CN115020254A - Magnetron sputtering method for packaging product - Google Patents
Magnetron sputtering method for packaging product Download PDFInfo
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- CN115020254A CN115020254A CN202210603114.XA CN202210603114A CN115020254A CN 115020254 A CN115020254 A CN 115020254A CN 202210603114 A CN202210603114 A CN 202210603114A CN 115020254 A CN115020254 A CN 115020254A
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- adhesive layer
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- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000001755 magnetron sputter deposition Methods 0.000 title claims abstract description 29
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 24
- 239000012790 adhesive layer Substances 0.000 claims abstract description 101
- 239000010410 layer Substances 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 238000005520 cutting process Methods 0.000 claims abstract description 31
- 238000004544 sputter deposition Methods 0.000 claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 7
- -1 polytetrafluoroethylene Polymers 0.000 claims description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 7
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 8
- 238000007747 plating Methods 0.000 abstract description 8
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000007711 solidification Methods 0.000 description 6
- 230000008023 solidification Effects 0.000 description 6
- 238000000926 separation method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a magnetron sputtering method of a packaged product, which comprises the following steps: providing a substrate, and arranging a curing adhesive layer on the substrate; providing a first preset energy value to the cured adhesive layer to partially cure the cured adhesive layer; cutting the substrate into a plurality of packages, wherein the cured adhesive layer is cut into a plurality of sub-cured adhesive layers, and each package is adhered with one sub-cured adhesive layer; providing a second preset energy value to the sub-cured bonding layer so as to completely cure the sub-cured bonding layer; arranging an adhesive layer on the tray, and attaching the completely cured sub-cured adhesive layer on the adhesive layer to attach the package member to the tray; the plurality of packages on the tray are subjected to a sputtering process. The magnetron sputtering method of the packaging product has the advantages of high cutting yield and difficult generation of the overflow plating defect.
Description
Technical Field
The invention relates to the technical field of new fans, in particular to a magnetron sputtering method for a packaged product.
Background
With the rapid development of System In Package (SiP) technology, the functions of electronic products become more and more complex, and the problem of electromagnetic interference between SiP modules becomes more and more prominent. The EMI electromagnetic shielding technology can effectively weaken the electromagnetic interference between electronic components of SIP products and the external environment by utilizing the metal shielding layer. For BGA (Ball Grid Array, high density surface mount package) devices, due to the height of the solder balls, the direct magnetron sputtering is prone to generate an over-plating defect, resulting in poor appearance. In order to overcome the defects, a curing adhesive layer is preset on a packaged product, and the curing adhesive layer is completely cured and then subjected to cutting and subsequent magnetron sputtering steps, but the bonding force between the curing adhesive layer and a substrate is reduced after the curing adhesive layer is completely cured, so that the curing adhesive layer is easy to separate from the substrate in the cutting process, and the yield of the product is reduced; and the gap between the cured bonding layer and the substrate is increased due to the cutting and pulling process, so that the over-plating defect is caused.
In view of the above, there is a need to provide a new magnetron sputtering method for packaging products to solve or at least alleviate the above technical drawbacks.
Disclosure of Invention
The invention mainly aims to provide a magnetron sputtering method for a packaged product, and aims to solve the technical problems that the magnetron sputtering method for the packaged product in the prior art is low in product cutting yield and has an excessive plating risk.
In order to solve the above problems, the present invention further provides a magnetron sputtering method for packaging products, which comprises the following steps:
providing a substrate, and arranging a curing bonding layer on the substrate;
providing a first preset energy value to the cured adhesive layer to partially cure the cured adhesive layer;
cutting the substrate into a plurality of packages, wherein the cured adhesive layer is cut into a plurality of sub-cured adhesive layers, and each package is adhered with one sub-cured adhesive layer;
providing a second preset energy value to the sub-cured bonding layer so that the sub-cured bonding layer is completely cured;
arranging an adhesive layer on a tray, and attaching the sub-curing adhesive layer which is completely cured on the adhesive layer so as to attach the packaging piece on the tray;
and carrying out sputtering treatment on the plurality of packages on the tray.
In one embodiment, define: the standard energy value is a first preset energy value and a second preset energy value, the first preset energy value is 30% -70% of the standard energy value, and the second preset energy value is 30% -70% of the standard energy value.
In one embodiment, the first predetermined energy value is 40% to 60% of the standard energy value, and the second predetermined energy value is 40% to 60% of the standard energy value.
In one embodiment, the cured adhesive layer is an optical adhesive layer.
In one embodiment, a solder ball is disposed on one side of the substrate, and the cured adhesive layer is disposed on one side of the substrate facing the solder ball and covers the solder ball.
In one embodiment, the step of providing a first predetermined energy value to the cured adhesive layer comprises:
providing a first preset energy value to the cured adhesive layer by an ultraviolet lamp;
the step of providing a second predetermined energy value to the cured bond layer comprises:
and providing a second preset energy value to the cured bonding layer through an ultraviolet lamp.
In one embodiment, the step of providing the first preset energy value to the cured adhesive layer by an ultraviolet lamp comprises:
providing a first preset energy value to the cured adhesive layer by controlling the frequency or time of an ultraviolet lamp;
the step of providing a second preset energy value to the cured adhesive layer by means of an ultraviolet lamp comprises:
and providing a second preset energy value to the cured bonding layer by controlling the frequency or time of the ultraviolet lamp.
In one embodiment, after the step of attaching the sub-curing adhesive layer to the adhesive layer to attach the package to the tray and before the step of performing the sputtering process on the plurality of packages on the tray, the method further includes the steps of:
and placing the tray on a carrier of a laminating machine, and pressing the packaging piece on the tray through the laminating machine.
In one embodiment, the step of providing the adhesive layer on the tray includes:
and coating polytetrafluoroethylene on the tray, and arranging the adhesive layer on the polytetrafluoroethylene.
In an embodiment, after the step of separating the package from the tray, the method further includes:
separating the package from the tray to obtain a packaged product;
and removing the adhesive layer on the tray.
In the scheme, the magnetron sputtering method for packaging the product comprises the following steps: providing a substrate, and arranging a curing adhesive layer on the substrate; providing a first preset energy value to the cured adhesive layer to partially cure the cured adhesive layer; cutting the substrate into a plurality of packages, wherein the solidified bonding layer is cut into a plurality of sub-solidified bonding layers, and each package is bonded with one sub-solidified bonding layer; providing a second preset energy value to the sub-curing adhesive layer so as to completely cure the sub-curing adhesive layer; arranging an adhesive layer on the tray, and attaching the completely cured sub-cured adhesive layer on the adhesive layer to attach the package member to the tray; the plurality of packages on the tray are subjected to a sputtering process. The curing of the cured bonding layer is divided into two parts, namely before cutting and after cutting, the cured bonding layer is partially cured through a first preset energy value, compared with the case that the cured bonding layer is completely cured, the cured bonding layer has certain bonding degree through partial curing, the cured bonding layer is not easy to fall off from the substrate in the subsequent cutting process, and the cutting yield is improved; and can make the solidification adhesive linkage glue tight base plate, follow-up cutting is dragged the process, is difficult to lead to solidification adhesive linkage and base plate clearance increase, reduces the risk that excessive plating defect produced. And after the cutting is finished, the sub-cured adhesive layer which is partially cured is completely cured, so that the separation after the subsequent sputtering forming is not influenced. The curing adhesive layer is an optical adhesive layer, curing can occur under the condition that the optical adhesive layer has energy input (such as illumination), and the curing degree is related to the total input amount of energy.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic flow chart of a magnetron sputtering method for packaging products according to a first embodiment of the present invention;
FIG. 2 is a schematic flow chart of a magnetron sputtering method for packaging products according to a second embodiment of the present invention;
FIG. 3 is a schematic flow chart of a magnetron sputtering method for packaging products according to a third embodiment of the present invention;
fig. 4 is a schematic structural diagram of a package, an adhesive layer, a sub-curing adhesive layer and a tray in the magnetron sputtering method for packaging a product according to the present invention.
1. A package; 2. sub-curing the bonding layer; 3. a bonding layer; 4. a tray.
The implementation, functional features and advantages of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive efforts based on the embodiments of the present invention, are within the scope of protection of the present invention.
It should be noted that all the directional indicators (such as the upper and lower … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
Moreover, the technical solutions in the embodiments of the present invention may be combined with each other, but it is necessary to be able to be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention.
In order to solve the above problems, referring to fig. 1 and 4, the present invention further provides a magnetron sputtering method for packaging a product, including the following steps:
s10, providing a substrate, and arranging a curing adhesive layer on the substrate;
the substrate here refers to a whole plate, the substrate comprises a plurality of packages 1, such as 2000 or 3000, and a cured adhesive layer is now coated or otherwise disposed on the substrate, the cured adhesive layer has a certain adhesion degree before curing, the adhesion degree disappears after full curing, and the adhesion degree is smaller when the curing degree is larger; conversely, the smaller the degree of curing, the greater the degree of adhesion. Specifically, the package may be a BGA device, the solder ball is disposed on one side of the substrate, and the cured adhesive layer is disposed on a side of the substrate facing the solder ball and covers the solder ball. The solder balls are coated, so that the phenomenon that the appearance is poor due to the overflow plating defect caused by the high influence of the solder balls in the subsequent sputtering process is avoided.
S20, providing a first preset energy value to the solidified bonding layer so that the solidified bonding layer is partially solidified;
when the energy value is 100%, the curing bonding layer is completely cured; the step is first curing, the cured bonding layer is partially cured through a first preset energy value, compared with the case that the cured bonding layer is completely cured, the cured bonding layer has a certain bonding degree through partial curing, the cured bonding layer is not easy to fall off from the substrate in the subsequent cutting process, and the cutting yield is improved; and can make the solidification adhesive linkage glue tight base plate, follow-up cutting is dragged the in-process, is difficult to lead to solidification adhesive linkage and base plate clearance increase, reduces the risk that the excessive plating defect produced.
S30, cutting the substrate into a plurality of packages 1, cutting the solidified bonding layer into a plurality of sub-solidified bonding layers 2, and bonding one sub-solidified bonding layer 2 on each package 1;
the whole solidified bonding layer is coated on one side of the substrate, and the solidified bonding layer is cut into sub-solidified bonding layers 2 in the process of cutting the substrate;
s40, providing a second predetermined energy value to the sub-cured adhesive layer 2, so that the sub-cured adhesive layer 2 is completely cured;
the second part is solidified, and after cutting is finished, the partially solidified sub-solidified bonding layer 2 is completely solidified, so that subsequent separation is facilitated;
s50, placing the adhesive layer 3 on the tray 4, and attaching the completely cured sub-cured adhesive layer 2 on the adhesive layer 3 to attach the package 1 to the tray 4;
the tray 4 may be a tool, and the adhesive layer 3 is disposed on the tray 4 to adhere and fix the package 1 to the tray 4 and prevent movement during magnetron sputtering. The adhesive layer 3 is mainly used for adhesion, and a common glue, such as an optical glue or an IC glue, can be used.
S60, performing sputtering processing on the plurality of packages 1 on the tray 4;
since the sub-cured adhesive layer 2 is adhered to the adhesive layer 3, the top surface and four side surfaces of the package member 1 can be subjected to sputtering treatment to form a thin film to play a role of electromagnetic shielding. Since the bottom surface of the package 1 provided with the sub-cured adhesive layer 2 is used for electrical connection with other components, a sputtering process is not required.
In the embodiment of the invention, the curing of the cured bonding layer is divided into two parts, namely before cutting and after cutting, the cured bonding layer is partially cured firstly through the first preset energy value, compared with the case of completely curing the cured bonding layer, the cured bonding layer has certain bonding degree through partial curing, the cured bonding layer is not easy to fall off from the substrate in the subsequent cutting process, and the cutting yield is improved; and can make the solidification adhesive linkage glue tight base plate, follow-up cutting is dragged the process, is difficult to lead to solidification adhesive linkage and base plate clearance increase, reduces the risk that excessive plating defect produced. And after the cutting is finished, the sub-cured adhesive layer 2 which is partially cured is completely cured, so that the separation after the subsequent sputtering forming is not influenced. The curing adhesive layer is an optical adhesive layer, the optical adhesive layer can be cured under the condition of energy input (such as illumination), the curing degree is related to the total input amount of energy, and the optical adhesive is cured in an energy accumulation type mode, so that the staged curing of the optical adhesive can be realized by adopting a staged energy input mode. This embodiment is particularly suitable for system in package products.
In one embodiment, define: the standard energy value is a first preset energy value and a second preset energy value, the first preset energy value is 30% -70% of the standard energy value, and the second preset energy value is 30% -70% of the standard energy value. Further, the first predetermined energy value is 40% to 60% of the standard energy value, and the second predetermined energy value is 40% to 60% of the standard energy value. The standard energy value refers to the energy value required to fully cure the optical adhesive layer. The ratio of the first preset energy value to the standard energy value is a first percentage, the ratio of the second preset energy value to the standard energy value is a second percentage, the first percentage is 30-70%, and the second percentage is 30-70%; wherein the first percentage + the second percentage is 100%. More specifically, the first percentage has a value of 40% to 60% and the second percentage has a value of 40% to 60%. The first percentage value also represents the degree of cure of the cured bond layer, e.g., when the first percentage value is 60%, it indicates that the degree of cure of the cured bond layer is 60%, corresponding to a viscosity of 40%. The first percentage value cannot be too large, which means that the adhesion is too small, the cured adhesive layer does not adhere well to the substrate, and is liable to fall off during cutting or to cause flash due to an increase in the gap between the cured adhesive layer and the substrate. Of course, the first percentage value cannot be too small, which indicates that the cured adhesive layer has a high viscosity, is easily stuck to a cutter during cutting, is inconvenient to cut, and is not easily separated from the adjacent package members 1 after cutting. Experiments show that the value range is designed to be appropriate.
In one embodiment, the step of S20 includes:
providing a first preset energy value to the curing bonding layer through an ultraviolet lamp;
the step of S40 includes:
and providing a second preset energy value to the cured bonding layer through an ultraviolet lamp.
Specifically, the first and second preset energy values may be supplied to the cured adhesive layer by controlling the frequency or time of the ultraviolet lamp. Taking the control of the irradiation time of the ultraviolet lamp as an example, if the irradiation time of 30 minutes is required at a certain frequency to completely cure the cured adhesive layer, when the first percentage value is set to 60%, the irradiation of the ultraviolet lamp is controlled for 18 minutes at the first curing and for 12 minutes at the second curing after the substrate is cut.
Referring to fig. 2, in an embodiment, after the step of S50 and before the step of S60, the method further includes the steps of:
s51, the tray 4 is placed on a carrier of a bonding machine, and the package 1 is pressed against the tray 4 by the bonding machine. The bottom of the sub-cured adhesive layer 2 is adhered to the adhesive layer 3 by a press so that the package member 1 can be firmly mounted on the tray 4.
In one embodiment, the step of S50 includes:
the tray 4 is coated with polytetrafluoroethylene, and the adhesive layer 3 is provided on the polytetrafluoroethylene. The tray 4 is coated with a layer of polytetrafluoroethylene first, so that the adhesive layer 3 can be separated from the tray 4 more easily.
Referring to fig. 3, in an embodiment, after the step of S60, the method further includes:
s70, the package 1 is separated from the tray 4.
The package member 1 can be taken away by a separator, the sub-cured adhesive layer 2 and the adhesive layer 3 are both left on the tray 4, and the sputtering molding of the package member 1 is completed to obtain a packaged product.
S80, the adhesive layer 3 is removed from the tray 4. The adhesive layer 3 can be removed by rubber rolling or air pressure, which is beneficial to the recycling of the tray 4.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents made by the claims and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A magnetron sputtering method of a packaged product is characterized by comprising the following steps:
providing a substrate, and arranging a curing bonding layer on the substrate;
providing a first preset energy value to the cured adhesive layer to partially cure the cured adhesive layer;
cutting the substrate into a plurality of packages, wherein the cured adhesive layer is cut into a plurality of sub-cured adhesive layers, and each package is adhered with one sub-cured adhesive layer;
providing a second preset energy value to the sub-cured bonding layer so that the sub-cured bonding layer is completely cured;
arranging an adhesive layer on a tray, and attaching the sub-curing adhesive layer which is completely cured on the adhesive layer so as to attach the packaging piece on the tray;
and carrying out sputtering treatment on the plurality of packages on the tray.
2. Magnetron sputtering method for packaging products according to claim 1, characterized in that it is defined: the standard energy value is a first preset energy value and a second preset energy value, the first preset energy value is 30% -70% of the standard energy value, and the second preset energy value is 30% -70% of the standard energy value.
3. The magnetron sputtering method for packaging a product as claimed in claim 2, wherein the first predetermined energy value is 40% to 60% of the standard energy value, and the second predetermined energy value is 40% to 60% of the standard energy value.
4. The magnetron sputtering method for packaging a product as claimed in claim 1, wherein the cured adhesive layer is an optical glue layer.
5. The magnetron sputtering method for packaging product as claimed in claim 1, wherein a solder ball is disposed on one side of said substrate, and said cured adhesive layer is disposed on a side of said substrate facing said solder ball and covers said solder ball.
6. The magnetron sputtering method for packaging a product according to any one of claims 1 to 5, wherein the step of providing a first predetermined energy value to the cured adhesive layer comprises:
providing a first preset energy value to the cured adhesive layer by an ultraviolet lamp;
the step of providing a second predetermined energy value to the cured bond layer comprises:
and providing a second preset energy value to the cured bonding layer through an ultraviolet lamp.
7. The magnetron sputtering method for packaging a product as claimed in claim 6, wherein said step of providing a first predetermined energy value to said cured adhesive layer by means of an ultraviolet lamp comprises:
providing a first preset energy value to the cured adhesive layer by controlling the frequency or time of an ultraviolet lamp;
the step of providing a second preset energy value to the cured adhesive layer by means of an ultraviolet lamp comprises:
and providing a second preset energy value to the cured bonding layer by controlling the frequency or time of the ultraviolet lamp.
8. The magnetron sputtering method for packaging a product as claimed in any one of claims 1 to 5, wherein, after the step of attaching the sub-cured adhesive layer completely cured to the adhesive layer to attach the package to the tray, and before the step of subjecting the plurality of packages on the tray to the sputtering process, the magnetron sputtering method further comprises the steps of:
and placing the tray on a carrier of a laminating machine, and pressing the packaging piece on the tray through the laminating machine.
9. The magnetron sputtering method for packaging products according to any one of claims 1 to 5, wherein the step of providing the adhesive layer on the tray comprises:
and coating polytetrafluoroethylene on the tray, and arranging the adhesive layer on the polytetrafluoroethylene.
10. The magnetron sputtering method for packaging a product according to any one of claims 1 to 5, wherein said step of separating said package from said tray is followed by further comprising:
separating the package from the tray to obtain a packaged product;
and removing the adhesive layer on the tray.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210603114.XA CN115020254A (en) | 2022-05-30 | 2022-05-30 | Magnetron sputtering method for packaging product |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210603114.XA CN115020254A (en) | 2022-05-30 | 2022-05-30 | Magnetron sputtering method for packaging product |
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| CN115020254A true CN115020254A (en) | 2022-09-06 |
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| CN202210603114.XA Pending CN115020254A (en) | 2022-05-30 | 2022-05-30 | Magnetron sputtering method for packaging product |
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