US20080179035A1 - Flexible nozzle for injection molded solder - Google Patents

Flexible nozzle for injection molded solder Download PDF

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Publication number
US20080179035A1
US20080179035A1 US11/626,986 US62698607A US2008179035A1 US 20080179035 A1 US20080179035 A1 US 20080179035A1 US 62698607 A US62698607 A US 62698607A US 2008179035 A1 US2008179035 A1 US 2008179035A1
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US
United States
Prior art keywords
solder
mold
recesses
nozzle
mold surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/626,986
Inventor
Peter A. Gruber
John U. Knickerbocker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Priority to US11/626,986 priority Critical patent/US20080179035A1/en
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION reassignment INTERNATIONAL BUSINESS MACHINES CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GRUBER, PETER A., KNICKERBOCKER, JOHN U.
Publication of US20080179035A1 publication Critical patent/US20080179035A1/en
Priority to US12/542,016 priority patent/US20090301685A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B22D17/20—Accessories: Details
    • B22D17/2015—Means for forcing the molten metal into the die
    • B22D17/2023—Nozzles or shot sleeves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B22D17/20—Accessories: Details
    • B22D17/30—Accessories for supplying molten metal, e.g. in rations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D18/00—Pressure casting; Vacuum casting
    • B22D18/04—Low pressure casting, i.e. making use of pressures up to a few bars to fill the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component

Definitions

  • the present invention relates to the provision of a flexible nozzle for injection molded solder. Moreover, the invention is also directed to a method of utilizing a flexible nozzle for injection molded solder applications.
  • a flexible or compliant solder extending or dispensing nozzle enables molten solder to readily be discharged therefrom while traversing the surface of the mold, however, the flexible nozzle which dispenses the solder can change shape in order to be able to accommodate its location on the mold even if the latter is not square or rectangular in configuration. This facilitates the flexible nozzle to be utilized in connection with silicon, or alternatively round molds.
  • a compliant or flexible solder-dispensing nozzle structure which is particularly advantageously adapted to be utilized with circular or round molds.
  • the tip of the nozzle which provides for the discharge of the solder, provides a series of small holes or apertures for extruding the solder under pressure from at least one solder reservoir.
  • each respective aperture or a group of apertures may be connected to, respectively, a separate solder reservoir of a plurality of reservoirs subjected to pressure to facilitate the solder extrusion onto the mold surface.
  • the discharge apertures of the flexible nozzle may be connected to, respectively, separate supply reservoirs for the solder.
  • a still further object of the present invention is to provide for a method of utilizing the flexible nozzle structures to implement the injection molded soldering process.
  • FIG. 1 illustrate a first embodiment of a flexible nozzle structure utilizing a single solder reservoir connected to a plurality of discharge orifices for extruding solder under pressure
  • FIG. 2 illustrates a second embodiment of a flexible nozzle, which is similar to the embodiment of FIG. 1 , which, in this instance, has the discharge orifices thereof connected to, respectively, separate solder reservoirs of a plurality of reservoirs.
  • the reservoirs may be made of a series of vertical tubes which each may hold molten solder during the injection process whereas the relative position of the tubes to each other and to the mold can be altered through the housing or guide plates so as to have the nozzle conform to the shape of mold as the mold or nozzle are moved relative to one another.
  • the nozzle may take the form of a curved surface initially convex as it begins at one edge of the mold, conform to a linear shape during movement relative to the mold and end as a concave shape relative to the far side of the mold with fill completion.
  • a mold 10 including a surface 12 containing a plurality of cavities or recesses 14 adapted to be filled with a suitable solder 16 by means of an injection molded soldering (IMS) process.
  • the mold 10 is preferably, but not necessarily of a round or essentially circularly-configured shape in the peripheral dimensions.
  • Movable relative to the surface 12 of the mold 10 in close spacing or contact with the surface thereof containing the cavities or recesses 14 is a flexible or compliable nozzle structure 20 , which, in this embodiment has a housing 22 containing a single reservoir 24 adapted to be filled with solder 16 under pressure.
  • the tip end 26 of the housing 22 facing the mold surface 12 is provided with a plurality of apertures 28 communicating with the reservoir 24 for dispensing or extruding the solder under pressure into the cavities or recesses in the mold surface during relative displacement of the nozzle therewith.
  • FIG. 2 of the drawings wherein the components which are similar to or identical with those in the embodiments of FIG. 1 , are designated with the same reference numerals, in this instance, rather than the housing 22 for the flexible nozzle containing a single reservoir of solder under pressure, there are arranged therein a plurality of separate solder reservoirs 30 , each being respectively connected to at least one separate solder dispensing aperture 32 at the tip end of the flexible nozzle in contact with or facing the surface of the mold 10 , so as to be able to fill the cavities or recesses in the mold during relative motion with respect to the nozzle.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

A flexible nozzle for injection molded solder and a method of utilizing a flexible nozzle for injection molded solder applications. In order to be able to efficiently carry out the injection molded soldering process, there is utilized a compliant or flexible solder-dispensing nozzle structure, which is particularly advantageously adapted to be utilized with circular or round molds. In this connection, the tip of the nozzle, which provides for the discharge of the solder, provides a series of small holes or apertures for extruding the solder under pressure from at least one solder reservoir. In one embodiment, there may be employed a single solder reservoir with which there communicates a plurality of discharge apertures or holes for extruding the solder so as to fill suitable cavities or recesses formed in a facing surface of a mold for injection molded solder. Alternatively, rather than dispensing or extruding the solder from a single reservoir through a plurality of holes or discharge apertures, each respective aperture or a group of apertures may be connected to, respectively, a separate solder reservoir of a plurality of reservoirs subjected to pressure to facilitate the solder extrusion onto the mold surface.

Description

    BACKGROUND OF THE INVENTION Field of the Invention
  • The present invention relates to the provision of a flexible nozzle for injection molded solder. Moreover, the invention is also directed to a method of utilizing a flexible nozzle for injection molded solder applications.
  • In the utilization of round or essentially circularly-configured molds, which are employed for injection molded solder (IMS) applications, difficulties may be encountered due to some amounts of solder having a tendency to leak over the edges of the molds, in contrast with either square or rectangular molds in which those solder leaking problems are not as prevalent, or are only infrequent in nature.
  • In order to be able to efficiently employ round or essentially circular molds in injection molded solder processing, it has been ascertained that a flexible or compliant solder extending or dispensing nozzle enables molten solder to readily be discharged therefrom while traversing the surface of the mold, however, the flexible nozzle which dispenses the solder can change shape in order to be able to accommodate its location on the mold even if the latter is not square or rectangular in configuration. This facilitates the flexible nozzle to be utilized in connection with silicon, or alternatively round molds.
    • SUMMARY OF THE INVENTION
  • In order to be able to efficiently carry out the injection molded soldering process, pursuant to the invention there is utilized a compliant or flexible solder-dispensing nozzle structure, which is particularly advantageously adapted to be utilized with circular or round molds. In this connection, the tip of the nozzle, which provides for the discharge of the solder, provides a series of small holes or apertures for extruding the solder under pressure from at least one solder reservoir. In one embodiment, there may be employed a single solder reservoir with which there communicates a plurality of discharge apertures or holes for extruding the solder so as to fill suitable cavities or recesses formed in a facing surface of a mold for injection molded solder. Alternatively, rather than dispensing or extruding the solder from a single reservoir through a plurality of holes or discharge apertures, each respective aperture or a group of apertures may be connected to, respectively, a separate solder reservoir of a plurality of reservoirs subjected to pressure to facilitate the solder extrusion onto the mold surface.
  • Accordingly, it is an object of the present invention to provide a novel flexible nozzle structure for dispensing solder under pressure from a single solder reservoir in order to fill cavities or recesses formed in a mold.
  • Pursuant to a further object of the invention, rather than providing a single reservoir, the discharge apertures of the flexible nozzle may be connected to, respectively, separate supply reservoirs for the solder.
  • A still further object of the present invention is to provide for a method of utilizing the flexible nozzle structures to implement the injection molded soldering process.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Reference may now be made to the following detailed description of preferred embodiments of the invention, taken in conjunction with the accompanying drawings; in which:
  • FIG. 1 illustrate a first embodiment of a flexible nozzle structure utilizing a single solder reservoir connected to a plurality of discharge orifices for extruding solder under pressure; and
  • FIG. 2 illustrates a second embodiment of a flexible nozzle, which is similar to the embodiment of FIG. 1, which, in this instance, has the discharge orifices thereof connected to, respectively, separate solder reservoirs of a plurality of reservoirs. In one example, the reservoirs may be made of a series of vertical tubes which each may hold molten solder during the injection process whereas the relative position of the tubes to each other and to the mold can be altered through the housing or guide plates so as to have the nozzle conform to the shape of mold as the mold or nozzle are moved relative to one another. In this example, the nozzle may take the form of a curved surface initially convex as it begins at one edge of the mold, conform to a linear shape during movement relative to the mold and end as a concave shape relative to the far side of the mold with fill completion.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • Referring specifically to the drawings, and in particular to FIG. 1, there is illustrated a mold 10 including a surface 12 containing a plurality of cavities or recesses 14 adapted to be filled with a suitable solder 16 by means of an injection molded soldering (IMS) process. The mold 10 is preferably, but not necessarily of a round or essentially circularly-configured shape in the peripheral dimensions. Movable relative to the surface 12 of the mold 10 in close spacing or contact with the surface thereof containing the cavities or recesses 14 is a flexible or compliable nozzle structure 20, which, in this embodiment has a housing 22 containing a single reservoir 24 adapted to be filled with solder 16 under pressure. The tip end 26 of the housing 22 facing the mold surface 12 is provided with a plurality of apertures 28 communicating with the reservoir 24 for dispensing or extruding the solder under pressure into the cavities or recesses in the mold surface during relative displacement of the nozzle therewith.
  • In the embodiment of FIG. 2 of the drawings, wherein the components which are similar to or identical with those in the embodiments of FIG. 1, are designated with the same reference numerals, in this instance, rather than the housing 22 for the flexible nozzle containing a single reservoir of solder under pressure, there are arranged therein a plurality of separate solder reservoirs 30, each being respectively connected to at least one separate solder dispensing aperture 32 at the tip end of the flexible nozzle in contact with or facing the surface of the mold 10, so as to be able to fill the cavities or recesses in the mold during relative motion with respect to the nozzle.
  • From the foregoing, it becomes readily apparent to one of skill in the technology that through the use of a flexible or compliant nozzle, which is adapted to move relative to the surface of a mold containing cavities or recesses which are adapted to be filled with the solder which is extruded from apertures of the flexible nozzle, this facilitates the filling of the cavities, in round or essentially circular molds, without encountering the difficulties or problems of solder spilling or leaking about the peripheral edges of the mold.
  • While the present invention has been particularly shown and described with respect to preferred embodiments thereof, it will be understood by those skilled in the art that the foregoing and other changes in forms and details may be made without departing from the spirit and scope of the present invention. It is therefore intended that the present invention not be limited to the exact forms and details described and illustrated, but to fall within the spirit and scope of the appended claims.

Claims (10)

1. An arrangement for injection molded solder applications, wherein said arrangement comprises:
a mold having a surface possessing a plurality of recesses; and
a flexible nozzle for extruding solder under pressure into said plurality of recesses during relative movement between said mold and the flexible nozzle upon displacement of the nozzle along the surface of said mold.
2. An arrangement as claimed in claim 1, wherein said flexible nozzle includes a housing having a single reservoir containing said solder; and a plurality of solder discharge apertures in said housing facing said mold surface and communicating with said single reservoir for extruding said solder into said recesses in the mold surface during said relative movement between the components.
3. An arrangement as claimed in claim 1, wherein said flexible nozzle includes a housing having a plurality of separate reservoirs, each containing a quantity of said solder; and a plurality of solder discharge apertures in said housing facing said mold surface of which at least one said aperture communicates with, respectively, one of said reservoirs for extruding the quantities of solder contained therein into said recesses in the mold surface during said relative movement between the components.
4. An arrangement as claimed in claim 1, wherein said mold is of an essentially round or circular configuration, and said mold surface possessing said recesses being substantially planar.
5. A method of implementing injection molded solder applications, wherein said method comprises:
providing a mold having a surface possessing a plurality of recesses; and
having a flexible nozzle for extruding solder under pressure into said plurality of recesses during relative movement between said mold and the flexible nozzle upon displacement of the nozzle, as said nozzle is displaced along the surface of said mold.
6. A method as claimed in claim 5, wherein said flexible nozzle includes a housing having a single reservoir containing said solder; and a plurality of solder discharge apertures in said housing facing said mold surface communicate with said single reservoir for extruding said solder into said recesses in the mold surface during said relative movement between said components.
7. A method as claimed in claim 5, wherein said flexible nozzle includes a housing having a plurality of separate reservoirs, each containing a quantity of said solder; and a plurality of solder discharge apertures in said housing facing said mold surface of which at least one said aperture communicates with, respectively, one of said reservoirs for extruding the quantities of solder contained therein into said recesses in the mold surface during said relative movement between the components.
8. A method as claimed in claim 5, wherein said mold is of an essentially round or circular configuration, and said mold surface possessing said recesses being substantially planar.
9. A method as claimed in claim 5, wherein said mold is of an essentially round, circular, square or rectangular configuration and said mold surface is non-planar and said flexible nozzle can conform the non-planar mold surface such as a curved mold surface or stepped mold surface.
10. A nozzle wherein the design, materials and structure may be comprised using
a high temperature polymer or rubber, a metal coating on a polymer or rubber, a combination of metal, polymer, and/or inorganic material including:
one or more reservoirs for solder;
one or more dispensing apertures; and
a housing, guide plate or external force to cause the flexible nozzle to alter its shape relative to its position with respect to the mold.
US11/626,986 2007-01-25 2007-01-25 Flexible nozzle for injection molded solder Abandoned US20080179035A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US11/626,986 US20080179035A1 (en) 2007-01-25 2007-01-25 Flexible nozzle for injection molded solder
US12/542,016 US20090301685A1 (en) 2007-01-25 2009-08-17 Flexible nozzle for injection molded solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/626,986 US20080179035A1 (en) 2007-01-25 2007-01-25 Flexible nozzle for injection molded solder

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080173697A1 (en) * 2007-01-23 2008-07-24 Suss Microtec Test Systems Gmbh Method and apparatus for the correction of defective solder bump arrays
US20080245847A1 (en) * 2007-04-05 2008-10-09 International Business Machines Corporation Compliant Mold Fill Head with Integrated Cavity Venting and Solder Cooling
US20120186771A1 (en) * 2008-01-16 2012-07-26 SUSS Micro Tec Removing material from defective opening in glass mold and related glass mold for injection molded solder
WO2022032062A1 (en) * 2020-08-06 2022-02-10 Carlex Glass America, Llc Method of attaching a connector to a glazing
US11420282B2 (en) * 2017-02-01 2022-08-23 Hitachi, Ltd. Soldering device
US11766729B2 (en) 2017-09-28 2023-09-26 International Business Machines Corporation Molten solder injection head with vacuum filter and differential gauge system

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* Cited by examiner, † Cited by third party
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US8162203B1 (en) * 2011-02-18 2012-04-24 International Business Machines Corporation Spherical solder reflow method
US8740040B2 (en) * 2012-07-31 2014-06-03 Samsung Electro-Mechanics Co., Ltd. Solder injection head

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US5244143A (en) * 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
US5698242A (en) * 1995-12-20 1997-12-16 General Instrument Corporation Of Delaware Apparatus for the injection molding of semiconductor elements
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US6231333B1 (en) * 1995-08-24 2001-05-15 International Business Machines Corporation Apparatus and method for vacuum injection molding
US5698242A (en) * 1995-12-20 1997-12-16 General Instrument Corporation Of Delaware Apparatus for the injection molding of semiconductor elements
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8011563B2 (en) * 2006-04-05 2011-09-06 International Business Machines Corporation Compliant mold fill head with integrated cavity venting and solder cooling
US20080173697A1 (en) * 2007-01-23 2008-07-24 Suss Microtec Test Systems Gmbh Method and apparatus for the correction of defective solder bump arrays
US8044320B2 (en) * 2007-01-23 2011-10-25 Enrico Herz Method and apparatus for the correction of defective solder bump arrays
US20080245847A1 (en) * 2007-04-05 2008-10-09 International Business Machines Corporation Compliant Mold Fill Head with Integrated Cavity Venting and Solder Cooling
US20120186771A1 (en) * 2008-01-16 2012-07-26 SUSS Micro Tec Removing material from defective opening in glass mold and related glass mold for injection molded solder
US20120241116A1 (en) * 2008-01-16 2012-09-27 Suss Microtec Removing material from defective opening in glass mold
US8800952B2 (en) * 2008-01-16 2014-08-12 International Business Machines Corporation Removing material from defective opening in glass mold and related glass mold for injection molded solder
US9254533B2 (en) * 2008-01-16 2016-02-09 GlobalFoundries, Inc. Removing material from defective opening in glass mold
US11420282B2 (en) * 2017-02-01 2022-08-23 Hitachi, Ltd. Soldering device
US11766729B2 (en) 2017-09-28 2023-09-26 International Business Machines Corporation Molten solder injection head with vacuum filter and differential gauge system
WO2022032062A1 (en) * 2020-08-06 2022-02-10 Carlex Glass America, Llc Method of attaching a connector to a glazing

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Date Code Title Description
AS Assignment

Owner name: INTERNATIONAL BUSINESS MACHINES CORPORATION, NEW Y

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GRUBER, PETER A.;KNICKERBOCKER, JOHN U.;REEL/FRAME:018803/0870

Effective date: 20070105

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION