CN215731613U - Box for wafer processing device and wafer processing device - Google Patents

Abstract

The application provides a box body for a wafer processing device and the wafer processing device, which comprise a shell, a mounting bracket, a valve and an exhaust pipe; the housing has a mounting cavity, an exhaust passage, and a first vent. The exhaust passage is integrated to be arranged on the shell, the mounting cavity is used for mounting a plurality of wafer processing units, the first air vent is communicated with the mounting cavity and the exhaust passage and used for being connected to an exhaust port of the wafer processing units, the exhaust passage is connected to the exhaust pipe, the valve is arranged on the exhaust pipe, and the exhaust pipe is communicated to an external space or a gas processing device. The shell comprises a first side plate, a second side plate and a back plate which jointly form a groove-shaped mounting cavity; at least one of the first side plate, the second side plate and the back plate is provided with a hollow structure to form an exhaust passage. The wafer processing apparatus includes a plurality of wafer processing units and the above-described case for the wafer processing apparatus. The integrated exhaust passage has the advantages of compact structure, convenience and reliability in installation, good adaptability, simplicity in arrangement of the wafer processing device and convenience in expansion.

Description

Box for wafer processing device and wafer processing device

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a box body for a wafer processing device and the wafer processing device.

Background

In the manufacturing process of the integrated circuit wafer, various processes are required to be carried out on the wafer, wherein various gases are required to be used in the processes or gases are generated in the processes, and the gases generated in part of the processes are high-temperature gases or harmful gases. For example, hydrophobization before coating a resist on a wafer, dehydration baking before coating, baking before development, soft baking for removing a solvent in a resist, hardening baking after development, cooling after high-temperature baking, and the like. Gases generated during these processes need to be exhausted through the exhaust passage in time.

In the prior art, an exhaust pipeline which is independently arranged is adopted to discharge the gas of a plurality of wafer processing units after being converged. For example, KR20060131503A discloses a wafer baking apparatus, which comprises a plurality of wafer baking units, each wafer baking unit having an exhaust pipe, all the exhaust pipes are merged to a main exhaust pipe and then exhausted.

However, the technical scheme has the following defects:

1. an independent exhaust pipe needs to be configured for each wafer baking unit, and more pipe arrangement space is needed when a plurality of wafer baking units exist, so that not only is the space occupied, but also the arrangement of other parts is influenced;

2. when a plurality of exhaust pipes are arranged in the space of the case, the exhaust pipes need to be non-metal hoses, so that the exhaust pipes are easy to age, and are likely to be damaged in the installation process and after long-time use, and have leakage hidden danger;

3. the installation process of the wafer baking unit is complicated, and the wafer baking unit needs to be increased, reduced, replaced or maintained, and needs to be disassembled and reinstalled more complicated, so the expansibility and the adaptability are poor.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned disadvantages of the prior art, an object of the present invention is to provide a box for a wafer processing apparatus and a wafer processing apparatus, which have a compact structure, are convenient for mounting a wafer processing unit, and have good expandability and adaptability.

In order to achieve the above object, the present invention provides the following technical solutions.

A box body for a wafer processing device comprises a shell, wherein the periphery of the shell wall of the shell is enclosed to form at least one mounting cavity; the shell wall is provided with at least one hollow structure, the hollow structure forms an exhaust passage, and the shell wall is also provided with at least one first air vent; the mounting cavity is used for mounting at least one wafer processing unit, each exhaust port of each wafer processing unit is communicated to the exhaust channel through one first vent, and the exhaust channel is communicated to an external space or a gas processing device.

The exhaust channel is formed by a hollow structure in the wall of the housing, and the exhaust channel is communicated with the mounting cavity through the first vent. In practical application, the position of the first vent is matched with the exhaust port of the wafer processing unit, and meanwhile, the positioning elements are arranged on the shell and the wafer processing unit, so that after the wafer processing unit is installed on the shell, the corresponding exhaust port and the first vent can be aligned, and meanwhile, the exhaust port and the exhaust channel are hermetically connected through the size matching of the exhaust port and the first vent or the sealing element arranged on the exhaust port. The exhaust pipeline does not need to be arranged for each wafer processing unit in actual application, and the exhaust pipeline is compact in structure, convenient to install, reliable in work and free of aging and maintenance problems.

Preferably, the housing wall comprises a first side plate, a second side plate, and a back plate, wherein the first side plate and the second side plate are connected to two sides of the back plate oppositely, and the back plate and the first side plate and the second side plate jointly enclose the mounting cavity in a groove shape; the mounting cavity is suitable for mounting a plurality of wafer processing units in an up-and-down arrangement manner; at least one of the first side plate, the second side plate and the back plate is provided with the hollow structure.

Form the installation cavity of trough-like through first curb plate, second curb plate and backplate and be convenient for the wafer processing unit from the opening part installation to the box of trough-like structure in, can set up one or more hollow structure according to the position of the gas vent of the wafer processing unit of different grade type simultaneously on curb plate or backplate, constitute exhaust passage. The hollow structure can be a cavity of a standard extruded section, can also be realized by assembling a plurality of parts, can also be a pipeline provided with a first air vent, and is integrally arranged in a side plate or a back plate.

Preferably, the backboard comprises a backboard body and a cover plate which are detachably connected, the backboard body is of a groove-shaped structure with an outward opening, and the cover plate covers the backboard body to form the hollow structure.

The wafer processing unit, which is mounted in a vertically stacked manner with the opening of the groove-like structure of the case for the wafer processing apparatus as the front surface, often loads and takes out wafers from the front surface or the side surface, and then exhausts the wafers from the back surface. Therefore, the exhaust channel is preferably arranged in the back plate of the box body, and the back plate body and the cover plate which are detachably connected form a hollow structure, so that the box body can be opened for cleaning or overhauling when needed.

Preferably, the back plate body and/or the cover plate are provided with vertically extending ribs which divide the exhaust channel into vertical exhaust grooves which are not communicated with each other.

When the exhaust channel is divided into a plurality of exhaust grooves by the convex ribs, the exhaust channel can be used in the application occasions where a plurality of exhaust grooves are needed to process different gases. At the moment, the exhaust ports of different gases can be connected to the corresponding exhaust grooves, so that the box body has better adaptability.

Preferably, the box body for the wafer processing device further comprises a mounting bracket which is horizontally and extendedly mounted to the shell in the mounting cavity and used for mounting the wafer processing unit.

The groove-shaped mounting cavity and the plurality of horizontally arranged mounting supports form a plurality of mounting positions, a first air vent is arranged on the back plate corresponding to each mounting position, and the groove-shaped mounting cavity and the plurality of horizontally arranged mounting supports are suitable for insertion installation, replacement, disassembly and maintenance of the modularized wafer processing unit. Can reserve installation position to with the rubber buffer shutoff for the first vent that corresponds for install extra wafer processing unit when needing extension apparatus.

Preferably, a wafer loading port is arranged on the first side plate and/or the second side plate and used for loading wafers to the wafer processing unit.

A wafer loading port may be provided at one or both sides of the cassette to load and remove wafers by a wafer loading robot.

Preferably, the box for the wafer processing device further comprises a valve and an exhaust pipe, wherein the valve is arranged on the exhaust pipe and is used for closing or opening the exhaust pipe; the back plate is provided with a second vent hole which is communicated with the exhaust channel and the exhaust pipe.

Each exhaust groove can be respectively provided with a second vent, then the vent is converged to an exhaust pipe, and the exhaust can also be respectively carried out. The valve is used for closing the exhaust pipe when the equipment does not work so as to prevent foreign matters from entering.

Preferably, the box for the wafer processing apparatus further comprises a connection box having a hollow structure, and an inner cavity of the connection box is used for communicating the second vent and the exhaust pipe.

Can establish a plurality of connecting boxes or set up a plurality of cavities in the connecting box and connect a plurality of second air ports and a plurality of blast pipes respectively, also can set up a connecting box and converge a plurality of second air ports to a blast pipe, make the box nimble configuration as required, the adaptability is better.

The application also provides a wafer processing device, which comprises a plurality of wafer processing units and the box body for any wafer processing device, wherein the wafer processing units are installed in the installation cavity, and each exhaust port of the wafer processing units is communicated to the exhaust channel through the first vent.

The exhaust passage shared by the wafer processing units does not need to be provided with a plurality of pipelines to be converged to the exhaust port like the prior art, has simple and compact structure and good reliability, is easy to install, expand and maintain, and is suitable for integrating the modularized wafer processing units into the wafer processing device.

Preferably, the plurality of wafer processing units comprise at least one of a hot plate baking unit, an HMDS processing unit and a cold plate cooling unit; the wafer processing units are sequentially arranged up and down according to the working temperature range and are installed in the installation cavity.

The plurality of wafer processing units are sequentially installed according to the working temperature range, so that gas is exhausted, mutual influence can be reduced, and the overall temperature and humidity management of the device can be easily performed by utilizing the exhaust process.

The utility model has the technical effects that:

1. the exhaust channel integrated on the box body is used for exhausting air in a centralized way, so that the box body is compact in structure, convenient to install, easy to expand and good in adaptability;

2. the exhaust channel is formed by the hollow structure in the back plate, so that the space is hardly occupied, the structure is reliable and durable, and the detachable structure is convenient for cleaning and maintaining the exhaust channel;

3. the modularized wafer processing unit is easy to install and can be used in a plug-and-play manner through an installation position formed by the installation cavity with the groove-shaped structure and the horizontally arranged installation support;

4. through the arrangement of the plurality of exhaust grooves and the connecting box, the exhaust channel can be flexibly arranged to meet the requirement of multi-path exhaust;

5. through the reasonable arrangement of the exhaust channel and the mounting position on the box body, the wafer processing device is easy to integrate a plurality of wafer processing units and is easy to expand and maintain.

Drawings

The above features, technical features, advantages and modes of realisation of the present invention will be further described in the following detailed description of preferred embodiments thereof, which is to be read in connection with the accompanying drawings.

FIG. 1 is a perspective view of a case and an installed wafer processing unit for a wafer processing apparatus according to a first embodiment;

FIG. 2 is a schematic view of a box assembly of the wafer processing apparatus according to the first embodiment;

FIG. 3 is a front view of a case for a wafer processing apparatus according to the first embodiment;

FIG. 4 is an enlarged view of detail A of FIG. 3;

FIG. 5 is a perspective view of a wafer processing unit of the first and second embodiments;

FIG. 6 is a cross-sectional view B-B of FIG. 3;

FIG. 7 is an enlarged view of detail C of FIG. 6;

FIG. 8 is a schematic diagram of the components of the back plate according to the first embodiment;

FIG. 9 is a schematic view of a wafer processing apparatus and a five-axis robot working in cooperation therewith according to a second embodiment;

the reference numbers illustrate:

1. the wafer processing device comprises a shell, a mounting support, a valve, an exhaust pipe, a connecting box, a mounting cavity, an exhaust channel, a first vent hole, a first side plate, a second side plate, a back plate, a wafer loading hole, a top plate, a bottom plate, a positioning hole, a wafer processing device box body, a vent groove, a wafer processing unit, a back plate body, a cover plate, a protruding rib, a wafer processing unit and a five-axis manipulator, wherein the mounting support is 2, the valve is 3, the vent pipe is 4, the connecting box is 5, the mounting cavity is 11, the vent channel is 12, the vent channel is 13, the first vent hole is 14, the first side plate is 15, the second side plate is 16, the back plate is 17, the wafer processing unit is 20, the positioning hole is 100, the wafer processing device box body is 121, the back plate body is 162, the protruding rib, the second vent hole, the wafer processing unit is 200, the exhaust hole, the positioning pin is 201, and the five-axis manipulator is 300.

Detailed Description

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following will describe the specific embodiments of the present invention with reference to the accompanying drawings. The drawings in the following description are only examples of the utility model, and it will be clear to a person skilled in the art that other drawings and embodiments can be obtained from these drawings without inventive effort.

For the sake of simplicity, the drawings only schematically show the parts relevant to the present invention, and they do not represent the actual structure as a product. In some of the figures, elements having the same structure or function are shown only schematically or only schematically. In this document, "one" means not only "only one" but also a case of "more than one". The terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

The term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The first embodiment is as follows: a box for a wafer processing device.

As shown in fig. 1 and 2, the case 100 for a wafer processing apparatus of the present embodiment is used for mounting up to 7 wafer processing units 200 and providing an exhaust passage 12 for the wafer processing units 200, and includes a housing 1, a mounting bracket 2, a valve 3, an exhaust pipe 4, and a connection box 5.

The walls of the housing 1 enclose a mounting chamber 11 for mounting the wafer processing apparatus 200 and other components. The shell 1 comprises a first side plate 14, a second side plate 15, a back plate 16, a top plate 18 and a bottom plate 19, wherein the first side plate 14 and the second side plate 15 are oppositely connected to two sides of the back plate 16, and form a groove-shaped mounting cavity 11 together with the back plate 16; the mounting bracket 2 is horizontally mounted on the first side plate 14 and the second side plate 15 in the mounting cavity 11 in an extending manner, and forms a plurality of vertically arranged pull-out mounting positions for mounting a plurality of wafer processing units 200.

As shown in fig. 8, the backplate 16 includes a backplate main body 161 and a cover plate 162 which are detachably connected, the backplate main body 161 is a groove-shaped structure which is opened toward the outside of the housing, and the cover plate 162 covers the groove-shaped opening of the backplate main body 161 to form a hollow structure which forms an exhaust passage 12 for providing a passage for concentrated exhaust of a plurality of wafer processing apparatuses 200 mounted in the mounting chamber 11. The back plate body 161 and the cover plate 162 have a rib 163 extending vertically to divide the exhaust passage 12 into a plurality of vertical exhaust grooves 121 which are not communicated with each other. The rib 163 is provided with a screw hole or a through hole for detachably mounting the cover plate 162 to the back plate body 161 by a screw.

As shown in fig. 4, the back plate body 161 is opened with a plurality of first vents 13, and the first vents 13 communicate the mounting cavity 11 and the exhaust passage 12. When actually used in a wafer processing apparatus, the first vent 13 is used to connect to the exhaust port 201 of the wafer processing unit 200. Fig. 5 shows a wafer processing unit 200, which is a typical hot plate baking unit for heating and baking a wafer, and has two exhaust ports 201 on the back side. One of the exhaust ports 201 is tubular, matching in size a first vent port 13; the other vent port 201 is a vent hole with a sealing ring adapted to be sealingly connected to the other first vent port 13. The back plate body 161 is provided with positioning holes 20, the wafer processing unit 200 is provided with positioning pins 202 in a matching manner, and the two exhaust ports 201 and the two first air vents 13 can form exhaust connection with sufficient sealing performance after the wafer processing unit 200 is installed by combining the positioning function of the installation support 2.

As shown in fig. 7 and 8, the back plate body 161 is further provided with a second vent 164, and the second vent 164 communicates the exhaust passage 12 with the inner cavity of the connection box 5 having a hollow structure and communicates with the exhaust pipe 4 through the inner cavity of the connection box 5. The exhaust pipe 4 is provided with a valve 3 to close the exhaust pipe 4 when the device is not in use, so as to prevent foreign matters or small animals from entering. The exhaust pipe 4 leads to an external space or gas treatment device. As shown in fig. 2 and 8, the first side plate 14 and the second side plate 15 are provided with wafer loading ports 17 for loading wafers to the wafer processing unit 200.

When the wafer processing apparatus is practically applied, the first air vent 13 on the back plate body 161 corresponding to each mounting position can be correspondingly matched according to the specific setting of the wafer processing unit 200, and a corresponding sealing measure is adopted. The exhaust passage 12 in this embodiment is divided into three independent exhaust grooves 121, and the first vent 13 is provided for only one exhaust groove 121. The configuration can be flexibly performed in combination with the arrangement of the connection box 5 and the exhaust pipe 4 as required. For example, a plurality of independent exhaust grooves 121, corresponding independent junction boxes 5 and exhaust pipes 4 may be arranged, and the plurality of exhaust ports 201 of the wafer processing unit 200, which require independent exhaust, may be respectively communicated with different exhaust grooves 121 by matching the first air vents 13, so as to achieve independent exhaust. At the moment, the process tail gas which does not contain harmful substances and has low temperature can be directly discharged to the atmosphere, the tail gas with high temperature is discharged after being cooled, and the tail gas containing the harmful substances or the tail gas with recycling value is separately discharged to a corresponding gas treatment device.

The embodiment can provide a convenient wafer processing unit mounting position for the wafer processing device, and simultaneously provide an exhaust passage with a compact structure, and is suitable for the wafer processing device needing flexible configuration.

As a variation of the present embodiment, the exhaust passage 12 may also be provided in the first side plate 14 or the second side plate 15, or a plurality of exhaust passages 12 may also be provided at multiple positions at the same time; the back plate 16 may be formed of an integrally formed profile, and the exhaust passage 12 may be formed of a hollow structure provided inside the profile. The mounting bracket 2 may also be integrally formed with the first side plate 14 and the second side plate 15. When the gas exhausted from the wafer processing unit 200 does not need to be harmlessly processed or recovered, the exhaust passage 12 may be directly led to the outside of the chamber without providing the structures or parts such as the second vent 164, the exhaust pipe 4, the valve 3, and the junction box 5. The exhaust duct 12 is vertically disposed so as to pass through the upper and lower portions, and the exhaust pipe 4 may be disposed at an upper portion of the case or at another position. The second vent 164 may be provided on the cover 162 while the exhaust pipe 4 is provided outside the case. The mounting chamber 11 may be provided in plural to further reduce the mutual influence between the wafer processing units 200 having large difference in operating temperature.

Example two: a wafer processing apparatus.

As shown in fig. 5 and 8, the wafer processing apparatus of the present embodiment is used for performing various processes on wafers in the manufacturing process of integrated circuit wafers, and includes a plurality of wafer processing units 200 and the first case 100 for wafer processing apparatus of the present embodiment, wherein the wafer processing units 200 are mounted to the mounting chamber 11, and the exhaust ports 201 of the wafer processing units 200 are communicated to the exhaust passage 12 through the first vent holes 13 to exhaust the gas used or generated by the wafer processing units 200. The wafer processing units 200 include a high-temperature hot plate baking unit, a low-temperature hot plate baking unit, an HMDS processing unit, a cold plate cooling unit, and the like, which are sequentially disposed from top to bottom. The typical working temperature range is 50-350 deg.C, 50-200 deg.C, 50-180 deg.C, and 15-120 deg.C. When they are arranged in sequence according to the working temperature range, the mutual influence among the units can be reduced.

One or more first air vents 13 may be formed in the same wafer processing unit 200, and the first air vents 13 in the mounting positions where the wafer processing units 200 are not mounted need to be sealed by rubber plugs so as to prevent air leakage. The wafer processing apparatus of the embodiment may work in cooperation with the five-axis robot 300, and the five-axis robot 300 may transfer wafers between the wafer processing units 200 through the wafer load port 17, or may transfer wafers between other apparatuses and the wafer processing units 200.

The foregoing is only a preferred embodiment of the present application and the technical principles employed, and various obvious changes, rearrangements and substitutions may be made without departing from the spirit of the application. Other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure herein. The present application is capable of other and different embodiments and its several details are capable of modifications and variations in various respects, all without departing from the spirit of the present application. The features in the above embodiments and embodiments may be combined with each other without conflict.

Claims (10)

1. A box (100) for a wafer processing apparatus, characterized in that:

comprises a shell (1) which is surrounded to form at least one mounting cavity (11);

the shell wall is provided with at least one hollow structure which forms an exhaust channel (12), and the shell wall is also provided with at least one first air vent (13);

the mounting cavity (11) is used for mounting at least one wafer processing unit (200), each exhaust port (201) of each wafer processing unit (200) is communicated to the exhaust channel (12) through one first vent hole (13), and the exhaust channel (12) is communicated to an external space or a gas processing device.

2. The case (100) for wafer processing apparatus according to claim 1, wherein:

the shell wall comprises a first side plate (14), a second side plate (15) and a back plate (16), wherein the first side plate (14) and the second side plate (15) are oppositely connected to two sides of the back plate (16), and the back plate (16) and the first side plate (14) and the second side plate (15) jointly enclose the mounting cavity (11) in a groove shape;

the mounting cavity (11) is suitable for mounting a plurality of wafer processing units (200) in an up-and-down arrangement;

at least one of the first side plate (14), the second side plate (15), and the back plate (16) has the hollow structure.

3. The case (100) for wafer processing apparatus according to claim 2, wherein:

backplate (16) are including backplate body (161) and apron (162) that can dismantle the connection, backplate body (161) are outside open-ended slot-like structure, apron (162) lid closes to backplate body (161), constitution hollow structure.

4. The case (100) for wafer processing apparatus according to claim 3, wherein:

the back plate body (161) and/or the cover plate (162) are provided with vertically extending ribs (163) which divide the exhaust channel (12) into vertical exhaust grooves (121) which are not communicated with each other.

5. The case (100) for wafer processing apparatus according to claim 2, wherein:

the wafer processing device further comprises a mounting bracket (2), wherein the mounting bracket (2) is mounted to the shell (1) in a horizontally extending mode in the mounting cavity (11) and used for mounting the wafer processing unit (200).

6. The case (100) for wafer processing apparatus according to any one of claims 2 to 5, wherein:

the first side plate (14) and/or the second side plate (15) are/is provided with a wafer loading port (17) for loading wafers to the wafer processing unit (200).

7. The box (100) for wafer processing apparatus according to claim 6, wherein:

the exhaust valve is characterized by further comprising a valve (3) and an exhaust pipe (4), wherein the valve (3) is arranged on the exhaust pipe (4) and used for closing or opening the exhaust pipe (4);

the back plate (16) is provided with a second vent hole (164), and the second vent hole (164) is communicated with the exhaust channel (12) and communicated to the exhaust pipe (4).

8. The box (100) for wafer processing apparatus according to claim 7, wherein:

the air conditioner further comprises a connecting box (5) which is of a hollow structure, and an inner cavity of the connecting box (5) is used for communicating the second vent hole (164) with the exhaust pipe (4).

9. A wafer processing apparatus, comprising:

comprising a plurality of wafer processing units (200) and the box (100) for wafer processing apparatus as claimed in any one of claims 1 to 8, wherein the wafer processing units (200) are mounted to the mounting chamber (11), and each exhaust port (201) of the wafer processing units (200) is communicated to the exhaust passage (12) through one of the first vent holes (13).

10. The wafer processing apparatus of claim 9, wherein:

the wafer processing units (200) comprise at least one of a hot plate baking unit, an HMDS processing unit and a cold plate cooling unit;

the wafer processing units (200) are sequentially arranged and mounted to the mounting cavity (11) according to the working temperature range.

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