is not limited to this configuration, and the slit nozzle 20 may be brought into contact with the sealing portion 111. Further, as described above, the upper limit of the gap W1 between the slit nozzle 20 and the sealing portion 111 is set to a range of about several hundreds μm. As in embodiment 1, the nozzle tip management device 210 can also effectively prevent the tip 21 of the slit nozzle 20 from drying and prevent the liquid L from entering the inside of the slit nozzle 20.

[ embodiment 3 ]

Embodiment 3 will be explained. Fig. 12 (B) is a cross-sectional view showing an example of the nozzle tip management device 310 according to embodiment 3. Note that the same components as those in embodiment 1 are denoted by the same reference numerals, and description thereof will be omitted or simplified. The shape of the porous block 321 of the nozzle tip management device 310 is different from the nozzle tip management device 10 according to embodiment 1, and the other configurations are the same as those of the nozzle tip management device 10. Note that, in fig. 12 (B), the cover frame 123 is not shown. As shown in fig. 12 (B), the surface 221B of the porous block 321 included in the porous structure 312 of the nozzle tip management device 310 is formed in a plurality of planes, and the cross section thereof is formed in a pentagonal shape.

The porous structure 312 includes two porous blocks 321. The two porous blocks 321 are disposed on both sides of the recess 112 sandwiching the storage tank 11. The porous block 321 has a plurality of air holes 321A. Further, the surface 321B of the porous block 321 is separated from the front end 21 of the slit nozzle 20. As in embodiment 1, the nozzle tip management device 310 can also effectively prevent the tip 21 of the slit nozzle 20 from drying and prevent the liquid L from entering the inside of the slit nozzle 20. Further, since the front surface 213B is formed on a plurality of flat surfaces, compared to the nozzle tip management device 210 according to embodiment 2, it is possible to easily manufacture (mold) the porous block 312, and to arrange the inclined surface of the front surface 321B near the tip 21 of the slit nozzle 20.

[ 4 th embodiment ]

Embodiment 4 will be explained. Fig. 13 (a) is a cross-sectional view showing an example of a nozzle tip management device 410 according to embodiment 4. Note that the same components as those in embodiment 1 are denoted by the same reference numerals, and description thereof will be omitted or simplified. The porous blocks 421L1 and 421L2 of the nozzle tip management device 410 are different in shape from the nozzle tip management device 10 of embodiment 1, and the other configurations are the same as those of the nozzle tip management device 10. Note that, in fig. 13 (a), the slit nozzle 20 and the cover frame 123 are not described. As shown in fig. 13 (a), the nozzle tip management device 410 includes porous blocks 421L1 and 421L2 divided into an outer side and an inner side.

The outer porous block 421L1 and the inner porous block 421L2 were used as 1 group, and they were in surface contact with each other. In addition, the two may be partially adhered to each other. The porous structure 412 includes two sets of porous blocks 421L1 and 421L2. The two sets of porous blocks 421L1, 421L2 are disposed on both sides of the recess 112 sandwiching the retention tank 11. That is, the inner porous blocks 421L2 face each other across the concave portion 112. The porous blocks 421L1, 421L2 have a plurality of air holes 421A. Further, since the porous blocks 421L1, 421L2 are matched, the arc-shaped surface 421B is formed similarly to the nozzle tip management device 10 of embodiment 1, and the surface 421B is separated from the tip 21 of the slit nozzle 20. The liquid L is sucked up through the outer porous block 421L1 and the inner porous block 421L2, respectively, and evaporated from the surface 421B.

As in embodiment 1, the nozzle tip management device 410 can also effectively prevent the tip 21 of the slit nozzle 20 from drying and prevent the liquid L from entering the inside of the slit nozzle 20. Further, different air holes 421A can be formed in the outer porous block 421L1 and the inner porous block 421L2. That is, at least one of the porosity, pore diameter, and air permeability can be changed between the outside and the inside. For example, the porosity of the inner porous block 421L2 may be made larger than that of the outer porous block 421L1, so that a large amount of liquid L is sucked up by the inner porous block 421L2 closer to the tip 21 of the slit nozzle 20. In this case, the porosity of the outer porous block 421L1 may be reduced to improve the rigidity, and deformation of the inner porous block 421L2 may be prevented. In the present embodiment, the two porous blocks 421L1 and 421L2 are set as one set, but 3 or more porous blocks may be set as one set.

[ 5 th embodiment ]

Embodiment 5 will be described. Fig. 13 (B) is a cross-sectional view showing an example of the nozzle tip management device 510 according to embodiment 5. Note that the same components as those in embodiment 1 are denoted by the same reference numerals, and description thereof will be omitted or simplified. The porous blocks 521L1 and 521L2 of the nozzle tip management device 510 are different in shape from the nozzle tip management device 10 according to embodiment 1, and the other configurations are the same as those of the nozzle tip management device 10. Note that, in fig. 13 (B), the slit nozzle 20 and the cover frame 123 are not described. As shown in fig. 13 (B), the nozzle tip management device 510 includes porous blocks 521L1 and 521L2 divided into a lower side and an upper side.

The lower porous block 521L1 and the upper porous block 521L2 are used as 1 group, and they are in surface contact with each other. In addition, the two may be partially adhered to each other. The porous structure 512 includes two sets of porous blocks 521L1 and 521L2. The two sets of porous blocks 521L1 and 521L2 are disposed on both sides of the recess 112 sandwiching the storage tank 11. That is, the lower porous blocks 521L1 and the upper porous blocks 521L2 face each other with the concave portion 112 interposed therebetween. The porous blocks 521L1, 521L2 have a plurality of air holes 521A. Further, since the porous blocks 521L1, 521L2 are fitted, similarly to the nozzle tip management device 10 of embodiment 1, an arc-shaped surface 521B is formed, the surface 521B being separated from the tip 21 of the slit nozzle 20. The liquid L moves from the porous block 521L1 on the lower side to the porous block 521L2 on the upper side, and evaporates from the surface 521B.

As in embodiment 1, the nozzle tip management device 510 can also effectively prevent the tip 21 of the slit nozzle 20 from drying and prevent the liquid L from entering the inside of the slit nozzle 20. Further, different air holes 521A can be formed in the lower porous block 521L1 and the upper porous block 521L2. That is, at least one of the porosity, pore diameter, and air permeability can be changed between the lower side and the upper side. For example, the porosity of the upper porous block 521L2 can be made larger than that of the lower porous block 521L1, and the liquid L moving from the lower porous block 521L1 can be efficiently moved to the surface 521B. In this case, the porosity of the lower porous block 521L1 can be reduced to improve the rigidity, and deformation and the like of the upper porous block 521L2 can be prevented. In the present embodiment, the two porous blocks 521L1 and 521L2 are provided as a set, but 3 or more porous blocks may be provided as a set.

[ examples ] A method for producing a compound

The following examples are given by way of illustration, but the present invention is not limited to the examples given below.

[ porous block ]

Sample pieces (length: 30mm, width: 30mm, height: 5 mm) of samples 1 to 5, which were different in at least one of material quality, pore diameter, porosity and air permeability, were prepared and studied. Table 1 shows samples 1 to 5.

[ TABLE 1 ]

For the material, two kinds of alumina and silicon carbide were prepared, and samples 1 to 5 having different pore diameters, porosities, and air permeabilities were prepared. 5 types were prepared for alumina, and 1 type was prepared for silicon carbide. The processability and the permeability to p-menthane were evaluated for samples 1 to 5. In the evaluation of the workability, when the porous block of the above embodiment was worked into the shape, the case of easy molding was regarded as excellent, the case of formability was regarded as excellent, and the case of brittle and non-formability was regarded as x. For the evaluation of permeability, a paper piece (vertical: 10mm, horizontal: 10 mm) was placed on each sample, the lower part was immersed in p-menthane, and the time (seconds) from the start of immersion until the whole paper piece was wetted was measured. If the time is short, the permeability of p-menthane in the sample is evaluated to be high.

As in sample 1 of table 1, it was confirmed that workability could be ensured when the pore diameter was 5 to 40 μm and the porosity was 50%, but the air permeability was small and the permeability was low at 15 seconds in the evaluation of permeability. Further, as in sample 2 of table 1, it was confirmed that the workability was good when the pore diameter was 5 to 40 μm and the porosity was 60%, but the air permeability was small and the permeability was low in the evaluation of permeability as 15 seconds. Further, as in sample 4 of Table 1, it was confirmed that when the pore diameter is 300 μm to 1000 μm, the workability is deteriorated (the material becomes brittle) and the material cannot be molded into the shape of a porous block even if the porosity is about 40%. Further, as in sample 6 of table 1, it was confirmed that workability could be ensured when the pore diameter was 5 to 30 μm and the porosity was 40%, but the air permeability was small and the permeability was low at 15 seconds in the evaluation of permeability.

From Table 1, considering workability and permeability, the appropriate conditions for the porous block are as shown in samples 3 and 5, the pore diameter is preferably 50 to 200 μm, the porosity is preferably 35 to 40%, and the air permeability is preferably 100X 10 ^-13 m ² ～270×10 ^-13 m ² . In addition, in consideration of the material cost, alumina is preferable to silicon carbide. From the above, it was judged that the sample 3 is suitable as a porous block.

The porous block 121 of embodiment 1 is formed from a material having the same characteristics as those of sample 3, and a porous structure 12 including the porous block 121 is manufactured. The porous structure 12 is disposed in the storage tank 11. Then, p-menthane is supplied as a liquid L (predetermined liquid) to the storage tank 11. The lower portion of the porous block 121 is immersed in about 8mm of p-menthane. After 60 seconds, a paper piece (length: 50mm, width: 20 mm) was placed on the porous block 121, and the wet state of the paper piece (whether p-menthane reached the surface 121B of the porous block 121) was confirmed.

Since wetting of the sheet was confirmed, the slit nozzle 20 (slit opening 100 μm) was inserted into the storage tank 11. At this time, the front end 21 of the slit nozzle 20 is separated from the porous block 121, and the front end 21 of the slit nozzle 20 is sealed (covered). The slit nozzle 20 was filled with TZNR-A4030H (manufactured by TOK, viscosity 300 cp) as a coating liquid Q1. After 24 hours had elapsed, the slit nozzle 20 was taken out of the storage tank 11, and it was confirmed whether or not the coating liquid Q1 could be discharged from the slit nozzle 20 satisfactorily. In addition, the wet state of the bottom 110 of the storage tank 11 and the surface 121B of the porous block 121 was confirmed.

When the slit nozzle 20 was verified, it was confirmed that the tip 21 of the slit nozzle 20 was not dried and the opening 23 was not clogged. When the coating liquid Q1 was discharged from the slit nozzle 20, the coating liquid Q1 was observed to drip from the distal end 21. Therefore, it was confirmed that the coating liquid Q1 could be satisfactorily discharged from the slit nozzle 20 after preventing the drying of the slit nozzle 20 by sealing (covering) the tip 21 of the slit nozzle 20 in the storage tank 11 so as to be in non-contact with the porous block 121 having the lower portion immersed in p-menthane. It was confirmed that the bottom 110 of the storage tank 11 and the surface 121B of the porous block 121 were wet and the storage tank 11 was not dried.

The embodiments and examples have been described above, but the technical scope of the present invention is not limited to the scope described in the embodiments and examples. 1 or more elements described in the above embodiments may be omitted. Further, the elements described in the above embodiments can be combined as appropriate. Further, it is obvious to those skilled in the art that various changes or modifications may be made to the above-described embodiments. The embodiment to which such a change or improvement is applied is also included in the technical scope of the present invention.

In the above embodiment, the description has been given of the case where the plurality of air holes 121A and the like are provided in the same manner in one porous block 121 and the like, but the present invention is not limited to this case. A plurality of air holes 121A and the like may be provided in different manners in one porous block 121 and the like. For example, in one porous block 121 or the like, the diameter or porosity of the lower pores may be increased and the diameter or porosity of the upper pores may be decreased, or conversely, the diameter or porosity of the lower pores may be decreased and the diameter or porosity of the upper pores may be increased. In addition, in one porous block 121 or the like, the pore diameter or porosity may gradually change from the lower portion to the upper portion.

In the above embodiment, the porous block 121 and the like may be formed by stacking a plurality of porous sheets, for example. In this case, the porous sheets may be partially adhered to each other.

Description of the reference numerals

L liquid (specified liquid)

Q1 coating liquid

R Standby region

S substrate

V space

10. 210, 310, 410, 510 nozzle front end management device

11. Storage tank

110. Bottom part

111. Sealing part

112. Concave part

113. Discharge pipe

114. Overflow pipe

12. Porous structure

121. Porous blocks 221, 321, 421L1, 421L2, 521L1 and 521L2

121A, 221A, 321A, 421A, 521A air hole

121B, 221B, 321B, 421B, 521B surface

121C, 221C, 421C, 521C notch

13. Liquid level sensor

131. Liquid level management pipeline

14. Liquid supply device

15. Control unit

16. Support body

20. Slit nozzle

21. Front end

22. Abutting part

100. An application device.

Claims (13)

1. A nozzle tip management device is characterized by comprising:

a storage tank surrounding the tip of the slit nozzle and storing a predetermined liquid for preventing drying of the tip;

a porous block disposed in the retention tank,

the storage tank stores the predetermined liquid so that the inserted slit nozzle is not in contact with the predetermined liquid,

the porous block is disposed so that a lower portion thereof is immersed in the predetermined liquid and is separated from the slit nozzle inserted into the storage tank.

2. The nozzle tip management device according to claim 1,

the storage tank includes a sealing portion that abuts against and seals a part of the slit nozzle when the slit nozzle is inserted.

3. The nozzle tip management device according to claim 1 or 2,

the retention tank is provided with an overflow pipe for limiting the liquid level of the predetermined liquid to not exceed a predetermined height.

4. The nozzle tip management device according to claim 1 or 2,

the retention tank includes a recess extending in one direction at a portion of a bottom thereof for allowing the predetermined liquid to flow.

5. The nozzle tip management device according to claim 4,

the porous blocks are respectively arranged on both sides of the concave portion.

6. The nozzle tip management device according to claim 1 or 2,

the diameter of the pores of the porous block is 5-200 μm.

7. The nozzle tip management device according to claim 1 or 2,

the porous block has an air permeability of 0.5 × 10 ^-13 m ² ～300×10 ^-13 m ² 。

8. The nozzle front end management device of claim 1 or 2,

the porous block is formed of an inorganic ceramic.

9. The nozzle front end management device of claim 8,

the porous block is formed of an alumina-based or silicon carbide-based raw material.

10. The nozzle tip management device according to claim 1 or 2, comprising:

a liquid level sensor for measuring a height of a liquid level of the predetermined liquid in the retention tank; a liquid supply device for supplying the liquid to the retention tank,

the liquid supply device supplies the predetermined liquid to the retention tank based on an output of the liquid level sensor.

11. The nozzle tip management device according to claim 10,

the liquid supply device supplies the predetermined liquid to the retention tank at predetermined intervals and at predetermined amounts.

12. A coating device is characterized by comprising:

a slit nozzle that applies the coating liquid to the substrate;

the nozzle tip management device according to any one of claims 1 to 11.

13. A coating apparatus as in claim 12,

a standby area for the slit nozzle to stand by when the slit nozzle does not perform the coating operation,

the nozzle front end management device is arranged in the standby area.

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