CN115483083A - 等离子体处理装置 - Google Patents
等离子体处理装置 Download PDFInfo
- Publication number
- CN115483083A CN115483083A CN202210600062.0A CN202210600062A CN115483083A CN 115483083 A CN115483083 A CN 115483083A CN 202210600062 A CN202210600062 A CN 202210600062A CN 115483083 A CN115483083 A CN 115483083A
- Authority
- CN
- China
- Prior art keywords
- bias
- power supply
- plasma processing
- electrode
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 212
- 230000001360 synchronised effect Effects 0.000 claims abstract description 11
- 238000010586 diagram Methods 0.000 description 28
- 239000013256 coordination polymer Substances 0.000 description 9
- 239000004020 conductor Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000000903 blocking effect Effects 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 238000003672 processing method Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000013626 chemical specie Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910000856 hastalloy Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32146—Amplitude modulation, includes pulsing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
- H01J37/32183—Matching circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32541—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-091015 | 2021-05-31 | ||
| JP2021091015 | 2021-05-31 | ||
| JP2022-086242 | 2022-05-26 | ||
| JP2022086242A JP7638930B2 (ja) | 2021-05-31 | 2022-05-26 | プラズマ処理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115483083A true CN115483083A (zh) | 2022-12-16 |
Family
ID=84193329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210600062.0A Pending CN115483083A (zh) | 2021-05-31 | 2022-05-30 | 等离子体处理装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US12300465B2 (https=) |
| JP (2) | JP7638930B2 (https=) |
| KR (1) | KR20220162086A (https=) |
| CN (1) | CN115483083A (https=) |
| TW (1) | TW202306441A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121368945A (zh) * | 2024-05-13 | 2026-01-20 | 东京毅力科创株式会社 | 等离子体处理装置和基片支承器 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7344821B2 (ja) * | 2020-03-17 | 2023-09-14 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP7450427B2 (ja) | 2020-03-25 | 2024-03-15 | 東京エレクトロン株式会社 | 基板支持器及びプラズマ処理装置 |
| JP7462803B2 (ja) * | 2021-01-29 | 2024-04-05 | 東京エレクトロン株式会社 | プラズマ処理装置及びソース高周波電力のソース周波数を制御する方法 |
| JP7719860B2 (ja) * | 2021-04-23 | 2025-08-06 | 東京エレクトロン株式会社 | プラズマ処理装置及び基板処理方法 |
| JP7761537B2 (ja) * | 2022-07-20 | 2025-10-28 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| JP2025526304A (ja) | 2022-08-11 | 2025-08-13 | エルジー エナジー ソリューション リミテッド | コネクタモジュール |
| JP2024094874A (ja) * | 2022-12-28 | 2024-07-10 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| CN120642034A (zh) * | 2023-02-14 | 2025-09-12 | 东京毅力科创株式会社 | 等离子体处理装置 |
| KR20240161340A (ko) * | 2023-05-04 | 2024-11-12 | 삼성전자주식회사 | 포커스 링 및 이를 포함하는 기판 처리 장치 |
| JPWO2024252740A1 (https=) * | 2023-06-05 | 2024-12-12 | ||
| WO2025197664A1 (ja) * | 2024-03-22 | 2025-09-25 | 東京エレクトロン株式会社 | プラズマ処理装置、および静電チャック |
| WO2025238994A1 (ja) * | 2024-05-13 | 2025-11-20 | 東京エレクトロン株式会社 | プラズマ処理装置及び基板支持器 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7829469B2 (en) * | 2006-12-11 | 2010-11-09 | Tokyo Electron Limited | Method and system for uniformity control in ballistic electron beam enhanced plasma processing system |
| JP4833890B2 (ja) | 2007-03-12 | 2011-12-07 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ分布補正方法 |
| JP5294669B2 (ja) * | 2008-03-25 | 2013-09-18 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP5657262B2 (ja) * | 2009-03-27 | 2015-01-21 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP5496568B2 (ja) * | 2009-08-04 | 2014-05-21 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| WO2019065710A1 (ja) * | 2017-09-29 | 2019-04-04 | 住友大阪セメント株式会社 | 静電チャック装置 |
| JP7101546B2 (ja) * | 2018-06-26 | 2022-07-15 | 株式会社日立ハイテク | プラズマ処理装置およびプラズマ処理方法 |
| JP7228989B2 (ja) * | 2018-11-05 | 2023-02-27 | 東京エレクトロン株式会社 | 載置台、エッジリングの位置決め方法及び基板処理装置 |
| JP7349329B2 (ja) * | 2018-12-10 | 2023-09-22 | 東京エレクトロン株式会社 | プラズマ処理装置及びエッチング方法 |
| JP7278896B2 (ja) * | 2019-07-16 | 2023-05-22 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
| JP7361002B2 (ja) * | 2019-10-02 | 2023-10-13 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP7325294B2 (ja) * | 2019-10-17 | 2023-08-14 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
-
2022
- 2022-05-26 JP JP2022086242A patent/JP7638930B2/ja active Active
- 2022-05-30 CN CN202210600062.0A patent/CN115483083A/zh active Pending
- 2022-05-31 TW TW111120148A patent/TW202306441A/zh unknown
- 2022-05-31 KR KR1020220066436A patent/KR20220162086A/ko active Pending
- 2022-05-31 US US17/828,103 patent/US12300465B2/en active Active
-
2025
- 2025-02-19 JP JP2025025160A patent/JP2025075070A/ja active Pending
- 2025-04-18 US US19/182,668 patent/US20250246408A1/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121368945A (zh) * | 2024-05-13 | 2026-01-20 | 东京毅力科创株式会社 | 等离子体处理装置和基片支承器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2022184788A (ja) | 2022-12-13 |
| JP7638930B2 (ja) | 2025-03-04 |
| US12300465B2 (en) | 2025-05-13 |
| US20250246408A1 (en) | 2025-07-31 |
| TW202306441A (zh) | 2023-02-01 |
| JP2025075070A (ja) | 2025-05-14 |
| KR20220162086A (ko) | 2022-12-07 |
| US20220384150A1 (en) | 2022-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |