CN115485820A - 带电极的固化树脂片的制造方法、带电极的固化树脂片及热固性树脂片 - Google Patents

带电极的固化树脂片的制造方法、带电极的固化树脂片及热固性树脂片 Download PDF

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Publication number
CN115485820A
CN115485820A CN202280004005.4A CN202280004005A CN115485820A CN 115485820 A CN115485820 A CN 115485820A CN 202280004005 A CN202280004005 A CN 202280004005A CN 115485820 A CN115485820 A CN 115485820A
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CN
China
Prior art keywords
resin sheet
thermosetting resin
cured resin
electrode
electrodes
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Pending
Application number
CN202280004005.4A
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English (en)
Chinese (zh)
Inventor
清水祐作
土生刚志
滨名大树
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Nitto Denko Corp
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Nitto Denko Corp
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Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN115485820A publication Critical patent/CN115485820A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/275—Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
    • H01L2224/27515—Curing and solidification, e.g. of a photosensitive layer material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/276—Manufacturing methods by patterning a pre-deposited material
    • H01L2224/27602—Mechanical treatment, e.g. polishing, grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN202280004005.4A 2021-03-11 2022-02-25 带电极的固化树脂片的制造方法、带电极的固化树脂片及热固性树脂片 Pending CN115485820A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021039162 2021-03-11
JP2021-039162 2021-03-11
PCT/JP2022/007845 WO2022190898A1 (ja) 2021-03-11 2022-02-25 電極付き硬化樹脂シートの製造方法、電極付き硬化樹脂シート、および熱硬化性樹脂シート

Publications (1)

Publication Number Publication Date
CN115485820A true CN115485820A (zh) 2022-12-16

Family

ID=83226778

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280004005.4A Pending CN115485820A (zh) 2021-03-11 2022-02-25 带电极的固化树脂片的制造方法、带电极的固化树脂片及热固性树脂片

Country Status (5)

Country Link
JP (1) JPWO2022190898A1 (ja)
KR (1) KR20230155344A (ja)
CN (1) CN115485820A (ja)
TW (1) TW202242009A (ja)
WO (1) WO2022190898A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3312723B2 (ja) * 1996-10-09 2002-08-12 松下電器産業株式会社 熱伝導シート状物とその製造方法及びそれを用いた熱伝導基板とその製造方法
KR20010064907A (ko) 1999-12-20 2001-07-11 마이클 디. 오브라이언 와이어본딩 방법 및 이를 이용한 반도체패키지
JP2004172597A (ja) * 2002-10-30 2004-06-17 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2006012949A (ja) * 2004-06-23 2006-01-12 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP6320239B2 (ja) * 2013-09-24 2018-05-09 日東電工株式会社 半導体チップ封止用熱硬化性樹脂シート及び半導体パッケージの製造方法
JP2016136567A (ja) * 2015-01-23 2016-07-28 日東電工株式会社 封止用シート
JP2016171315A (ja) * 2015-03-09 2016-09-23 日東電工株式会社 貼着シート、貼着光半導体素子の製造方法および光半導体装置の製造方法

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KR20230155344A (ko) 2023-11-10
WO2022190898A1 (ja) 2022-09-15
TW202242009A (zh) 2022-11-01
JPWO2022190898A1 (ja) 2022-09-15

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