CN218691650U - Semiconductor component feeding and conveying line - Google Patents

Semiconductor component feeding and conveying line Download PDF

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Publication number
CN218691650U
CN218691650U CN202222482240.2U CN202222482240U CN218691650U CN 218691650 U CN218691650 U CN 218691650U CN 202222482240 U CN202222482240 U CN 202222482240U CN 218691650 U CN218691650 U CN 218691650U
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conveying
component
feeding
driving
semiconductor
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CN202222482240.2U
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陈伟明
陈树钊
康茂
单忠频
黄仁发
黄昌浩
薛克瑞
温炜杰
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Guangdong Gede Intelligent Equipment Co ltd
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Guangdong Gede Intelligent Equipment Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract

The utility model belongs to the technical field of the semiconductor component is carried, concretely relates to semiconductor components and parts feed transfer chain, semiconductor components and parts feed transfer chain is through setting up components and parts distribution mechanism and multitrack feeding mechanism, and components and parts distribution mechanism can realize carrying semiconductor components to every pay-off station with a plurality of components and parts delivery track butt joints respectively, and a plurality of semiconductor components of being convenient for feed simultaneously carries out the product detection, and product detection efficiency is high.

Description

Semiconductor component feeding and conveying line
Technical Field
The utility model belongs to the technical field of semiconductor element carries, concretely relates to semiconductor components and parts feed transfer chain.
Background
In the conventional electrical component, for example, a semiconductor element is provided, and pins of an input terminal and an output terminal are respectively provided at both sides of the semiconductor element. However, the conventional semiconductor component feeding conveying line is a single feeding conveying channel, that is, only one semiconductor component can be output by the feeding conveying channel at a time, product performance detection of a plurality of semiconductor components fed at the same time cannot be realized, and the product detection efficiency is not high enough.
It is seen that improvements and enhancements to the prior art are needed.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned deficiencies in the prior art, the utility model aims to overcome the deficiencies in the prior art and provide a semiconductor component feeding conveyor line that can realize the simultaneous feeding of a plurality of semiconductor elements.
In order to achieve the purpose, the utility model adopts the following technical proposal:
a semiconductor component feeding and conveying line comprises a component distributing mechanism and a multi-track feeding mechanism.
The component distribution mechanism comprises a butt joint driving mechanism, a distribution material conveying track, a first material blocking assembly and a first power conveying mechanism, wherein the distribution material conveying track is used for receiving an entering semiconductor element; the first material blocking assembly is used for limiting an entering semiconductor element in the material distribution conveying track or releasing the semiconductor element to be conveyed downstream, and the butt joint driving mechanism is used for driving the material distribution conveying track to be in butt joint with different paths respectively so that the first power conveying mechanism conveys the semiconductor element to the corresponding path.
The multi-track feeding mechanism comprises at least two component conveying tracks, a second power conveying mechanism, a second material blocking assembly and a component pushing mechanism, the distribution material conveying tracks are respectively butted with each component conveying track, the second power conveying mechanism is used for driving the semiconductor components to be conveyed along the downstream of the component conveying tracks, the component pushing mechanism is connected to the tail ends of the component conveying tracks, the component pushing mechanism comprises a feeding station and a pushing driving assembly for driving the feeding station to be relatively separated from and close to the tail ends of the component conveying tracks, and the second material blocking assembly is arranged between the component conveying tracks and the component pushing mechanism and used for blocking or releasing the semiconductor components from entering the feeding station.
Furthermore, a plurality of component conveying rails are arranged in parallel; through setting up like this, be convenient for distribute the material delivery track with the mode of translation removal respectively with different components and parts delivery track butt joints, distribute material delivery track moving mode simple.
Furthermore, the plurality of component conveying rails are of an integrated structure; alternatively, the plurality of component conveying rails are arranged in parallel at intervals.
Furthermore, the butt joint driving mechanism comprises a mounting frame, and a butt joint driving motor, a first belt pulley, a second belt pulley and a transmission belt which are arranged on the mounting frame, the transmission belt is wound on the first belt pulley and the second belt pulley respectively, the butt joint driving motor is in transmission connection with the first belt pulley, the sorting conveying track is arranged on the transmission belt, and the butt joint of the distribution conveying track and different component conveying tracks is realized through the drive of the butt joint driving motor; through setting up like this, butt joint actuating mechanism sets up the mode simply, and the drive is distributed the material delivery track and is removed the effect rapidly.
Furthermore, a distributing material conveying channel is arranged in the distributing material conveying track; the first power conveying mechanism comprises a plurality of first conveying air paths which are arranged on the distributing material conveying track and are obliquely arranged along the downstream conveying direction and communicated with the distributing material conveying channel, and the plurality of first conveying air paths are respectively communicated with the airflow generating device; through the arrangement, the first power conveying mechanism is driven in an air pressure transmission mode, and the moving driving effect of the semiconductor element is good.
Further, the component pushing mechanism comprises a fixed seat and a feeding frame, the pushing driving assembly comprises a feeding driving motor and an eccentric driving part, the feeding station is arranged on the feeding frame, the feeding frame is slidably arranged on the fixed seat through a first sliding rail device, the eccentric driving part is eccentrically arranged at the output end of the feeding driving motor, the feeding frame is provided with a waist-shaped hole sleeved on the eccentric driving part, and the feeding driving motor drives the eccentric driving part to operate to enable the feeding frame to approach or separate to one side of the tail end of the conveying guide rail along the component; through the arrangement, the component pushing mechanism is simple in structure, and the driving feeding station is stable and rapid in moving effect.
Furthermore, the second material blocking assembly comprises a second material blocking push rod, a bracket and a second blocking piece, one second blocking piece is arranged corresponding to each feeding station, the bracket is vertically and slidably connected to the fixed seat through a second slide rail device, the second blocking piece is arranged at the upper end of the bracket, the bracket is in transmission connection with the second material blocking push rod, and the second material blocking push rod drives the bracket to move along the direction of the second slide rail device so as to extend the corresponding second blocking piece to the outer side of the feeding station or reset relatively; through setting up like this, the second keeps off material subassembly simple structure, keeps off effectually.
Further, a component conveying channel is arranged in the component conveying track; the second power conveying mechanism comprises a plurality of second conveying air paths which are arranged on the component conveying track and are obliquely arranged along the downstream conveying direction and communicated with the component conveying channel, and the plurality of second conveying air paths are respectively communicated with the airflow generating device; through the arrangement, the second power conveying mechanism is driven in an air pressure transmission mode, and the moving driving effect of the semiconductor element is good.
Has the advantages that: compared with the prior art, the utility model discloses a semiconductor components and parts feed transfer chain through setting up components and parts distribution mechanism and multitrack feeding mechanism, and components and parts distribution mechanism can realize carrying semiconductor component to every pay-off station with a plurality of components and parts delivery track butt joints respectively, and a plurality of semiconductor component supplies carry out the product detection simultaneously of being convenient for, and product detection efficiency is high.
Drawings
Fig. 1 is a schematic view of a semiconductor component supply and delivery line.
Fig. 2 is a schematic diagram of a component dispensing mechanism.
Fig. 3 is an exploded view of a multi-track feeding mechanism.
FIG. 4 is a schematic view of a multi-track feeding mechanism.
Fig. 5 is a schematic diagram of a component transfer track.
Fig. 6 is a schematic diagram of the first conveying gas path being located on the dispensing material conveying track (or the second conveying gas path being located on the component conveying track).
Description of the main element symbols: description of the reference symbols: 1-component distribution mechanism, 2-multi-track feeding mechanism, 11-butt joint driving mechanism, 12-distribution conveying track, 13-first material stopping assembly, 14-first power conveying mechanism, 21-component conveying track, 23-second material stopping assembly, 3-component pushing mechanism, 30-feeding station, 111-mounting rack, 112-butt joint driving motor, 113-first belt pulley, 114-second belt pulley, 115-driving belt, 116-third sliding rail device, 121-distribution conveying channel, 141-first conveying gas path, 31-fixing rack, 32-feeding rack, 33-pushing driving assembly, 331-feeding driving motor, 332-eccentric transmission piece, 333-waist-shaped hole, 231-second material stopping push rod, 232-bracket, 233-second blocking piece, 234-second sliding rail device, 131-first material stopping push rod, 132-first blocking piece, 37-first sliding rail device, 5-semiconductor component, 22-second power conveying mechanism and 221-second conveying gas path.
Detailed Description
The utility model provides a semiconductor components and parts feed transfer chain, for making the utility model discloses a purpose, technical scheme and effect are clearer, clear and definite, and it is right to refer to the attached drawing below and to lift the embodiment the utility model discloses further detailed description. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the scope of the invention.
Referring to fig. 1 to 6, the semiconductor component feeding and conveying line of the present invention includes a component distributing mechanism 1 and a multi-track feeding mechanism 2.
The component distributing mechanism 1 comprises a butt joint driving mechanism 11, a distributing and conveying track 12, a first material blocking assembly 13 and a first power conveying mechanism 14, wherein the head end of the distributing and conveying track 12 is used for receiving incoming semiconductor components, can receive a single semiconductor component respectively, and can also be connected with and receive a plurality of semiconductor components which enter continuously; the first material blocking assembly 13 is used for limiting an entering semiconductor element in the distributing and conveying track 12 or releasing the semiconductor element to be conveyed downstream, and the butt joint driving mechanism 11 is used for driving the distributing and conveying track 12 to be in butt joint with different paths respectively, so that the first power conveying mechanism 14 conveys the semiconductor element to the corresponding path.
The multi-track feeding mechanism 2 comprises at least two component conveying tracks 21, a second power conveying mechanism 22, a second blocking component 23 and a component pushing mechanism 3, the tail ends of the distributing conveying tracks 12 are respectively butted with each component conveying track 21, the second power conveying mechanism 22 is used for driving the semiconductor elements to be conveyed along the downstream of the component conveying tracks 21, the component pushing mechanism 3 is connected with the tail ends of the component conveying tracks 21, the component pushing mechanism 3 comprises at least two feeding stations 30 corresponding to the number of the component conveying tracks 21 and a pushing driving component 32 for driving the feeding stations 30 to be relatively separated from and close to the tail ends of the component conveying tracks 21, the second blocking component 23 is arranged between the component conveying tracks 21 and the component pushing mechanism 3 and used for blocking or releasing the semiconductor elements to enter the feeding stations 30, and the semiconductor elements in the feeding stations 30 are used for being fed into a detection device to perform performance detection.
Compared with the prior art, the utility model discloses a semiconductor components and parts feed transfer chain through setting up components and parts distribution mechanism 1 and multitrack feeding mechanism 2, and components and parts distribution mechanism 1 can realize carrying semiconductor component to every pay-off station 30 with the butt joint of a plurality of components and parts delivery track 21 respectively, and a plurality of semiconductor component supplies simultaneously of being convenient for carry out product detection, and product detection efficiency is high.
Referring to fig. 3 to 5, in an embodiment, a plurality of component conveying rails 21 are arranged in parallel, and the plurality of component conveying rails 21 may be an integrated structure; alternatively, the plurality of component conveying rails 21 may be arranged in parallel at intervals; through the arrangement, the distributing material conveying rails 12 are respectively butted with different component conveying rails 21 in a translational movement mode, and the moving mode of the distributing material conveying rails 12 is simple.
In the present embodiment, two component conveying rails 21 are provided in parallel.
Referring to fig. 1 and fig. 2, in an embodiment, the docking driving mechanism 11 includes a mounting frame 111, and a docking driving motor 112, a first pulley 113, a second pulley 114, and a driving belt 115, which are disposed on the mounting frame 111, the driving belt 115 is wound around the first pulley 113 and the second pulley 114, respectively, the docking driving motor 112 is in driving connection with the first pulley 113, the sorting conveying track is disposed on the driving belt 115 and slidably disposed on the mounting frame 111 through a third sliding rail device 116, and the docking driving of the docking driving motor 112 enables the distributing conveying track 12 to be docked with different component conveying tracks 21; through the arrangement, the butt joint driving mechanism 11 is simple in arrangement mode, and the effect of driving the distributing material conveying track 12 to move is rapid.
Referring to fig. 1, 2 and 6, in one embodiment, a dispensing material conveying channel 121 is provided in the dispensing material conveying track 12; the first power conveying mechanism 14 comprises a plurality of first conveying gas paths 141 which are arranged on the upper side or the side part of the distributing material conveying track 12 and are obliquely arranged along the downstream conveying direction and communicated with the distributing material conveying channel 121, and the plurality of first conveying gas paths 141 are respectively communicated with the airflow generating device; by such an arrangement, the first power transmission mechanism 14 is driven by pneumatic transmission, and the semiconductor element moving driving effect is good.
Referring to fig. 1 and 2, in an embodiment, the first striker assembly 13 includes a first striker push rod 131 and a first blocking member 132, the first striker push rod 131 is preferably a pneumatic push rod or an electric push rod, and the first striker push rod 131 achieves a blocking effect or relative reset by driving the first blocking member 132 to relatively extend to the end of the dispensing material conveying track 12; through setting up like this, first fender material subassembly 13 simple structure keeps off effectually.
The size of the feeding station 30 is about the size of one semiconductor element, when the second power conveying mechanism 22 drives the semiconductor elements in the component conveying rail 21 to move towards the tail end, only one semiconductor element enters the feeding station 30, after the semiconductor element enters the feeding station 30, the component pushing mechanism 3 moves the feeding station 30 to be connected with the detection device, and meanwhile, the second blocking piece 233 of the second blocking component 23 extends out of the tail end of the component conveying rail 21 to limit the semiconductor element inside the component conveying rail to drop outwards.
Referring to fig. 3 to 6, in an embodiment, the component pushing mechanism 3 includes a fixed seat 31 and a feeding frame 32, the pushing driving assembly 33 includes a feeding driving motor 331 and an eccentric driving member 332, the feeding station 30 is disposed on the feeding frame 32, the feeding frame 32 is longitudinally slidably disposed on the fixed seat 31 by a first slide rail device 37, the eccentric driving member 332 is eccentrically disposed at an output end of the feeding driving motor 331, the feeding frame 32 is provided with a kidney-shaped hole 333 that is sleeved on the eccentric driving member 332, and the feeding driving motor 331 drives the eccentric driving member 332 to operate to enable the feeding frame 32 to approach or separate along one side of the end of the component conveying rail 21; through the arrangement, the component pushing mechanism 3 is simple in structure, and the driving feeding station 30 is stable and rapid in moving effect.
Referring to fig. 3 to 5, in an embodiment, the second material blocking assembly 23 includes a second material blocking push rod 231, a bracket 232, and a second blocking member 233, one second blocking member 233 is disposed corresponding to each feeding station 30, the bracket 232 is vertically slidably connected to the fixing base 31 through a second slide rail device 234, the second blocking member 233 is disposed at an upper end of the bracket 232, the bracket 232 is in transmission connection with the second material blocking push rod 231, and the second material blocking push rod 231 is configured to movably extend the corresponding second blocking member 233 to an outer side of the feeding station 30 or to relatively reset by driving the bracket 232 along a direction of the second slide rail device 234; through setting up like this, second fender material subassembly 23 simple structure keeps off effectually.
Referring to fig. 3 to 6, in an embodiment, a component conveying channel 211 is provided in the component conveying track 21; the second power conveying mechanism 22 comprises a plurality of second conveying air passages 221 which are arranged on the upper side or the side part of the component conveying track 21 along the downstream conveying direction in an inclined manner and communicated with the component conveying channel 211, and the plurality of second conveying air passages 221 are respectively communicated with the air flow generating device; by such an arrangement, the second power transmission mechanism 22 is driven by pneumatic transmission, and the semiconductor element moving driving effect is good.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other suitable relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
It is understood that equivalent substitutions or changes can be made by those skilled in the art according to the technical solution of the present invention and the inventive concept thereof, and all such changes or substitutions shall fall within the scope of the present invention.

Claims (8)

1. A semiconductor component feeding and conveying line is characterized by comprising:
the component distributing mechanism comprises a butt joint driving mechanism, a distributing and conveying track, a first material stopping assembly and a first power conveying mechanism, wherein the distributing and conveying track is used for receiving an entering semiconductor element; the first material blocking assembly is used for limiting an entering semiconductor element in the material distribution conveying track or releasing the semiconductor element to be conveyed downstream, and the butt joint driving mechanism is used for driving the material distribution conveying track to be in butt joint with different paths respectively so that the first power conveying mechanism conveys the semiconductor element to the corresponding path;
the multi-track feeding mechanism comprises at least two component conveying tracks, a second power conveying mechanism, a second material blocking assembly and a component pushing mechanism, wherein the component conveying tracks are butted with the component conveying tracks respectively, the second power conveying mechanism is used for driving the semiconductor components to be conveyed along the downstream of the component conveying tracks, the component pushing mechanism is connected to the tail ends of the component conveying tracks, the component pushing mechanism comprises at least two feeding stations and a pushing driving assembly for driving the feeding stations to be relatively separated from and close to the tail ends of the component conveying tracks, and the second material blocking assembly is arranged between the component conveying tracks and the component pushing mechanism and used for blocking or releasing the semiconductor components from entering the feeding stations.
2. A semiconductor component supply and conveyance line as claimed in claim 1, wherein the plurality of component conveyance rails are juxtaposed.
3. A semiconductor component feeding and conveying line as claimed in claim 2, wherein the plurality of component conveying rails are of an integral structure;
alternatively, the plurality of component conveying rails are arranged in parallel at intervals.
4. A semiconductor component feeding conveyor line as claimed in claim 1, wherein the docking driving mechanism comprises a mounting frame, and a docking driving motor, a first belt pulley, a second belt pulley and a transmission belt which are arranged on the mounting frame, the transmission belt is wound on the first belt pulley and the second belt pulley respectively, the docking driving motor is in transmission connection with the first belt pulley, the distributing material conveying rail is arranged on the transmission belt, and the distributing material conveying rail is driven by the docking driving motor to be docked with different component conveying rails.
5. A semiconductor component feeding and conveying line according to claim 1, wherein a dispensing conveying channel is provided in the dispensing conveying rail; the first power conveying mechanism comprises a plurality of first conveying air paths which are arranged on the distributing material conveying track and are obliquely arranged along the downstream conveying direction and communicated with the distributing material conveying channel, and the first conveying air paths are respectively communicated with the airflow generating device.
6. A semiconductor component feeding conveyor line according to any one of claims 1 to 3, wherein the component pushing mechanism includes a fixing base and a feeding frame, the pushing driving assembly includes a feeding driving motor and an eccentric driving member, the feeding station is disposed on the feeding frame, the feeding frame is slidably disposed on the fixing base through a first slide rail device, the eccentric driving member is eccentrically disposed at an output end of the feeding driving motor, the feeding frame is provided with a kidney-shaped hole in which the eccentric driving member is sleeved, and the feeding driving motor drives the eccentric driving member to operate so that the feeding frame approaches or separates from one side of the end of the conveying guide rail along the component.
7. The semiconductor component feeding conveying line according to claim 6, wherein the second blocking assembly comprises a second blocking push rod, a support and a second blocking piece, one second blocking piece is arranged corresponding to each feeding station, the support is connected to the fixing seat through a second slide rail device in a vertical sliding mode, the second blocking piece is arranged at the upper end of the support and is in transmission connection with the second blocking push rod, and the second blocking push rod is used for driving the support to move along the direction of the second slide rail device to enable the corresponding second blocking piece to extend to the outer side of the feeding station or to reset relatively.
8. A semiconductor component feeding and conveying line according to claim 1, wherein a component conveying passage is provided in the component conveying rail; the second power conveying mechanism comprises a plurality of second conveying air paths which are arranged on the component conveying track and are obliquely arranged along the downstream conveying direction and communicated with the component conveying channel, and the plurality of second conveying air paths are respectively communicated with the airflow generating device.
CN202222482240.2U 2022-09-19 2022-09-19 Semiconductor component feeding and conveying line Active CN218691650U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222482240.2U CN218691650U (en) 2022-09-19 2022-09-19 Semiconductor component feeding and conveying line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222482240.2U CN218691650U (en) 2022-09-19 2022-09-19 Semiconductor component feeding and conveying line

Publications (1)

Publication Number Publication Date
CN218691650U true CN218691650U (en) 2023-03-24

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ID=85634958

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222482240.2U Active CN218691650U (en) 2022-09-19 2022-09-19 Semiconductor component feeding and conveying line

Country Status (1)

Country Link
CN (1) CN218691650U (en)

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