CN115461857A - 一种芯片封装、电子设备及芯片封装的制备方法 - Google Patents
一种芯片封装、电子设备及芯片封装的制备方法 Download PDFInfo
- Publication number
- CN115461857A CN115461857A CN202080100136.3A CN202080100136A CN115461857A CN 115461857 A CN115461857 A CN 115461857A CN 202080100136 A CN202080100136 A CN 202080100136A CN 115461857 A CN115461857 A CN 115461857A
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- China
- Prior art keywords
- chip
- layer
- diamond
- chip package
- heat dissipation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本申请实施例提供一种芯片封装、电子设备及芯片封装的制备方法，涉及电子产品散热技术领域，芯片封装包括：芯片和复合散热衬底以及连接层，复合散热衬底通过连接层与芯片的无源面连接，复合散热衬底包括：多个金刚石片和基体层，多个金刚石片沿与芯片相平行的面布设，多个金刚石片设置在基体层内。
Description
PCT国内申请，说明书已公开。
Claims (16)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/087302 WO2021217361A1 (zh) | 2020-04-27 | 2020-04-27 | 一种芯片封装、电子设备及芯片封装的制备方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115461857A true CN115461857A (zh) | 2022-12-09 |
Family
ID=78332282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080100136.3A Pending CN115461857A (zh) | 2020-04-27 | 2020-04-27 | 一种芯片封装、电子设备及芯片封装的制备方法 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115461857A (zh) |
| WO (1) | WO2021217361A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118522707A (zh) * | 2024-07-23 | 2024-08-20 | 合肥阿基米德电子科技有限公司 | 衬板结构、集成pcb驱动结构及其双面散热模块封装结构 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1565938A4 (en) * | 2002-10-11 | 2006-03-22 | Chien-Min Sung | CARBONATED HEAT DISTRIBUTORS AND CORRESPONDING METHODS |
| JP2006261505A (ja) * | 2005-03-18 | 2006-09-28 | Mitsubishi Materials Corp | 絶縁伝熱シート |
| TW201115070A (en) * | 2011-01-13 | 2011-05-01 | yao-quan Wu | Heat dissipation substrate |
| TW201342423A (zh) * | 2012-04-13 | 2013-10-16 | Nation Chiao Tung University | 散熱基板與其製作方法 |
| US20160003563A1 (en) * | 2014-06-22 | 2016-01-07 | Thermal Management Solutions, LLC d/b/a SANTIER | Composite Structure of Tungsten Copper and Molybdenum Copper with Embedded Diamond for Higher Thermal Conductivity |
| CN110358508B (zh) * | 2019-08-02 | 2021-02-26 | 太原理工大学 | 含金刚石的复合散热材料及其制备方法 |
-
2020
- 2020-04-27 CN CN202080100136.3A patent/CN115461857A/zh active Pending
- 2020-04-27 WO PCT/CN2020/087302 patent/WO2021217361A1/zh active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118522707A (zh) * | 2024-07-23 | 2024-08-20 | 合肥阿基米德电子科技有限公司 | 衬板结构、集成pcb驱动结构及其双面散热模块封装结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021217361A1 (zh) | 2021-11-04 |
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