CN217116809U - Spring plate structure - Google Patents
Spring plate structure Download PDFInfo
- Publication number
- CN217116809U CN217116809U CN202220304379.5U CN202220304379U CN217116809U CN 217116809 U CN217116809 U CN 217116809U CN 202220304379 U CN202220304379 U CN 202220304379U CN 217116809 U CN217116809 U CN 217116809U
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- turning
- extension
- circuit board
- installation department
- spring plate
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Abstract
The utility model provides a shell fragment structure, including supporting to paste and weld in an installation department of predetermineeing the circuit board, this installation department is towards first direction bending type and is formed a first turn portion, there is a supporting part by this first turn portion extension, and this installation department is towards second direction bending type and is formed a second turn portion, there is an inclined portion by this second turn portion extension, the terminal bending type of this inclined portion becomes a third turn portion, it has can support with a predetermined conductive element and support and form electric connection's a support portion to extend by this third turn portion.
Description
Technical Field
The utility model relates to a shell fragment structure especially indicates one kind when predetermineeing conductive element and bulldoze supporting of shell fragment and hold the portion and move towards the installation department direction, the extension portion to one side compressed and with the contained angle between second turn portion and the third turn portion diminish, and a surface of extension portion to one side supports and holds in the supporting part and pushes down it to make the supporting part also be compression state and share the stress that the extension portion to one side bore, so that the whole advantage that has high strength, high elasticity and antifatigue nature of shell fragment.
Background
All electronic products have electromagnetic waves, and the reason for the electromagnetic waves is that a plurality of electronic components (or conductive components) and printed circuits are disposed on the circuit board. Because electronic signals with different frequencies and currents are transmitted in the printed circuit, the printed circuit and the grounding circuit of the circuit board form an inductance effect under high frequency and simultaneously form electronic noise, and the electronic noise is transmitted to the outside through electromagnetic radiation to form an electromagnetic interference (EMI) phenomenon.
The contact spring sheet is welded on the circuit board by a Surface Mount Technology (SMT), and generates elasticity after being bent to form Grounding, elastic buffering or electromagnetic interference prevention electrical protection when the contact spring sheet is used as an electrical connection between an electronic element and the circuit board, or is electrically connected with an electrode of a battery or an external antenna.
However, the bending portion of the contact spring is the most stressed portion, and if the stress is too large or has a continuous nature (such as vibration or impact), the contact spring will cause an unrecoverable deformation state, and an electrical or electronic signal is broken after the contact spring is deformed. Furthermore, after repeated compression and rebound operations, the contact spring is prone to form an elastic fatigue state, which causes the electronic product to malfunction or damage, and needs to be improved and solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
Therefore, in view of the above problems and disadvantages, the present invention provides a new practical design of the spring structure by collecting relevant data and evaluating and considering the data in many ways.
The utility model mainly relates to a shell fragment structure, including supporting pasting and welding in an installation department of predetermineeing the circuit board, this installation department is towards first direction bending type one first turn portion, there is a supporting part by this first turn portion extension, and this installation department is towards second direction bending type one second turn portion, there is an oblique extension by this second turn portion extension, the terminal bending type of this oblique extension becomes a third turn portion, extend by this third turn portion have can support with a predetermineeing conductive element and support and form electric connection's one and support the portion of holding. By means of the structure, when the preset conductive element pushes the abutting part of the elastic sheet to move towards the direction of the mounting part, the inclined extending part is compressed, an included angle between the inclined extending part and the second turning part and an included angle between the inclined extending part and the third turning part are reduced, one surface of the inclined extending part abuts against the suspended end of the supporting part and presses the suspended end downwards, so that the supporting part is also in a compressed state and distributes stress borne by the inclined extending part, and the elastic sheet has the advantages of high strength, high elasticity and fatigue resistance.
The utility model discloses a secondary aim at more have in this installing part and supply this solder pad surface soldering tin infiltration's of predetermineeing the circuit board a thru hole.
Another object of the present invention is to provide the mounting portion and the supporting portion in a parallel state.
The utility model discloses a still another aim at has the plural line that link up the body in this shell fragment.
Another objective of the present invention is to provide a spring plate made of beryllium copper, wherein a nickel layer is formed on the surface of beryllium copper, and a gold-plating layer is formed on the surface of nickel layer.
The utility model discloses rely on aforementioned constitution, when predetermineeing conductive element and bulldoze supporting of shell fragment and hold the portion towards the installation department direction when removing, the extension portion to one side is compressed and diminishes with the contained angle between second turn portion and the third turn portion, and the surface of extension portion to one side supports and holds in the free end of supporting part and pushes down it to make the supporting part also be compression state and share the stress that the extension portion bore to one side, so that the whole advantage that has high strength, high elasticity and anti tired nature of shell fragment. The utility model discloses when the shell fragment is applied to electronic component and circuit board electric connection to form ground connection (Grounding), elastic buffer or prevent electromagnetic interference's electric protection, have splendid practicality.
Drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is another perspective external view of the present invention.
Fig. 3 is a side sectional view of the present invention in use.
Description of reference numerals: 1-a spring plate; 11-a mounting portion; 12-a first turning section; 13-a support; 14-a second turn; 15-a slanted extension; 16-a third turn; 17-a holding portion; 18-texture; 2-a circuit board; 3-conductive elements.
Detailed Description
Referring to fig. 1 to 3, a three-dimensional external view with another viewing angle, and a side sectional view in application of the present invention are shown, as can be clearly seen from the drawings, the detailed structure and connection relationship of the elastic sheet 1 of the present invention are as follows:
the utility model discloses shell fragment 1 is including supporting pasting and welding in an installation department 11 of predetermineeing circuit board 2, this installation department 11 is towards first direction bending type and is formed a first turning portion 12, there is a supporting part 13 by this first turning portion 12 extension, and this installation department 11 is towards second direction bending type and is formed a second turning portion 14, there is an inclined portion 15 by this second turning portion 14 extension, this 15 terminal bending type of inclined portion becomes a third turning portion 16, it has can support with one predetermine conductive element 3 and support and form an electric connection's a portion 17 of supporting by this third turning portion 16 extension. The mounting portion 11 and the abutting portion 17 are approximately parallel.
The spring plate 1 is made of an integral metal sheet, the metal is Beryllium Copper (berylium Copper), the Beryllium Copper has the characteristics of high elasticity, high strength, high hardness and fatigue resistance, a nickel (Ni) layer is firstly formed on the surface of the Beryllium Copper, then a gold (Au) plating layer is formed on the surface of the nickel layer, the conductivity coefficient of the spring plate 1 is increased by the plating layer, and the spring plate has the characteristics of high voltage resistance and high current resistance.
The elastic sheet 1 is provided with a plurality of lines 18 which run through the body (the elastic sheet 1 is made of material and has lower stress bearing capacity of the lines), and the lines 18 are longitudinally run through the elastic sheet 1, so that the elastic sheet 1 has higher bearing strength when bearing compressive stress; on the contrary, if the lines 18 are distributed transversely (i.e. turned ninety degrees) in the elastic sheet 1, the elastic sheet 1 is easily broken during compression, so the utility model discloses adopt the preferred direction of cutting to make the elastic sheet 1.
The mounting portion 11 further has a through hole 110 for solder to penetrate into the surface of a Pad (Pad) (not shown) of the predetermined circuit board 2, the through hole 110 can be used to fix the spring plate 1 on the Pad of the predetermined circuit board 2 by Surface Mount Technology (SMT), when the spring plate passes through a reflow machine (not shown), the solder printed on the surface of the Pad of the predetermined circuit board 2 is melted by heating or ultrasonic, the solder flows into the through hole 110 and the bottom surface of the mounting portion 11 in a liquid state, and the through hole 110 can break the surface tension of the liquid solder, so that the spring plate 1 does not form a floating state on the surface of the Pad of the predetermined circuit board 2, and the arrangement of the through hole 110 can actually increase the stability and the positioning accuracy of the spring plate 1 and the predetermined circuit board 2 during soldering.
The utility model discloses shell fragment 1 utilizes Surface Mount Technology (SMT) to be fixed in on presetting the weld pad of circuit board 2 earlier with the installation department 11 of shell fragment 1 when actual application, accomplishes shell fragment 1 promptly and presets the fixed knot structure of circuit board 2. When the preset conductive element 3 (for example, an electrode of the conductive element or a pin of the electronic element) pushes the abutting portion 17 of the elastic sheet 1 to move toward the mounting portion 11, the inclined portion 15 is compressed, an included angle between the inclined portion 15 and the second turning portion 14 and the third turning portion 16 is reduced, and one surface of the inclined portion 15 abuts against the free end of the supporting portion 13 and presses down the free end, so that the supporting portion 13 is also in a compressed state and distributes stress borne by the inclined portion 15, so that the elastic sheet 1 has the advantages of high strength, high elasticity and fatigue resistance as a whole, and the service life of the elastic sheet 1 is prolonged. Meanwhile, the elastic sheet 1 is disposed between the preset conductive element 3, the pad of the preset circuit board 2 and the printed circuit (not shown) connected to the pad, so that the circuit can be ensured to operate well by virtue of the high conductivity of the elastic sheet 1.
Rely on above-mentioned fig. 1 to the revelation of fig. 3, can understand the utility model relates to a shell fragment structure, including supporting and pasting and welding in an installation department of predetermineeing the circuit board, this installation department is towards first direction bending type and is formed a first turning portion, there is a supporting part by this first turning portion extension, and this installation department is towards second direction bending type and is formed a second turning portion, there is an oblique extension by this second turning portion extension, this oblique extension end bending type forms a third turning portion, it has one to support with a predetermined conductive element and form electric connection's a support portion to extend by this third turning portion. By means of the structure, when the preset conductive element pushes the abutting part of the elastic sheet to move towards the direction of the mounting part, the inclined extension part is compressed, an included angle between the inclined extension part and the second turning part and an included angle between the inclined extension part and the third turning part are reduced, one surface of the inclined extension part abuts against the suspension end of the supporting part and presses the suspension end downwards, so that the supporting part is also in a compressed state and stress borne by the inclined extension part is distributed, and the elastic sheet has the advantages of high strength, high elasticity and fatigue resistance integrally. The utility model discloses when the shell fragment is applied to electronic component and circuit board electric connection to form ground connection (Grounding), elastic buffer or prevent electromagnetic interference's electric protection, have splendid practicality.
The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (5)
1. A shell fragment structure which characterized in that: the mounting part is bent towards a first direction to form a first turning part, a supporting part is extended from the first turning part, the mounting part is bent towards a second direction to form a second turning part, an inclined part is extended from the second turning part, the tail end of the inclined part is bent to form a third turning part, and a supporting part which can support a preset conductive element and form electrical connection is extended from the third turning part.
2. The spring structure of claim 1, wherein: the mounting part is also provided with a through hole for solder to penetrate into the surface of the welding pad of the preset circuit board.
3. The spring structure of claim 1, wherein: the mounting part is parallel to the abutting part.
4. The spring structure of claim 1, wherein: the spring plate has a plurality of lines penetrating the body.
5. The spring structure of claim 1, wherein: the spring plate is made of an integrated metal sheet, the metal is beryllium copper, and after a nickel layer is formed on the surface of the beryllium copper, a gold-plated layer is formed on the surface of the nickel layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220304379.5U CN217116809U (en) | 2022-02-15 | 2022-02-15 | Spring plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220304379.5U CN217116809U (en) | 2022-02-15 | 2022-02-15 | Spring plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217116809U true CN217116809U (en) | 2022-08-02 |
Family
ID=82598826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220304379.5U Active CN217116809U (en) | 2022-02-15 | 2022-02-15 | Spring plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217116809U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115466864A (en) * | 2022-11-15 | 2022-12-13 | 北京泰派斯特科技发展有限公司 | Beryllium copper reed, and preparation method and application thereof |
-
2022
- 2022-02-15 CN CN202220304379.5U patent/CN217116809U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115466864A (en) * | 2022-11-15 | 2022-12-13 | 北京泰派斯特科技发展有限公司 | Beryllium copper reed, and preparation method and application thereof |
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| GR01 | Patent grant |