CN115445944A - High-voltage testing, sorting and conveying line for semiconductor components - Google Patents
High-voltage testing, sorting and conveying line for semiconductor components Download PDFInfo
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- CN115445944A CN115445944A CN202211135954.4A CN202211135954A CN115445944A CN 115445944 A CN115445944 A CN 115445944A CN 202211135954 A CN202211135954 A CN 202211135954A CN 115445944 A CN115445944 A CN 115445944A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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Abstract
According to the high-voltage testing and sorting conveying line for the semiconductor components, after the material receiving mechanism receives the material pipes loaded with the plurality of semiconductor components in the horizontal position, the material receiving mechanism is driven by the overturning driving mechanism to be in butt joint with the automatic blanking mechanism, so that the plurality of semiconductor components automatically slide into the high-voltage testing mechanism for the components along the obliquely-arranged blanking channel, the high-voltage testing of the plurality of semiconductor components is realized, the testing efficiency of the components is high, the semiconductor components are output in a rail conveying mode after the component sorting mechanism sorts the semiconductor components of each group, the position deviation generated when the semiconductor components are output is well avoided, and the using effect is good.
Description
Technical Field
The invention belongs to the technical field of high-voltage testing of semiconductor elements, and particularly relates to a high-voltage testing, sorting and conveying line for semiconductor elements.
Background
The existing electric appliance components, such as semiconductor elements, are provided with pins with input ends and output ends on two sides, after manufacturing and forming, generally perform high-voltage testing on the semiconductor elements to detect whether the performance of products is qualified, the existing high-voltage testing and sorting equipment for testing the semiconductor elements generally adopts a gripper vacuum chuck assembly to perform feeding testing and discharging sorting on the semiconductor elements, however, the gripper vacuum chuck assembly can only grip one semiconductor element at a time for testing, the working efficiency is low, and the gripper vacuum chuck assembly is adopted to grip the semiconductor elements, after the semiconductor elements are re-gripped for many times through the processes of gripping in the feeding process, releasing in the testing process, discharging and the like, a large accumulated position deviation is easily generated between the gripper and the semiconductor elements, so that the final gripper outputs the semiconductor elements to a station of a production line to generate position deviation, and the production efficiency of the production line is influenced.
It is seen that improvements and enhancements in the prior art are needed.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention is directed to overcome the shortcomings of the prior art, and to provide a high-voltage testing and sorting conveyor line for semiconductor devices, which can simultaneously perform high-voltage testing on a plurality of semiconductor devices and prevent the semiconductor devices from being displaced during discharging and outputting.
In order to achieve the purpose, the invention adopts the following technical scheme:
a high-voltage testing, sorting and conveying line for semiconductor components comprises a control module, a blanking conveying device, a high-voltage testing mechanism for the components and a component sorting mechanism; the blanking conveying device comprises an automatic blanking mechanism, a material receiving mechanism, a turnover driving mechanism and a first blocking mechanism, wherein one end of the material receiving mechanism is rotatably connected with the upstream end of the automatic blanking mechanism, the automatic blanking mechanism is provided with a blanking channel which is arranged in a downward inclining manner, the turnover driving mechanism is used for driving the material receiving mechanism to switch between a horizontal position and an inclined position, the upstream end of the material receiving mechanism is used for receiving a material pipe loaded with a plurality of semiconductor elements in the horizontal position and unloading one group of semiconductor elements in the material pipe into the blanking channel in the inclined position, and the first blocking mechanism is used for blocking and releasing the semiconductor elements in the blanking channel to convey downstream; the device high-voltage testing mechanism is arranged at the downstream of the blanking conveying device and comprises a testing conveying track, electric connection modules, a testing driving mechanism, a first power conveying mechanism and a second blocking mechanism, wherein the testing conveying track is connected with the downstream end of the blanking channel, the electric connection modules are positioned at two sides of the testing conveying track, the testing driving mechanism is used for driving the semiconductor elements of the testing conveying track to be conveyed downstream, the second blocking mechanism is used for limiting the semiconductor elements of the testing conveying track at the testing stations or releasing the semiconductor elements to be conveyed along the downstream direction, the testing driving mechanism is used for driving the two electric connection modules to respectively move or reset towards one side of the semiconductor elements, so that a plurality of electric connection terminals on the electric connection modules are respectively butted with pins of each semiconductor element one by one to carry out high-voltage power-on testing on the semiconductor elements, and the control module is used for respectively identifying the groups where unqualified semiconductor elements exist in the high-voltage power-on testing and the groups where all qualified semiconductor elements exist; the component sorting mechanism comprises a translation driving mechanism, a sorting conveying track connected with the downstream end of the testing conveying track, a component output mechanism, a component recycling mechanism, a third blocking mechanism and a second power conveying mechanism; the third blocking mechanism is used for limiting the entering semiconductor elements in the sorting conveying track, and the translation driving mechanism is used for driving the sorting conveying track to be respectively butted with the component output mechanism or the component recycling mechanism, so that the second power conveying mechanism respectively conveys the semiconductor elements of the qualified mark groups to the component output mechanism and respectively conveys the semiconductor elements of the unqualified mark groups to the partial component output mechanism.
Further, the turning driving mechanism comprises a support, a turning driving push rod and a driving arm, the driving arm is respectively connected with the upstream end of the automatic blanking mechanism and the output end of the turning driving push rod in a rotating mode, the material receiving mechanism is arranged on the driving arm, the turning driving push rod is connected to the support, and the turning driving push rod drives the driving arm to enable the material receiving mechanism to be horizontally placed on the support or obliquely butted with the automatic blanking mechanism; through the arrangement, the arrangement mode of the turnover driving mechanism is simple, and the relative turnover effect of the driving material receiving mechanism is good.
Further, the support is horizontally arranged, the support is provided with a buffer assembly, and the material receiving mechanism is placed on the support through the buffer assembly; through setting up like this, effectively avoid taking place rigid collision between receiving mechanism and the support and cause the loss, the product is used reliably.
Furthermore, at least two high-voltage component testing mechanisms are continuously arranged along the downstream direction of the blanking conveying device; through setting up like this, effectively improve components and parts high voltage test work efficiency.
Furthermore, the test driving mechanism comprises a test driving push rod and a slide rail assembly, the power connection module is arranged on the slide rail assembly, and the test driving push rod is in transmission connection with the power connection module; through setting up like this, test actuating mechanism simple structure, the drive connects the electric module to remove the effect stable, smooth.
Furthermore, the component high-voltage testing mechanism and the blanking channel are obliquely arranged in the same direction, the component high-voltage testing mechanism is horizontally arranged, and the sorting conveying track is in transitional connection with the testing conveying track through an arc guide track; by the arrangement, the semiconductor elements can be conveniently and smoothly slid into the sorting conveying track from the testing conveying track.
Furthermore, the translation driving mechanism comprises a mounting frame, and a translation driving motor, a first belt pulley, a second belt pulley and a transmission belt which are arranged on the mounting frame, the transmission belt is wound on the first belt pulley and the second belt pulley respectively, the translation driving motor is in transmission connection with the first belt pulley, the sorting conveying track is arranged on the transmission belt, and the sorting conveying track is driven by the translation driving motor to be in butt joint with the component output mechanism or the component recovery mechanism in the translation direction; through setting up like this, translation actuating mechanism simple structure, the drive letter sorting delivery track removes the effect rapidly.
Furthermore, a test conveying channel is arranged in the test conveying track, the first power conveying mechanism comprises a plurality of first conveying air paths which are arranged on the test conveying track and obliquely arranged along the downstream conveying direction and communicated with the test conveying channel, and the plurality of first conveying air paths are respectively communicated with the airflow generating device; when the translation driving mechanism drives the sorting conveying track to move relatively, the downstream end of the sorting conveying track is in butt joint with the component output mechanism, or the upstream end of the sorting conveying track is in butt joint with the component recovery mechanism; the sorting and conveying track is internally provided with a sorting and conveying channel, the second power conveying mechanism comprises a plurality of second conveying gas paths which are arranged at the top of the sorting and conveying track and are obliquely arranged along the downstream conveying direction and communicated with the sorting and conveying channel, a plurality of third conveying gas paths which are arranged at the side of the sorting and conveying track and are obliquely arranged along the downstream conveying direction and communicated with the sorting and conveying channel, and an air blowing device, wherein the plurality of second conveying gas paths and the third conveying gas paths are respectively communicated with an air flow generating device, the air flow generating device enters air flows of the sorting and conveying channel through the second conveying gas paths and the third conveying gas paths, so that semiconductor elements in the sorting and conveying channel are moved into the component output mechanism, and the air blowing device is used for generating air flows which enable the semiconductor elements in the sorting and conveying channel to move into the component recycling mechanism; through the arrangement, the power conveying mechanism is driven in an air flow transmission mode, and the moving driving effect of the semiconductor element is good.
Furthermore, two sides of the test conveying track are respectively provided with an electric connection avoiding port, and pins at two sides of the semiconductor element in the test conveying track are respectively communicated with the outer side through the corresponding electric connection avoiding ports; through the arrangement, the power connection modules on the two sides can conveniently carry out high-voltage test through the power connection avoiding ports.
Furthermore, the automatic blanking mechanism comprises a blanking conveying rail, the blanking channel is arranged in the blanking conveying rail, the blanking conveying rail is provided with a first avoiding hole corresponding to the first blocking mechanism, and a first blocking piece of the first blocking mechanism can extend into the blanking channel through the first avoiding hole to realize a blocking effect; the test conveying track is provided with a second avoiding hole corresponding to the second blocking mechanism, and a second blocking piece of the second blocking mechanism can extend into the test conveying channel through the second avoiding hole to realize a blocking effect; the sorting conveying track is provided with a third avoiding hole corresponding to the third blocking mechanism, and the third blocking piece of the third blocking mechanism can pass through the third avoiding hole and stretch into the sorting conveying channel to achieve a blocking effect.
Has the advantages that: compared with the prior art, the high-voltage testing and sorting conveyor line for the semiconductor components has the advantages that after the material receiving mechanism receives the material pipes loaded with the semiconductor components in the horizontal position, the material receiving mechanism is driven by the overturning driving mechanism to be in butt joint with the automatic blanking mechanism, so that the semiconductor components automatically slide into the high-voltage testing mechanism for the components along the obliquely-arranged blanking channels, the high-voltage testing of the semiconductor components is realized, the testing efficiency of the components is high, the semiconductor components are output in a rail conveying mode after the component sorting mechanism sorts the semiconductor components of each group, the position deviation of the semiconductor components during output is well avoided, and the using effect is good.
Drawings
Fig. 1 is a schematic diagram of a semiconductor component high-voltage testing, sorting and conveying line.
Fig. 2 is a schematic diagram of the blanking conveying device.
Fig. 3 is a schematic diagram of an automatic blanking mechanism and a material receiving mechanism.
Fig. 4 is a schematic diagram of a high-voltage testing mechanism for components.
Fig. 5 is a schematic view of a test transport track and a second blocking mechanism.
Fig. 6 is a schematic diagram of a component sorting mechanism.
Fig. 7 is a schematic view of the third conveying gas path on the sorting conveying track.
Fig. 8 is a schematic diagram of a component recovery mechanism.
Fig. 9 is a schematic diagram of the component recovery mechanism, the component output mechanism, and the component sorting mechanism.
Fig. 10 is a schematic view of a high voltage testing apparatus.
Description of the main element symbols: 1-blanking conveying device, 2-component high-voltage testing mechanism, 13-receiving mechanism, 3-component sorting mechanism, 4-tilting driving mechanism, 12-first blocking mechanism, 11-blanking conveying rail, 111-blanking channel, 5-material pipe, 51-semiconductor component, 21-testing conveying rail, 22-power connection module, 23-testing driving mechanism, 24-second blocking mechanism, 25-testing station, 20-bottom frame, 32-translation driving mechanism, 33-sorting conveying rail, 34-component output mechanism, 35-component recycling mechanism, 36-third blocking mechanism, 41-bracket, 42-tilting driving push rod, 43-driving arm, 44-buffer assembly, 231-testing driving push rod, and 232-sliding rail component, 26-arc guide rail, 321-mounting rack, 322-translation driving motor, 323-first belt pulley, 324-second belt pulley, 325-driving belt, 61-first conveying gas circuit, 611-first power conveying mechanism, 621-second power conveying mechanism, 62-second conveying gas circuit, 63-third conveying gas circuit, 27-electric avoiding port, 121-first avoiding hole, 211-testing conveying channel, 331-sorting conveying channel, 241-second avoiding hole, 361-third avoiding hole, 122-first driver, 123-first blocking piece, 242-second driver, 243-second blocking piece, 362-third driver, 363-third blocking piece, 16-fourth barrier mechanism, 351-blowing unit, 221-upper test piece, 222-lower test piece.
Detailed Description
The invention provides a high-voltage testing, sorting and conveying line for semiconductor components, which is further described in detail below by referring to the attached drawings and embodiments in order to make the purpose, technical scheme and effect of the invention clearer and clearer. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the scope of the invention.
Referring to fig. 1 to 8, the semiconductor component high-voltage testing, sorting and conveying line of the present invention includes a rack (not shown), and a control module, a blanking conveying device 1, a component high-voltage testing mechanism 2 and a component sorting mechanism 3 which are arranged on the rack; the blanking conveying device 1 comprises an automatic blanking mechanism, a material receiving mechanism 13 with one end rotatably connected with the upstream end of the automatic blanking mechanism, a swinging driving mechanism 4 and a first blocking mechanism 12, wherein the automatic blanking mechanism is provided with a blanking channel 111 arranged in a downward inclining manner, the swinging driving mechanism 4 is used for driving the material receiving mechanism 13 to be switched between a horizontal position and an inclined position, the upstream end of the material receiving mechanism 13 is used for receiving a material pipe 5 loaded with a plurality of semiconductor elements 51 in the horizontal position and unloading one group of semiconductor elements 51 in the material pipe 5 to the blanking channel 111 in the inclined position, and the first blocking mechanism 12 is used for blocking and releasing the downstream conveying of the semiconductor elements 51 in the blanking channel 111.
The component high-voltage testing mechanism 2 is arranged at the downstream of the blanking conveying device 1, and comprises a bottom frame 20, a testing conveying track 21 arranged on the bottom frame 20 and connected with the downstream end of the blanking channel 111, electric connection modules 22 arranged at two sides of the testing conveying track 21, a testing driving mechanism 23, a first power conveying mechanism 611 and a second blocking mechanism 24, wherein the testing conveying track 21 is provided with a testing station 25, the first power conveying mechanism 611 is used for driving the semiconductor elements 51 of the testing conveying track 21 to be conveyed downstream, the second blocking mechanism 24 is used for limiting the semiconductor elements 51 of the testing conveying track 21 at the testing station 25 or conveying the released semiconductor elements 51 in the downstream direction, the testing driving mechanism 23 is used for driving the two electric connection modules 22 to respectively move or reset towards one side of the semiconductor elements 51, so that a plurality of electric connection terminals on the electric connection modules 22 are respectively butted with pins of each semiconductor element 51 one by one to one, so as to carry out high-voltage electrified testing on the semiconductor elements 51, and the control module is used for respectively identifying groups where the unqualified semiconductor elements 51 and groups where all qualified semiconductor elements 51 are located in the high-voltage electrified testing.
The component sorting mechanism 3 comprises a translation driving mechanism 32, a sorting conveying track 33 connected with the downstream end of the testing conveying track 21, a component output mechanism 34, a component recycling mechanism 35, a third blocking mechanism 36 and a second power conveying mechanism 621; the third blocking mechanism 36 is configured to limit the entered semiconductor elements 51 in the sorting and conveying track 33, and the translational driving mechanism 32 is configured to drive the sorting and conveying track 33 to respectively interface with the component output mechanism 34 or the component recycling mechanism 35, so that the second power conveying mechanism 621 respectively conveys the semiconductor elements 51 in the qualified mark group to the component output mechanism 34 and respectively conveys the semiconductor elements 51 in the unqualified mark group to the component recycling mechanism 35.
Compared with the prior art, the high-voltage testing and sorting conveyor line for the semiconductor components has the advantages that after the material receiving mechanism 13 receives the material pipe 5 loaded with the plurality of semiconductor elements 51 in the horizontal position, the material receiving mechanism is driven by the overturning driving mechanism 4 to be in butt joint with the automatic blanking mechanism, so that the plurality of semiconductor elements 51 automatically slide into the high-voltage testing mechanism 2 along the obliquely-arranged blanking channel 111, high-voltage testing of the plurality of semiconductor elements 51 is realized, the testing efficiency of the components is high, the semiconductor elements 51 are output in a rail conveying mode after the component sorting mechanism 3 sorts the semiconductor elements 51 of each group, the position deviation of the semiconductor elements 51 in the output process is well avoided, and the using effect is good.
In an embodiment (not shown), the material receiving mechanism 13 may be a material receiving groove or a material clamping mechanism adapted to the material pipe 5.
Referring to fig. 1 to 3, in an embodiment, the swing driving mechanism 4 includes a support 41, a swing driving push rod 42 and a driving arm 43, the swing driving push rod 42 is preferably a pneumatic push rod or an electric push rod, the driving arm 43 is respectively connected to an upstream end of the automatic blanking mechanism and an output end of the swing driving push rod 42 in a rotating manner, the material receiving mechanism 13 is disposed on the driving arm 43, the swing driving push rod 42 is connected to the support 41, and the swing driving push rod 42 drives the driving arm 43 to enable the material receiving mechanism 13 to be horizontally placed on the support 41 or obliquely butted with the automatic blanking mechanism; through the arrangement, the arrangement mode of the turnover driving mechanism 4 is simple, and the relative turnover effect of the driving material receiving mechanism 13 is good.
Referring to fig. 1 to 3, in one embodiment, the support 41 is horizontally disposed, the support 41 is provided with a buffer assembly 44, the buffer assembly 44 is, for example, a nitrogen buffer rod or the like, and the receiving mechanism 13 rests on the support 41 through the buffer assembly 44; through setting up like this, effectively avoid taking place hard collision between receiving mechanism 13 and the support 41 and cause the loss, the product is used reliably.
Referring to fig. 1, 4 and 5, in an embodiment, the test driving mechanism 23 is provided with one corresponding to each side of the power connection module 22, the test driving mechanism 23 includes a test driving push rod 231 and a slide rail assembly 232, the test driving push rod 231 is preferably an electric push rod or a pneumatic push rod, and the like, the power connection module 22 is slidably disposed on the bottom chassis 20 through the slide rail assembly 232, the test driving push rod 231 is in transmission connection with the power connection module 22, and the power connection module 22 approaches one side of the test conveying rail 21 and performs high-voltage testing or relatively resets through the driving of the test driving push rod 231; through the arrangement, the test driving mechanism 23 is simple in structure, and the movement effect of the power connection module 22 is stable and smooth.
The material pipe 5 can load a plurality of semiconductor elements 51 at one time, all the power connection modules are connected with a high-voltage tester, in this embodiment, each side of the semiconductor element 51 is provided with two pins, and four pins are provided in total, each test station can test 10 semiconductor elements at a time, and the number of the power connection modules of the high-voltage test device 22 is correspondingly set to ten groups; each group of the power connection module of the high voltage testing device 22 includes two upper test strips 221 and two lower test strips 222 corresponding to each side of the semiconductor element 51, the two upper test strips 221 in the same group are connected and the two lower test strips 222 in the same group are also connected, the pair of upper test strips 221 and the pair of lower test strips 222 are used for performing high voltage testing on one pin of the semiconductor element 51, the upper test strips 221 and the lower test strips 222 in the same vertical direction are arranged in a staggered manner, when the pair of upper test strips 221 and the pair of lower test strips 222 in the same vertical direction contact the same pin of the semiconductor element 51, the pin is used as an intermediate for connecting the upper test strips 221 and the lower test strips 222, the power connection module of the high voltage testing device 22 performs power connection testing, when the upper test strips 221 and the lower test strips 222 can be successfully powered through the pin, the semiconductor element 51 is a qualified product, otherwise, the semiconductor element 51 is a unqualified product. Two test piece 221 and test piece 222 on being located same vertical direction stagger the setting each other, and the benefit of the setting of staggering each other like this can detect test piece 221 and test piece 222 down whether to semiconductor pin contact well. During testing, 10 semiconductor elements are subjected to high-voltage testing simultaneously, and compared with the prior art, the testing effect and the testing stability are greatly improved.
Referring to fig. 1, 4 and 5, in an embodiment, at least two high-voltage component testing mechanisms 2 are continuously arranged in a downstream direction of the blanking conveying device 1, and in this embodiment, two high-voltage component testing mechanisms 2 are arranged; through setting up like this, two components and parts high voltage test mechanism 2 test semiconductor element simultaneously, effectively improve components and parts high voltage test work efficiency. And two components and parts high voltage test mechanism 2 share a high voltage tester, reduce equipment manufacturing cost.
Referring to fig. 1, 4 and 5, in an embodiment, the component high-voltage testing mechanism 2 and the blanking channel 111 are obliquely arranged in the same direction, the component sorting mechanism 3 is horizontally arranged, and the sorting conveying track 33 and the testing conveying track 21 are transitionally connected through an arc guide track 26; by this arrangement, the semiconductor elements 51 are smoothly slid into the sorting conveying rails 33 from the test conveying rails 21.
Referring to fig. 1, 6 to 8, in an embodiment, the translation driving mechanism 32 includes a mounting rack 321, and a translation driving motor 322, a first belt pulley 323, a second belt pulley 324, and a transmission belt 325, which are disposed on the mounting rack 321, the transmission belt 325 is wound around the first belt pulley 323 and the second belt pulley 324, respectively, the translation driving motor 322 is in transmission connection with the first belt pulley 323, the sorting conveying track 33 is disposed on the transmission belt 325 and disposed on the mounting rack 321 through a guiding device, and driven by the translation driving motor 322, the sorting conveying track 33 is in butt joint with the component output mechanism 34 or the component recycling mechanism 35, respectively, in a translation direction; through the arrangement, the translation driving mechanism 32 is simple in structure, and the moving effect of driving the sorting conveying track 33 is rapid.
Referring to fig. 1, 6 to 8, in an embodiment, a test conveying channel 211 is disposed in the test conveying track 21, the first power conveying mechanism 611 includes a plurality of first conveying air paths 61 disposed in the test conveying track 21 and obliquely arranged along a downstream conveying direction to communicate with the test conveying channel 211, the plurality of first conveying air paths 61 are respectively communicated with an air flow generating device, and an air flow entering the test conveying channel 211 through the first conveying air paths 61 is generated by the air flow generating device, so as to convey the semiconductor elements 51 in the downstream direction; with this arrangement, the power transmission mechanism is driven by pneumatic transmission, and the movement driving effect of the semiconductor element 51 is good.
Referring to fig. 1, 6 to 8, in an embodiment, when the translational driving mechanism 32 drives the sorting conveying track 33 to move relatively, the downstream end of the sorting conveying track 33 is butted with the component output mechanism 34, or the upstream end of the sorting conveying track 33 is butted with the component recycling mechanism 35; a sorting and conveying channel 331 is arranged in the sorting and conveying track 33, the second power conveying mechanism 621 comprises a plurality of second conveying air paths 62 arranged on the sorting and conveying track 33 and obliquely arranged along the downstream conveying direction to be communicated with the sorting and conveying channel 331, a plurality of third conveying air paths 63 arranged on the sorting and conveying track 33 and obliquely arranged along the downstream conveying direction to be communicated with the sorting and conveying channel 331, and an air blowing device 351, wherein the plurality of second conveying air paths 62 and the plurality of third conveying air paths 63 are respectively communicated with an air flow generating device (not shown), air flows entering the sorting and conveying channel 331 through the second conveying air paths 62 and the third conveying air paths 63 are generated by the air flow generating device, so that the semiconductor elements 51 are conveyed to the component output mechanism 34, and the air blowing device 351 is used for generating air flows which enable the semiconductor elements 51 in the sorting and conveying channel 331 to move to the component recycling mechanism 35; through setting up like this, translation actuating mechanism 32 both sides opposite direction is located respectively to components and parts output mechanism 34 and components and parts recovery mechanism 35, conveniently sorts the delivery track 33 and carries semiconductor component 51 to components and parts output mechanism 34 and components and parts recovery mechanism 35 respectively to and power transmission mechanism adopts the mode drive of atmospheric pressure, and semiconductor component 51 removes the drive effectual.
Referring to fig. 4 and 5, in an embodiment, the test conveying track 21 is provided with power connection avoiding ports 27 at both sides thereof, and pins at both sides of the semiconductor element 51 in the test conveying track 21 are communicated with the outside through the corresponding power connection avoiding ports 27; by means of the arrangement, the power connection modules 22 on two sides can conveniently carry out high-voltage test through the power connection avoiding ports 27 respectively.
Referring to fig. 3, in an embodiment, the first blocking mechanism 12 is disposed between the blanking conveying track 11 and the testing conveying track 21, the first blocking mechanism 12 includes a first driver 122 and a first blocking member 123, the automatic blanking mechanism includes the blanking conveying track 11, the blanking channel 111 is disposed in the blanking conveying track 11, the blanking conveying track 11 is provided with a first avoiding hole 121 corresponding to the first blocking mechanism 12, and the first blocking member 123 of the first blocking mechanism 12 can extend into the blanking channel 111 through the first avoiding hole 121 to achieve a blocking effect.
Referring to fig. 5, in an embodiment, the second blocking mechanism 24 includes a second driver 242 and a second blocking member 243, the test conveying track 21 is provided with a second avoiding hole 241 corresponding to the second blocking mechanism 24, and the second blocking member 243 of the second blocking mechanism 24 can extend into the test conveying channel 211 through the second avoiding hole 241 to achieve a blocking effect.
Referring to fig. 1 and fig. 6, in an embodiment, the third blocking mechanism 36 includes a third driver 362 and a third blocking member 363, the sorting conveying track 33 is provided with a third avoiding hole 361 corresponding to the third blocking mechanism 36, and the third blocking member 363 of the third blocking mechanism 36 can extend into the sorting conveying channel 331 through the third avoiding hole 361 to achieve a blocking effect or be relatively accommodated to facilitate the semiconductor element 51 in the sorting conveying channel 331 to enter the component output mechanism 34.
Referring to fig. 2, in an embodiment, the apparatus further includes a fourth blocking mechanism 16 disposed between the blank conveying rail 11 and the receiving mechanism 13, and the fourth blocking mechanism 16 is configured to block and release the semiconductor component 51 in the material pipe 5 from being conveyed toward the blank conveying rail 11. The fourth blocking mechanism 16 is similar in structure to the first blocking mechanism 12.
Referring to fig. 3, in an embodiment, in order to increase the conveying speed of the semiconductor element 51 in the blanking conveying track 11, the semiconductor element 51 may also be provided with the first power conveying mechanism 611.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically, electrically or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other suitable relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
It should be understood that equivalents and modifications of the technical solution and inventive concept thereof may occur to those skilled in the art, and all such modifications and alterations should fall within the protective scope of the present invention.
Claims (10)
1. The utility model provides a transfer chain is selected separately in semiconductor components and parts high voltage test which characterized in that includes:
a control module;
the blanking conveying device comprises an automatic blanking mechanism, a material receiving mechanism, a swinging driving mechanism and a first blocking mechanism, wherein one end of the material receiving mechanism is rotatably connected with the upstream end of the automatic blanking mechanism, the automatic blanking mechanism is provided with a blanking channel which is arranged in a downward inclining manner, the swinging driving mechanism is used for driving the material receiving mechanism to switch between a horizontal position and an inclined position, the upstream end of the material receiving mechanism is used for receiving a material pipe loaded with a plurality of semiconductor elements in the horizontal position and unloading one group of semiconductor elements in the material pipe into the blanking channel in the inclined position, and the first blocking mechanism is used for blocking and releasing the semiconductor elements in the blanking channel from being conveyed downstream;
the device high-voltage testing mechanism is arranged at the downstream of the blanking conveying device and comprises a testing conveying track, electric connection modules, a testing driving mechanism, a first power conveying mechanism and a second blocking mechanism, wherein the testing conveying track is connected with the downstream end of the blanking channel, the electric connection modules are positioned at two sides of the testing conveying track, the testing driving mechanism is used for driving the semiconductor elements of the testing conveying track to be conveyed downstream, the second blocking mechanism is used for limiting the semiconductor elements of the testing conveying track at the testing stations or releasing the semiconductor elements to be conveyed along the downstream direction, the testing driving mechanism is used for driving the two electric connection modules to respectively move or reset towards one side of the semiconductor elements, so that a plurality of electric connection terminals on the electric connection modules are respectively butted with pins of each semiconductor element one by one to carry out high-voltage power-on testing on the semiconductor elements, and the control module is used for respectively identifying the groups where unqualified semiconductor elements exist in the high-voltage power-on testing and the groups where all qualified semiconductor elements exist;
the component sorting mechanism comprises a translation driving mechanism, a sorting conveying track connected with the downstream end of the testing conveying track, a component output mechanism, a component recycling mechanism, a third blocking mechanism and a second power conveying mechanism; the third blocking mechanism is used for limiting the entering semiconductor elements in the sorting conveying track, and the translation driving mechanism is used for driving the sorting conveying track to be respectively butted with the component output mechanism or the component recycling mechanism, so that the second power conveying mechanism respectively conveys the semiconductor elements of the qualified mark groups to the component output mechanism and respectively conveys the semiconductor elements of the unqualified mark groups to the partial component output mechanism.
2. The high-voltage testing, sorting and conveying line for the semiconductor components as claimed in claim 1, wherein the swing driving mechanism comprises a support, a swing driving push rod and a driving arm, the driving arm is respectively and rotatably connected with the upstream end of the automatic blanking mechanism and the output end of the swing driving push rod, the material receiving mechanism is arranged on the driving arm, the swing driving push rod is connected on the support, and the swing driving push rod drives the driving arm to enable the material receiving mechanism to be horizontally placed on the support or obliquely butted with the automatic blanking mechanism.
3. The high-voltage testing, sorting and conveying line for the semiconductor components as claimed in claim 2, wherein the support is horizontally arranged, the support is provided with a buffer assembly, and the material receiving mechanism is placed on the support through the buffer assembly.
4. The high-voltage testing, sorting and conveying line for semiconductor components as claimed in claim 1, wherein at least two of the high-voltage testing mechanisms are provided in series in a downstream direction of the blanking and conveying device.
5. The high-voltage testing, sorting and conveying line for the semiconductor components as claimed in claim 1, wherein the testing driving mechanism comprises a testing driving push rod and a sliding rail assembly, the power connection module is arranged on the sliding rail assembly, and the testing driving push rod is in transmission connection with the power connection module.
6. The high-voltage testing, sorting and conveying line for the semiconductor components as claimed in claim 1 or 4, wherein the high-voltage testing mechanism for the components and the blanking channel are obliquely arranged in the same direction, the high-voltage testing mechanism for the components is horizontally arranged, and the sorting and conveying track is in transitional connection with the testing and conveying track through an arc guide track.
7. The semiconductor component high-voltage testing and sorting conveying line according to claim 1, wherein the translation driving mechanism comprises a mounting frame and a translation driving motor, a first belt pulley, a second belt pulley and a transmission belt which are arranged on the mounting frame, the transmission belt is wound on the first belt pulley and the second belt pulley respectively, the translation driving motor is in transmission connection with the first belt pulley, the sorting conveying track is arranged on the transmission belt, and the sorting conveying track is driven by the translation driving motor to be in butt joint with a component output mechanism or a component recycling mechanism respectively in the translation direction.
8. The high-voltage testing, sorting and conveying line for the semiconductor components as claimed in claim 1, wherein a testing conveying channel is arranged in the testing conveying track, the first power conveying mechanism comprises a plurality of first conveying gas paths which are arranged on the testing conveying track in an inclined manner along a downstream conveying direction and communicated with the testing conveying channel, and the plurality of first conveying gas paths are respectively communicated with the airflow generating device;
when the translation driving mechanism drives the sorting conveying track to move relatively, the downstream end of the sorting conveying track is in butt joint with the component output mechanism, or the upstream end of the sorting conveying track is in butt joint with the component recovery mechanism;
the sorting conveying track is internally provided with a sorting conveying channel, the second power conveying mechanism comprises a plurality of second conveying gas circuits arranged at the top of the sorting conveying track along the downstream conveying direction in an inclined mode and communicated with the sorting conveying channel, a plurality of third conveying gas circuits arranged at the side of the sorting conveying track along the downstream conveying direction in an inclined mode and communicated with the sorting conveying channel, and a gas blowing device, the plurality of second conveying gas circuits and the third conveying gas circuits are respectively communicated with a gas flow generating device, the gas flow generating device enters the gas flow of the sorting conveying channel through the second conveying gas circuits and the third conveying gas circuits to enable semiconductor elements in the sorting conveying channel to move into the component output mechanism, and the gas blowing device is used for generating gas flow which enables the semiconductor elements in the sorting conveying channel to move into the component recycling mechanism.
9. The high-voltage testing, sorting and conveying line for the semiconductor components as claimed in claim 8, wherein electric connection avoiding ports are respectively formed in two sides of the testing conveying rail, and pins on two sides of the semiconductor components in the testing conveying rail are respectively communicated with the outside through the corresponding electric connection avoiding ports.
10. The high-voltage testing, sorting and conveying line for the semiconductor components as claimed in claim 8, wherein the automatic blanking mechanism comprises a blanking conveying track, the blanking channel is arranged in the blanking conveying track, the blanking conveying track is provided with a first avoiding hole corresponding to the first blocking mechanism, and a first blocking piece of the first blocking mechanism can extend into the blanking channel through the first avoiding hole to achieve a blocking effect;
the test conveying track is provided with a second avoidance hole corresponding to the second blocking mechanism, and a second blocking piece of the second blocking mechanism can extend into the test conveying channel through the second avoidance hole to achieve a blocking effect;
the sorting conveying track is provided with a third avoiding hole corresponding to the third blocking mechanism, and a third blocking piece of the third blocking mechanism can pass through the third avoiding hole and stretch into the sorting conveying channel to achieve a blocking effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211135954.4A CN115445944A (en) | 2022-09-19 | 2022-09-19 | High-voltage testing, sorting and conveying line for semiconductor components |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211135954.4A CN115445944A (en) | 2022-09-19 | 2022-09-19 | High-voltage testing, sorting and conveying line for semiconductor components |
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| CN115445944A true CN115445944A (en) | 2022-12-09 |
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| CN202211135954.4A Pending CN115445944A (en) | 2022-09-19 | 2022-09-19 | High-voltage testing, sorting and conveying line for semiconductor components |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117347814A (en) * | 2023-11-22 | 2024-01-05 | 广东歌得智能装备有限公司 | High-temperature test structure of semiconductor device and gravity type normal temperature and high temperature tester |
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2022
- 2022-09-19 CN CN202211135954.4A patent/CN115445944A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117347814A (en) * | 2023-11-22 | 2024-01-05 | 广东歌得智能装备有限公司 | High-temperature test structure of semiconductor device and gravity type normal temperature and high temperature tester |
| CN117347814B (en) * | 2023-11-22 | 2024-04-02 | 广东歌得智能装备有限公司 | High-temperature test structure of semiconductor device and gravity type normal temperature and high temperature tester |
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