CN115466576B - UV adhesive tape, BGA magnetron sputtering packaging method and BGA electronic product - Google Patents
UV adhesive tape, BGA magnetron sputtering packaging method and BGA electronic product Download PDFInfo
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- CN115466576B CN115466576B CN202211042233.9A CN202211042233A CN115466576B CN 115466576 B CN115466576 B CN 115466576B CN 202211042233 A CN202211042233 A CN 202211042233A CN 115466576 B CN115466576 B CN 115466576B
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- 238000001755 magnetron sputter deposition Methods 0.000 title claims abstract description 59
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims abstract description 42
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 17
- 238000010030 laminating Methods 0.000 abstract description 13
- 239000012790 adhesive layer Substances 0.000 abstract description 9
- 238000007747 plating Methods 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000012858 packaging process Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000001723 curing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Packages (AREA)
Abstract
The application discloses a UV adhesive tape, a BGA magnetron sputtering packaging method and a BGA electronic product. The UV adhesive tape comprises an attaching area and a non-attaching area, wherein the attaching area is used for attaching a BGA product and a tin ball used for embedding the BGA product; the non-laminating area is located the periphery of laminating district, just the thickness of non-laminating district is less than the thickness of laminating district. When the UV adhesive tape provided by the application is used for enabling the BGA product to be attached in the attaching region, on one hand, the solder balls can be completely embedded in the adhesive layer of the attaching region, so that the overflow plating defect during magnetron sputtering is avoided; on the other hand, the thickness of the non-bonding area is thinner, so that the defect of incomplete magnetron sputtering at other positions of the BGA product can be avoided, and the yield of the BGA magnetron sputtering packaging product is improved.
Description
Technical Field
The application relates to the technical field of packaging technology, in particular to a UV adhesive tape, a BGA magnetron sputtering packaging method and a BGA electronic product.
Background
With the rapid development of SIP (system in package ) technology, the functions of electronic products are more and more complex, and the problem of electromagnetic interference between SIP modules is more and more prominent. The EMI electromagnetic shielding technology utilizes the metal shielding layer to effectively weaken electromagnetic interference between the SIP product electronic components and the external environment. For BGA (ball grid array packaging technology) devices, direct magnetron sputtering is easy to generate short-circuit defects due to the height of solder balls, so that the yield of products is reduced.
In the prior art, for magnetron sputtering packaging of BGA products, a PCB substrate with a BGA device attached thereto is generally attached to an adhesive tape, and solder ball pins thereof are embedded into the adhesive tape, so as to avoid the defect of short circuit between a metal layer and the solder ball pins generated in magnetron sputtering. However, in this way, the solder balls are fully embedded in the adhesive tape, so that other positions outside the solder balls are embedded in the adhesive tape, and the defect of incomplete sputtering during magnetron sputtering is caused, so that the anti-electromagnetic interference effect of the magnetron sputtering is affected.
Disclosure of Invention
An object of the present application is to provide a new technical solution for a UV tape, a BGA magnetron sputtering packaging method and a BGA electronic product, so as to solve at least one of the problems in the background art.
According to a first aspect of the present application, there is provided a UV tape applied to a BGA magnetron sputtering package, the UV tape comprising:
the attaching region is used for attaching the BGA product and is used for embedding the solder balls of the BGA product;
and the non-bonding region is positioned at the periphery of the bonding region, and the thickness of the non-bonding region is smaller than that of the bonding region.
Optionally, the thickness of the attaching region is 80-100 um higher than that of the non-attaching region.
Optionally, the laminating district is provided with a plurality of, non-laminating district matches a plurality of laminating district sets up.
According to a second aspect of the present application, there is provided a BGA magnetron sputtering packaging method, packaging using the UV tape of the first aspect, the method comprising:
cutting the PCB substrate with the BGA devices into a plurality of single BGA products;
attaching a plurality of single BGA products to an attaching region of the UV adhesive tape, so that solder balls of the single BGA products are embedded into the attaching region;
and performing magnetron sputtering on the single BGA products to obtain the BGA electronic product packaged by the magnetron sputtering.
Optionally, pressing the UV adhesive tape to enable the tin balls of the single BGA product to be embedded into the attaching area;
and curing the pressed UV adhesive tapes to fix a plurality of single BGA products on the UV adhesive tapes.
Optionally, the projections of the solder balls of the single BGA product on the UV tape are all located within the range of the corresponding bonding region.
Optionally, the projection of the single BGA product on the UV tape at least covers the corresponding bonding region.
Optionally, under the condition that the solder balls are embedded in the bonding region, the height of the solder balls is lower than 30-50 um of the thickness of the bonding region.
Optionally, after performing magnetron sputtering on a plurality of single BGA products, removing the single BGA products from the UV adhesive tape to obtain the BGA electronic product packaged by magnetron sputtering.
According to a second aspect of the present application, there is provided a BGA electronic product manufactured by the BGA magnetron sputtering packaging method of the first aspect.
According to one embodiment of the present application, a UV adhesive tape is provided having a bonding region and a non-bonding region disposed about the periphery of the bonding region. The thickness of the non-bonding region is smaller than that of the bonding region, so that when the BGA product is bonded in the bonding region, on one hand, tin balls of the BGA product can be completely embedded in a glue layer of the bonding region, and overflow plating defects are avoided during magnetron sputtering; on the other hand, the thickness of the non-bonding area is thinner, so that the defect of incomplete magnetron sputtering at other positions of the BGA product can be avoided, and the yield of the BGA magnetron sputtering packaging product is improved.
Other features of the present application and its advantages will become apparent from the following detailed description of exemplary embodiments of the application, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application.
Fig. 1 is a schematic diagram of a UV tape provided by the present application.
Fig. 2 is a side view of a UV tape provided by the present application.
Fig. 3 is a step diagram of a BGA magnetron sputtering packaging method provided by the application.
Reference numerals illustrate:
1. a bonding region; 2. a non-conforming region.
Detailed Description
Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless it is specifically stated otherwise.
The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the application, its application, or uses.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
As shown in fig. 1 to 3, the application provides a UV adhesive tape, which is applied to BGA magnetron sputtering packaging, and comprises a bonding area 1 and a non-bonding area 2; the attaching area 1 is used for attaching a BGA product and is used for embedding a solder ball of the BGA product; the non-laminating area 2 is located at the periphery of the laminating area 1, and the thickness of the non-laminating area 2 is smaller than that of the laminating area 1.
Specifically, the UV adhesive tape is an adhesive tape made of UV adhesive, which is also called photosensitive adhesive and UV curing adhesive, is an adhesive which can be cured only by irradiation of ultraviolet light, and can be used as an adhesive. In this embodiment, the UV adhesive tape is provided with a bonding region 1 and a non-bonding region 2 disposed at the periphery of the bonding region 1, and can be applied to the magnetron sputtering packaging process of the BGA product for fixing the BGA product. The thickness of the non-attaching region 2 of the UV adhesive tape is smaller than that of the attaching region 1, so that when the BGA product is attached to the attaching region 1, on one hand, a tin ball of the BGA product can be completely embedded into a glue layer of the attaching region 1, and overflow plating defects are avoided during magnetron sputtering; on the other hand, the thickness of the non-bonding area 2 is thinner, so that the defect of incomplete magnetron sputtering at other positions of the BGA product can be avoided, and the yield of the BGA magnetron sputtering packaging product is improved as a whole.
In the application, the thickness of the bonding area 1 can be set according to the height of the solder balls of the BGA product to be bonded, namely, the thickness dimension of the bonding area 1 is set to be larger than the height dimension of the solder balls, so that the solder balls can be completely embedded into the adhesive layer. The thickness of the non-bonding area 2 can be matched with the thickness and other dimensions of the BGA product, so that other parts of the BGA product except the solder balls can be exposed out of the UV adhesive tape, and the yield of the magnetron sputtering packaging product is improved. In addition, the area of the bonding area 1 may be designed according to the actual size of the BGA product, which is not limited in the present application.
Optionally, the thickness of the attaching region 1 is 80-100 um higher than the thickness of the non-attaching region 2.
Specifically, in this embodiment, the thickness of the bonding region 1 is set to be 80-100 um higher than the thickness of the non-bonding region 2, so that the adhesive layer of the bonding region 1 is not too thick, thereby reducing the process difficulty and the material cost. In addition, when the thickness of the laminating area 1 is too thick, when the solder balls are embedded into the adhesive layer of the laminating area 1 in the following process, the problems of glue overflow and the like are easy to occur, other positions of the BGA product are covered by the adhesive layer, the defect of magnetron sputtering packaging products occurs, and the reliability of the packaging process is improved. For example, in one embodiment, the thickness of the bonding region 1 may be set to 120um and the thickness of the non-bonding region 2 to 20un to satisfy both the embedding of solder balls and the exposure of non-solder ball regions of the BGA product.
Optionally, a plurality of the attaching regions 1 are provided, and the non-attaching regions 2 are matched with a plurality of the attaching regions 1.
Specifically, as shown in fig. 1, in this embodiment, the UV adhesive tape may include one attaching region 1, to which one BGA product may be attached, or may include a plurality of attaching regions 1, to which a plurality of BGA products may be attached. In practical application, the UV adhesive tape comprises a plurality of attaching areas 1, so that the magnetron sputtering efficiency can be improved, and the UV adhesive tape is suitable for mass production.
As shown in fig. 3, according to a second aspect of the present application, there is provided a BGA magnetron sputtering packaging method, packaging using the UV tape according to the first aspect, the method comprising:
s01: the PCB substrate on which the BGA devices are attached is cut into a plurality of individual BGA products.
In this dicing process, the PCB substrate may be fixed by a vacuum adsorption apparatus, and then diced by a JIG SAW or the like process. A single BGA product may have multiple solder balls, depending on the actual product.
S02: and attaching a plurality of single BGA products to the attaching region 1 of the UV adhesive tape, so that the solder balls of the single BGA products are embedded into the attaching region 1.
When the single BGA product is attached to the attaching region 1 of the UV adhesive tape, the thickness dimension of the attaching region 1 is larger than that of the non-attaching region 2, so that the solder balls of the single BGA product can be completely embedded into the adhesive layer of the attaching region 1, and the non-solder ball region, for example, the side wall of the single BGA product can be exposed out of the attaching region 1. The operation can prevent the tin ball position from being sputtered to metal in the subsequent magnetron sputtering process, so that the defects of overflow plating, short circuit and the like are avoided, but the tin ball position can be sputtered to metal as much as possible, the electromagnetic interference resistance of the BGA product is improved, and the product yield of the magnetron sputtering is improved as a whole.
S03: and performing magnetron sputtering on the single BGA products to obtain the BGA electronic product packaged by the magnetron sputtering.
In the magnetron sputtering process, a plurality of single BGA products can be attached to the UV adhesive tape with a plurality of attaching areas 1, and the magnetron sputtering is integrally and fixedly carried out, so that the magnetron sputtering packaged BGA electronic product is finally obtained after the sputtering is finished, and the magnetron sputtering packaging device is suitable for batch production.
According to the BGA magnetron sputtering packaging method provided by the application, the PCB substrate adhered with the BGA device is cut into a plurality of single BGA products, and then the single BGA products are respectively adhered to the UV adhesive tape. In addition, compared with the traditional process, the whole packaging process is simpler in flow, and the production efficiency is improved.
Optionally, pressing the UV adhesive tape to enable the tin balls of the single BGA product to be embedded into the attaching area 1; and curing the pressed UV adhesive tapes to fix a plurality of single BGA products on the UV adhesive tapes.
Specifically, after a single BGA product is attached to the attaching region 1 of the UV adhesive tape, the solder ball position of the single BGA product can be completely embedded into the adhesive layer of the attaching region 1 in a pressing mode and the like, and ultraviolet light is irradiated and solidified, so that the bonding force between the solder ball position and the attaching region 1 is stronger, the phenomenon that a gap is generated between the solder ball and the UV adhesive tape in the magnetron sputtering process, and the overflow plating defect is caused is avoided, and the yield of the product is improved.
Optionally, the projections of the solder balls of the single BGA product on the UV tape are all located within the range of the corresponding bonding region 1.
Specifically, in this embodiment, the solder balls of the single BGA product are projected in the bonding region 1, i.e. the range of the bonding region 1 should be greater than or equal to the size of the solder balls, so that the solder balls can be completely embedded in the bonding region 1, and the overflow plating defect is avoided.
Optionally, the projection of the single BGA product on the UV tape covers at least the corresponding bonding region 1.
Specifically, in this embodiment, the projection of the single BGA product at least covers the corresponding bonding region 1, that is, the range of the bonding region 1 should be smaller than or equal to that of the single BGA product, so that the situation that the position of the non-solder ball region of the single BGA product is embedded into the bonding region 1 can be avoided, and the undesirable phenomenon of incomplete sputtering is avoided.
Optionally, in the case that the solder balls are embedded in the bonding region 1, the height of the solder balls is lower than 30-50 um of the thickness of the bonding region 1.
Specifically, in this embodiment, the solder ball is embedded into the bonding region 1 by 30-50 um, so that the solder ball can be completely covered by the adhesive layer of the bonding region 1, the solder ball is prevented from falling out of the bonding region 1 due to the influence of external force, and the overflow plating defect is avoided. If the depth of the solder ball embedded in the bonding area 1 is large, the glue layer in the bonding area 1 may overflow to the non-bonding area 2, and the magnetron sputtering effect of other areas of the single BGA product is affected. However, if the depth of the solder ball embedded in the bonding area 1 is too shallow, the overflow plating defect is liable to occur. By adopting the depth range provided by the embodiment, the defects in the two aspects can be avoided at the same time, and the product yield is improved.
Optionally, after performing magnetron sputtering on a plurality of single BGA products, removing the single BGA products from the UV adhesive tape to obtain the BGA electronic product packaged by magnetron sputtering.
Specifically, in this embodiment, after magnetron sputtering, a plurality of single BGA products may be removed from the UV tape one by one, and placed in a tray or other package for standby, and the way of taking the BGA products may refer to the way in the prior art, which is not described in detail in the present application.
According to a third aspect of the present application, there is provided a BGA electronic product manufactured by the BGA magnetron sputtering packaging method of the second aspect.
Specifically, in this embodiment, since the BGA magnetron sputtering packaging method provided in the second aspect is adopted, the PCB substrate on which the BGA device is attached is cut into a plurality of single BGA products, and then the plurality of single BGA products are attached to the attachment region 1 of the UV tape, so that the overflow plating defect caused by tape falling or increased gap between the tape and the PCB substrate due to the tape being pulled in the cutting process is avoided. In addition, when the adhesive tape is attached, the UV adhesive tape provided by the first aspect of the application is provided with the attaching area 1, so that solder balls of the BGA product can be embedded in the attaching area 2 at the periphery, other positions are prevented from being embedded in the adhesive layer, and the product quality of the BGA electronic product is improved.
The foregoing embodiments mainly describe differences between the embodiments, and as long as there is no contradiction between different optimization features of the embodiments, the embodiments may be combined to form a better embodiment, and in consideration of brevity of line text, no further description is given here.
While certain specific embodiments of the application have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the application. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the application. The scope of the application is defined by the appended claims.
Claims (7)
1. A BGA magnetron sputtering packaging method, the method comprising:
cutting the PCB substrate with the BGA devices into a plurality of single BGA products;
attaching a plurality of single BGA products to an attaching region of a UV adhesive tape, so that tin balls of the single BGA products are embedded into the attaching region, wherein the thickness of the attaching region of the UV adhesive tape is larger than that of a non-attaching region, and the non-tin ball region is exposed out of the attaching region;
and performing magnetron sputtering on the single BGA products to obtain the BGA electronic product packaged by the magnetron sputtering.
2. The method of BGA magnetron sputtering packaging as defined in claim 1, wherein,
pressing the UV adhesive tape to enable the tin balls of the single BGA product to be embedded into the attaching area;
and curing the pressed UV adhesive tapes to fix a plurality of single BGA products on the UV adhesive tapes.
3. The method of claim 1, wherein the projections of the solder balls of the single BGA product on the UV tape are all located within the range of the corresponding bonding region.
4. A method of BGA magnetron sputtering packaging according to claim 3, wherein the projection of the individual BGA products onto the UV tape at least covers the corresponding attachment region.
5. The BGA magnetron sputtering packaging method of claim 1, wherein the solder balls are less than 30-50 um of the thickness of the bonding region with the solder balls embedded in the bonding region.
6. The method for packaging the BGA by magnetron sputtering according to claim 1, wherein after magnetron sputtering is carried out on a plurality of single BGA products, the single BGA products are taken down from the UV adhesive tape, and the BGA electronic products packaged by magnetron sputtering are obtained.
7. A BGA electronic product prepared by the BGA magnetron sputtering packaging method of any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211042233.9A CN115466576B (en) | 2022-08-29 | 2022-08-29 | UV adhesive tape, BGA magnetron sputtering packaging method and BGA electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211042233.9A CN115466576B (en) | 2022-08-29 | 2022-08-29 | UV adhesive tape, BGA magnetron sputtering packaging method and BGA electronic product |
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| Publication Number | Publication Date |
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| CN115466576A CN115466576A (en) | 2022-12-13 |
| CN115466576B true CN115466576B (en) | 2023-11-17 |
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| CN202211042233.9A Active CN115466576B (en) | 2022-08-29 | 2022-08-29 | UV adhesive tape, BGA magnetron sputtering packaging method and BGA electronic product |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105826211A (en) * | 2016-05-11 | 2016-08-03 | 苏州日月新半导体有限公司 | Semiconductor product, and tool and method for manufacturing the semiconductor product |
| US9780041B1 (en) * | 2016-05-25 | 2017-10-03 | Universal Scientific Industrial (Shanghai) Co., Ltd. | Method for making EMI shielding layer on a package |
| CN111040719A (en) * | 2018-10-15 | 2020-04-21 | 宏凌先进科技有限公司 | Semiconductor package shielding glue and shielding process thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6999350B2 (en) * | 2017-10-05 | 2022-01-18 | 株式会社ディスコ | Package substrate processing method |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105826211A (en) * | 2016-05-11 | 2016-08-03 | 苏州日月新半导体有限公司 | Semiconductor product, and tool and method for manufacturing the semiconductor product |
| US9780041B1 (en) * | 2016-05-25 | 2017-10-03 | Universal Scientific Industrial (Shanghai) Co., Ltd. | Method for making EMI shielding layer on a package |
| CN111040719A (en) * | 2018-10-15 | 2020-04-21 | 宏凌先进科技有限公司 | Semiconductor package shielding glue and shielding process thereof |
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| CN115466576A (en) | 2022-12-13 |
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