CN115463907B - Device and method for removing dust by utilizing high acceleration and deceleration characteristics of linear motor - Google Patents
Device and method for removing dust by utilizing high acceleration and deceleration characteristics of linear motor Download PDFInfo
- Publication number
- CN115463907B CN115463907B CN202211279334.8A CN202211279334A CN115463907B CN 115463907 B CN115463907 B CN 115463907B CN 202211279334 A CN202211279334 A CN 202211279334A CN 115463907 B CN115463907 B CN 115463907B
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- Prior art keywords
- air flow
- wafer
- sliding table
- linear sliding
- linear
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- 239000000428 dust Substances 0.000 title claims abstract description 41
- 230000001133 acceleration Effects 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 15
- 230000033001 locomotion Effects 0.000 claims abstract description 24
- 230000007704 transition Effects 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims 3
- 235000012431 wafers Nutrition 0.000 abstract description 64
- 230000003749 cleanliness Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 238000007664 blowing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a device and a method for dedusting by utilizing the high acceleration and deceleration characteristic of a linear motor, which relate to the field of wafer dedusting and aim at the problems in the prior art, and the technical scheme comprises a linear sliding table and the linear motor for driving the linear sliding table to do linear reciprocating motion, wherein the upper surface of the linear sliding table is fixed with a rotary support which is arranged in parallel with the linear sliding table through at least two mounting supports, and the inner side of the rotary support is provided with a wafer sucker for adsorbing wafers; and air flow accelerating structures are symmetrically fixed on two sides of the mounting bracket, and the air flow accelerating structures pressurize air flow in the moving process of the linear sliding table and blow the air flow to the wafer. The invention removes dust on the surface of the wafer by the pressurized air flow generated during the high-speed movement and the matching movement of the linear motor and the vibration generated by the impact, thereby avoiding the damage of the wafer, and having good dust removing effect and high cleanliness.
Description
Technical Field
The invention relates to the field of wafer dust removal, in particular to a device and a method for removing dust by utilizing the high acceleration and deceleration characteristic of a linear motor.
Background
Wafer dust removal is an important process of wafer processing, and the surface of the wafer cannot be removed by high-pressure gas or using articles, so that the body structure of the wafer can be damaged, the wafer is damaged, and the wafer damage is irreversible;
at present, the main stream dust removing mode is to remove dust through dust collection equipment adsorption or ultrasonic equipment, and the two modes have larger defects, such as that the dust collection equipment cannot adsorb dust with stronger adhesive force on the surface of a wafer, and the structural damage possibility of the ultrasonic equipment to the wafer is larger.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides equipment and a method for removing dust attached to the surface of a wafer by utilizing the high acceleration and deceleration characteristic of a linear motor and combining inertial vibration.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the device for removing dust by utilizing the high acceleration and deceleration characteristic of the linear motor is used for removing dust on the surface of a wafer and comprises a linear sliding table and a linear motor for driving the linear sliding table to do linear reciprocating motion, wherein a rotating support which is arranged in parallel with the linear sliding table is fixed on the upper surface of the linear sliding table through at least two mounting supports, and a wafer sucker for sucking the wafer is arranged on the inner side of the rotating support;
and air flow accelerating structures are symmetrically fixed on two sides of the mounting bracket, and the air flow accelerating structures pressurize air flow in the moving process of the linear sliding table and blow the air flow to the wafer.
Preferably, the air flow accelerating structure is provided with an air flow exhaust pipeline which is fixed on the outer side of the mounting bracket and moves towards one side of the linear sliding table, and a plurality of air flow suction frames facing the wafer are arranged on the air flow exhaust pipeline along the axial direction;
the connection part of the air flow discharge pipeline and the air flow suction frame is in transition through a smooth curved surface.
Preferably, the opening of the air flow discharge pipeline is larger than the air flow outlet of the air flow suction frame, and the pipe diameter of the air flow suction frame is gradually reduced from the joint of the air flow suction frame and the air flow discharge pipeline to the outlet of the air flow suction frame;
when the air flow flows to the air flow suction frame through the air flow discharge duct, the air flow is pressurized and a high-speed air flow is blown to the wafer.
Preferably, the wafer sucker is rotatably arranged at the inner side of the rotary bracket through a rotary shaft, at least one downward extending balancing weight is fixed on the rotary shaft, and a locking screw is fixed at the front side of the balancing weight;
an arc-shaped through groove for the locking screw to swing is formed in the surface of the rotating bracket, which is perpendicular to the locking screw;
and the locking screw is also provided with a locking nut which is matched with the threads of the locking screw to adjust the swinging state of the balancing weight.
Preferably, when the locking screw and the locking nut are in a locking state, the balancing weight does not swing along with the movement of the linear sliding table, and the wafer sucker is always in a horizontal state in the process of moving of the linear sliding table.
Preferably, when the locking screw and the locking nut are in an unlocked state, the balancing weight swings with the movement of the linear sliding table due to inertia, and in the process of moving the linear sliding table, the wafer sucker adjusts the swinging state according to the moving direction of the linear sliding table.
The invention also provides a method for removing dust by utilizing the high acceleration and deceleration characteristic of the linear motor, and the device for removing dust comprises the following steps:
step one: fixing a wafer, placing the wafer to be dedusted on a wafer chuck, and adsorbing and fixing the wafer through the wafer chuck;
step two: the linear sliding table is driven to move at a high speed, the moving direction of the linear sliding table is continuously switched, and dust on the surface of the wafer is removed by utilizing air flow generated by the high-speed movement and vibration generated by inertial vibration;
step three: and after the dust removal is completed, the wafer is taken down.
Preferably, before the second step, the locking state between the locking nut and the locking screw is adjusted according to the actual dust removal requirement of the wafer.
The beneficial effects of the invention are as follows:
the invention removes dust on the surface of the wafer by the pressurized air flow generated during the high-speed movement and the matching movement of the linear motor and the vibration generated by the impact, thereby avoiding the damage of the wafer, and having good dust removing effect and high cleanliness.
Drawings
Fig. 1 is a schematic top view of a device for removing dust by using high acceleration and deceleration characteristics of a linear motor according to the present invention.
Fig. 2 is a schematic diagram of a front view structure of a device for removing dust by using high acceleration and deceleration characteristics of a linear motor according to the present invention.
FIG. 3 is a schematic view of an installation structure of an airflow accelerating structure in the present invention.
Fig. 4 is an enlarged schematic view of the structure at a in fig. 3.
FIG. 5 is a schematic view of the swing direction of the wafer chuck and the direction of air flow blowing when the linear slide is moved in one direction with the locking screw and the locking nut unlocked;
FIG. 6 is a schematic view of the swing direction of the wafer chuck and the direction of air flow blowing when the linear slide moves in the other direction with the locking screw and the locking nut unlocked;
reference numerals in the drawings: a 10 linear motor; 20 linear sliding tables; 30 airflow accelerating structure; 31 air flow suction frame; 32 air flow discharge duct; 40 wafer chuck; 50 rotating the bracket; a 51 rotation shaft; 52 arc-shaped through grooves; 53 balancing weights; 54 locking the nut; 60 mounting brackets.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Example 1
As shown in fig. 1 and 2, the present invention proposes a device for removing dust by using high acceleration and deceleration characteristics of a linear motor, which is used for removing dust on a surface of a wafer, and comprises a linear sliding table 20 and a linear motor 10 for driving the linear sliding table 20 to perform linear reciprocating motion, wherein the speed of the linear motor 10 is 5-20 times that of a conventional ball screw, for acceleration of the linear sliding table 20, the speed of the conventional ball screw is 120m/min, the acceleration is 1.5g, and the speed of the linear motor can reach 420m/min, and the acceleration can reach 10g, specifically, for the wafer, the load is lower according to the load;
the upper surface of the linear sliding table 20 is fixedly provided with a rotary bracket 50 which is arranged in parallel with the linear sliding table 20 through at least two mounting brackets 60, the inner side of the rotary bracket 50 is provided with a wafer sucker 40 for sucking wafers, and the wafers can not be separated under the high-speed movement action of a linear motor after the wafers are sucked by the wafer sucker 40;
as shown in fig. 3, the air flow accelerating structures 30 are symmetrically fixed on both sides of the mounting bracket 60, and the air flow accelerating structures 30 pressurize the air flow during the movement of the linear sliding table 20 and then blow the air flow to the wafer.
The air flow accelerating structure 30 has an air flow discharge duct 32 fixed to the outside of the mounting bracket 60 toward the moving side of the linear slide 20, the air flow discharge duct 32 being arranged with a plurality of air flow suction frames 31 toward the wafer in the axial direction;
the junction of the air flow discharge duct 32 and the air flow suction frame 31 is transited by a smooth curved surface.
The opening of the air flow discharge pipeline 32 is larger than the air flow outlet of the air flow suction frame 31, and the pipe diameter of the air flow suction frame 31 is gradually reduced from the joint of the air flow suction frame 31 and the air flow discharge pipeline 32 to the outlet of the air flow suction frame 31;
when the air flow flows to the air flow suction frame 31 through the air flow discharge duct 32, the air flow is pressurized, and a high-speed air flow is blown to the wafer.
During the movement of the linear sliding table 20, air enters through the air flow discharge pipeline 32 and is sprayed out by the air flow suction frames 31, and the air flow is accelerated and sprayed out due to the structure of the air flow suction frames 31, so that the linear sliding table 20 is utilized to move at a high speed, and meanwhile, the air flow sprayed out by the air flow suction frames 31 is matched to assist in blowing out dust on the surface of the wafer.
Referring to fig. 4, the wafer chuck 40 is rotatably mounted at the inner side of the rotating bracket 50 through a rotating shaft 51, at least one balancing weight 53 extending downward is fixed on the rotating shaft 51, and a locking screw is fixed at the front side of the balancing weight 53;
the surface of the rotary bracket 50 perpendicular to the locking screw is provided with an arc-shaped through groove 52 for the locking screw to swing;
the locking screw is also provided with a locking nut 54 which is matched with the thread of the locking screw to adjust the swinging state of the balancing weight 53.
When the locking screw and the locking nut 54 are in the locked state, the balancing weight 53 does not swing along with the movement of the linear sliding table 20, and the wafer chuck 40 is always in the horizontal state during the movement of the linear sliding table 20.
When the lock screw and the lock nut 54 are in the unlocked state, the weight 53 swings due to inertia along with the movement of the linear slide table 20, and the wafer chuck 40 adjusts the swing state according to the movement direction of the linear slide table 20 during the movement of the linear slide table 20.
As shown in fig. 5 and 6, when the locking screw and the locking nut 54 are in an unlocked state, the wafer chuck 40 rotates around the rotating shaft 51 under the action of the balancing weight 53 along with the movement of the linear sliding table 20, and through the rotation angle being controlled within 30 degrees, the locking screw can strike the edge of the arc-shaped through groove 52 to generate vibration, dust on the wafer surface vibrates through layer-by-layer transmission, and dust on the wafer surface is further assisted in removing.
Example two
The invention also provides a method for removing dust by utilizing the high acceleration and deceleration characteristic of the linear motor, and the device for removing dust comprises the following steps:
step one: fixing a wafer, placing the wafer to be dedusted on a wafer chuck 40, and adsorbing and fixing the wafer through the wafer chuck 40;
step two: the linear sliding table 20 is driven to move at a high speed, the moving direction of the linear sliding table 20 is continuously switched, and dust on the surface of the wafer is removed by utilizing air flow generated by the high-speed movement and vibration generated by inertial vibration;
step three: and after the dust removal is completed, the wafer is taken down.
Before the second step, according to the actual dust removal requirement of the wafer, the locking state between the locking nut and the locking screw rod is adjusted. In some cases, the wafer chuck 40 may be in a horizontal state without separating the lock nut 54 from the lock screw.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (3)
1. The device for removing dust by utilizing the high acceleration and deceleration characteristic of the linear motor is used for removing dust on the surface of a wafer and comprises a linear sliding table and the linear motor for driving the linear sliding table to do linear reciprocating motion, and is characterized in that a rotating bracket which is arranged in parallel with the linear sliding table is fixed on the upper surface of the linear sliding table through at least two mounting brackets, and a wafer sucker for sucking the wafer is arranged on the inner side of the rotating bracket;
the two sides of the mounting bracket are symmetrically fixed with air flow accelerating structures, and the air flow accelerating structures pressurize air flow in the moving process of the linear sliding table and then blow the air flow to the wafer;
the wafer sucker is rotatably arranged at the inner side of the rotary bracket through a rotary shaft, at least one downward extending balancing weight is fixed on the rotary shaft, and a locking screw is fixed at the front side of the balancing weight;
an arc-shaped through groove for the locking screw to swing is formed in the surface of the rotating bracket, which is perpendicular to the locking screw;
the locking screw is also provided with a locking nut which is matched with the screw thread to adjust the swinging state of the balancing weight;
when the locking screw rod and the locking nut are in a locking state, the balancing weight does not swing along with the movement of the linear sliding table, and the wafer sucker is always in a horizontal state in the process of moving of the linear sliding table;
when the locking screw rod and the locking nut are in an unlocked state, the balancing weight swings along with the movement of the linear sliding table due to inertia, and in the process of moving the linear sliding table, the wafer sucker adjusts the swinging state according to the moving direction of the linear sliding table;
the equipment adopts the following steps to remove dust:
step one: fixing a wafer, placing the wafer to be dedusted on a wafer sucker, adsorbing and fixing the wafer by the device through the wafer sucker, and adjusting the locking state between a locking nut and a locking screw according to the actual dedusting requirement of the wafer;
step two: adjusting the locking screw and the locking nut to an unlocked state;
step three: the linear sliding table is driven to move at a high speed, the moving direction of the linear sliding table is continuously switched, and dust on the surface of the wafer is removed by utilizing air flow generated by the high-speed movement and vibration generated by inertial vibration;
step four: and after the dust removal is completed, the wafer is taken down.
2. The apparatus for removing dust using high acceleration and deceleration characteristics of a linear motor according to claim 1, wherein the air flow accelerating structure has an air flow discharge duct fixed to an outer side of the mounting bracket toward a moving side of the linear table, the air flow discharge duct being arranged with a plurality of air flow suction frames toward the wafer in an axial direction;
the connection part of the air flow discharge pipeline and the air flow suction frame is in transition through a smooth curved surface.
3. The apparatus for removing dust by utilizing high acceleration and deceleration characteristic of linear motor according to claim 2, wherein the opening of the air flow discharging pipe is larger than the air flow outlet of the air flow sucking frame, the pipe diameter of the air flow discharging pipe is gradually reduced from the connection of the air flow sucking frame and the air flow discharging pipe to the outlet of the air flow sucking frame;
when the air flow flows to the air flow suction frame through the air flow discharge duct, the air flow is pressurized and a high-speed air flow is blown to the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211279334.8A CN115463907B (en) | 2022-10-19 | 2022-10-19 | Device and method for removing dust by utilizing high acceleration and deceleration characteristics of linear motor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211279334.8A CN115463907B (en) | 2022-10-19 | 2022-10-19 | Device and method for removing dust by utilizing high acceleration and deceleration characteristics of linear motor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115463907A CN115463907A (en) | 2022-12-13 |
| CN115463907B true CN115463907B (en) | 2024-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211279334.8A Active CN115463907B (en) | 2022-10-19 | 2022-10-19 | Device and method for removing dust by utilizing high acceleration and deceleration characteristics of linear motor |
Country Status (1)
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| CN (1) | CN115463907B (en) |
Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH052781A (en) * | 1991-06-26 | 1993-01-08 | Dainippon Ink & Chem Inc | Method for removing dust and dirt sticking to surface of substrate for optical disk |
| JPH1055647A (en) * | 1996-08-12 | 1998-02-24 | Fuji Photo Film Co Ltd | Cartridge for recording medium |
| JPH11134789A (en) * | 1997-10-31 | 1999-05-21 | Fuji Photo Film Co Ltd | Magnetic disk driving device |
| EP1533423A1 (en) * | 2003-11-18 | 2005-05-25 | Sec Envel | Method for shock absorbing on a road barrier and barrier therefor |
| CN204194280U (en) * | 2014-09-30 | 2015-03-11 | 瑞安市宏发电器有限公司 | Automatic dust removing, except powder device |
| CN204479899U (en) * | 2015-03-17 | 2015-07-15 | 燕山大学里仁学院 | Multimedia overhead projector curtain spool stationary installation |
| CN106891083A (en) * | 2017-05-02 | 2017-06-27 | 航天科工哈尔滨风华有限公司 | A kind of Three Degree Of Freedom for TIG automatic surfacings can water-cooled workbench |
| CN106984592A (en) * | 2017-06-08 | 2017-07-28 | 福建省将乐县长兴电子有限公司 | A kind of crystal oscillator produces surface dust collection device |
| CN107138477A (en) * | 2017-06-29 | 2017-09-08 | 杭州小橙工业设计有限公司 | A kind of oscillatory type Chinese medicinal material dust removal machine |
| CN206838719U (en) * | 2017-06-08 | 2018-01-05 | 福建省将乐县长兴电子有限公司 | A kind of crystal oscillator high-effective dust-removing equipment |
| CN109706876A (en) * | 2018-12-26 | 2019-05-03 | 长沙中联重科环境产业有限公司 | Pneumatic plant and sweeping machine |
| CN208875210U (en) * | 2018-09-12 | 2019-05-21 | 青岛聚恒电力设备有限公司 | A kind of scarer for field electric tower |
| CN209729883U (en) * | 2019-04-12 | 2019-12-03 | 若名芯半导体科技(苏州)有限公司 | A kind of wash chamber |
| CN210474833U (en) * | 2019-07-12 | 2020-05-08 | 北海翰博士科技有限公司 | A central diffusion formula air current dust removal subassembly for touch panel pressfitting |
| CN112271132A (en) * | 2020-10-28 | 2021-01-26 | 上海中欣晶圆半导体科技有限公司 | Method for removing large particles on surface of polished surface of silicon wafer |
| CN212856752U (en) * | 2020-08-10 | 2021-04-02 | 天津一达成机电设备有限公司 | A integral type slip table for linear guide |
| CN112878867A (en) * | 2021-01-28 | 2021-06-01 | 何超 | Domestic sliding door with cleaning function |
| CN113522859A (en) * | 2021-09-14 | 2021-10-22 | 徐州腾龙交通运输设备有限公司 | Self-compensation full-coverage adsorption and wastewater collection and passive discharge integrated trailer |
| KR102429547B1 (en) * | 2021-11-09 | 2022-08-05 | (주)신승이앤씨 | Panel for removing fine dust using traffic wind, fence having the same and soundproof wall having the same |
-
2022
- 2022-10-19 CN CN202211279334.8A patent/CN115463907B/en active Active
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH052781A (en) * | 1991-06-26 | 1993-01-08 | Dainippon Ink & Chem Inc | Method for removing dust and dirt sticking to surface of substrate for optical disk |
| JPH1055647A (en) * | 1996-08-12 | 1998-02-24 | Fuji Photo Film Co Ltd | Cartridge for recording medium |
| JPH11134789A (en) * | 1997-10-31 | 1999-05-21 | Fuji Photo Film Co Ltd | Magnetic disk driving device |
| EP1533423A1 (en) * | 2003-11-18 | 2005-05-25 | Sec Envel | Method for shock absorbing on a road barrier and barrier therefor |
| CN204194280U (en) * | 2014-09-30 | 2015-03-11 | 瑞安市宏发电器有限公司 | Automatic dust removing, except powder device |
| CN204479899U (en) * | 2015-03-17 | 2015-07-15 | 燕山大学里仁学院 | Multimedia overhead projector curtain spool stationary installation |
| CN106891083A (en) * | 2017-05-02 | 2017-06-27 | 航天科工哈尔滨风华有限公司 | A kind of Three Degree Of Freedom for TIG automatic surfacings can water-cooled workbench |
| CN206838719U (en) * | 2017-06-08 | 2018-01-05 | 福建省将乐县长兴电子有限公司 | A kind of crystal oscillator high-effective dust-removing equipment |
| CN106984592A (en) * | 2017-06-08 | 2017-07-28 | 福建省将乐县长兴电子有限公司 | A kind of crystal oscillator produces surface dust collection device |
| CN107138477A (en) * | 2017-06-29 | 2017-09-08 | 杭州小橙工业设计有限公司 | A kind of oscillatory type Chinese medicinal material dust removal machine |
| CN208875210U (en) * | 2018-09-12 | 2019-05-21 | 青岛聚恒电力设备有限公司 | A kind of scarer for field electric tower |
| CN109706876A (en) * | 2018-12-26 | 2019-05-03 | 长沙中联重科环境产业有限公司 | Pneumatic plant and sweeping machine |
| CN209729883U (en) * | 2019-04-12 | 2019-12-03 | 若名芯半导体科技(苏州)有限公司 | A kind of wash chamber |
| CN210474833U (en) * | 2019-07-12 | 2020-05-08 | 北海翰博士科技有限公司 | A central diffusion formula air current dust removal subassembly for touch panel pressfitting |
| CN212856752U (en) * | 2020-08-10 | 2021-04-02 | 天津一达成机电设备有限公司 | A integral type slip table for linear guide |
| CN112271132A (en) * | 2020-10-28 | 2021-01-26 | 上海中欣晶圆半导体科技有限公司 | Method for removing large particles on surface of polished surface of silicon wafer |
| CN112878867A (en) * | 2021-01-28 | 2021-06-01 | 何超 | Domestic sliding door with cleaning function |
| CN113522859A (en) * | 2021-09-14 | 2021-10-22 | 徐州腾龙交通运输设备有限公司 | Self-compensation full-coverage adsorption and wastewater collection and passive discharge integrated trailer |
| KR102429547B1 (en) * | 2021-11-09 | 2022-08-05 | (주)신승이앤씨 | Panel for removing fine dust using traffic wind, fence having the same and soundproof wall having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115463907A (en) | 2022-12-13 |
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