CN113324048A - Semiconductor heat treatment equipment and exhaust pressure adjusting device thereof - Google Patents
Semiconductor heat treatment equipment and exhaust pressure adjusting device thereof Download PDFInfo
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- CN113324048A CN113324048A CN202110560139.1A CN202110560139A CN113324048A CN 113324048 A CN113324048 A CN 113324048A CN 202110560139 A CN202110560139 A CN 202110560139A CN 113324048 A CN113324048 A CN 113324048A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 238000010438 heat treatment Methods 0.000 title claims abstract description 50
- 238000007789 sealing Methods 0.000 claims abstract description 102
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- 230000003750 conditioning effect Effects 0.000 description 4
- 239000013013 elastic material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
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- 239000004945 silicone rubber Substances 0.000 description 2
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
- F16K1/02—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with screw-spindle
- F16K1/04—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with screw-spindle with a cut-off member rigid with the spindle, e.g. main valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K27/00—Construction of housing; Use of materials therefor
- F16K27/02—Construction of housing; Use of materials therefor of lift valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K27/00—Construction of housing; Use of materials therefor
- F16K27/08—Guiding yokes for spindles; Means for closing housings; Dust caps, e.g. for tyre valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/44—Mechanical actuating means
- F16K31/50—Mechanical actuating means with screw-spindle or internally threaded actuating means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/44—Mechanical actuating means
- F16K31/60—Handles
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K37/00—Special means in or on valves or other cut-off apparatus for indicating or recording operation thereof, or for enabling an alarm to be given
- F16K37/0008—Mechanical means
- F16K37/0016—Mechanical means having a graduated scale
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K41/00—Spindle sealings
- F16K41/02—Spindle sealings with stuffing-box ; Sealing rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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Abstract
The invention discloses semiconductor heat treatment equipment and an exhaust pressure adjusting device thereof. The main part is provided with first passageway, and first passageway is including adjusting the section and with the circulation section that adjusts the section intercommunication. The semiconductor heat treatment equipment comprises an exhaust pipeline, and the adjusting section is provided with a through hole for communicating the exhaust pipeline and the adjusting section. The sealing component is arranged at one end of the adjusting section far away from the flow section. The sealing component is respectively matched with the main body and the adjusting rod in a sealing way. The adjusting rod penetrates through the sealing assembly and extends into the adjusting section. The adjusting plate is arranged at one end of the adjusting rod extending into the adjusting section. The adjusting rod can drive the adjusting plate to move along the adjusting section. The cross section of the through hole is provided with two adjusting edges, the distance between the two adjusting edges in the first direction is equal, and the first direction is perpendicular to the moving direction of the adjusting plate. The scheme can solve the problem that the exhaust pressure adjusting device is difficult to realize stable and gradual change of the exhaust pressure.
Description
Technical Field
The invention relates to the technical field of semiconductor processing equipment, in particular to semiconductor heat treatment equipment and an exhaust pressure adjusting device thereof.
Background
In semiconductor manufacturing, it is often necessary to use vertical furnace equipment for product processing. For example, a chip fabrication plant processes chips using vertical furnace equipment. In the process of carrying out the normal pressure process on the product of the chip processing factory in the vertical furnace equipment, negative pressure needs to be provided for the vertical furnace equipment through a factory service end of the processing factory so as to ensure that the air pressure in a cavity of the vertical furnace equipment is micro negative pressure. Because the pressure that the factory service end of different processing plants can provide exists the difference, and then need the atmospheric pressure adjusting device to adjust the atmospheric pressure in the cavity of vertical furnace equipment to guarantee the uniformity of the product of different processing plants production. The pressure regulating process of the currently used exhaust pressure regulating device is not stable enough.
Disclosure of Invention
The invention discloses semiconductor heat treatment equipment and an exhaust pressure adjusting device thereof, which aim to solve the problem that the exhaust pressure adjusting device in the related technology is difficult to realize stable and gradual change of exhaust pressure.
In order to solve the problems, the invention adopts the following technical scheme:
the exhaust pressure adjusting device disclosed by the embodiment of the invention comprises a main body, an adjusting rod, an adjusting plate and a sealing assembly. Wherein, the main part is provided with first passageway, and first passageway is including adjusting section and circulation section, adjusts section and circulation section intercommunication. The semiconductor heat treatment equipment comprises an exhaust pipeline, wherein a through hole is formed in the side wall of the adjusting section and is used for communicating the exhaust pipeline and the adjusting section. The sealing assembly is arranged at one end, far away from the circulation section, of the adjusting section, the sealing assembly is in sealing fit with the main body, part of the adjusting rod penetrates through the sealing assembly to stretch into the adjusting section, the adjusting rod can move in the adjusting section, and the adjusting rod is in sealing fit with the sealing assembly. The adjusting plate is in a flat plate shape and is arranged at one end, extending into the adjusting section, of the adjusting rod and can move in the adjusting section along with the movement of the adjusting rod, two opposite adjusting edges are arranged in the cross section of the through hole, the distance between the two adjusting edges in the first direction is equal, and the first direction is perpendicular to the moving direction of the adjusting plate.
The embodiment of the invention also discloses semiconductor heat treatment equipment which comprises the exhaust pressure adjusting device.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the semiconductor heat treatment equipment and the exhaust pressure adjusting device thereof disclosed by the embodiment of the invention, the adjusting rod can drive the adjusting plate to move in the adjusting section, so that the increase or decrease of the flow area of the part of the through hole communicated with the flow section is realized, and the adjustment of the exhaust pressure in the semiconductor heat treatment equipment is further realized. The sealing assembly is respectively in sealing fit with the main body and the adjusting rod, so that the air tightness of the exhaust pressure adjusting device is improved, the exhaust pressure of the semiconductor heat treatment equipment is prevented from being influenced by air leakage of the exhaust pressure adjusting device, and the accuracy of the exhaust pressure adjusting device in the semiconductor heat treatment equipment is improved. The distance between the two adjusting edges in the first direction is equal, and the first direction is perpendicular to the moving direction of the adjusting plate relative to the adjusting section, so that in the process that the adjusting plate moves along the adjusting edges, the variation of the flow area of the part of the through hole communicated with the flow section can be in a direct proportion relation with the moving distance of the adjusting plate relative to the adjusting section, and the stable and gradual adjustment of the exhaust pressure in the semiconductor heat treatment equipment is realized.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of an application of an exhaust pressure regulating device according to an embodiment of the present disclosure;
FIG. 2 is a cross-sectional view of a first perspective of an exhaust pressure regulator according to an embodiment of the present disclosure;
FIG. 3 is a flow diagram of an exhaust pressure regulating device according to an embodiment of the present disclosure;
FIG. 4 is a cross-sectional view of a second perspective of an exhaust pressure regulator apparatus according to an embodiment of the present disclosure;
FIG. 5 is a schematic view of an assembled seal assembly according to one embodiment of the present disclosure;
FIG. 6 is a schematic view of an adjusting lever according to an embodiment of the present invention;
FIG. 7 is an assembly view of the handle and the stop segment according to one embodiment of the present disclosure;
FIG. 8 is a top view of the disclosed handle according to one embodiment of the present invention;
FIG. 9 is a partial schematic view of an exhaust pressure regulator according to an embodiment of the disclosure;
FIG. 10 is a schematic view of an adjustment plate and a through hole according to a first embodiment of the present invention;
fig. 11 is a schematic view of an adjusting plate and a through hole according to a second embodiment of the invention.
In the figure: 100-a body; 110 — a first channel; 111-a conditioning section; 112-a flow-through section; 120-a via hole; 200-adjusting rod; 210-a limiting section; 220-active segment; 230-positioning step; 300-adjusting plate; 400-a seal assembly; 410-shaft sleeve; 420-a sealing cover; 430-a seal; 440-a first sealing ring; 450-a second sealing ring; 500-side intake connection; 510-a second channel; a 520-side intake transfer plate; 530-pressure detecting tube; 600-a third seal ring; 700-a handle; 710-mounting holes; 800-handle stop.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to fig. 1 to 11.
Referring to fig. 1 and 2, an exhaust pressure adjusting apparatus in a semiconductor heat treatment apparatus according to an embodiment of the present invention includes a main body 100, an adjusting rod 200, an adjusting plate 300, and a sealing assembly 400. The body 100 is a basic structural member that may provide a mounting base for the adjustment lever 200, the adjustment plate 300, and/or the seal assembly 400.
Referring to fig. 2, the body 100 may be provided with a first passage 110. The first channel 110 may include a conditioning section 111 and a flow-through section 112, the conditioning section 111 being in communication with the flow-through section 112. The semiconductor heat treatment equipment comprises an exhaust pipeline, a through hole 120 is formed in the side wall of the adjusting section 111, and the through hole 120 is used for communicating the exhaust pipeline of the semiconductor heat treatment equipment and the adjusting section 111, so that gas exhausted by the semiconductor heat treatment equipment can be exhausted through an exhaust pressure adjusting device.
Referring to fig. 2 and 3, the seal assembly 400 may be disposed at an end of the conditioning segment 111 distal from the flow segment 112. The seal assembly 400 may be in sealing engagement with the body 100. Part of the adjusting rod 200 passes through the sealing assembly 400 and extends into the adjusting section 111, the adjusting rod 200 can move in the adjusting section 111, and the adjusting rod 200 is in sealing fit with the sealing assembly 400, so that the sealing assembly 400 can realize the gap between the adjusting rod 200 and the adjusting section 111, and gas leakage from the adjusting rod 200 is avoided.
The adjustment plate 300 may be provided in a flat plate shape. Specifically, the adjusting plate 300 may be disposed at an end of the adjusting rod 200 extending into the adjusting section 111, and the adjusting plate 300 may move in the adjusting section 111 along with the movement of the adjusting rod 200, so that the adjusting rod 200 may adjust the position of the adjusting plate 300 in the adjusting section 111 to adjust the flow area of the exhaust pressure adjusting device, thereby adjusting the exhaust pressure in the semiconductor heat treatment apparatus.
The through-hole 120 has two opposite regulating edges in the cross-section. The two adjustment edges are equally spaced in the first direction, which is to be understood as meaning that the spacing of the two adjustment edges in the first direction is everywhere equal. The first direction is perpendicular to the moving direction of the adjusting plate 300. Referring to fig. 10 and 11, the shapes of the adjusting sides may be many, straight sides and arc shapes, and for this reason, the present embodiment does not limit the specific shapes of the two adjusting sides. The moving direction of the adjusting plate 300 refers to the moving direction of the adjusting plate 300 relative to the adjusting section 111 in the process that the adjusting rod 200 drives the adjusting plate 300 to move.
The exhaust gas of the semiconductor heat treatment apparatus passes through the exhaust line and enters the exhaust pressure adjusting means from the through hole 120 to adjust the exhaust pressure of the semiconductor heat treatment apparatus by the exhaust pressure adjusting means. Typically, the flow-through section 112 is in communication with the service end such that the exhaust gas from the semiconductor thermal processing apparatus can flow to the service end via the exhaust pressure regulating device. Specifically, in the process that the adjusting rod 200 drives the adjusting plate 300 to move from the side of the through hole 120 close to the flow section 112 to the side of the through hole 120 far from the flow section 112, the cross-sectional area of the communicating part between the through hole 120 and the flow section 112 is increased, i.e., the flow area is increased, and the exhaust pressure of the semiconductor heat treatment equipment is closer to the air pressure provided by the plant service end. In the process that the adjusting rod 200 drives the adjusting plate 300 to move from the side of the through hole 120 far away from the flow section 112 to the side of the through hole 120 close to the flow section 112, the cross-sectional area of the communicating part of the through hole 120 and the flow section 112 is reduced, that is, the flow area is reduced, and the exhaust pressure of the semiconductor heat treatment equipment and the exhaust pressure difference of the plant end are larger. It should be noted that, in general, the pressure at the plant side can be regarded as a constant pressure, and therefore, the exhaust pressure of the semiconductor heat treatment apparatus can be adjusted by the exhaust pressure adjusting means.
The adjusting plate 300 is configured as a flat plate, so that the side of the adjusting plate 300 close to the flow-through section 112 can be prevented from obstructing the airflow. The distance between the two adjusting sides in the first direction is equal, and the first direction is perpendicular to the moving direction of the adjusting plate 300 relative to the adjusting section 111, so that in the process that the adjusting plate 300 moves along the two adjusting sides, the variation of the flow area of the exhaust pressure adjusting device is the product of the moving distance of the adjusting plate 300 relative to the adjusting section 111 and the distance between the two adjusting sides in the first direction. In addition, the distance between the two adjusting sides in the cross section of the through hole 120 in the first direction is a fixed value, and the distance between the adjusting plate 300 and the adjusting section 111 is equal to the distance between the adjusting rod 200 and the adjusting section 111. Therefore, the above technical solution can make the variation of the flow area of the exhaust pressure adjusting device directly proportional to the moving distance of the adjusting rod 200 relative to the adjusting section 111, so as to accurately adjust the exhaust pressure of the semiconductor heat treatment equipment, and realize gradual and stable adjustment of the exhaust pressure in the semiconductor heat treatment equipment.
Referring to fig. 2, the size of the regulation section 111 is larger than that of the flow-through section 112, and a boss may be formed where the regulation section 111 communicates with the flow-through section 112. The axial side wall of the adjusting plate 300 is in sliding fit with the inner side wall of the adjusting section 111, and in the case that the adjusting plate 300 slides along the adjusting section 111 to the end of the adjusting section 111 close to the flow-through section 112, the adjusting plate 300 can be in interference seal with the boss, so that the exhaust pressure adjusting device can also be used for blocking the exhaust of the semiconductor heat treatment equipment.
In an alternative embodiment, the cross section of the through hole 120 is rectangular, so that the exhaust pressure adjusting device can realize that the moving distance of the adjusting rod 200 relative to the adjusting section 111 is in a direct proportion relation with the variation of the flow area of the exhaust pressure adjusting device within an adjustable range, and further the range of stable and gradual adjustment of the exhaust pressure in the semiconductor heat treatment equipment can be expanded. Moreover, the cross section of the through hole 120 is rectangular, and the processing difficulty of the through hole 120 can be reduced.
In an alternative embodiment, the cross-section of the through-hole 120 may include at least two sets of adjusting edges, each set of adjusting edges including two opposite adjusting edges. For ease of illustration, the following text distinguishes between the first set of adjustment edges and the second set of adjustment edges. Optionally, the distance between two adjusting sides in the first group of adjusting sides in the first direction is equal, and the distance between two adjusting sides in the first group of adjusting sides in the first direction is smaller than the distance between two adjusting sides in the second group of adjusting sides in the first direction. The exhaust pressure regulating device according to this embodiment may rapidly regulate the size of the flow area of the exhaust pressure regulating device when the regulating plate 300 is located in the region corresponding to the second regulating edge, so that the flow rate of the gas in the exhaust pressure regulating device is rapidly regulated to a certain range. Under the condition that the adjusting plate 300 is located in the region corresponding to the first adjusting edge, the linear adjustment of the flow area of the exhaust pressure adjusting device can be realized, and the stable and gradual adjustment of the exhaust pressure can be further realized. The present embodiment can realize that the exhaust pressure regulating device realizes different regulating speeds in different exhaust pressure ranges. The regulating precision of the exhaust pressure regulating device can be ensured, and the exhaust pressure regulating speed can be increased. Of course, the distance between two adjusting sides in the first direction in the second group of adjusting sides can also be equal.
The exhaust pressure adjusting apparatus described in the above embodiments may be applied to, but is not limited to, the following usage scenarios. When the semiconductor heat treatment equipment normally works, the range of the exhaust pressure is a first range, and the minimum value in the first range is larger than zero. Therefore, the exhaust pressure regulating means can quickly regulate the exhaust pressure of the semiconductor heat treatment apparatus to be within the first range by the second group of regulating edges described in the above embodiments. And then the fine adjustment of the exhaust pressure of the semiconductor heat treatment equipment is realized through the first group of adjusting edges, so that the adjusting precision of the exhaust pressure of the semiconductor heat treatment equipment is ensured.
In an alternative embodiment, the adjusting rod 200 is provided with scale marks to record the exhaust pressure of the semiconductor heat treatment device corresponding to each adjusting position through the scale marks, so that not only can the exhaust pressure of the semiconductor heat treatment device be quickly and accurately adjusted according to the scale marks, but also the consistency of each adjusting mechanism can be quantitatively detected.
Referring to fig. 3 and 5, the seal assembly 400 may include a hub 410, a seal cap 420, and a seal 430. The shaft sleeve 410, the sealing cover 420 and the sealing member 430 are sleeved on the adjusting rod 200, the shaft sleeve 410 is in threaded fit with the adjusting rod 200, and the shaft sleeve 410 is fixedly connected with one end of the main body 100 close to the adjusting section 111, so that the adjusting rod 200 can move along the adjusting section 111 by rotating the adjusting rod 200, the adjusting plate 300 is further driven to move relative to the adjusting section 111, and the purpose of adjusting the exhaust pressure of the semiconductor heat treatment equipment is achieved. Specifically, the boss 410 may be at least partially embedded in the adjustment segment 111 to improve the stability and sealing of the mounting of the boss 410 to the body 100.
In the above embodiment, the sealing of the gap between the adjusting rod 200 and the shaft sleeve 410 can be realized by the sealing member 430, and the adjusting rod 200 can rotate relative to the shaft sleeve 410 to realize the movement of the adjusting rod 200 relative to the adjusting section 111, so as to achieve the purpose of adjusting the exhaust pressure of the semiconductor heat treatment equipment. Specifically, the bushing 410 may be fastened to the body 100 by a screw or a bolt.
In an alternative embodiment, the adjustment plate 300 may be rotatably engaged with the adjustment lever 200. Specifically, in the case that the cross section of the adjusting section 111 is square or has other multiple deformations, the adjusting rod 200 can rotate relative to the adjusting plate 300 and drive the adjusting plate 300 to move along the adjusting section 111.
The sealing member 430 may be made of teflon to prevent scratches from being generated between the sealing member 430 and the adjustment lever 200, thereby ensuring durability of the sealing member 430 and the adjustment lever 200.
Referring to fig. 5, the sealing assembly 400 may further include a first sealing ring 440, a first sealing groove is disposed at an end of the shaft sleeve 410 away from the adjusting section 111, the first sealing ring 440 is disposed in the first sealing groove and sleeved on the adjusting rod 200, and the sealing member 430 is at least partially disposed in the first sealing groove and presses the first sealing ring 440, so that the first sealing ring 440 seals a gap between the shaft sleeve 410 and the adjusting rod 200. The first sealing ring 440 may be made of an elastic material, so that the first sealing ring 440 may form an elastic seal with the shaft housing 410, the sealing member 430 and the adjustment lever 200, further improving the sealing performance between the adjustment lever 200 and the shaft housing 410. The first seal groove may provide a mounting space for the first seal ring 440 and prevent the first seal ring 440 from being damaged by excessive pressure of the sleeve 410 and the seal member 430.
Referring to fig. 5, the seal assembly 400 further includes a second seal ring 450, and a second seal groove is disposed at an end of the body 100 remote from the flow section 112. A second seal ring 450 may be disposed in the second seal groove. Further, the second sealing ring 450 is sleeved on the shaft sleeve 410, and the second sealing ring 450 interferes with the shaft sleeve 410 and the adjusting section 111 for sealing. The second sealing ring 450 may further improve the sealing performance between the bushing 410 and the body 100. The second sealing ring 450 may be made of an elastic material such that an elastic seal is formed between the body 100 and the bushing 410. One end of the adjusting section 111, which is far away from the flow section 112, is provided with a second sealing groove, so that not only can the mounting stability of the shaft sleeve 410 and the main body 100 be ensured, but also the second sealing ring 450 can be prevented from being damaged due to overlarge assembling force between the main body 100 and the shaft sleeve 410, and the sealing performance between the shaft sleeve 410 and the main body 100 is improved.
Referring to fig. 3 and 5, the exhaust pressure adjusting apparatus may further include a side intake connector 500 and a third sealing ring 600, a third sealing groove is further formed on the outer sidewall of the main body 100 around the through hole 120, a second channel 510 is provided in the side intake connector 500, a side intake transfer plate 520 is provided at one end of the side intake connector 500, the side intake connector 500 is connected with the outer sidewall of the main body 100 through the side intake transfer plate 520, the through hole 120 may be communicated with an exhaust pipeline through the second channel 510, and the third sealing ring 600 is disposed in the third sealing groove and is in abutting seal with the side intake transfer plate 520 and the main body 100. Alternatively, the side intake transfer plate 520 may be a flange plate. Specifically, the side air intake transfer plate 520 is connected to the outer sidewall of the main body 100 around the through hole 120. Further alternatively, the side intake transfer plate 520 may be fastened to the side wall of the main body 100 by screws. Optionally, the outer sidewall of the main body 100 around the through hole 120 may be a plane, so that the side air intake transfer plate 520 is attached to the outer sidewall of the through hole 120.
In the above embodiment, the side intake adapter plate 520 is disposed at the end of the side intake connector 500 connected to the main body 100, so that the side intake connector 500 and the main body 100 can be conveniently and fixedly mounted. In addition, the third sealing ring 600 and the third sealing groove can improve the sealing performance of the joint of the side inlet connector 500 and the main body 100, thereby ensuring the sealing performance of the joint of the through hole 120 and the second channel 510.
By providing the side inlet connector 500, the difficulty in installing the exhaust pressure regulating device can be reduced, and the exhaust pressure regulating device can be conveniently connected with an exhaust pipeline of the semiconductor heat treatment equipment. Specifically, one end of the side intake connector 500, which is away from the body 100, may be provided with a flange, so that the side intake connector 500 may be connected to an exhaust line communicating with or connecting the semiconductor heat treatment apparatus through the flange. Alternatively, the side intake connector 500 may be removably coupled to the body 100 to accommodate different exhaust line configurations by replacing the side intake connector 500.
It should be noted that the first seal ring 440, the second seal ring 450, and/or the third seal ring 600 may be made of an elastic material. There are many types of elastic materials, for example: nitrile rubber (NBR), Fluororubber (FPM), Ethylene Propylene Diene Monomer (EPDM), and silicone rubber (SI), and therefore the specific material of the first seal ring 440, the second seal ring 450, and/or the third seal ring 600 is not limited in this embodiment. Optionally, the first seal ring 440, the second seal ring 450, and/or the third seal ring 600 may be O-rings.
Optionally, a pressure detecting tube 530 is disposed on a sidewall of the side inlet connector 500, and the pressure detecting tube 530 is communicated with the second channel 510 for monitoring the magnitude of the exhaust pressure of the semiconductor thermal processing apparatus. The pressure detecting tube 530 is disposed at the side inlet connector 500, so that the exhaust pressure adjusting device can directly detect the exhaust pressure of the semiconductor heat treatment device during the adjustment of the exhaust pressure of the semiconductor heat treatment device, thereby achieving more precise adjustment of the exhaust pressure of the semiconductor heat treatment device and reducing the movement of operators. It should be noted that, although the adjustment rod 200 is provided with the scale marks to provide reference for adjusting the exhaust pressure of the semiconductor heat treatment apparatus, in the case that the required exhaust pressure is located between the pressure ranges indicated by two adjacent scales, the accurate adjustment of the exhaust pressure cannot be achieved through the scale marks. Therefore, the exhaust pressure of the semiconductor heat treatment equipment can be monitored in real time by the pressure detecting tube 530, so that more precise adjustment can be realized.
Referring to fig. 6 to 9, the exhaust pressure adjusting apparatus may further include a handle 700, the handle 700 is provided with a mounting hole 710, the handle 700 is sleeved on a portion of the adjusting lever 200 located outside the main body 100, the handle 700 may move along the adjusting lever 200, a portion of the adjusting lever 200 located outside the main body 100 includes a position-limiting section 210 and a movable section 220, and the handle 700 may move between the position-limiting section 210 and the movable section 220. When the handle 700 is located at the position-limiting section 210, the mounting hole 710 is in position-limiting fit with the position-limiting section 210, so that the handle 700 can drive the adjusting rod 200 to rotate. When the handle 700 is positioned on the movable section 220, the mounting hole 710 is rotatably engaged with the movable section 220. Specifically, under the condition that the exhaust pressure of the semiconductor heat treatment equipment needs to be adjusted, the handle 700 can be moved to the limiting section 210, and then the exhaust pressure of the semiconductor heat treatment equipment can be adjusted by rotating the handle 700. Under the condition that the exhaust pressure of the semiconductor heat treatment equipment does not need to be adjusted, the handle 700 can be moved to the movable section 220, so that the handle 700 cannot drive the adjusting rod 200 to rotate, and the change of the exhaust pressure of the semiconductor heat treatment equipment caused by mistakenly touching the handle 700 is avoided.
The mounting hole 710 and the limiting section 210 are matched in a limiting manner, specifically, the mounting hole 710 can be a square hole, and the limiting section 210 is a square shaft matched with the mounting hole 710, so that the handle 700 can drive the adjusting rod 200 to rotate. Of course, the mounting hole 710 may also be provided as a through hole with other shapes, for example, the mounting hole 710 may also be provided as an oval through hole, a hexagonal prism through hole, or the like. In addition, the mounting hole 710 can also be in interference fit with the limiting section 210, so that the handle 700 can drive the adjusting rod 200 to rotate. In addition, the inside wall of the mounting hole 710 may further be provided with a positioning groove, a positioning protrusion matched with the positioning groove is provided on the side wall of the limiting section 210, and the adjusting lever 200 is embedded in the positioning groove through the positioning protrusion under the condition that the handle 700 is located at the limiting section 210, so as to realize the rotation limitation of the adjusting lever 200 and the handle 700. For this reason, the present embodiment does not limit the specific way of the mounting hole 710 engaging with the limiting section 210.
In an alternative embodiment, the adjustment rod 200 may be vertically disposed, and the position-limiting section 210 is located above the movable section 220, so that the handle 700 can move from the position-limiting section 210 to the movable section 220 under the self-gravity. In this embodiment, the handle 700 can be automatically reset to the active segment 220, and thus the operator does not need to reset the handle 700 to the active segment 220 after adjusting the exhaust pressure, the operation steps of adjusting the exhaust pressure by the exhaust pressure adjusting device are simplified, and the operator is prevented from forgetting to reset the handle 700 to the active segment 220 after adjusting the exhaust pressure.
In another alternative embodiment, the exhaust pressure adjusting apparatus may further include a return elastic member, one end of the return elastic member is connected to the handle 700, and the other end of the return elastic member is connected to the adjusting lever 200, so that the handle 700 may move from the position-limiting section 210 to the movable section 220 under the action of the return elastic member. Specifically, the return elastic member may be a spring, and in the case that the handle 700 is located at the position-limiting section 210, the spring is stretched or compressed, so that the pulling force or pushing force generated by the spring can act on the handle 700 to move to the movable section 220. In this embodiment, the adjusting rod 200 can be arranged in any direction, thereby improving the flexibility of the installation of the exhaust pressure adjusting device.
Referring to fig. 7 and 9, the exhaust pressure regulating device may further include a handle stopper 800. The handle stopper 800 is disposed at an end of the adjustment lever 200 away from the main body 100, and the size of the handle stopper 800 is larger than that of the mounting hole 710, so that the handle 700 is stopped by the handle stopper 800 and the handle 700 is prevented from sliding off the adjustment lever 200.
Referring to fig. 4 and 6, the portion of the adjustment lever 200 located outside the main body 100 is further provided with a positioning step 230, and the size of the positioning step 230 is larger than that of the mounting hole 710, so that the positioning step 230 can limit the distance the handle 700 moves along the adjustment lever 200 toward the end near the main body 100. Optionally, the positioning step 230 is located at a side of the sealing cover 420 and the sealing member 430 close to the handle 700 to prevent the handle 700 from colliding with the sealing cover 420 and the sealing member 430, thereby protecting the sealing cover 420 and the sealing member 430.
The embodiment of the invention also discloses semiconductor heat treatment equipment which comprises the exhaust pressure adjusting device described in the embodiment.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (12)
1. An exhaust pressure adjusting apparatus in a semiconductor heat treatment apparatus, comprising a main body (100), an adjusting rod (200), an adjusting plate (300), and a sealing assembly (400), wherein,
the main body (100) is provided with a first channel (110), the first channel (110) comprises an adjusting section (111) and a circulating section (112), and the adjusting section (111) is communicated with the circulating section (112);
the semiconductor heat treatment equipment comprises an exhaust pipeline, wherein a through hole (120) is formed in the side wall of the adjusting section (111), and the through hole (120) is used for communicating the exhaust pipeline and the adjusting section (111);
the sealing assembly (400) is arranged at one end, far away from the flow-through section (112), of the adjusting section (111), the sealing assembly (400) is in sealing fit with the main body (100), part of the adjusting rod (200) penetrates through the sealing assembly (400) and extends into the adjusting section (111), the adjusting rod (200) can move in the adjusting section (111), and the adjusting rod (200) is in sealing fit with the sealing assembly (400);
regulating plate (300) are flat, set up in it stretches into to adjust pole (200) the one end department of adjusting section (111), can be in along with the removal of adjusting pole (200) move in adjusting section (111), have two relative regulation limits, two in the cross section of through-hole (120) adjust the limit and equal at the interval on the first direction, the first direction with the moving direction mutually perpendicular of regulating plate (300).
2. An exhaust pressure regulating device according to claim 1, characterized in that the cross-section of the through hole (120) is rectangular.
3. Exhaust pressure regulating device according to claim 1, characterized in that the regulating rod (200) is provided with graduation marks.
4. Exhaust pressure regulating device according to claim 1, characterized in that said sealing assembly (400) comprises a sleeve (410), a sealing cover (420) and a sealing member (430),
the shaft sleeve (410), the sealing cover (420) and the sealing element (430) are sleeved on the adjusting rod (200), the shaft sleeve (410) is in threaded fit with the adjusting rod (200), the shaft sleeve (410) is fixedly connected with one end of the main body (100) close to the adjusting section (111),
the sealing cover (420) and the sealing element (430) are positioned at one end of the shaft sleeve (410) far away from the adjusting section (111), the sealing element (430) is positioned between the shaft sleeve (410) and the sealing cover (420),
the sealing cover (420) is in threaded fit with the shaft sleeve (410), and the sealing element (430) is fastened to one end of the shaft sleeve (410) far away from the adjusting section (111) through the sealing cover (420).
5. The exhaust pressure regulation apparatus of claim 4, wherein the seal assembly (400) further comprises a first seal ring (440), and an end of the bushing (410) distal from the regulation section (111) is provided with a first seal groove; the first sealing ring (440) is arranged in the first sealing groove and sleeved on the adjusting rod (200); the sealing element (430) is at least partially located in the first sealing groove and compresses the first sealing ring (440) such that the first sealing ring (440) seals a gap between the bushing (410) and the adjustment rod (200).
6. The exhaust pressure regulating device of claim 4, wherein the sealing assembly (400) further comprises a second sealing ring (450), a second sealing groove is disposed at an end of the main body (100) away from the flow-through section (112), the second sealing ring (450) is disposed in the second sealing groove and sleeved on a shaft sleeve (410), and the second sealing ring (450) is in interference sealing with the shaft sleeve (410) and the regulating section (111).
7. The exhaust pressure regulating device according to claim 1, further comprising a side intake connector (500) and a third sealing ring (600), wherein a third sealing groove is further formed on the outer sidewall of the main body (100) around the through hole (120), a second channel (510) is disposed in the side intake connector (500), a side intake adapter plate (520) is disposed at one end of the side intake connector (500), the side intake connector (500) is connected with the outer sidewall of the main body (100) through the side intake adapter plate (520), the through hole (120) is communicated with the exhaust pipeline through the second channel (510), and the third sealing ring (600) is disposed in the third sealing groove and sealed with the side intake adapter plate (520) and the main body (100).
8. The exhaust pressure regulating device according to claim 7, wherein a pressure detecting pipe (530) is provided on a side wall of the side intake connection member (500), the pressure detecting pipe (530) communicating with the second passage (510).
9. The exhaust pressure adjusting device according to any one of claims 1 to 8, further comprising a handle (700), wherein the handle (700) is provided with a mounting hole (710), the handle (700) is sleeved on a portion of the adjusting rod (200) located outside the main body (100), and the handle (700) can move along the adjusting rod (200),
the part of the adjusting rod (200) positioned outside the main body (100) comprises a limiting section (210) and a movable section (220), and the handle (700) can move between the limiting section (210) and the movable section (220);
when the handle (700) is positioned on the limiting section (210), the mounting hole (710) is in limiting fit with the limiting section (210), so that the handle (700) can drive the adjusting rod (200) to rotate;
when the handle (700) is positioned on the movable section (220), the mounting hole (710) is in running fit with the movable section (220).
10. The exhaust pressure regulating device according to claim 9, further comprising a handle stopper (800), the handle stopper (800) being disposed at an end of the regulating rod (200) away from the main body (100), the handle stopper (800) having a size larger than that of the mounting hole (710).
11. The exhaust pressure adjusting apparatus according to claim 9, wherein a positioning step (230) is further provided on a portion of the adjusting lever (200) located outside the main body (100), and a size of the positioning step (230) is larger than a size of the mounting hole (710).
12. A semiconductor heat treatment apparatus characterized by comprising the exhaust pressure regulating device according to any one of claims 1 to 11.
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| CN202110560139.1A CN113324048A (en) | 2021-05-21 | 2021-05-21 | Semiconductor heat treatment equipment and exhaust pressure adjusting device thereof |
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| CN202110560139.1A CN113324048A (en) | 2021-05-21 | 2021-05-21 | Semiconductor heat treatment equipment and exhaust pressure adjusting device thereof |
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| CN115440633A (en) * | 2022-10-17 | 2022-12-06 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and exhaust adjusting mechanism |
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Application publication date: 20210831 |