CN115466864A - Beryllium copper reed, and preparation method and application thereof - Google Patents
Beryllium copper reed, and preparation method and application thereof Download PDFInfo
- Publication number
- CN115466864A CN115466864A CN202211420130.1A CN202211420130A CN115466864A CN 115466864 A CN115466864 A CN 115466864A CN 202211420130 A CN202211420130 A CN 202211420130A CN 115466864 A CN115466864 A CN 115466864A
- Authority
- CN
- China
- Prior art keywords
- beryllium copper
- beryllium
- reed
- copper reed
- shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The application relates to the technical field of shielding material preparation, and particularly discloses a beryllium copper reed and a preparation method and application thereof. The beryllium copper reed comprises beryllium copper alloy and a nickel plating layer plated on the beryllium copper alloy; the beryllium-copper alloy is C12700; the thickness of the nickel plating layer is 1-7 μm. The attenuation of the beryllium copper reed is more than 89dB under 100MHz, the beryllium copper reed is rust-free in a 96h salt spray resistance test, and the compression permanent deformation rate is less than 1.82% after pressing repeatedly for 36000 times. The preparation method of the beryllium copper reed comprises electrolytic oil removal, water washing, sulfuric acid activation, water washing and nickel electroplating, and has the advantages of simple process, easiness in operation, capability of realizing batch production and the like. The beryllium copper reed obtained by the method can be used for shielding chambers/doors/cabinet doors/cover plates/integrated circuits and the like, and can improve the shielding effectiveness and the service life of the shielding chambers and the like.
Description
Technical Field
The application relates to the technical field of shielding material preparation, in particular to a beryllium copper reed, and a preparation method and application thereof.
Background
With the development of science and technology, higher requirements are put forward on military or civil shelter, mobile shielding cars and the like, particularly on the aspect of electromagnetic shielding. When the shelter has higher electromagnetic interference shielding and electromagnetic pulse shielding performance, normal operation of equipment in the shelter can be ensured.
In the electromagnetic shielding shelter, the shielding door is the only channel for entering and exiting the shelter and is also the largest opening in the shelter, the shielding door needs to be opened and closed continuously, and after the shielding door is used for a period of time, a gap is easy to form between the shielding door and a door frame. Therefore, the gap between the shielding door and the door frame serves as a path for leakage of electromagnetic waves, resulting in a great reduction in the shielding effectiveness of the electromagnetic shielding shelter.
The shielding door is usually made of a wire mesh strip with a rubber core or a beryllium copper reed. The wire mesh strip with the rubber core is used for filling gaps at the movable lap joint of the shelter shielding door by utilizing the conductive performance of a metal wire mesh and the excellent compressibility of rubber, so that the conductive continuity between the shielding door and a door frame is realized. However, the screen strips with rubber cores have low shielding effectiveness and are gradually eliminated from the market. Although the beryllium copper reed has high shielding effectiveness, the beryllium copper reed has poor salt spray resistance and rebound resilience, and the service life of the beryllium copper reed is short when the shielding door is used under the condition of high-frequency opening and closing and in a severe environment, so that the performance of the beryllium copper reed needs to be further improved to meet the use requirement of a higher condition.
Disclosure of Invention
In order to enable the beryllium copper reed to have higher shielding effectiveness, salt spray resistance and resilience, the application provides the beryllium copper reed and a preparation method and application thereof.
In a first aspect, the present application provides a beryllium copper reed comprising a beryllium copper alloy and a nickel plating layer plated on the beryllium copper alloy;
the beryllium-copper alloy is C12700;
the thickness of the nickel plating layer is 1-7 μm.
In the application, the beryllium-copper alloy is named C12700 and comprises 1.8-2.0% by weight of beryllium, 0.1-0.3% by weight of cobalt, 0.1-0.3% by weight of nickel and 0-0.4% by weight of iron, wherein the total amount of the cobalt, the nickel and the iron is less than or equal to 0.6%, and the balance of copper. The beryllium copper reed has higher shielding efficiency, salt mist resistance and rebound resilience by plating the nickel plating layer with the thickness of 1-7 mu m on the beryllium copper alloy.
After the obtained beryllium-copper reed is compressed 36000 times, the permanent deformation rate is less than or equal to 1.82 percent; under 100MHz, the attenuation of electromagnetic wave is more than or equal to 89dB; in 50g/L sodium chloride solution, no rust is generated after 96 h.
In one embodiment, the nickel plating layer has a thickness of 2 to 6 μm.
Preferably, the thickness of the nickel plating layer is 3-4 μm.
More preferably, the thickness of the nickel plating layer is 4 μm.
In the application, the thickness of the nickel plating layer is 1-7 μm, and the shielding effectiveness and the salt spray resistance of the beryllium copper reed are gradually improved along with the gradual increase of the thickness of the nickel plating layer. However, the nickel plating layer has an excessively large thickness, and the binding force between the nickel plating layer and the beryllium copper alloy is affected, and when the thickness of the nickel plating layer is more than 7 μm, the possibility of the nickel plating layer falling off is gradually increased. When the nickel plating layer falls off, the protection of the beryllium copper alloy is directly lost, so that the shielding efficiency, the salt spray resistance and other properties of the beryllium copper reed are reduced, and the service life of the beryllium copper reed is shortened. When the thickness of the nickel plating layer is less than 1 μm, the beryllium copper reed has poor shielding effectiveness and other performances, and cannot be effectively protected, so that the service life of the beryllium copper reed is also shortened.
When the thickness of the nickel plating layer is in the range of 2-6 mu m, the shielding effectiveness of the beryllium copper reed is gradually improved along with the gradual increase of the thickness of the nickel plating layer, and the rebound resilience is basically kept unchanged. The attenuation of the electromagnetic wave of the beryllium copper reed is over 107dB, the permanent deformation rate is 0.90-0.91%, and no corrosion is generated in a 96-hour salt spray resistance test.
In the present application, beryllium copper alloys are commercially available or can be obtained by self-manufacturing. For example, beryllium copper alloys are available from Shanghai Hongtong industries, inc., having a hardness of 36-46HRC, an electrical conductivity of 23% IACS, a thermal conductivity of 160W (m.k) 20, and an elongation of 1%.
The beryllium-copper alloy can also be prepared according to the following preparation method, and the preparation method comprises the following steps;
(1) Smelting, namely preparing alloy raw materials according to the chemical element composition, and melting at 920-970 ℃ to obtain beryllium copper castings;
(2) Performing heat treatment, namely performing solid solution treatment and aging treatment on the beryllium copper casting to obtain a beryllium copper blank;
the temperature of the solution treatment is 850-880 ℃; the temperature of the aging treatment is 350-400 ℃;
(3) Forging, namely forging the beryllium copper blank to obtain a beryllium copper forging, wherein the deformation amount of the beryllium copper blank is 20-50%;
in the method, firstly, alloy raw materials are smelted, and vacuum induction smelting is adopted to prepare beryllium copper castings; then, carrying out heat treatment on the beryllium copper casting to change the internal structure and the grain structure of the beryllium copper casting, and preparing for forging operation to obtain a beryllium copper blank; and secondly, forging the beryllium copper blank, further refining the internal structure of the beryllium copper blank, and obtaining the beryllium copper alloy.
The preparation method provided by the application is utilized to prepare the beryllium-copper alloy, and then the beryllium-copper alloy is plated with the nickel coating, so that the beryllium-copper alloy has high shielding efficiency, salt mist resistance and rebound resilience.
In the present application, the temperature of the solution treatment is 850 to 880 ℃.
Preferably, the temperature of the solution treatment is 870-880 ℃, and the time is 2-4h.
More preferably, the temperature of the solution treatment is 870 ℃ and the time is 2-4h.
The temperature of the solution treatment in the present application may be 850 ℃, 860 ℃, 870 ℃, 875 ℃ or 880 ℃. When the temperature of the solution treatment is 850-880 ℃, the attenuation of the obtained beryllium copper reed is more than 102dB and the permanent deformation rate is less than 1.24 percent under 100MHz, and the beryllium copper reed has no corrosion in a 96h salt spray resistance test.
In this application, the temperature of the ageing treatment is 350 to 400 ℃.
Preferably, the temperature of the aging treatment is 350-370 ℃, and the time is 0.5-1.5h.
More preferably, the temperature of the aging treatment is 370 ℃ and the time is 0.5-1.5h.
The temperature of the aging treatment in this application may be 350 ℃, 360 ℃, 365 ℃, 370 ℃, 380 ℃, 390 ℃ or 400 ℃. When the temperature of the aging treatment is in the range of 350-400 ℃, the attenuation of the obtained beryllium copper reed is more than 102dB and the permanent deformation rate is less than 1.22 percent under 100MHz, and the beryllium copper reed is free from corrosion in a salt spray resistance test for 96 h.
In the application, the beryllium copper casting is forged after being subjected to solid solution treatment and aging treatment, so that the shielding effectiveness, the salt spray resistance and the resilience of the beryllium copper reed are further improved.
In one embodiment, the beryllium copper blank has a deformation amount of 20-50%.
Preferably, the deformation amount of the beryllium copper blank is 20-35%.
More preferably, the amount of deformation of the beryllium copper blank is 35%.
And heating the beryllium copper blank obtained after the heat treatment at the heating temperature of 830-860 ℃, then placing the beryllium copper blank on a quick forging machine for forging, controlling the deformation amount of the beryllium copper blank within the range of 20-50%, controlling the attenuation amount of electromagnetic waves to be more than 100dB and the permanent deformation rate to be less than 1.29% under 100MHz, and having no corrosion in a 96-hour salt spray resistance test.
In a second aspect, the present application provides a method for preparing a beryllium copper reed, comprising electrolytic degreasing, washing, sulfuric acid activation, washing and nickel electroplating;
wherein the time of the nickel electroplating step is 2-6min.
The method utilizes electroplating to form a nickel coating on the beryllium-copper alloy, and the electroplating mainly comprises the steps of electrolytic degreasing, washing, sulfuric acid activation, washing, nickel electroplating and the like. Generally, the thickness of the nickel coating is measured using a test apparatus, which is available from Micro-Pioneer XRF-2000L.
In the step of electroplating nickel, the electroplating solution includes NiSO 4 ·6H 2 O，NiCl 2 ·6H 2 O and H 3 BO 3 Wherein said NiSO 4 ·6H 2 The concentration of O is 180-220g/L, and the NiCl 2 ·6H 2 The concentration of O is 30-50 g/L, and the concentration of H is 3 BO 3 The concentration of (A) is 30-50 g/L.
Preferably, the NiSO 4 ·6H 2 The concentration of O is 200g/L, and the NiCl 2 ·6H 2 The concentration of O is 40g/L, and H 3 BO 3 Has a concentration of 40 g/L.
In one embodiment, the voltage in the step of electroplating nickel is 2-4V.
Preferably, the voltage in the step of electroplating nickel is 2V.
In order to prepare beryllium copper reeds with different shapes and sizes, the beryllium copper alloy needs to be punched before electroplating treatment, so as to prepare the beryllium copper reeds with different specifications. The beryllium copper reed with different specifications prepared by stamping is well known in the art and can be prepared according to actual requirements.
In a third aspect, the present application provides a beryllium copper reed for use in shielding cages/hatches/cabinet doors/lids/integrated circuits.
The beryllium copper reed obtained by the method has high performance, and the permanent deformation rate is below 1.24% after being compressed for 36000 times; under 100MHz, the attenuation of electromagnetic wave is above 102 dB; the salt spray resistance is 96h, and the rust is avoided. The beryllium copper reed is used for shielding the chamber/door/cabinet door/cover plate/integrated circuit, so that the shielding effectiveness and durability of the shielding chamber/door/cabinet door/cover plate/integrated circuit can be improved.
The beryllium copper reed obtained by the method is used for a shielding door in an electromagnetic shielding shelter, and the obtained beryllium copper reed has higher shielding efficiency, salt spray resistance and rebound resilience. When the beryllium copper reed is used in a high-frequency opening and closing state of the shielding door, the electrical continuity between the shielding door and the door frame of the electromagnetic shielding shelter can be ensured, and the shielding performance of the electromagnetic shielding shelter is improved. In addition, the beryllium copper reed has high salt spray resistance and can be used in severe environment.
In summary, the present application has the following beneficial effects:
1. the beryllium copper reed comprises a beryllium copper alloy and a nickel coating with the thickness of 1-7 mu m plated on the beryllium copper alloy, and the permanent deformation rate of the obtained beryllium copper reed is less than or equal to 1.82 percent after being compressed for 36000 times; under 100MHz, the attenuation of electromagnetic wave is more than or equal to 89dB; in 50g/L sodium chloride solution, no rust is generated after 96 hours;
2. the thickness of the nickel plating layer is preferably 1-7 mu m, and the permanent deformation rate of the obtained beryllium copper reed is in the range of 0.88-0.92%; the attenuation of the electromagnetic wave is more than or equal to 91dB; the salt spray resistance is 96 hours, and the rust is avoided;
3. the beryllium copper reed is prepared by utilizing the self-made beryllium copper alloy, wherein the beryllium copper alloy is subjected to operations such as smelting, heat treatment, forging and the like, the attenuation of electromagnetic waves of the beryllium copper reed is over 91dB under 100MHz, the beryllium copper reed is free from corrosion in a 96-hour salt spray resistance test, and the compression permanent deformation rate is below 1.60 percent after being pressed down repeatedly for 36000 times.
Drawings
FIG. 1 is a schematic structural diagram of a semi-finished beryllium copper reed;
FIG. 2 is a top view of a semi-finished beryllium copper reed;
FIG. 3 is a front view of a semi-finished beryllium copper reed;
in the figure, 1, a clamping part; 2. a deformation section; 21. an arc-shaped section; 22. a clamping section.
Detailed Description
The present application will be described in further detail with reference to examples and comparative examples.
Preparing beryllium-copper alloy:
(1) Smelting, namely smelting, wherein the chemical element composition comprises 1.8% of beryllium, 0.1% of cobalt, 0.1% of nickel, 0.4% of iron and the balance of copper (the total amount of elements is 100%); preparing alloy raw materials, and melting at 950 ℃ to prepare beryllium copper castings;
(2) Performing heat treatment, namely performing solid solution treatment and aging treatment on the beryllium-copper casting to obtain a beryllium-copper blank; the time of the solution treatment is 3 hours, and the time of the aging treatment is 1 hour;
(3) And forging, namely heating the beryllium copper blank at 850 ℃ on a rapid forging machine to obtain the beryllium copper alloy.
Preparation examples 1 to 13
The process parameters of preparation examples 1 to 13 are shown in Table 1.
TABLE 1 parameters for preparation examples 1 to 13
Examples
Example 1
Stamping the beryllium copper alloy prepared in the preparation example 1, and adjusting the shape of the beryllium copper alloy to prepare a semi-finished beryllium copper reed; referring to fig. 1 and 2, the semi-finished beryllium copper reed comprises a clamping part 1, seventeen deformation parts 2 are fixedly connected to the clamping part 1, the seventeen deformation parts 2 are uniformly arranged at intervals, the clamping part 1 is arranged in a concave shape, and the opening direction of the clamping part 1 faces the deformation parts 2. The deformation part 2 consists of an arc-shaped section 21 and a clamping section 22, and an arc-shaped bulge of the arc-shaped section 21 deviates from one side of the clamping part 1;
electroplating the semi-finished product of the beryllium copper reed to form a nickel coating on the semi-finished product of the beryllium copper reed to prepare the beryllium copper reed, wherein the thickness of the nickel coating is 4 mu m;
the electroplating operation steps are as follows:
s1: electrolytic degreasing, namely putting the semi-finished beryllium-copper reed product into a degreasing tank, adding 70g/L electrolytic degreasing powder, controlling the temperature at 50 ℃, controlling the voltage at 10V and controlling the electrolytic time at 5min;
s2: washing, namely washing the beryllium copper reed semi-finished product subjected to electrolytic degreasing with water;
s3: sulfuric acid activation, namely soaking the beryllium copper reed semi-finished product subjected to water washing in an activation tank, wherein the activation tank is filled with sulfuric acid with the volume ratio of 15%, and the soaking time is 45s;
s4: washing, namely washing the activated beryllium-copper reed semi-finished product with water;
s5: electroplating nickel, and washing to obtain beryllium-copper reed halfThe finished product is placed in a plating bath which contains 200g/L of NiSO 4 ·6H 2 O,40g/L NiCl 2 ·6H 2 O,40g/L of H 3 BO 3 The voltage is 2V, and the electroplating time is 4min.
Examples 2 to 19, comparative examples 1 to 2
The differences between examples 2-18 and example 1 are shown in table 2.
Table 2 parameters distinguishing examples 2-18 from example 1
Example 19
Example 19 differs from example 1 in that example 19 is a commercially available beryllium copper alloy, the hardness of which was 40HRC, the electrical conductivity was 23% iacs, the thermal conductivity was 160W (m.k) 20, and the elongation was 1%, based on shanghai honglimon realty ltd.
Comparative example 1
Comparative example 1 differs from example 1 in that the chemical composition of the beryllium copper alloy in comparative example 1 is 1.7% beryllium, 0.1% cobalt, 0.1% nickel, 0.4% iron, and the balance copper (100% of the total elements).
Comparative example 2
Comparative example 2 is different from example 1 in that the thickness of the nickel plating layer in comparative example 2 is 0.5 μm.
Performance detection
Beryllium copper reeds prepared in the above examples 1 to 19 and comparative examples 1 to 2 were subjected to a shielding effectiveness test, a salt spray resistance test and a rebound resilience test.
Detecting the shielding effectiveness by referring to GJB8820-2015 method for measuring the shielding effectiveness of electromagnetic shielding materials; testing at 100MHz, and calculating attenuation of electromagnetic waves; the greater the attenuation of electromagnetic waves, the better the shielding effectiveness of the beryllium copper reed.
Reference is made to gjb150a.11-2009 section 11 "military equipment laboratory environmental test methods: salt spray resistance test is carried out in a salt spray test; the salt spray test was carried out for a period of 96h in 50g/L sodium chloride solution.
Referring to fig. 3, resilience detection: measuring the height H of the beryllium copper reed, recording as the initial height, fixing the clamping section 22 of the beryllium copper reed on a punching machine, moving one side of the clamping part 1 of the beryllium copper reed along the horizontal direction, and vertically compressing the arc section 21 downwards by the punching machine on the punching machine to enable the beryllium copper reed to move 40% downwards; removing the pressure of the punch, recovering the beryllium copper reed to the original position, repeatedly compressing for 36000 times, and measuring the height H of the beryllium copper reed and recording the height H as the height after compression; the compression set was calculated according to the formula (1), and the smaller the compression set, the higher the rebound resilience, and the specific test results are shown in Table 3.
TABLE 3 Performance test results
It can be seen from the combination of examples 1 to 19 and comparative examples 1 to 2 and table 3 that the attenuation of the electromagnetic wave of the beryllium copper reed obtained by the method of examples 1 to 19 is more than 89dB at 100MHz, the beryllium copper reed is rust-free in 96h salt spray resistance test, and the compression set is less than 1.82% after being pressed 36000 times in a reciprocating manner.
As can be seen from examples 1 to 19 and table 3, the beryllium copper reed is prepared from the self-made beryllium copper alloy according to the present invention, wherein the beryllium copper alloy is subjected to melting, heat treatment, forging, and the like, the attenuation of the electromagnetic wave of the obtained beryllium copper reed is above 91dB at 100MHz, the beryllium copper reed is corrosion-free in a salt spray resistance test for 96h, and the compression set percentage is below 1.60% after being pressed down 36000 times in a reciprocating manner.
It can be seen from examples 1 to 5 and table 3 that, under the condition that other preparation parameters are not changed, as the temperature of the solution treatment is gradually increased, the attenuation amount of the electromagnetic wave is increased and then decreased, and the permanent deformation rate is decreased and then increased. It is shown that the shielding effectiveness and resilience of the beryllium copper reed are improved and then reduced along with the gradual increase of the temperature of the solution treatment.
It can be seen from the combination of examples 1 and 6 to 9 and table 3 that, under the condition of the same other preparation parameters, as the aging temperature gradually increases, the attenuation of the electromagnetic wave increases and then decreases, and the permanent deformation ratio decreases and then increases. It is demonstrated that the shielding effectiveness and resilience of the beryllium copper reed are improved and then reduced along with the gradual increase of the aging treatment temperature.
It can be seen from the combination of examples 1 and 10 to 13 and table 3 that, under the condition of the same other preparation parameters, as the deformation amount gradually increases during the forging process, the attenuation amount of the electromagnetic wave increases and then decreases, and the permanent deformation ratio decreases and then increases. It shows that the shielding effectiveness and resilience of the beryllium copper reed are improved and then reduced along with the gradual increase of the deformation amount.
As can be seen from the combination of examples 1/14 to 18 and comparative example 2 and table 3, under the condition that other preparation parameters are not changed, the attenuation of the electromagnetic wave is gradually increased along with the gradual increase of the thickness of the nickel plating layer, which indicates that the shielding effectiveness of the beryllium copper reed is gradually improved along with the gradual increase of the thickness of the nickel plating layer; the permanent deformation rate is basically kept unchanged, which shows that the thickness of the nickel coating on the beryllium copper spring has no influence on the resilience.
When the thickness of the nickel plating layer is 1-7 μm, the attenuation of electromagnetic wave is above 91dB, the permanent deformation rate is 0.88-0.92%, and no rust is generated in 96h salt spray resistance test. It is demonstrated that beryllium copper spring plate has higher shielding effectiveness, rebound resilience and salt fog resistance when the thickness of nickel plating layer is 1-7 μm.
It can be seen from examples 1 to 19 and comparative example 1 and table 3 that, when the beryllium copper alloy is adopted with the alloy designation C12700, the attenuation of the electromagnetic wave of the resulting beryllium copper reed is above 89dB at 100MHz, the beryllium copper reed is rust-free in the 96-hour salt spray resistance test, and the compression set is below 1.82% after pressing 36000 times in a reciprocating manner.
Examples 20 to 24
Example 20
Example 20 differs from example 1 in that the NiSO is applied in the S5 nickel electroplating step 4 ·6H 2 The concentration of O is 180g/L, and the NiCl 2 ·6H 2 The concentration of O is 50g/L, and the concentration of H is 3 BO 3 The concentration of (2) is 30g/L.
Example 21
Example 21 differs from example 1 in that the NiSO is used in the S5 nickel electroplating step 4 ·6H 2 The concentration of O is 220g/L, and the NiCl 2 ·6H 2 The concentration of O is 30g/L, and the concentration of H is 3 BO 3 Has a concentration of 50 g/L.
Example 22
Example 22 differs from example 1 in that in the S5 nickel electroplating step, the time is 2min.
Example 23
Example 23 is different from example 1 in that in the step of S5 nickel electroplating, the time is 6min.
Example 24
Example 24 is different from example 1 in that in the S5 nickel electroplating step, the voltage is 4V.
The beryllium copper reed obtained in the above examples 20 to 24 was subjected to performance test, and the specific test results are shown in table 4.
TABLE 4 test results
It can be seen from the combination of examples 20 to 24 and table 4 that, under different electroplating process conditions, the obtained beryllium copper spring has different properties, the attenuation of the electromagnetic wave of the beryllium copper spring is above 100dB under 100MHz, the beryllium copper spring is not rusted in the 96h salt spray resistance test, and the compression set rate is below 1.38% after pressing 36000 times in a reciprocating manner.
It is to be understood that the above embodiments are merely exemplary embodiments that are employed to illustrate the principles of the present application, and that the present application is not limited thereto. It will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention, and these changes and modifications are to be considered as within the scope of the invention.
Claims (9)
1. The beryllium copper reed is characterized by comprising beryllium copper alloy and a nickel plating layer plated on the beryllium copper alloy;
the beryllium-copper alloy is C12700;
the thickness of the nickel plating layer is 1-7 μm.
2. The beryllium copper reed as recited in claim 1, wherein the thickness of the nickel plating layer is 2 to 6 μm.
3. The beryllium copper reed as set forth in claim 1, wherein the nickel plating layer has a thickness of 3-4 μm.
4. A method for producing a beryllium copper spring as claimed in any one of claims 1 to 3, which comprises electrolytic degreasing, washing with water, sulfuric acid activation, washing with water and electroplating with nickel,
wherein the time of the nickel electroplating step is 2-6min.
5. The method for manufacturing a beryllium copper spring plate as claimed in claim 4, wherein the electrolyte in the step of electroplating nickel comprises NiSO 4 ·6H 2 O，NiCl 2 ·6H 2 O and H 3 BO 3 。
6. The method for preparing the beryllium-copper reed according to claim 5, wherein the NiSO is 4 ·6H 2 The concentration of O is 180-220g/L, and the NiCl 2 ·6H 2 The concentration of O is 30-50 g/L, and the concentration of H is 3 BO 3 The concentration of (A) is 30-50 g/L.
7. The method for making a beryllium copper reed as in claim 6, wherein the NiSO is 4 ·6H 2 The concentration of O is 200g/L, and the NiCl 2 ·6H 2 The concentration of O is 40g/L, the H 3 BO 3 Has a concentration of 40 g/L.
8. The method for manufacturing the beryllium copper reed according to claim 4, wherein the voltage in the step of electroplating nickel is 2-4V.
9. Use of a beryllium-copper reed as defined in any one of claims 1 to 3 in a shielded room/hatch/cabinet door/cover/integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211420130.1A CN115466864B (en) | 2022-11-15 | 2022-11-15 | Beryllium copper reed, and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211420130.1A CN115466864B (en) | 2022-11-15 | 2022-11-15 | Beryllium copper reed, and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115466864A true CN115466864A (en) | 2022-12-13 |
| CN115466864B CN115466864B (en) | 2023-03-21 |
Family
ID=84338267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211420130.1A Active CN115466864B (en) | 2022-11-15 | 2022-11-15 | Beryllium copper reed, and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115466864B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4028064A (en) * | 1976-02-17 | 1977-06-07 | Texas Instruments Incorporated | Beryllium copper plating process |
| US20020153913A1 (en) * | 2000-11-28 | 2002-10-24 | Japan Electronic Materials Corp. | Probe for the probe card |
| CN111304484A (en) * | 2019-12-10 | 2020-06-19 | 湘潭大学 | Preparation method of beryllium-copper composite plasma surface wall annular piece |
| CN111900592A (en) * | 2020-07-03 | 2020-11-06 | 哈尔滨工业大学 | Preparation method of nickel-plated-layer-assisted high-strength composite electric brush |
| CN112176371A (en) * | 2020-10-22 | 2021-01-05 | 深圳市海里表面技术处理有限公司 | Electroplating process for plating gold on beryllium copper surface |
| CN114657361A (en) * | 2022-03-22 | 2022-06-24 | 湖北熙之翼电子科技有限公司 | Wafer probe processing method |
| CN217116809U (en) * | 2022-02-15 | 2022-08-02 | 恒昌行精密工业有限公司 | Spring plate structure |
-
2022
- 2022-11-15 CN CN202211420130.1A patent/CN115466864B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4028064A (en) * | 1976-02-17 | 1977-06-07 | Texas Instruments Incorporated | Beryllium copper plating process |
| US20020153913A1 (en) * | 2000-11-28 | 2002-10-24 | Japan Electronic Materials Corp. | Probe for the probe card |
| CN111304484A (en) * | 2019-12-10 | 2020-06-19 | 湘潭大学 | Preparation method of beryllium-copper composite plasma surface wall annular piece |
| CN111900592A (en) * | 2020-07-03 | 2020-11-06 | 哈尔滨工业大学 | Preparation method of nickel-plated-layer-assisted high-strength composite electric brush |
| CN112176371A (en) * | 2020-10-22 | 2021-01-05 | 深圳市海里表面技术处理有限公司 | Electroplating process for plating gold on beryllium copper surface |
| CN217116809U (en) * | 2022-02-15 | 2022-08-02 | 恒昌行精密工业有限公司 | Spring plate structure |
| CN114657361A (en) * | 2022-03-22 | 2022-06-24 | 湖北熙之翼电子科技有限公司 | Wafer probe processing method |
Non-Patent Citations (1)
| Title |
|---|
| 张先立等: "《复杂电磁环境下电磁兼容性设计》", 31 December 2006, 甘肃科学技术出版社 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115466864B (en) | 2023-03-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10815557B2 (en) | Copper alloy sheet material and method for producing copper alloy sheet material | |
| JP5320541B2 (en) | Copper alloy material for electrical and electronic parts | |
| FI87804C (en) | Copper alloy treatment | |
| US20090130480A1 (en) | Sn-Plated Copper Alloy Strip Having Improved Fatigue Characteristics | |
| EP2340318B1 (en) | Copper-tin alloy, composite material and use thereof | |
| CN110157945B (en) | Softening-resistant copper alloy and preparation method and application thereof | |
| DE10125586A1 (en) | Copper alloy used in electrical and electronic components e.g. semiconductor conductor frames contains alloying additions of nickel, iron, phosphorous and zinc | |
| JP4129807B2 (en) | Copper alloy for connector and manufacturing method thereof | |
| EP2522763A1 (en) | Surface-treated metal sheet and process for producing formed article from the surface-treated metal sheet | |
| CN110885938A (en) | Cu-Ni-Sn alloy strip foil for 5G communication and preparation method thereof | |
| CN115466864B (en) | Beryllium copper reed, and preparation method and application thereof | |
| CN105063418B (en) | Preparation method of low-alloying copper belt | |
| CN2514498Y (en) | Non-mercury-alkaline button cell | |
| CN101597780A (en) | A kind of method for preparing the nickel-silver alloy steel strip that battery case uses | |
| Gabe | Corrosion and protection of sintered metal parts | |
| CN101899690B (en) | Multi-porous alloy material and method for preparing same | |
| JP5150908B2 (en) | Copper alloy for connector and its manufacturing method | |
| JP4186095B2 (en) | Copper alloy for connector and its manufacturing method | |
| JPS63250434A (en) | Copper-base alloy for connector | |
| Nakano et al. | Electrodeposition behavior of Zn–Fe alloy from zincate solution containing triethanolamine | |
| CN109112351B (en) | High-elasticity-modulus brass alloy material and preparation method thereof | |
| JPH09263994A (en) | Battery can material excellent in deep drawability and its production | |
| CN108754549B (en) | Nickel-plated layer stress regulator and application thereof | |
| CN105619040A (en) | Manufacturing method for multifunctional drill | |
| JP5315571B2 (en) | Stainless steel conductive member and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |