CN218482205U - Semiconductor processing equipment and air inlet device thereof - Google Patents

Abstract

The embodiment of the application provides semiconductor process equipment and an air inlet device thereof. The air inlet device comprises an air inlet component and a rotary driving mechanism; the air inlet component comprises a flow equalizing plate and a main shaft which are integrally arranged, the flow equalizing plate is arranged in the process chamber, the main shaft is movably and hermetically connected with the process chamber, one end of the main shaft penetrates through the top wall of the process chamber and is connected with the flow equalizing plate, and the other end of the main shaft is connected with the rotary driving mechanism; the rotary driving mechanism is arranged above the process chamber and used for driving the flow equalizing plate to rotate in the process chamber through the main shaft so as to equalize the flow of the process gas introduced into the process chamber. The embodiment of the application can greatly improve the uniformity of wafer etching and improve the capacity and competitiveness of semiconductor process equipment.

Description

Semiconductor process equipment and air inlet device thereof

Technical Field

The application relates to the technical field of semiconductor processing, in particular to semiconductor process equipment and an air inlet device thereof.

Background

At present, micro LEDs are high-density Micro-sized LED arrays integrated on a chip, each pixel has the characteristics of addressing, individual driving, self-luminescence, and the like, and compared with the mainstream OLED and LCD in the current display technology, micro LEDs have simpler structures, more obvious performance advantages, high brightness, low energy consumption, long service life, no image branding, high response speed, and the like. Micro LED chip etching is used as a main stream etching process requirement, and the Micro LED chip etching not only has a great market space, but also has higher requirements on etching uniformity and etching rate, so that a severe requirement is provided for the performance of semiconductor process equipment.

In the prior art, gas enters an interlayer between the uniform flow plate and the process chamber from the gas inlet pipe and then enters the process chamber through the gas holes, but the etching rate and the etching depth on the surface of the wafer are not uniform due to the limitation and the non-uniformity of the position distribution of the gas holes, so that the competitiveness is greatly reduced.

SUMMERY OF THE UTILITY MODEL

The application provides semiconductor process equipment and an air inlet device thereof aiming at the defects of the prior art, and is used for solving the technical problems of uneven etching and higher application and maintenance cost in the prior art.

In a first aspect, embodiments of the present application provide a gas inlet apparatus for a process chamber of semiconductor processing equipment, the gas inlet apparatus comprising a gas inlet component and a rotary drive mechanism; the air inlet component comprises a flow equalizing plate and a main shaft which are integrally arranged, the flow equalizing plate is arranged in the process chamber, the main shaft is movably and hermetically connected with the process chamber, one end of the main shaft penetrates through the top wall of the process chamber and is connected with the flow equalizing plate, and the other end of the main shaft is connected with the rotary driving mechanism; the rotary driving mechanism is arranged above the process chamber and used for driving the flow equalizing plate to rotate in the process chamber through the main shaft so as to equalize the flow of the process gas introduced into the process chamber.

In an embodiment of the present application, the air inlet device further includes a sealing assembly, the sealing assembly is sleeved outside the main shaft, one end of the sealing assembly is movably and sealingly connected to the main shaft, the other end of the sealing assembly is connected to the top wall of the process chamber, the main shaft can rotate relative to the sealing assembly, and the sealing assembly can follow the main shaft to synchronously lift.

In an embodiment of the application, the seal assembly includes a sleeve, a seal groove extending along the circumferential direction is formed in the inner wall of the sleeve, the seal groove is formed in a plurality of positions in the axial direction of the sleeve at intervals, a magnetic fluid is contained in the seal groove, and the sleeve is sealed with the main shaft through the seal groove.

In an embodiment of the present application, an air inlet hole penetrates through a peripheral wall of the sleeve, and the air inlet hole is located between any two adjacent sealing grooves; and a uniform flow channel structure is formed in the air inlet part, and the air inlet is used for introducing the process gas into the uniform flow channel structure.

In an embodiment of the present application, the uniform flow channel structure includes a flow guide groove, a vertical flow channel, a uniform flow cavity, and a uniform flow hole, the circumferential wall of the spindle is provided with the flow guide groove extending along the circumferential direction, and the flow guide groove is aligned with the air inlet hole in the vertical direction; the vertical flow channel is formed in the main shaft, the top end of the vertical flow channel is communicated with the flow guide groove, and the bottom end of the vertical flow channel is communicated with the uniform flow cavity; the flow homogenizing cavity is formed in the flow homogenizing plate, and a plurality of flow homogenizing holes communicated with the flow homogenizing cavity are formed in the bottom surface of the flow homogenizing plate.

In an embodiment of the present application, the gas inlet device further includes a frame structure, the frame structure is disposed at the top of the process chamber, an accommodating space is formed in the frame structure, and the other end of the spindle is located in the accommodating space; the rotary driving mechanism is arranged at the top of the frame structure and is connected with the main shaft in the accommodating space.

In an embodiment of the present application, the rotation driving mechanism includes a first driver, a movable component and a rotating shaft, the first driver is disposed in the accommodating space; the movable assembly is arranged at the top of the frame structure; the rotation axis liftable wear to locate in activity subassembly and the first driver to the bottom with the main shaft is connected, first driver passes through the activity subassembly drives the rotation axis is rotatory.

In an embodiment of the present application, the movable assembly includes an outer fixing member and an inner rotating member that are nested with each other, the outer fixing member is fixedly disposed at the top of the frame structure, the inner rotating member is sleeved on the periphery of the rotating shaft, so as to drive the rotating shaft to rotate automatically, and the rotating shaft can lift relative to the inner rotating member.

In an embodiment of the present application, the rotary driving mechanism further includes a transmission member, the transmission member includes a transmission disc and a transmission pipe, the transmission disc is connected to the bottom of the first driver, and a through hole for the rotary shaft to pass through is formed in a central position of the transmission disc; the transmission pipe sleeve is arranged on the periphery of the rotating shaft, the bottom end of the transmission pipe is connected with the transmission disc, and the top end of the transmission pipe is connected with the inner rotating piece and used for driving the rotating shaft to rotate automatically through the inner rotating piece.

In an embodiment of the present application, the air inlet device further includes a lifting driving mechanism, and the lifting driving mechanism is connected to the rotating shaft and is configured to drive the spindle to lift through the rotating shaft; the sealing assembly further comprises a corrugated pipe, the corrugated pipe is sleeved on the periphery of the main shaft, two ends of the corrugated pipe are respectively connected with the bottom end of the sleeve and the top wall in a sealing mode, and the corrugated pipe can stretch along with the lifting of the main shaft.

In an embodiment of this application, lift actuating mechanism is including second driver, lead screw structure and slider, the second driver with lead screw structure connects, the one end of slider with lead screw structure connects, the other end with the top swing joint of rotation axis, lead screw structure be used for with the rotatory action of driver turns into sharp action, with through the slider drives the rotation axis goes up and down.

In an embodiment of the present application, the rotation driving mechanism further includes a connecting member, a bottom end of the rotating shaft is nested in a top end of the main shaft, and the rotating shaft and the main shaft are detachably connected through the connecting member.

In an embodiment of the present application, a connecting groove is formed on a top surface of the spindle for accommodating a bottom end of the rotating shaft; the peripheral wall of the bottom end of the rotating shaft is provided with a limiting groove, the connecting piece penetrates through the peripheral wall of the main shaft and then is positioned in the limiting groove, and the connecting piece is connected with the peripheral wall of the main shaft.

In a second aspect, embodiments of the present application provide a semiconductor processing apparatus, comprising: the process chamber and the gas inlet device provided in the first aspect.

The technical scheme provided by the embodiment of the application has the following beneficial technical effects:

the flow equalizing plate and the main shaft are integrally designed, and the rotating driving mechanism drives the flow equalizing plate to rotate in the process chamber. By adopting the design, the uniform flow plate rotates in the process chamber, so that the process gas is uniformly distributed in the process chamber, and the uniformity of wafer etching is greatly improved. The main shaft and the flow equalizing plate are of an integrated structure, so that the structure is simplified, the application and maintenance cost can be greatly reduced, and the use experience is greatly improved.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic cross-sectional view of a gas inlet apparatus in cooperation with a process chamber according to an embodiment of the present disclosure;

FIG. 2 is a schematic cross-sectional view of an air inlet component and a sleeve in cooperation according to an embodiment of the present disclosure;

FIG. 3 is an enlarged, fragmentary, cross-sectional view of an air induction device provided in accordance with an embodiment of the present disclosure;

FIG. 4 is a schematic cross-sectional view of a rotating shaft engaged with a movable assembly according to an embodiment of the present disclosure;

fig. 5 is a schematic perspective view of a first driver according to an embodiment of the present disclosure;

fig. 6 is a schematic perspective view of a mounting base according to an embodiment of the present disclosure;

FIG. 7 is a schematic perspective view of a transmission component according to an embodiment of the present disclosure;

fig. 8 is a partial schematic structural diagram of a screw structure and a slider provided in an embodiment of the present application;

FIG. 9 is an enlarged, cross-sectional view of a slider engaged with a rotating shaft according to an embodiment of the present disclosure;

fig. 10 is a schematic perspective view of a frame structure according to an embodiment of the present application;

fig. 11 is a schematic perspective view of a connector according to an embodiment of the present application.

Detailed Description

Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

The following describes the technical solution of the present application and how to solve the above technical problems in detail by specific embodiments.

The embodiment of the application provides a gas inlet device, which is used for a process chamber of semiconductor process equipment, the structural schematic diagram of the gas inlet device is shown in fig. 1 and fig. 2, the gas inlet device comprises a gas inlet part 21 and a rotary driving mechanism 3; the gas inlet part 21 comprises an integrated flow equalizing plate 211 and a main shaft 212, the flow equalizing plate 211 is arranged in the process chamber 100, the main shaft 212 is movably and hermetically connected with the process chamber 100, one end of the main shaft 212 penetrates through the top wall 101 of the process chamber 100 and is connected with the flow equalizing plate 211, and the other end of the main shaft 212 is connected with the rotary driving mechanism 3; the rotation driving mechanism 3 is disposed above the process chamber 100 and configured to drive the flow equalizing plate 211 to rotate in the process chamber 100 through the main shaft 212, so as to equalize the flow of the process gas introduced into the process chamber 100.

As shown in fig. 1 and fig. 2, the semiconductor process equipment may be applied to etching of a Micro LED chip, but the embodiment of the present application does not limit the specific field of the semiconductor process equipment, and a person skilled in the art may adjust the setting according to actual situations. The gas inlet part 21 includes a flow equalizing plate 211 and a main shaft 212 integrally formed, and the flow equalizing plate 211 may have a circular structure and is disposed inside the process chamber 100 for introducing the process gas after uniform flow into the process chamber 100. The spindle 212 has a bottom end located at a central position of the flow equalizing plate 211 and a top end connected to the rotary driving mechanism 3 after passing through the top wall 101 of the process chamber 100. The rotation driving mechanism 3 may be disposed above the process chamber 100 for connecting with the top end of the spindle 212, and the driving mechanism 3 may drive the spindle 212 to rotate to drive the flow equalizing plate 211 to rotate in the process chamber 100, so as to avoid non-uniform etching of the wafer caused by non-uniform process gas.

The flow equalizing plate and the main shaft are integrally designed, and the rotating driving mechanism drives the flow equalizing plate to rotate in the process chamber. By adopting the design, the uniform flow plate rotates in the process chamber, so that the process gas is uniformly distributed in the process chamber, and the uniformity of wafer etching is greatly improved. The main shaft and the flow equalizing plate are of an integrated structure, so that the structure is simplified, the application and maintenance cost can be greatly reduced, and the use experience is greatly improved.

In an embodiment of the present application, as shown in fig. 1 and 2, the gas inlet apparatus further includes a sealing assembly 22, the sealing assembly 22 is sleeved outside the main shaft 212, one end of the sealing assembly 22 is movably and sealingly connected to the main shaft 212, and the other end of the sealing assembly 22 is connected to the top wall 101 of the process chamber 100, the main shaft 212 can rotate relative to the sealing assembly 22, and the sealing assembly 22 can synchronously lift and lower along with the main shaft 212. Specifically, the sealing element 22 is disposed around the spindle 212, a bottom end of the sealing element 22 is sealingly connected to the top wall 101 of the process chamber 100, and a top end of the sealing element 22 is sealingly disposed around the spindle 212. In practice, the main shaft 212 can rotate relative to the sealing assembly 22, and the sealing assembly 212 can move up and down along with the main shaft 212 to achieve sealing. By adopting the above design, the embodiment of the present application adopts a simpler structure, i.e., the movable and sealed connection between the main shaft 212 and the process chamber 100 can be realized, thereby not only simplifying the structure, but also greatly reducing the application and maintenance costs.

In an embodiment of the present application, as shown in fig. 1 and fig. 2, the sealing assembly 22 includes a sleeve 221, a plurality of sealing grooves 222 are formed in an inner wall of the sleeve 221 and extend along a circumferential direction, the plurality of sealing grooves 222 are arranged at intervals along an axial direction of the sleeve 221, a magnetic fluid (not shown) is contained in the sealing grooves 222, and the sleeve 221 is magnetically sealed with the spindle 212 through the sealing grooves 222. Specifically, the sleeve 221 may have a circular hollow structure, at least two circumferentially extending seal grooves 222 may be formed in an inner circumferential wall of the sleeve 221, and the two seal grooves 222 are spaced apart from each other in an axial direction of the sleeve 221. The sleeve 221 is sleeved on the periphery of the main shaft 212, magnetic fluid is contained in the two sealing grooves 222, a permanent magnet can be arranged on the periphery of the sleeve 221, or the sleeve 221 is made of a permanent magnet material, so that the magnetic fluid is fixed between the sealing grooves 222 and the outer peripheral wall of the main shaft 212, the magnetic fluid and the outer peripheral wall of the main shaft 212 can move relatively and seal, and the main shaft 212 can rotate and seal relative to the sleeve 221. Alternatively, a bearing may be disposed between the sleeve 221 and the main shaft 212, and an end cover may be disposed at a top end of the sleeve 221 to close a top end of the sleeve 221 and an outer circumference of the main shaft 221, so as to enable the main shaft 212 to rotate relative to the sleeve 221. By adopting the above design, the embodiment of the present application adopts a simpler structure, that is, relative movement and sealing between the sleeve 221 and the outer peripheral wall of the main shaft 212 can be realized, so that the structure is simplified, and the application and maintenance costs can be greatly reduced. However, the embodiment of the present application does not limit the specific number of the sealing grooves 222, for example, the number of the sealing grooves 222 may be two or more. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.

In an embodiment of the present application, as shown in fig. 2, an air inlet 223 penetrates through a circumferential wall of the sleeve 221, and the air inlet 223 is located between any two adjacent sealing grooves 222; the air inlet part 21 is formed with a uniform flow passage structure, and the air inlet holes 223 are used for introducing process gas into the uniform flow passage structure. Specifically, the circumferential wall of the sleeve 221 penetrates through at least one air inlet hole 223, and the air inlet hole 223 can be located between any two adjacent sealing grooves 222, so that the process gas introduced through the air inlet hole 223 is sealed by the magnetofluid in the two sealing grooves 222. A uniform flow channel structure is formed in the air inlet part 21, and the uniform flow channel structure can be communicated with the air inlet hole 223, that is, the top end of the uniform flow channel structure is also located between the two seal grooves 222, so that the air inlet hole 223 can introduce the process gas into the uniform flow channel structure, and the process gas can be prevented from leaking, thereby improving the safety of the embodiment of the present application. By adopting the design, the main shaft 212 can rotate in the sleeve 221 and can realize sealing, so that the structure of the embodiment of the application is further simplified, and the application and maintenance cost is further reduced. However, the embodiment of the present application is not limited thereto, and those skilled in the art can adjust the setting according to the actual situation.

In an embodiment of the present application, as shown in fig. 2, the uniform flow channel structure includes a flow guide groove 213, a vertical flow channel 214, a uniform flow cavity 215 and a uniform flow hole 216, the peripheral wall of the main shaft 212 is provided with the flow guide groove 213 extending along the circumferential direction, and the flow guide groove 213 is aligned with the air inlet 223 in the vertical direction; a vertical flow passage 214 is formed in the main shaft 212, the top end of the vertical flow passage 214 is communicated with the guide groove 213, and the bottom end of the vertical flow passage 214 is communicated with the uniform flow cavity 215; the uniform flow chamber 215 is formed in the uniform flow plate 211, and a plurality of uniform flow holes 216 communicating with the uniform flow chamber 215 are formed in the bottom surface of the uniform flow plate 211.

As shown in fig. 2, the guide groove 213 extending in the circumferential direction may be formed in the outer circumferential wall of the main shaft 212, and the guide groove 213 may be aligned with the air inlet hole 223 in the vertical direction, or the guide groove 213 may be located above or below the air inlet hole 223 as long as the guide groove 213 is located between the two sealing grooves 222. The main shaft 212 has a vertical flow passage 214 formed therein and extending in the axial direction, the vertical flow passage 214 may be eccentrically disposed from the main shaft 212 so as to be connected to the guide groove 213, the top end of the vertical flow passage 214 may communicate with the guide groove 213, and the bottom end may communicate with a flow equalizing chamber 215 provided in the flow equalizing plate 211. The uniform flow chamber 215 is a cylindrical cavity formed inside the uniform flow plate 211, but the embodiment of the present application is not limited to a specific shape of the uniform flow chamber 215 as long as the uniform flow chamber 215 is disposed corresponding to the shape of the uniform flow plate 211. A plurality of uniform flow holes 216 communicated with the uniform flow cavity 215 are formed on the bottom surface of the uniform flow plate 211, and the uniform flow holes 216 are uniformly and alternately distributed on the bottom surface of the uniform flow plate 211. The process gas enters the flow guide groove 213 through the gas inlet hole 223, then enters the vertical flow channel 214 after primary uniform flow in the flow guide groove 213, then enters the uniform flow cavity 215 for secondary uniform flow, and finally enters the process chamber 100 through the plurality of uniform flow holes 216 for participating in the process. By adopting the design, the structure of the embodiment of the application is simple and easy to realize, and the uniform flow effect of the process gas can be further improved, so that the etching uniformity of the wafer is further improved. However, the embodiment of the present application does not limit the arrangement manner of the vertical flow channel 214, for example, the top end of the vertical flow channel 214 is communicated with the flow guiding slot 213, and the bottom end is communicated with the central position of the uniform flow cavity 215, so as to improve the uniformity of the process gas in the uniform flow cavity 215. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.

In an embodiment of the present application, as shown in fig. 1 to fig. 2, the gas inlet apparatus further includes a frame structure 1, the frame structure 1 is disposed at the top of the process chamber 100, and an accommodating space 11 is formed in the frame structure 1, and the other end of the main shaft 212 is located in the accommodating space 11; the rotation driving mechanism 3 is disposed on the top of the frame structure 1 and connected to the main shaft 212 located in the accommodating space 11. Specifically, frame structure 1 can be the cuboid structure, and frame structure 1 sets up in the roof 101 outside of process chamber 100, and frame structure 1's inside can be formed with accommodation space 11, and it is hollow out construction all around to carry out the dismouting to air inlet part 21 and rotary drive mechanism 3 and maintain. The top end of the spindle 212 penetrates through the top wall 101 of the process chamber 100 and is located inside the accommodating space 11, the rotation driving mechanism 3 may be disposed at the top of the frame structure 1, and a portion of the rotation driving mechanism 3 is located in the accommodating space 11 and is used for being connected to the top end of the spindle 212, and the rotation driving mechanism 3 can drive the spindle 212 to move up and down and rotate so as to drive the flow equalizing plate 211 to rotate in the process chamber 100, thereby improving uniformity of the process gas. By adopting the design, the disassembly, assembly and maintenance of the embodiment of the application are simpler, and the work efficiency of the disassembly, assembly and maintenance is greatly improved.

In an embodiment of the present application, as shown in fig. 3 to 5, the rotation driving mechanism 3 includes a first driver 31, a movable element 32 and a rotating shaft 33, the first driver 31 is disposed in the accommodating space 11; the movable assembly 32 is arranged on the top of the frame structure 1; the rotating shaft 33 is disposed through the movable assembly 32 and the first driver 31 in a liftable manner, and the bottom end of the rotating shaft is connected with the main shaft 212, and the first driver 31 drives the rotating shaft 33 to rotate through the movable assembly 32.

As shown in fig. 3 to 5 and 10, the first driver 31 may be a direct drive motor or a hollow shaft motor, but the embodiment of the present application is not limited thereto. Referring to fig. 10, the frame structure 1 includes a top plate 12, a bottom plate 13 and vertical bars 14, wherein the top plate 12 and the bottom plate 13 are both rectangular, and four vertical bars 14 are disposed between the top plate 12 and the bottom plate 13 to form a frame with a rectangular parallelepiped structure, but the embodiment of the present invention is not limited thereto. The first driver 31 may be disposed in the accommodating space 11 and fixedly connected to the top plate 12 of the frame structure 1, and the first driver 31 may be connected to the top plate 12 through a plurality of fasteners. The movable assembly 32 may be disposed on top of the frame structure 1 and attached to the top panel 12 using a plurality of fasteners. The top plate 12 is further provided with a through hole for the rotation shaft 33 to pass through, the rotation shaft 33 is further disposed through the movable assembly 32 and the first driver 31, and the bottom end of the rotation shaft 33 can be connected with the top end of the main shaft 212 to drive the main shaft 212 to rotate. The first driver 31 can drive the rotation shaft 33 to rotate through the movable assembly 32, thereby driving the main shaft 212 to rotate. By adopting the design, the embodiment of the present application realizes the quick disassembly and assembly maintenance of the rotating shaft 33 and the main shaft 212, thereby greatly reducing the maintenance time and improving the productivity.

In an embodiment of the present application, as shown in fig. 3, 4 and 6, the movable assembly 32 includes an outer fixing element 321 and an inner rotating element 322 that are nested with each other, the outer fixing element 321 is fixedly disposed at the top of the frame structure 1, the inner rotating element 322 is sleeved on the periphery of the rotating shaft 33 for driving the rotating shaft 33 to rotate, and the rotating shaft 33 can lift and lower relative to the inner rotating element 322. Specifically, the outer fixing member 321 may be a circular hollow structure, the outer fixing member 321 may be disposed on the top of the frame structure 1, the inner fixing member 322 may be rotatably nested in the outer fixing member 321, and both are implemented by using a ball-fit manner, but the embodiment of the present invention is not limited thereto. The inner rotating member 322 may have a cylindrical structure, and the inner rotating member 322 is sleeved on the outer circumference of the rotating shaft 33, so as to drive the rotating shaft 33 to rotate and enable the rotating shaft 33 to lift in the inner rotating member 322, and the inner rotating member and the rotating shaft may be realized by a ball spline fit method. By adopting the design, the embodiment of the application can realize transmission of the rotating shaft 33 and can also enable the rotating shaft 33 to ascend and descend relative to the movable assembly 32, so that the practicability of the embodiment of the application is greatly improved. Optionally, the movable assembly 32 further includes a mounting seat 323, the mounting seat 323 may adopt a circular hollow structure, and the periphery forms a rectangular connecting plate, as shown in fig. 6. The mounting seat 323 is disposed at the top of the frame structure 1 through a connecting plate and a fastener, and the outer fixing member 321 can be installed at the bottom of the mounting seat 323 and connected to the bottom end of the mounting seat 323 through the fastener. With the above design, the stability of the movable assembly 32 can be further improved, thereby avoiding mechanical interference between the movable assembly 32 and the rotating shaft 33. It should be noted that, the embodiments of the present application are not limited to include the mounting seat 323 in all embodiments, and those skilled in the art can adjust the setting according to actual situations.

In an embodiment of the present application, as shown in fig. 3 to 7, the rotation driving mechanism 3 further includes a transmission member 34, the transmission member 34 includes a transmission disc 341 and a transmission tube 342, the transmission disc 341 is connected to the bottom of the first driver 31, and the central position has a through hole for the rotation shaft 33 to pass through; the periphery of rotation axis 33 is located to the cover of transmission pipe 342 to the bottom and the drive plate 341 of transmission pipe 342 are connected, and the top is connected with interior rotating member 322, is used for driving rotation axis 33 autogyration through interior rotating member 322. Specifically, the transmission part 34 includes a transmission disc 341 and a transmission tube 342 that are integrally formed, a through hole for the rotation shaft 33 to pass through is formed in a central position of the transmission disc 341, the transmission tube 342 and the transmission disc 341 are coaxially disposed, and the transmission tube 342 is a hollow structure. The transmission disc 341 may be coupled to the rotating portion of the first driver 31 and coupled thereto using a fastener, thereby achieving a detachable coupling therebetween. The transmission pipe 342 is sleeved on the periphery of the rotating shaft 33, and the top end of the transmission pipe 342 is connected with the bottom end of the inner rotating element 322, and the transmission pipe 342 and the inner rotating element are connected by a fastener, so that the detachable connection between the transmission pipe and the inner rotating element is realized. The first driver 31 sequentially drives the transmission disc 341, the transmission tube 342 and the inner rotating member 322 to finally drive the rotating shaft 33 to rotate. By adopting the design, the integration level of the embodiment of the application is higher, the disassembly, assembly and maintenance can be facilitated, and the occupied space can be greatly reduced.

In an embodiment of the present application, as shown in fig. 1 and fig. 3, the air intake device further includes a lifting driving mechanism 30, the lifting driving mechanism 30 is connected to the rotating shaft 33, and is configured to drive the main shaft 212 to lift through the rotating shaft 33; the sealing assembly 22 further includes a bellows 224, the bellows 224 is sleeved on the outer periphery of the main shaft 212, and two ends of the bellows 224 are respectively connected to the bottom end of the sleeve 221 and the top wall 101 in a sealing manner, and the bellows 224 can extend and contract along with the lifting of the main shaft 212.

As shown in fig. 1 and 3, the lifting driving mechanism 30 may be disposed above the process chamber 100 and connected to the rotating shaft 33 for driving the spindle 212 to lift and lower through the rotating shaft 33. The bellows 224 may be a telescopic bellows structure made of a metal material, and the bellows 224 is sleeved on the outer periphery of the main shaft 212 and in clearance fit with the main shaft 212, so that the main shaft 212 can be lifted and lowered in the bellows 224, and the bellows 224 can be lifted and lowered along with the main shaft 212. Both ends of the bellows 224 are connected to the sleeve 221 and the top wall 101 through flange structures, respectively, and both ends of the bellows 224 are provided with sealing structures, such as a groove disposed on the flange structure and a sealing ring assembled in the groove, to realize a sealing connection between the sleeve 221 and the process chamber 100. However, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to the actual situation. By adopting the above design, the sealing assembly 22 can realize the sealing between the main shaft 212 and the process chamber 100 and the sleeve 221 while the main shaft 212 is lifted, so as to greatly improve the sealing performance of the embodiment of the present application, and further simplify the structure of the embodiment of the present application, so as to further reduce the application and maintenance costs.

In an embodiment of the present application, as shown in fig. 1, 8 and 9, the lifting driving mechanism 30 includes a second driver 35, a screw structure 36 and a slider 37, the second driver 35 is connected to the screw structure 36, one end of the slider 37 is connected to the screw structure 36, and the other end is movably connected to the top end of the rotating shaft 33, the screw structure 36 is used for converting the rotation of the driver into a linear motion, so as to drive the rotating shaft 33 to lift through the slider 37. Specifically, the second driver 35 may adopt a servo motor or a stepping motor, the second driver 35 may be disposed on the top end of the screw structure 36, the bottom end of the screw structure 36 may be fixedly connected to one side of the frame structure 1, and the screw structure 36 may convert the rotation of the second driver 35 into a linear motion, so as to drive the slider 37 to ascend and descend. One end of the sliding block 37 is connected to the screw structure 36, and the other end of the sliding block can be movably connected to the top end of the rotating shaft 33, for example, a self-aligning bearing is disposed in the sliding block 37, and a spline structure can be disposed at the top end of the rotating shaft 33 to fit in the self-aligning bearing, so that the sliding block 37 can drive the rotating shaft 33 to move up and down without interfering with the rotation of the rotating shaft 33. By adopting the design, the control precision of the rotating shaft 33 can be improved, so that the etching rate can be accurately controlled, and the applicability and the application range of the embodiment of the application are greatly improved; and the structure of the embodiment of the application is simple, so that the application and maintenance cost is further reduced.

In an embodiment of the present application, as shown in fig. 1 to 4 and 11, the rotation driving mechanism 3 further includes a connecting member 38, a bottom end of the rotating shaft 33 is nested in a top end of the main shaft 212, and the rotating shaft 33 and the main shaft 212 are detachably connected through the connecting member 38. Optionally, the top surface of the main shaft 212 is provided with a connecting groove 217 for accommodating the bottom end of the rotating shaft 33; the peripheral wall of the bottom end of the rotating shaft 33 is provided with a limiting groove 331, the connecting piece 38 passes through the peripheral wall of the main shaft 212 and then is positioned in the limiting groove 331, and the connecting piece 38 is connected with the peripheral wall of the main shaft 212.

As shown in fig. 1 to 4 and 11, a circular connecting slot 217 may be opened on the top surface of the main shaft 212, and a rectangular connecting hole 218 is opened on the peripheral wall of the main shaft 212 for communicating with the inner wall of the connecting slot 217. The diameter of the bottom end of the rotating shaft 33 is relatively small with respect to the diameter of the other portion for being received in the connecting groove 217; the peripheral wall of the bottom end of the rotating shaft 33 is provided with a rectangular stopper groove 331, and the stopper groove 331 is provided in a shape corresponding to the shape of the connection hole 218. In practical applications, the bottom end of the rotating shaft 33 is received in the connecting slot 217, and the limiting slot 331 is aligned with the connecting hole 218. The limit protrusion 381 of the connecting member 38 extends into the connecting hole 218 and the limit groove 331 to limit the position of the rotating shaft 33 and the main shaft 212, and the connecting plate 382 of the connecting member 38 presses against the outer periphery of the main shaft 212 and is connected with the outer periphery of the main shaft 212 through two fasteners. By adopting the design, the structural stability of the embodiment of the application is higher, and the disassembly and the maintenance are easy. However, the connection mode between the rotating shaft 33 and the main shaft 212 is not limited in the embodiments of the present application, and those skilled in the art can adjust the setting according to actual situations.

Based on the same concept, the embodiment of the application provides semiconductor process equipment, which comprises: a process chamber and a gas inlet device as provided in the first aspect.

By applying the embodiment of the application, at least the following beneficial effects can be realized:

the embodiment of the application adopts an integrated design for the uniform flow plate and the main shaft, and the uniform flow plate is driven to rotate in the process chamber through the rotary driving mechanism. By adopting the design, the uniform flow plate rotates in the process chamber, so that the process gas is uniformly distributed in the process chamber, and the uniformity of wafer etching is greatly improved. The main shaft and the flow equalizing plate are of an integrated structure, so that the structure is simplified, the application and maintenance cost can be greatly reduced, and the use experience is greatly improved.

It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.

Claims (14)

1. The gas inlet device is used for a process chamber of semiconductor process equipment and is characterized by comprising a gas inlet part and a rotary driving mechanism;

the air inlet component comprises a flow equalizing plate and a main shaft which are integrally arranged, the flow equalizing plate is arranged in the process chamber, the main shaft is movably and hermetically connected with the process chamber, one end of the main shaft penetrates through the top wall of the process chamber and is connected with the flow equalizing plate, and the other end of the main shaft is connected with the rotary driving mechanism;

the rotary driving mechanism is arranged above the process chamber and used for driving the flow equalizing plate to rotate in the process chamber through the main shaft so as to equalize the flow of the process gas introduced into the process chamber.

2. The gas inlet device according to claim 1, further comprising a sealing assembly, wherein the sealing assembly is sleeved outside the main shaft, one end of the sealing assembly is movably and hermetically connected with the main shaft, the other end of the sealing assembly is connected to a top wall of the process chamber, the main shaft can rotate relative to the sealing assembly, and the sealing assembly can synchronously lift and lower along with the main shaft.

3. The gas inlet device as claimed in claim 2, wherein the sealing assembly includes a sleeve, a plurality of sealing grooves extending in the circumferential direction are formed in an inner wall of the sleeve, the plurality of sealing grooves are arranged at intervals in the axial direction of the sleeve, a magnetic fluid is contained in the sealing grooves, and the sleeve is sealed with the main shaft through the magnetic fluid in the sealing grooves.

4. The air intake device of claim 3, wherein an air intake hole extends through the peripheral wall of the sleeve, and the air intake hole is positioned between any two adjacent sealing grooves; and a uniform flow channel structure is formed in the air inlet part, and the air inlet is used for introducing the process gas into the uniform flow channel structure.

5. The air inlet device as claimed in claim 4, wherein the uniform flow passage structure comprises a flow guide groove, a vertical flow passage, a uniform flow cavity and a uniform flow hole, the flow guide groove extending along the circumferential direction is formed on the outer circumferential wall of the spindle, and the flow guide groove is vertically aligned with the air inlet hole; the main shaft is internally provided with the vertical flow channel, the top end of the vertical flow channel is communicated with the flow guide groove, and the bottom end of the vertical flow channel is communicated with the uniform flow cavity; the uniform flow cavity is formed in the uniform flow plate, and a plurality of uniform flow holes communicated with the uniform flow cavity are formed in the bottom surface of the uniform flow plate.

6. The gas inlet device according to claim 3, wherein the gas inlet device further comprises a frame structure, the frame structure is arranged at the top of the process chamber, an accommodating space is formed in the frame structure, and the other end of the spindle is located in the accommodating space; the rotary driving mechanism is arranged at the top of the frame structure and is connected with the main shaft in the accommodating space.

7. The air intake apparatus according to claim 6, wherein the rotation driving mechanism includes a first driver, a movable member and a rotation shaft, the first driver is disposed in the accommodating space; the movable assembly is arranged at the top of the frame structure; the rotating shaft is liftable and arranged in the movable assembly and the first driver in a penetrating mode, the bottom end of the rotating shaft is connected with the main shaft, and the first driver drives the rotating shaft to rotate through the movable assembly.

8. The intake apparatus as claimed in claim 7, wherein the movable assembly includes an outer fixed member and an inner rotating member nested with each other, the outer fixed member is fixedly disposed on the top of the frame structure, the inner rotating member is sleeved on the outer circumference of the rotating shaft for driving the rotating shaft to rotate, and the rotating shaft can move up and down relative to the inner rotating member.

9. The intake device according to claim 8, wherein the rotary drive mechanism further includes a transmission member including a transmission disc and a transmission pipe, the transmission disc being connected to a bottom of the first driver and having a through hole in a central position through which the rotary shaft passes; the transmission pipe sleeve is arranged on the periphery of the rotating shaft, the bottom end of the transmission pipe is connected with the transmission disc, and the top end of the transmission pipe is connected with the inner rotating piece and used for driving the rotating shaft to rotate automatically through the inner rotating piece.

10. The air intake device of claim 7, further comprising a lifting driving mechanism, wherein the lifting driving mechanism is connected to the rotating shaft and is used for driving the spindle to lift through the rotating shaft; the sealing assembly further comprises a corrugated pipe, the corrugated pipe is sleeved on the periphery of the main shaft, two ends of the corrugated pipe are respectively connected with the bottom end of the sleeve and the top wall in a sealing mode, and the corrugated pipe can stretch and retract along with the lifting of the main shaft.

11. The intake apparatus as claimed in claim 10, wherein the lifting driving mechanism includes a second driver, a screw rod structure and a slider, the second driver is connected to the screw rod structure, one end of the slider is connected to the screw rod structure, the other end of the slider is movably connected to the top end of the rotating shaft, and the screw rod structure is configured to convert the rotation of the driver into a linear motion, so as to drive the rotating shaft to lift via the slider.

12. The air intake apparatus of claim 7, wherein the rotary drive mechanism further comprises a connector, a bottom end of the rotary shaft is nested within a top end of the main shaft, and the rotary shaft and the main shaft are detachably connected by the connector.

13. The air intake apparatus of claim 12, wherein the top surface of the spindle has a connecting groove for receiving the bottom end of the rotating shaft; the circumferential wall of the bottom end of the rotating shaft is provided with a limiting groove, the connecting piece penetrates through the circumferential wall of the main shaft and then is positioned in the limiting groove, and the connecting piece is connected with the circumferential wall of the main shaft.

14. A semiconductor processing apparatus, comprising: the process chamber and the gas inlet device as claimed in any one of claims 1 to 13.

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