CN115440633A - Semiconductor processing equipment and exhaust adjusting mechanism - Google Patents
Semiconductor processing equipment and exhaust adjusting mechanism Download PDFInfo
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- CN115440633A CN115440633A CN202211265823.8A CN202211265823A CN115440633A CN 115440633 A CN115440633 A CN 115440633A CN 202211265823 A CN202211265823 A CN 202211265823A CN 115440633 A CN115440633 A CN 115440633A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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Abstract
The embodiment of the application provides an exhaust adjusting mechanism of semiconductor process equipment. The process chamber of the semiconductor process equipment comprises a plurality of accommodating cavities which are stacked along the vertical direction, wherein the accommodating cavities are used for accommodating wafers to be processed; the exhaust device comprises exhaust components, and the exhaust components are in one-to-one correspondence with the accommodating cavities and are communicated with the accommodating cavities; the exhaust assembly comprises an exhaust pipe and an exhaust adjusting mechanism, the exhaust pipe extends along the vertical direction, the peripheral wall of the exhaust pipe is communicated with the accommodating cavity, and one end of the exhaust pipe is connected with an air extractor; the exhaust adjusting mechanism extends in the vertical direction, the adjusting end of the exhaust adjusting mechanism is accommodated in the exhaust pipe, the operating end of the exhaust adjusting mechanism is located outside the other end of the exhaust pipe, and the operating end is operated to enable the adjusting end to perform lifting action in the vertical direction and be used for adjusting the gas flow of the exhaust pipe.
Description
Technical Field
The application relates to the technical field of semiconductor processing, in particular to semiconductor process equipment and an exhaust adjusting mechanism.
Background
At present, in wet cleaning equipment in the field of IC, aiming at different wafer cleaning requirements, acidic and alkaline cleaning liquid medicines can be applied, and harmful gases such as acidity and alkalinity can be volatilized in the cleaning process, so that the environment in a process chamber is relatively severe. Therefore, an exhaust pipeline is required to be configured to pump the harmful gas out of the process chamber in time, so that the smooth gas field for cleaning the microenvironment and no corrosive gas overflow are ensured. The design of the exhaust pipeline of the process chamber directly influences the final cleaning effect of the wafer, and the exhaust pipeline needs to be cleaned regularly, so that the exhaust effect is prevented from being reduced due to the blockage of the exhaust pipeline caused by acid-base reaction crystallization.
In the prior art, a flap structure is arranged in an exhaust pipeline and used for adjusting the exhaust volume of a process chamber. But the adjusting mechanism has larger appearance and volume, which is not beneficial to realizing the miniaturization of the process chamber; the turning plate occupies the internal space of the exhaust pipeline, so that the internal pressure loss of the exhaust pipeline is increased, and the diameter of the exhaust pipeline needs to be designed to be larger on the premise of the same exhaust volume, so that the space occupation is further increased; furthermore, because the turning plate is easy to form crystals, the cleaning and maintenance process is complicated, and the working efficiency is seriously influenced.
Disclosure of Invention
The application aims at the defects of the prior art and provides semiconductor process equipment and an exhaust adjusting mechanism, which are used for solving the technical problems that the exhaust pipeline in the prior art occupies a large space, has a complex structure and needs to be cleaned and maintained regularly.
In a first aspect, embodiments of the present application provide a semiconductor processing apparatus, comprising: a process chamber and exhaust; the process chamber comprises a plurality of accommodating cavities which are stacked in the vertical direction and used for accommodating wafers to be processed; the exhaust device comprises exhaust components, the exhaust components correspond to the accommodating cavities one by one and are communicated with the accommodating cavities, and the exhaust components are used for respectively exhausting gas in the accommodating cavities; the exhaust assembly comprises an exhaust pipe and an exhaust adjusting mechanism, the exhaust pipe extends along the vertical direction, the peripheral wall of the exhaust pipe is communicated with the accommodating cavity, and one end of the exhaust pipe is connected with an air extracting device; the exhaust adjusting mechanism extends along the vertical direction, the adjusting end of the exhaust adjusting mechanism is accommodated in the exhaust pipe, the operating end of the exhaust adjusting mechanism is located outside the other end of the exhaust pipe, and the operating end is operated to enable the adjusting end to lift along the vertical direction so as to adjust the gas flow of the exhaust pipe.
In an embodiment of the application, the peripheral wall of each exhaust pipe is provided with an air inlet, the air inlet is respectively communicated with each accommodating cavity through a connecting transverse pipe, and the adjusting end adjustably shields the ventilation section of the air inlet through lifting motion so as to adjust the air flow between the connecting transverse pipe and the exhaust pipe.
In an embodiment of this application, the bottom of adjusting the end is provided with adjusts the inclined plane, adjust the inclined plane and follow the circumference extension setting of adjusting the end to from last to down the leanin with the axial of adjusting the end is preset angle, adjust the inclined plane be used for with the inner wall cooperation of blast pipe is in order to adjust the cross-section of ventilating of air inlet, and can the selectivity completely cut off the air inlet with the blast pipe intercommunication.
In an embodiment of this application, the top of adjusting the end still is provided with seal structure, seal structure with the sealed laminating of blast pipe internal perisporium adjust the end and be located when the air inlet top, seal structure be used for with the blast pipe is sealed.
In an embodiment of the present application, the sealing structure is a plurality of groove structures or bump structures formed on the peripheral wall of the adjusting end, and the plurality of groove structures or bump structures extend along the circumferential direction of the adjusting end and are uniformly and alternately arranged along the axial direction of the adjusting end.
In an embodiment of the present application, the operation end is located outside the top end of the exhaust pipe, a spraying channel is formed in the adjustment end, and a plurality of spraying ports are formed on the bottom surface of the adjustment end of the spraying channel; and a switching pipe is arranged in the exhaust adjusting mechanism, one end of the switching pipe is communicated with the spraying channel, and the other end of the switching pipe is connected with a liquid supply pipeline and used for spraying cleaning solution into the exhaust pipe.
In an embodiment of the application, the exhaust apparatus further includes an integrated box, the integrated box covers the top of the exhaust pipes, and the exhaust adjusting mechanism is disposed on the top wall of the integrated box in a penetrating manner, so that the adjusting end is located in the exhaust pipes, and the exhaust adjusting mechanism can be lifted and lowered relative to the top wall and selectively positioned.
In an embodiment of this application, exhaust adjustment mechanism's periphery is provided with the threaded connection portion of predetermineeing length, threaded connection hole has been seted up to the roof of integrated box, threaded connection portion with threaded connection hole cooperation is connected.
In an embodiment of the application, still be provided with the scale on the threaded connection portion, the scale with the aperture of the cross-section of ventilating of air inlet corresponds the setting.
In an embodiment of the present application, the two ends of the threaded connection portion are respectively provided with a stopping portion, and an outer diameter of the stopping portion is greater than an outer diameter of the threaded connection portion, and is used for cooperating with the top wall of the integrated box to limit a lifting stroke of the exhaust adjusting mechanism.
In an embodiment of the present application, the plurality of exhaust pipes are sequentially arranged along a circumferential direction of the process chamber, and top ends of the plurality of exhaust pipes are sequentially arranged in a descending manner in a height matching manner with the corresponding accommodating cavities; and/or the lengths of the connecting transverse pipes are sequentially increased.
In an embodiment of the present application, the semiconductor processing equipment is a cleaning machine, and the plurality of accommodating chambers are used for cleaning a wafer and recovering a cleaning solution.
In a second aspect, an embodiment of the present invention provides an exhaust adjusting mechanism for a semiconductor processing apparatus, the exhaust adjusting mechanism is connected to an exhaust pipe of the semiconductor processing apparatus, the exhaust adjusting mechanism is disposed to extend in a vertical direction, an adjusting end of the exhaust adjusting mechanism is accommodated in the exhaust pipe, an operating end of the exhaust adjusting mechanism is located outside the exhaust pipe, the operating end is operated to enable the adjusting end to move up and down along an axial direction of the exhaust pipe, an adjusting inclined surface is disposed at a bottom of the adjusting end, the adjusting inclined surface extends in a circumferential direction of the adjusting end and is inclined inward from top to bottom to form a predetermined angle with the axial direction of the adjusting end, and the adjusting inclined surface is configured to cooperate with an inner wall of the exhaust pipe to adjust a ventilation cross section of an air inlet on a circumferential wall of the exhaust pipe, and is capable of selectively isolating the air inlet from communicating with the exhaust pipe.
In an embodiment of this application, be provided with the adapter tube in the exhaust adjustment mechanism, be formed with spray passage in the regulation end, and spray passage is in be formed with a plurality of mouths that spray on the regulation end bottom surface, the one end of adapter tube with spray passage intercommunication, the other end and supply pipeline are connected, be used for to spray cleaning solution in the exhaust pipe.
The technical scheme provided by the embodiment of the application has the following beneficial technical effects:
this application embodiment sets up through a plurality of exhaust subassembly and a plurality of holding chamber one-to-ones to set up the perisporium and the holding chamber intercommunication of blast pipe, and in exhaust adjustment mechanism stretched into the blast pipe by the one end of blast pipe, in order to be used for adjusting the gas flow in the blast pipe, thereby realize adjusting the exhaust flow in each holding chamber of process chamber. By adopting the design, the whole structure of the exhaust device is small and exquisite, and the exhaust device can be adapted to the structural layout design of various process chambers, so that the space occupation is greatly reduced, and the miniaturization of the process chambers is facilitated; the adjusting end of the exhaust adjusting mechanism can adjust the gas flow in the exhaust pipe in a lifting manner, so that the internal space of the exhaust pipe can be prevented from being occupied, and the space occupation can be further reduced; but also the regulation is more accurate, so as to meet the requirement of accurate regulation and control of high-end semiconductor process equipment. In addition, the exhaust device is simple in structure and convenient to disassemble, assemble and maintain, and therefore maintenance and cleaning cost is greatly reduced.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic top view of semiconductor processing equipment according to an embodiment of the present disclosure;
FIG. 2 is a schematic, cross-sectional, transverse view of one of the semiconductor processing apparatus provided in FIG. 1;
FIG. 3 isbase:Sub>A schematic cross-sectional view ofbase:Sub>A semiconductor processing apparatus A-A provided in FIG. 2;
FIG. 4 is an enlarged, partial cross-sectional view of a semiconductor processing apparatus according to an embodiment of the present disclosure;
FIG. 5 is a schematic cross-sectional view of an exhaust apparatus provided in an embodiment of the present application, with a portion omitted;
FIG. 6 is a schematic cross-sectional view of an exhaust adjustment mechanism provided in an embodiment of the present application;
FIG. 7 is a schematic cross-sectional view of an exhaust adjustment mechanism illustrating the flow of cleaning solution provided by an embodiment of the present application;
fig. 8 is a schematic side view of a semiconductor processing apparatus according to an embodiment of the present disclosure.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is unnecessary for the features of the present application shown, it is omitted. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present application and are not construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.
An embodiment of the present application provides a semiconductor process apparatus, a schematic structural diagram of which is shown in fig. 1 to 3, including: a process chamber 1 and an exhaust apparatus 2; the process chamber 1 comprises a plurality of accommodating cavities 11 which are stacked along the vertical direction, and the accommodating cavities 11 are used for accommodating wafers to be processed; the exhaust device 2 comprises exhaust components 21, and the exhaust components 21 are in one-to-one correspondence with the accommodating cavities 11 and are communicated with the accommodating cavities 11 to respectively exhaust gas in the accommodating cavities 11; the exhaust assembly 21 includes an exhaust pipe 22 and an exhaust adjusting mechanism 23, the exhaust pipe extends along the vertical direction, the peripheral wall of the exhaust pipe 22 is communicated with the accommodating chamber 11, and one end of the exhaust pipe is connected with an air extracting device (not shown in the figure); the exhaust adjusting mechanism 23 extends in a vertical direction, the adjusting end 231 of the exhaust adjusting mechanism 23 is accommodated inside the exhaust pipe 22, the operating end 232 of the exhaust adjusting mechanism 23 is located outside the other end of the exhaust pipe 22, and the operating end 232 is operated to enable the adjusting end 231 to move up and down along the exhaust pipe 22 in the vertical direction so as to adjust the gas flow rate of the exhaust pipe 22.
As shown in fig. 1 to 3, the semiconductor processing equipment is, for example, a single wafer wet cleaning equipment, but the embodiment of the present application is not limited thereto, and a person skilled in the art can adjust the setting according to actual situations. The three stacked and communicated accommodating cavities 11 are arranged in the process chamber 1, the three accommodating cavities 11 are arranged in the vertical direction, the bearing device can drive the wafer to lift between the three accommodating cavities 11, and the accommodating cavities 11 can adopt different cleaning liquid medicines to clean the wafer and can recycle the cleaning liquid medicines. The exhaust device 2 includes three exhaust assemblies 21, and the three exhaust assemblies 21 and the three accommodating cavities 11 are arranged in a one-to-one correspondence manner, and are used for respectively discharging exhaust gas in each accommodating cavity 11, where the gas is, for example, harmful gas volatilized by different types of cleaning liquid medicines or other gases generated in the cleaning process. However, the number of the exhaust assemblies 21 is not limited in the embodiments of the present application, as long as the number of the exhaust assemblies 21 corresponds to the number of the accommodating chambers 11. Each exhaust assembly 21 comprises an exhaust pipe 22 and an exhaust adjusting mechanism 23, the exhaust pipe 22 extends in the vertical direction, and the peripheral wall of the exhaust pipe 22 close to the top end can be connected with the peripheral wall of the process chamber 1 so as to be communicated with the accommodating cavity 11; the bottom end of the exhaust pipe 22 may be connected to an air extracting device, such as a vacuum pump or a negative pressure exhaust pipe of a plant, but the embodiment of the present invention is not limited thereto. For example, the top end of the exhaust pipe 22 may be connected to an air extractor, and the peripheral wall near the bottom end may be communicated with the accommodating chamber 11. In the example of fig. 1 to 3, the exhaust gas adjusting mechanism 23 is provided to extend in the vertical direction, and the exhaust gas adjusting mechanism 23 may extend from the top end of the exhaust pipe 22 into the exhaust pipe 22 such that the adjusting end 231 of the exhaust gas adjusting mechanism 23 is located inside the exhaust pipe 22 and the operating end 232 of the exhaust gas adjusting mechanism 23 is located outside the top end of the exhaust pipe 22, or the operating end 232 of the exhaust gas adjusting mechanism 23 may also be located outside the bottom end of the exhaust pipe 22. By operating the operation end 232, the adjustment end 231 can be lifted up and down in the exhaust pipe 22 in the vertical direction to adjust the gas flow in the exhaust pipe 22, thereby adjusting the exhaust flow of each accommodation chamber 11 of the process chamber 1.
This application embodiment sets up through a plurality of exhaust subassembly and a plurality of holding chamber one-to-ones to set up the perisporium and the holding chamber intercommunication of blast pipe, and in exhaust adjustment mechanism stretched into the blast pipe by the one end of blast pipe, in order to be used for adjusting the gas flow in the blast pipe, thereby realize adjusting the exhaust flow in each holding chamber of process chamber. By adopting the design, the whole structure of the exhaust device is small and exquisite, and the exhaust device can be adapted to the structural layout design of various process chambers, so that the space occupation is greatly reduced, and the miniaturization of the process chambers is facilitated; the adjusting end of the exhaust adjusting mechanism can adjust the gas flow in the exhaust pipe in a lifting manner, so that the internal space of the exhaust pipe can be prevented from being occupied, and the space occupation can be further reduced; but also the regulation is more accurate, so as to meet the requirement of accurate regulation and control of high-end semiconductor process equipment. In addition, the exhaust device is simple in structure and convenient to disassemble, assemble and maintain, and therefore maintenance and cleaning cost is greatly reduced.
In an embodiment of the present application, as shown in fig. 1 to 3, an air inlet 221 is formed on a peripheral wall of the exhaust pipe 22, the air inlet 221 is communicated with the accommodating chamber 11 through a connecting cross pipe 24, and the adjusting end 231 adjustably shields a ventilation section of the air inlet 221 through a lifting motion to adjust an air flow between the connecting cross pipe 24 and the exhaust pipe 22.
As shown in fig. 1 to 3, the exhaust pipe 22 may have a circular tubular structure, and a circular inlet 221 is opened in a circumferential wall near a tip end of the exhaust pipe 22. The horizontal connecting pipe 24 may be a tubular structure, one end of the horizontal connecting pipe 24 is connected to the air inlet 221 in a sealing manner, and the other end of the horizontal connecting pipe is connected to the side wall of the process chamber 1, so as to be communicated with the accommodating chamber 11. In the initial state, the adjusting end 231 may be located at the middle lower part of the air inlet 221, as shown in fig. 2, for closing the connecting cross pipe 24 and the exhaust pipe 22, so as to completely close the exhaust; when the exhaust is needed, the adjusting end 231 is gradually lifted up to adjustably shield the ventilation section of the air inlet 221, specifically referring to the position state of the exhaust adjusting mechanism 23 on the left side in fig. 4, so as to achieve the purpose of starting the exhaust of the exhaust pipe 22 and adjusting the exhaust flow rate, that is, the adjusting end 231 adjustably shields the ventilation section of the air inlet 221 through the lifting motion to adjust the air flow rate between the connecting cross pipe 24 and the exhaust pipe 22. By adopting the design, the exhaust flow can be accurately adjusted by adopting a simpler structure, so that the application and maintenance cost is greatly reduced.
In an embodiment of the present application, as shown in fig. 4 to 6, the bottom of the adjusting end 231 is provided with an adjusting inclined surface 233, the adjusting inclined surface 233 extends along the circumferential direction of the adjusting end 231, and is inclined inward from top to bottom to form a predetermined angle with the axial direction of the adjusting end 231, and the adjusting inclined surface 233 is configured to cooperate with the inner wall of the exhaust pipe 22 to adjust the ventilation cross section of the air inlet 221 and selectively isolate the communication between the air inlet 221 and the exhaust pipe 22. Optionally, the preset angle is 20 ° to 30 °.
As shown in fig. 4 to fig. 6, the whole exhaust adjusting mechanism 23 may be made of a soft PTFE material, in order to facilitate matching with the inner diameter of the exhaust pipe 22, the diameter of the adjusting end 231 is larger than the rest of the exhaust adjusting mechanism 23, the adjusting end 231 may be attached to the inner wall of the exhaust pipe 22, and due to the material of the adjusting end 231, the adjusting end 231 may be sealed with the inner wall of the exhaust pipe 22. For example, in the initial state, the regulation end 231 may completely close the space inside the intake port 221 and the exhaust pipe 22; or when venting is desired, the tuning tip 231 may be positioned at the top of the gas inlet 221 to avoid gas exiting the top end of the gas exit tube 22. Further, in order to improve the sealing isolation between the adjustment end 231 and the exhaust pipe 22, the lower half portion of the adjustment end 231 may be provided with an adjustment inclined surface 233, the adjustment inclined surface 233 extends around the circumferential direction of the adjustment end 231, and is inclined inward from top to bottom to form a predetermined angle with the axial direction of the adjustment end 231, and the predetermined angle may be any value between 20 ° and 30 °. By adopting the design, the adjusting inclined plane 233 can better seal and isolate the inner space of the air inlet 221 and the exhaust pipe 22, the adjusting inclined plane 233 can also play a role in accurately adjusting the air flow when the adjusting end 231 rises, the opening degree of the ventilation section of the air inlet 221 is prevented from being large, and the adjusting precision is further improved. In addition, the adjusting inclined surface 233 is arranged, so that the adjusting end 231 can enter the exhaust pipe 22 below the air inlet 221 conveniently, a guiding effect is achieved, the adjusting end 231 is prevented from being clamped at the air inlet 221, and the usability of the embodiment of the application is improved.
In an embodiment of the present application, as shown in fig. 4 to 6, a sealing structure 234 is further disposed on the top of the adjusting end 231, the sealing structure 234 is in sealing contact with the inner peripheral wall of the exhaust pipe 22, and when the adjusting end 231 is located on the top of the air inlet 221, the sealing structure 234 is used for sealing the exhaust pipe 22. Specifically, the sealing structure 234 is disposed at the top of the adjusting end 231, and the sealing structure 234 may be disposed above the adjusting inclined surface 233 and adjacent to the adjusting inclined surface 233, but the embodiment of the present application is not limited thereto, for example, the sealing structure 234 and the adjusting inclined surface 233 may be disposed at an interval. When needs are discharged, seal structure 234 can be sealed with the inner wall of blast pipe 22 and is laminated, when adjusting that end 231 is located the top of air inlet 221 promptly, seal structure 234 cooperates in order to realize sealedly with the internal perisporium of blast pipe 22 to avoid the gas of air inlet 221 department to be discharged by the top of blast pipe 22, thereby further improve the leakproofness of exhaust in-process, in order to avoid polluting external environment.
In an embodiment of the present application, as shown in fig. 4 to 6, the sealing structure 234 is a groove structure or a bump structure formed on the peripheral wall of the adjusting end 231, and a plurality of groove structures or bump structures extend along the circumferential direction of the adjusting end 231 and are uniformly and alternately arranged along the axial direction of the adjusting end 231.
As shown in fig. 4 to 6, the sealing structure 234 is a plurality of grooves formed on the peripheral wall of the adjusting end 231, for example, three grooves are formed on the periphery of the adjusting end 231 in a stacked manner, and the sealing structure 234 can adopt a plurality of grooves or bumps because the grooves and the bumps can be correspondingly formed. In addition, the embodiment of the present application does not limit the specific number of the grooves, and theoretically, the larger the number of the grooves, the better the sealing effect, so that the setting can be automatically adjusted by a person skilled in the art according to actual situations. In a specific embodiment, the distance between any two adjacent grooves is 2 mm, and the depth of the groove can be set to 3 to 5 mm, but the embodiment of the present application does not limit the specific specification of the groove, and the setting can be adjusted by a person skilled in the art according to the actual situation. During the exhaust process, since the bottom end of the exhaust pipe 22 is connected to the air extractor, the sealing structure 234 can seal the space at the top of the air inlet 221, so that the air at the air inlet 221 enters the air extractor along the exhaust pipe 22 and is exhausted, as shown in fig. 5, wherein the black arrows show the air flow direction. By adopting the design, the structure of the embodiment of the application is simpler, so that the manufacturing and maintenance cost is greatly reduced. It should be noted that, the embodiment of the present application is not limited to the specific implementation of the sealing structure 234, for example, the sealing structure 234 may be a plurality of flexible sealing rings sleeved on the outer periphery of the adjusting end 231, and the above technical effects can also be achieved. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 4 to 7, the operation end 232 is located outside the top end of the exhaust pipe 22, a spraying channel 235 is formed in the adjustment end 231, and a plurality of spraying openings are formed on the bottom surface of the spraying channel 235 on the adjustment end 231; an adapter tube 236 is arranged in the exhaust adjusting mechanism 23, one end of the adapter tube 236 is communicated with the spraying channel 235, and the other end is connected with a liquid supply pipeline for spraying cleaning solution into the exhaust pipe 22.
As shown in fig. 4 to 7, the exhaust gas adjusting mechanism 23 may protrude from the top end of the exhaust pipe 22 into the exhaust pipe 22 such that the adjusting end 231 of the exhaust gas adjusting mechanism 23 is located inside the exhaust pipe 22 and the operating end 232 of the exhaust gas adjusting mechanism 23 is located outside the top end of the exhaust pipe 22. A plurality of spraying channels 235 can be formed in the adjusting end 231, a uniform flow cavity is formed at the top of the plurality of spraying channels 235, and a spraying port is formed on the bottom surface of the adjusting end 231 by the plurality of spraying channels 235 for spraying cleaning solution into the exhaust pipe 22, so that the exhaust pipe 22 is cleaned. The adaptor tube 236 may be integrally formed in an internal channel of the exhaust adjustment mechanism 23, or may be nested in the exhaust adjustment mechanism 23 by using a tubular structure, which is not limited by the embodiments of the present application. One end of the adapter tube 236 is communicated with the plurality of spraying channels 235 through the uniform flow cavity, and the other end of the adapter tube can be connected with the liquid supply pipeline through a quick-release interface, wherein the quick-release interface is located at the operation end 232 of the exhaust adjusting mechanism 23 and is used for quickly opening or closing the adapter tube 236 and the liquid supply pipeline. In practical application, because the exhaust adjusting mechanism 23 is located at the upstream of the whole exhaust device, the adapter tube 236 is only required to be communicated with the liquid supply pipeline, the cleaning solution can be sprayed into the exhaust pipe 22, the cleaning action can be completed within a preset time, and compared with a method that each accommodating cavity of a process chamber needs to be separated and then the exhaust pipe 22 needs to be cleaned in the prior art, the cleaning difficulty of the exhaust assembly 21 is greatly reduced in the embodiment of the application, so that the disassembly, assembly and maintenance efficiency is greatly improved. It should be noted that deionized water may be used as the cleaning solution, but the embodiment of the present invention is not limited thereto as long as the exhaust pipe 22 can be cleaned. By adopting the design, the exhaust pipe 22 can be cleaned without disassembling the exhaust assembly 21 in the embodiment of the application, so that the disassembly, assembly and maintenance cost of the exhaust assembly 21 is greatly reduced, and the working efficiency of the embodiment of the application is improved. Further, one of the spraying channels 235 is coaxial with the adjusting end 231, the other spraying channels 235 can be uniformly arranged around the axis of the adjusting end 231, and the spraying channels 235 are inclined outwards from top to bottom, so that the axes of the spraying channels 235 and the axis of the adjusting end 231 form a preset included angle. With the above design, the spray passages 235 can spray the cleaning solution to the inner peripheral wall of the exhaust pipe 22, thereby improving the cleaning effect of the exhaust pipe 22.
In an embodiment of the present application, as shown in fig. 1 to fig. 3 and fig. 8, the exhaust device 2 further includes an integrated box 25, the integrated box 25 covers the top portions of the exhaust pipes 22, the exhaust adjusting mechanisms 23 are all disposed through the top wall of the integrated box 25, so that the adjusting end 231 is located in the exhaust pipe 22, and the exhaust adjusting mechanisms 23 can be lifted and lowered relative to the top wall and selectively positioned.
As shown in fig. 1 to 3 and 8, the integration box 25 may have a rectangular-like structure, and the side wall near the process chamber 1 may have an arc-like structure for engaging with the peripheral wall of the process chamber 1, and the bottom wall of the integration box 25 may have a stepped-like structure for engaging with the top end of the exhaust pipes 22 arranged at different heights and may be sealingly connected with the top end of the exhaust pipe 22. The exhaust adjusting mechanisms 23 are all arranged on the top wall of the integrated box 25 in a penetrating mode, so that the adjusting end 231 can be located in the exhaust pipe 22, the exhaust adjusting mechanisms 23 can lift relative to the top wall of the integrated box 25 and can be located with the top wall, and therefore the adjustment of the gas flow of the exhaust pipe 22 through the adjusting end 231 is achieved. Adopt above-mentioned design for the integrated level of this application embodiment is higher, can not only reduce the space and occupy, but also can help going up and down and the location to exhaust adjustment mechanism 23, thereby further improves the convenience that the dismouting was maintained. It should be noted that the embodiment of the present application does not limit the specific shape of the integrated box 25, and the setting can be adjusted by a person skilled in the art according to practical situations.
In an embodiment of the present application, as shown in fig. 1 to 8, a threaded connection portion 237 with a preset length is disposed on an outer periphery of the exhaust adjusting mechanism 23, a threaded connection hole is formed on a top wall of the integrated box 25, and the threaded connection portion 237 is connected with the threaded connection hole in a matching manner. Specifically, the outer circumference of the exhaust adjustment mechanism 23 is provided with a screw coupling portion 237, and the screw coupling portion 237 has a predetermined length for covering the elevating stroke of the adjustment end 231. The top wall of the integrated box 25 is provided with a threaded connection hole, and the threaded connection portion 237 is connected with the threaded connection hole in a matching manner. In practical applications, the operation end 232 of the exhaust adjusting mechanism 23 is operated, for example, the operation end 232 is manually rotated, so that the threaded connection portion 237 and the threaded connection hole cooperate to drive the adjusting end 231 to move up and down in the exhaust pipe 22. Optionally, the operation end 232 of the exhaust adjusting mechanism 23 may be further connected to a servo motor or a stepping motor for driving the operation end 232 to rotate, which not only can realize the automatic control of the embodiment of the present application, but also can improve the accuracy of the adjustment. By adopting the design, the embodiment of the present application adopts a simpler structure, that is, the relative movement and selective positioning between the exhaust adjusting mechanism 23 and the top wall of the integrated box 25 can be realized, so that the application and maintenance costs are greatly reduced. However, the embodiment of the present invention is not limited to this, and for example, a damper may be provided between the exhaust adjustment mechanism 23 and the top wall of the integration box 25, and the adjustment end 231 may be lifted and positioned in the exhaust pipe 22 by pulling or pressing the operation end 232. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1 to 8, a scale is further disposed on the threaded connection portion 237, and the scale is disposed corresponding to an opening degree of the ventilation section of the air inlet 221. Specifically, the threaded portion 237 may be provided with a scale, which may be formed on the threaded portion 237 by laser engraving, and the scale and the threaded portion 237 have the same length for corresponding to the opening degree of the ventilation section of the air inlet 221. In practical applications, an operator can read the elevation height of the threaded connection portion 237 according to the scale to determine the ventilation cross-sectional opening of the air inlet 221. By adopting the design, the adjusting accuracy of the embodiment of the application can be further improved, so that the applicability and the application range are improved. However, the embodiment of the present application does not limit the specific implementation of the scale, and a person skilled in the art can adjust the setting according to the actual situation.
In an embodiment of the present application, as shown in fig. 1 to 8, the two ends of the threaded connection portion 237 are respectively provided with a stop portion 238, and an outer diameter of the stop portion 238 is larger than an outer diameter of the threaded connection portion 237 for cooperating with a top wall of the integration box 25 to limit a lifting stroke of the exhaust adjusting mechanism 23. Specifically, the exhaust adjustment mechanism 23 has a circumferential groove, and the groove extends along the axial direction of the exhaust adjustment mechanism 23, the bottom surface of the groove may be formed with a threaded connection portion 237, the side wall of the groove is used for forming a stopping portion 238, that is, the outer diameter of the stopping portion 238 is greater than the outer diameter of the threaded connection portion 237, so that the exhaust adjustment mechanism 23 is stopped in the lifting process of the top wall of the integrated box 25, and the adjustment end 231 and the exhaust pipe 22 are prevented from falling off, thereby improving the stability of the embodiment. Further, the exhaust adjusting mechanism 23 is of a cylindrical structure with the same diameter, the thread adjusting part is formed on the outer circumferential surface of the exhaust adjusting mechanism 23, and the smooth surface part of the exhaust adjusting mechanism 23 can directly form the stop part 238; or circumferentially extending projections for forming the stopper 238 are provided at both ends of the threaded connection 237. By adopting the design, the structure of the embodiment of the application is simple, so that the manufacturing and application cost is further reduced.
In an embodiment of the present application, as shown in fig. 1 to 8, the exhaust pipes 22 are sequentially disposed along a circumferential direction of the process chamber 1, and top ends of the exhaust pipes 22 are sequentially arranged in a decreasing manner in a height-matching manner with the corresponding accommodating cavities 11, and/or lengths of the horizontal connecting pipes 24 are sequentially increased. Specifically, the three exhaust pipes 22 may be sequentially arranged along the circumferential direction of the process chamber 1, and the three exhaust pipes 22 may be attached to each other in the circumferential direction of the process chamber 1, so as to further save the occupied space. The top ends of the exhaust pipes 22 are sequentially lowered in the axial direction of the process chamber 1, that is, the top ends of the exhaust pipes 22 are respectively matched with the heights of the corresponding accommodating cavities 11, and the top ends of the exhaust pipes 22 are raised relative to the end portion of the connecting cross pipe 24, so that the adjusting ends 231 can be accommodated inside the top ends of the exhaust pipes 22, but the embodiment of the present invention is not limited thereto. Further, the connecting cross pipes 24 have different lengths in the radial direction of the process chamber 1, for example, the lengths of the three connecting cross pipes 24 in the radial direction of the process chamber 1 are sequentially increased, so that the three exhaust pipes 22 can be staggered in the vertical direction, the space at the bottom ends of the exhaust pipes 22 is optimized, and the exhaust pipes 22 are conveniently connected with an air exhaust device. By adopting the design, the space occupation of the exhaust device 2 can be further reduced, and the space occupation of the exhaust pipe 22 can be optimized, so that the working efficiency of dismounting and maintenance of the embodiment of the application is improved.
Based on the same inventive concept, an embodiment of the present application provides an exhaust adjusting mechanism 23 for a semiconductor processing apparatus, a schematic structural diagram of the exhaust adjusting mechanism 23 is shown in fig. 1 to 8, the exhaust adjusting mechanism 23 is connected to an exhaust pipe 22 of the semiconductor processing apparatus, the exhaust adjusting mechanism 23 extends in a vertical direction, an adjusting end 231 of the exhaust adjusting mechanism 23 is accommodated inside the exhaust pipe 22, an operating end 232 of the exhaust adjusting mechanism 23 is located outside the exhaust pipe 22, the operating end 232 is operated to make the adjusting end 231 perform a lifting motion along an axial direction of the exhaust pipe 22, a bottom of the adjusting end 231 is provided with an adjusting inclined surface 233, the adjusting inclined surface 233 extends along a circumferential direction of the adjusting end 231 and is inclined inward from top to bottom to form a preset angle with the axial direction of the adjusting end 231, the adjusting inclined surface 233 is used for cooperating with an inner wall of the exhaust pipe 22 to adjust a ventilation cross section of an air inlet 221 on the circumferential wall of the exhaust pipe 22, and can selectively isolate the air inlet 221 from communicating with the exhaust pipe 22. By adopting the design, the whole structure of the exhaust adjusting mechanism is small and exquisite, and the exhaust adjusting mechanism can be adapted to the structural layout design of various process chambers, so that the space occupation is greatly reduced, and the miniaturization of the process chambers is facilitated; the adjusting end of the exhaust adjusting mechanism can adjust the gas flow in the exhaust pipe in a lifting manner, so that the internal space of the exhaust pipe can be prevented from being occupied, and the space occupation can be further reduced; but also makes the adjustment more accurate so as to meet the accurate regulation and control requirement of high-end semiconductor process equipment.
In an embodiment of the present application, as shown in fig. 1 to 8, an adapter tube 236 is disposed in the exhaust adjusting mechanism 23, a spraying channel 235 is formed in the adjusting end 231, and a plurality of spraying openings are formed on a bottom surface of the adjusting end 231 of the spraying channel 235, one end of the adapter tube 236 is communicated with the spraying channel 235, and the other end is connected to the liquid supply pipeline for spraying the cleaning solution into the exhaust pipe 22. By adopting the design, the exhaust pipe 22 can be cleaned without being disassembled, so that the disassembly and assembly maintenance cost is greatly reduced, and the working efficiency of the embodiment of the application is improved.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
this application embodiment sets up through a plurality of exhaust subassembly and a plurality of holding chamber one-to-ones to set up the perisporium and the holding chamber intercommunication of blast pipe, and in exhaust adjustment mechanism stretched into the blast pipe by the one end of blast pipe, in order to be used for adjusting the gas flow in the blast pipe, thereby realize adjusting the exhaust flow in each holding chamber of process chamber. By adopting the design, the whole structure of the exhaust device is small and exquisite, and the exhaust device can be adapted to the structural layout design of various process chambers, so that the space occupation is greatly reduced, and the miniaturization of the process chambers is facilitated; the adjusting end of the exhaust adjusting mechanism can adjust the gas flow in the exhaust pipe in a lifting manner, so that the internal space of the exhaust pipe can be prevented from being occupied, and the space occupation can be further reduced; but also makes the adjustment more accurate so as to meet the accurate regulation and control requirement of high-end semiconductor process equipment. In addition, the exhaust device has a simple structure, so that the exhaust device is convenient to assemble, disassemble and maintain, and the maintenance and cleaning cost is greatly reduced.
It will be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principles of the present invention, and the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, merely for convenience in describing the present invention and to simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (14)
1. A semiconductor processing apparatus, comprising: a process chamber and exhaust;
the process chamber comprises a plurality of accommodating cavities which are stacked in the vertical direction and used for accommodating wafers to be processed;
the exhaust device comprises exhaust components, the exhaust components correspond to the accommodating cavities one by one and are communicated with the accommodating cavities, and the exhaust components are used for respectively exhausting gas in the accommodating cavities;
the exhaust assembly comprises an exhaust pipe and an exhaust adjusting mechanism, the exhaust pipe extends along the vertical direction, the peripheral wall of the exhaust pipe is communicated with the accommodating cavity, and one end of the exhaust pipe is connected with an air extraction device; the exhaust adjusting mechanism extends along the vertical direction, an adjusting end of the exhaust adjusting mechanism is contained in the exhaust pipe, an operating end of the exhaust adjusting mechanism is located outside the other end of the exhaust pipe, and the operating end is operated to enable the adjusting end to lift along the vertical direction so as to adjust the gas flow of the exhaust pipe.
2. The semiconductor processing apparatus according to claim 1, wherein each of the exhaust pipes has an inlet opening formed on a peripheral wall thereof, the inlet opening being respectively communicated with the receiving cavities through a connecting cross-pipe, and the adjusting end adjustably shields a ventilation cross-section of the inlet opening through a lifting motion to adjust a flow rate of the gas between the connecting cross-pipe and the exhaust pipe.
3. The semiconductor processing apparatus according to claim 2, wherein the bottom of the adjustment end is provided with an adjustment slope extending along a circumferential direction of the adjustment end and inclined inward from top to bottom to form a predetermined angle with an axial direction of the adjustment end, the adjustment slope being adapted to cooperate with an inner wall of the exhaust pipe to adjust an air-vent section of the air inlet and selectively isolate the air inlet from communicating with the exhaust pipe.
4. The semiconductor processing apparatus according to claim 3, wherein a top portion of the tuning tip is further provided with a sealing structure, the sealing structure sealingly engaging an inner peripheral wall of the exhaust pipe, the sealing structure adapted to seal with the exhaust pipe when the tuning tip is positioned at the top portion of the gas inlet.
5. The semiconductor processing apparatus according to claim 4, wherein the sealing structure is a plurality of groove structures or bump structures formed on a peripheral wall of the adjustment end, each of the plurality of groove structures or bump structures extending in a circumferential direction of the adjustment end and arranged uniformly and at intervals in an axial direction of the adjustment end.
6. The semiconductor processing apparatus of claim 1, wherein the handle end is located outside a top end of the exhaust pipe, the conditioning end has a spray channel formed therein, and the spray channel has a plurality of spray ports formed on a bottom surface of the conditioning end; and a switching pipe is arranged in the exhaust adjusting mechanism, one end of the switching pipe is communicated with the spraying channel, and the other end of the switching pipe is connected with a liquid supply pipeline and used for spraying cleaning solution into the exhaust pipe.
7. The semiconductor processing apparatus according to claim 2, wherein the exhaust device further comprises an integrated box covering the top of the plurality of exhaust pipes, wherein the plurality of exhaust adjustment mechanisms are disposed through a top wall of the integrated box such that the adjustment ends are located in the exhaust pipes, and wherein the exhaust adjustment mechanisms are capable of being raised and lowered and selectively positioned relative to the top wall.
8. The semiconductor processing apparatus according to claim 7, wherein the exhaust gas adjusting mechanism is provided at an outer periphery thereof with a screw coupling portion having a predetermined length, and a screw coupling hole is formed at a top wall of the integration box, the screw coupling portion being coupled to the screw coupling hole in a fitting manner.
9. The semiconductor processing apparatus according to claim 8, wherein the threaded connection portion is further provided with a scale, and the scale is provided corresponding to an opening degree of a vent section of the gas inlet.
10. The semiconductor processing apparatus according to claim 8, wherein the threaded portion is provided at both ends thereof with stoppers, respectively, having an outer diameter larger than that of the threaded portion, for cooperating with a top wall of the integrated box to limit a lifting stroke of the degassing adjustment mechanism.
11. The semiconductor processing apparatus according to claim 7, wherein a plurality of said exhaust pipes are sequentially arranged along a circumferential direction of said process chamber, and top ends of said plurality of said exhaust pipes are arranged in a sequentially decreasing arrangement in a height-matching manner with said accommodating cavities corresponding thereto; and/or
The lengths of the connecting transverse pipes are sequentially increased.
12. The semiconductor processing apparatus according to any one of claims 1 to 11, wherein the semiconductor processing apparatus is a cleaning machine, and the plurality of receiving chambers are used for cleaning wafers and recovering cleaning solution.
13. An exhaust adjusting mechanism is used for semiconductor process equipment and is characterized in that the exhaust adjusting mechanism is connected with an exhaust pipe of the semiconductor process equipment, the exhaust adjusting mechanism extends in the vertical direction, an adjusting end of the exhaust adjusting mechanism is accommodated in the exhaust pipe, an operating end of the exhaust adjusting mechanism is located outside the exhaust pipe, the operating end is operated to enable the adjusting end to do lifting motion along the axial direction of the exhaust pipe, an adjusting inclined surface is arranged at the bottom of the adjusting end, the adjusting inclined surface extends in the circumferential direction of the adjusting end and inclines inwards from top to bottom to form a preset angle with the axial direction of the adjusting end, and the adjusting inclined surface is used for being matched with the inner wall of the exhaust pipe to adjust the ventilation section of an air inlet in the circumferential wall of the exhaust pipe and selectively isolating the air inlet from being communicated with the exhaust pipe.
14. The exhaust gas adjusting mechanism according to claim 13, wherein an adapter tube is provided in the exhaust gas adjusting mechanism, a spray passage is formed in the adjusting end, and the spray passage is formed with a plurality of spray ports on a bottom surface of the adjusting end, and one end of the adapter tube communicates with the spray passage and the other end thereof is connected to a liquid supply line for spraying a cleaning solution into the exhaust pipe.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211265823.8A CN115440633B (en) | 2022-10-17 | 2022-10-17 | Semiconductor process equipment and exhaust gas adjusting mechanism |
| PCT/CN2023/124683 WO2024083066A1 (en) | 2022-10-17 | 2023-10-16 | Semiconductor process apparatus and exhaust adjusting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211265823.8A CN115440633B (en) | 2022-10-17 | 2022-10-17 | Semiconductor process equipment and exhaust gas adjusting mechanism |
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| Publication Number | Publication Date |
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| CN115440633A true CN115440633A (en) | 2022-12-06 |
| CN115440633B CN115440633B (en) | 2023-07-11 |
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| CN202211265823.8A Active CN115440633B (en) | 2022-10-17 | 2022-10-17 | Semiconductor process equipment and exhaust gas adjusting mechanism |
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| CN (1) | CN115440633B (en) |
| WO (1) | WO2024083066A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024083066A1 (en) * | 2022-10-17 | 2024-04-25 | 北京北方华创微电子装备有限公司 | Semiconductor process apparatus and exhaust adjusting mechanism |
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| CN115440633B (en) | 2023-07-11 |
| WO2024083066A1 (en) | 2024-04-25 |
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