CN113451184A - Chip wafer storage device and use method thereof - Google Patents
Chip wafer storage device and use method thereof Download PDFInfo
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- CN113451184A CN113451184A CN202110728417.XA CN202110728417A CN113451184A CN 113451184 A CN113451184 A CN 113451184A CN 202110728417 A CN202110728417 A CN 202110728417A CN 113451184 A CN113451184 A CN 113451184A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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Abstract
The invention discloses a chip wafer storage device and a use method thereof, wherein four corners at the bottom of a base are fixedly provided with movable wheels, one side of the base is provided with two first operation doors, the top of the base is provided with a top plate, the top of the base is fixedly connected with a storage protective shell, the bottom of the front surface of the storage protective shell is provided with two second operation doors, the top of the front surface of the storage protective shell is provided with two third operation doors, the middle inside of the storage protective shell is provided with a partition plate, the partition plate divides the inner cavity of the storage protective shell into a storage cavity and a nitrogen cavity, the top end of the top plate at the bottom of the storage cavity is provided with an adjusting mechanism, the top of the adjusting mechanism is provided with four storage mechanisms, the four storage mechanisms are distributed around the center of the adjusting mechanism at equal angles, and the nitrogen cavity is provided with a nitrogen charging system; after adopting above-mentioned structure, can store the wafer of the chip of different sizes, avoid the oxidation of wafer through filling into nitrogen gas.
Description
Technical Field
The invention relates to the technical field of chip raw material storage, in particular to chip wafer storage equipment and a using method thereof.
Background
During or after chip wafer production, a special wafer storage device is required to store the wafers for transfer or transportation.
The conventional wafer storage device is of an open structure, and wafers placed in the wafer storage device are in a state of being in contact with air for a long time, so that the surfaces of the wafers are easily contaminated, and meanwhile, the wafers are also easily affected by oxygen and water vapor in the air to generate oxidation reaction, and the yield of the wafers is affected.
Disclosure of Invention
In order to overcome the technical problems, the invention aims to provide a chip wafer storage device and a using method thereof.
The purpose of the invention can be realized by the following technical scheme:
the utility model provides a chip wafer storage device, the on-line screen storage device comprises a base, the equal fixed mounting in four angles in base bottom has the removal wheel, base one side is provided with two first operation doors, the roof is installed at the base top, base top fixedly connected with storage protective housing, storage protective housing openly bottom is provided with two second operation doors, the viewing frame mouth has all been seted up at two second operation door middle parts, two viewing frame mouth internal seal install transparent plastic board, storage protective housing openly top is provided with two third operation doors, be provided with the baffle in the middle of the storage protective housing is inside, the baffle separates storage protective housing inner chamber for storage chamber and nitrogen gas chamber, the roof top of storage chamber bottom is provided with guiding mechanism, four storage mechanism have been placed at the guiding mechanism top, angular distribution such as four storage mechanism center around guiding mechanism, be provided with the nitrogen filling system in the nitrogen gas chamber.
As a further scheme of the invention: fill nitrogen system and include two nitrogen gas storage jar, two nitrogen gas storage tank bottom equal symmetries are provided with the fixing base, nitrogen gas storage jar passes through fixing base fixed mounting on the baffle, all be provided with the delivery pipe in the middle of two nitrogen gas storage tank bottoms, a delivery pipe bottom is installed first solenoid valve, another delivery pipe bottom is installed the second solenoid valve, first solenoid valve and second solenoid valve bottom cooperation are connected with first conveyer pipe, first conveyer pipe bottom intermediate junction has the second conveyer pipe, second conveyer pipe lower extreme is connected with two third conveyer pipes, two third conveyer pipes alternately communicate each other, the head of aerifing is all installed to two third conveyer pipe both ends bottoms, the clamp has been cup jointed to a third conveyer pipe bilateral symmetry, the equal fixedly connected with first cylinder in two clamp tops, two first cylinder fixed mounting is on the baffle bottom surface.
As a further scheme of the invention: the adjusting mechanism comprises a stabilizing seat, the bottom of the stabilizing seat is fixedly installed at the center of the top surface of the top plate, a first installation groove is formed in the middle of the stabilizing seat, a second cylinder is fixedly installed in the first installation groove, a piston rod fixedly connected with push column of the second cylinder is arranged in the first installation hole formed in the side wall of the stabilizing seat in a sliding mode, a placing table is sleeved on the stabilizing seat, first motors are symmetrically and fixedly installed on the bottom surface of the top plate, output shafts of the two first motors all penetrate through first gears of the top plate fixedly connected with, the two first gears are all meshed with the shaft surface of the placing table and connected with the shaft surface of the placing table, four first placing grooves are formed in the top surface of the placing table, and limiting glass beads are symmetrically installed at two ends of the inner side of the four first placing grooves.
As a further scheme of the invention: storage mechanism includes the storage box, the storage box is provided with sealing door, the storage box top is provided with the connecting seat, the inside bilateral symmetry of storage box is provided with a plurality of spout, the spout of both sides relative position all cooperates slidable mounting to have placement mechanism, be provided with the deep bead in the middle of the inside top surface of storage box, the deep bead top is provided with the air inlet duct with the storage box junction, an air discharge duct and two exhaust holes have been seted up at the inside bottom surface center of storage box, two exhaust holes are linked together with the air discharge duct, and all be provided with the third solenoid valve in two exhaust holes.
As a further scheme of the invention: placing the mechanism and including the first board of placing, the board is placed to the second, a plurality of second standing groove has been seted up to the first board top surface of placing, a plurality of annular through groove has all been seted up to a plurality of second standing groove bottom, a plurality of annular through groove is arranged by the outside to the inboard in proper order, and the diameter reduces in proper order, equal slidable mounting has spacing ring in the logical groove of a plurality of annular, a plurality of spacing ring diameter equals with the annular through groove diameter that corresponds, the first board bottom surface fixedly connected with second of placing is placed the board, the board top surface is placed to the second has seted up a plurality of second mounting groove, every spacing ring bottom both sides symmetry is provided with the adjusting lever, a plurality of adjusting lever and second are placed board threaded connection, the first board of placing is placed with the second and is placed and evenly seted up a plurality of air vents on the board.
As a further scheme of the invention: the use method of the chip wafer storage device comprises the following steps:
adjusting an adjusting rod to support a limiting ring, sequentially placing wafers into a second placing groove, pushing the placing mechanisms into a sliding groove after the wafers are fully placed, and closing a sealing door until all the placing mechanisms are placed;
after the four storage mechanisms are fully filled with the wafers, the storage mechanisms are sequentially pushed into the first placing groove and are limited by limiting glass beads;
after the placement is finished, starting the first air cylinder to drive the third conveying pipe and the inflating head to descend until the inflating head is inserted into the connecting seat, opening the first electromagnetic valve and the third electromagnetic valve, discharging air in the storage box, and filling nitrogen;
and step four, manually detecting the nitrogen concentration of the gas discharged from the exhaust hole, closing the first electromagnetic valve and the third electromagnetic valve after the nitrogen concentration reaches the set concentration, and closing the second operating door for storage.
The invention has the beneficial effects that:
1. according to the invention, the nitrogen charging system is used for discharging air in the whole storage mechanism, and the inert gas nitrogen is charged to avoid the contact of the wafer and the air, so that the contamination of the surface of the wafer is avoided, the influence of oxygen and water vapor in the air is solved, and the yield of the wafer is improved.
2. The positioning device has the advantages that the limiting rings with different diameters can be supported by the adjusting rods at different positions, so that the placing mechanism can place wafers with different sizes, the diversity of the whole device is improved, the first placing plate and the second placing plate are uniformly provided with the plurality of vent holes, the positions of the plurality of vent holes correspond to one another, and the diffusion of nitrogen is guaranteed.
3. In the taking-out process, the pushing column pushes the storage mechanism to be further convenient to separate, so that the labor is saved, the whole equipment is convenient and flexible to use, the filled nitrogen is easy to obtain, and the manufacturing cost is low.
Drawings
The invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention with the storage case removed;
FIG. 3 is a schematic view of the adjusting mechanism of the present invention;
FIG. 4 is a schematic top view of the adjustment mechanism of the present invention;
FIG. 5 is a schematic cross-sectional view of a nitrogen dosing system according to the present invention;
FIG. 6 is a schematic view of a partial structure of the nitrogen charging system of the present invention;
FIG. 7 is a schematic view of the storage mechanism of the present invention;
FIG. 8 is a schematic cross-sectional view of a storage mechanism according to the present invention;
fig. 9 is an enlarged structure diagram of the area a in fig. 8.
In the figure: 1. a base; 11. a moving wheel; 12. a first operation door; 13. a top plate; 2. a storage protective shell; 21. a second operation door; 22. an observation frame opening; 23. a third operation door; 24. a partition plate; 3. a nitrogen charging system; 31. a fixed seat; 32. a nitrogen storage tank; 33. a discharge pipe; 34. a first solenoid valve; 35. a second solenoid valve; 36. a first delivery pipe; 37. a second delivery pipe; 38. a third delivery pipe; 39. an inflation head; 310. clamping a hoop; 311. a first cylinder; 4. an adjustment mechanism; 41. a first motor; 42. a first gear; 43. a placing table; 431. a first placing groove; 432. limiting the glass beads; 44. a stabilizing base; 45. a second cylinder; 46. pushing the column; 5. a storage mechanism; 50. a storage box; 51. a connecting seat; 52. a wind deflector; 53. an air inlet groove; 54. a chute; 55. a placement mechanism; 551. a first placing plate; 552. a second placing plate; 553. a second placing groove; 554. a limiting ring; 555. an adjusting lever; 56. an exhaust groove; 57. and (4) exhausting holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-9, a chip wafer storage device comprises a base 1, wherein four corners at the bottom of the base 1 are fixedly provided with movable wheels 11 for facilitating the turnover and movement of the whole storage device, one side of the base 1 is provided with two first operation doors 12, the top of the base 1 is provided with a top plate 13, the base 1 is internally provided with a placing cavity for placing other sundries, the top of the base 1 is connected with a storage protection shell 2, the top plate 13 is positioned inside the storage protection shell 2, the bottom of the front surface of the storage protection shell 2 is provided with two second operation doors 21, the middle parts of the two second operation doors 21 are respectively provided with an observation frame opening 22, the two observation frame openings 22 are internally and hermetically provided with transparent plastic plates for facilitating the observation of the internal conditions, the top of the front surface of the storage protection shell 2 is provided with two third operation doors 23, the middle part of the storage protection shell 2 is provided with a partition plate 24, the partition plate 24 divides the inner cavity of the storage protection shell 2 into a storage cavity and a nitrogen cavity, an adjusting mechanism 4 is arranged at the top of a top plate 13 at the bottom of the storage cavity, four storage mechanisms 5 are arranged at the top of the adjusting mechanism 4, the four storage mechanisms 5 are distributed around the center of the adjusting mechanism 4 at equal angles, and a nitrogen charging system 3 is arranged in the nitrogen cavity;
the nitrogen charging system 3 comprises two nitrogen storage tanks 32, fixing seats 31 are symmetrically arranged on two sides of the bottoms of the two nitrogen storage tanks 32, the nitrogen storage tanks 32 are fixedly arranged on a partition plate 24 through the fixing seats 31, the stability of the nitrogen storage tanks 32 is ensured, the deviation is avoided, a discharge pipe 33 is arranged in the middle of the bottoms of the two nitrogen storage tanks 32, a first electromagnetic valve 34 is arranged at the bottom of one discharge pipe 33, a second electromagnetic valve 35 is arranged at the bottom of the other discharge pipe 33, the other ends of the first electromagnetic valve 34 and the second electromagnetic valve 35 are both arranged on a first conveying pipe 36, the first conveying pipe 36 is fixedly arranged on the partition plate 24, a second conveying pipe 37 is connected in the middle of the bottom of the first conveying pipe 36, the second conveying pipe 37 is a hose and is convenient for adjusting the distance, nitrogen is charged into the storage mechanism 5, the other end of the second conveying pipe 37 is connected with two third conveying pipes 38, and the two third conveying pipes 38 are communicated with each other in a crossed manner, inflation head 39 is all installed to third conveyer pipe 38 both ends bottom, clamp 310 has been cup jointed to a third conveyer pipe 38 bilateral symmetry, the equal fixedly connected with first cylinder 311 in two clamp 310 tops, two first cylinders 311 fixed mounting are on 24 bottom surfaces of baffle, release nitrogen gas through nitrogen gas storage jar 32, through first conveyer pipe 36, second conveyer pipe 37 and third conveyer pipe 38, discharge in the head 39 is aerifyd to the follow, it protects the wafer to fill nitrogen gas to the storage mechanism 5 of below, first cylinder 311 nimble adjustment inflation head 39 position simultaneously, guarantee the flexibility of aerifing.
The adjusting mechanism 4 comprises a stabilizing base 44, the bottom of the stabilizing base 44 is fixedly arranged at the center of the top surface of the top plate 13, a first installation groove is arranged in the middle of the stabilizing base 44, a second air cylinder 45 is fixedly arranged in the first installation groove, a piston rod of the second air cylinder 45 is fixedly connected with a push column 46, the push column 46 is slidably arranged in a first installation hole arranged on the side wall of the stabilizing base 44, a placing table 43 is sleeved on the stabilizing base 44, the bottom surface of the placing table 43 is abutted against the top surface of the top plate 13, first motors 41 are symmetrically and fixedly arranged on the oblique two sides of the bottom surface of the top plate 13, first gears 42 are fixedly connected with the output shafts of the two first motors 41 through the top plate 13, the two first gears 42 are respectively meshed with the axial surface of the placing table 43, four first placing grooves 431 are arranged on the top surface of the placing table 43, limiting beads 432 are symmetrically arranged at the two ends of the inner sides of the four first placing grooves 431, the limiting beads 432 are used for limiting and stabilizing the storage mechanism 5, guarantee to place platform 43 and rotate the in-process, storage mechanism 5 is stable, and two first gears 42 are synchronous to be transmitted simultaneously, have also guaranteed to place platform 43 pivoted stability, and at the in-process of taking out, promote through pushing column 46, further make things convenient for storage mechanism 5 to break away from, use manpower sparingly.
The storage mechanism 5 comprises a storage box 50, the storage box 50 is provided with a sealing door which can seal and prevent air leakage, the top of the storage box 50 is provided with a connecting seat 51 which can be in adaptive connection with an inflation head 39 to ensure the inflation of nitrogen, a plurality of sliding chutes 54 are symmetrically arranged on two sides in the storage box 50, the sliding chutes 54 on two opposite sides are matched with and slidably provided with a placing mechanism 55, a wind shield 52 is arranged in the middle of the top surface in the storage box 50, an air inlet groove 53 is arranged at the joint of the top of the wind shield 52 and the storage box 50, the wind shield 52 and the connecting seat 51 are coaxially arranged, nitrogen enters from a through hole in the center of the connecting seat 51 and comes out from the air inlet groove 53 at the top of the wind shield 52, the wind shield 52 is arranged into a downward slope to block the impact of the nitrogen, the entering nitrogen is decelerated to avoid the damage to wafers and ensure the uniformity of the nitrogen, an exhaust groove 56 and two exhaust holes 57 are arranged in the center of the bottom surface in the storage box 50, the two exhaust holes 57 are communicated with the exhaust groove 56, and third electromagnetic valves are arranged in the two exhaust holes 57 to control the nitrogen in the storage box 50 in time.
The placing mechanism 55 comprises a first placing plate 551 and a second placing plate 552, wherein a plurality of second placing grooves 553 are formed in the top surface of the first placing plate 551, a plurality of annular through grooves are formed in the bottoms of the plurality of second placing grooves 553, each annular through groove consists of two unconnected arc-shaped grooves, the plurality of annular through grooves are sequentially arranged from the outer side to the inner side, the diameters of the annular through grooves are sequentially reduced, the annular through grooves can also be formed according to actual requirements, a limiting ring 554 is slidably mounted in each annular through groove, the diameters of the limiting rings 554 are equal to the diameters of the corresponding annular through grooves, the sizes of wafers placed in the second placing grooves 553 can be changed through the limiting rings 554, the second placing plate 552 is fixedly connected to the bottom surface of the first placing plate 551, the second placing plate 552 is formed in positions, which are located below the annular grooves, on the top surface of the second placing plate, adjusting rods 555 are symmetrically arranged on two sides of the bottom of each limiting ring 554, plate 552 threaded connection is placed with the second to a plurality of adjusting rod 555, and adjusting rod 555 position and second mounting groove position one-to-one, can prop up the spacing ring 554 of different diameters through the adjusting rod 555 of different positions, make placing mechanism 55 can place the wafer of unidimensional, promote the variety of whole device, a plurality of air vents have evenly been seted up on first placing plate 551 and the second placing plate 552, the diffusion of nitrogen gas is guaranteed to a plurality of air vent position one-to-ones.
A method for using a chip wafer storage device comprises the following steps:
step one, adjusting an adjusting rod 555 at a proper position according to the actual size of the wafer to support a proper limit ring 554, then sequentially placing the wafer into a first placing groove 431, pushing the placing mechanisms 55 into a sliding groove 54 after the wafer is fully placed, and closing the sealing door until all the placing mechanisms 55 are placed;
after the four storage mechanisms 5 are fully stored with wafers, the storage mechanisms 5 are sequentially pushed into the first placing groove 431, the first gear 42 is driven to rotate by starting the first motor 41 in the middle, the two first gears 42 drive the placing table 43 to rotate, the position is adjusted, and the wafers are limited by the limiting glass beads 432;
step three, after the placement is finished, starting the first air cylinder 311, driving the third conveying pipe 38 and the inflating head 39 to descend until the inflating head 39 is inserted into the connecting seat 51, opening the first electromagnetic valve 34 and the third electromagnetic valve, discharging air in the storage box 50, filling nitrogen, protecting the wafer, and after the nitrogen storage tank 32 connected with the first electromagnetic valve 34 is filled completely, opening the second electromagnetic valve 35 and continuing to fill nitrogen;
step four, manually detecting the nitrogen concentration of the gas discharged from the exhaust hole 57, manually setting the set concentration after the nitrogen concentration reaches the set concentration, closing the first electromagnetic valve 34, the second electromagnetic valve 35 and the third electromagnetic valve, closing the second operating door 21, and storing;
and step five, when the wafer needs to be taken out, opening the second operation door 21, starting the first air cylinder 311 to drive the third conveying pipe 38 and the inflating head 39 to ascend, simultaneously starting the second air cylinder 45 to drive the push column 46 to move, pushing out the storage mechanism 5, opening the sealing door, taking out the placing mechanism 55, and taking away the wafer.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is illustrative and explanatory only and is not intended to be exhaustive or to limit the invention to the precise embodiments described, and various modifications, additions, and substitutions may be made by those skilled in the art without departing from the scope of the invention or exceeding the scope of the claims.
Claims (6)
1. A chip wafer storage device comprises a base (1) and is characterized in that four corners at the bottom of the base (1) are fixedly provided with movable wheels (11), one side of the base (1) is provided with two first operation doors (12), the top of the base (1) is provided with a top plate (13), the top of the base (1) is fixedly connected with a storage protective shell (2), the front bottom of the storage protective shell (2) is provided with two second operation doors (21), the middle parts of the two second operation doors (21) are respectively provided with an observation frame port (22), transparent plastic plates are hermetically arranged in the two observation frame ports (22), the front top of the storage protective shell (2) is provided with two third operation doors (23), the middle part in the storage protective shell (2) is provided with a partition plate (24), the partition plate (24) divides an inner cavity of the storage protective shell (2) into a storage cavity and a nitrogen cavity, the top end of the top plate (13) at the bottom of the storage cavity is provided with an adjusting mechanism (4), four storage mechanisms (5) are arranged at the top of the adjusting mechanism (4), the four storage mechanisms (5) are distributed around the center of the adjusting mechanism (4) at equal angles, and a nitrogen charging system (3) is arranged in the nitrogen cavity.
2. The chip wafer storage device according to claim 1, wherein the nitrogen filling system (3) comprises two nitrogen storage tanks (32), two sides of the bottoms of the two nitrogen storage tanks (32) are symmetrically provided with fixing seats (31), the nitrogen storage tanks (32) are fixedly mounted on the partition plate (24) through the fixing seats (31), the middle of the bottoms of the two nitrogen storage tanks (32) is provided with a discharge pipe (33), the bottom of one discharge pipe (33) is provided with a first electromagnetic valve (34), the bottom of the other discharge pipe (33) is provided with a second electromagnetic valve (35), the bottom ends of the first electromagnetic valve (34) and the second electromagnetic valve (35) are connected with a first delivery pipe (36) in a matching manner, the middle of the bottom of the first delivery pipe (36) is connected with a second delivery pipe (37), the lower end of the second delivery pipe (37) is connected with two third delivery pipes (38), and the two third delivery pipes (38) are communicated with each other in a crossing manner, inflation head (39) are all installed to two third conveyer pipes (38) both ends bottom, and clamp (310) have been cup jointed to a third conveyer pipe (38) bilateral symmetry, and the equal fixedly connected with first cylinder (311) in two clamp (310) tops, two first cylinder (311) fixed mounting are on baffle (24) bottom surface.
3. The chip wafer storage device according to claim 2, wherein the adjusting mechanism (4) comprises a stabilizing base (44), the bottom of the stabilizing base (44) is fixedly installed at the center of the top surface of the top plate (13), a first installation groove is formed in the middle of the stabilizing base (44), a second cylinder (45) is fixedly installed in the first installation groove, a piston rod of the second cylinder (45) is fixedly connected with a push column (46), the push column (46) is slidably arranged in a first installation hole formed in the side wall of the stabilizing base (44), a placing table (43) is sleeved on the stabilizing base (44), first motors (41) are symmetrically and fixedly installed on the bottom surface of the top plate (13), output shafts of the two first motors (41) penetrate through the top plate (13) and are fixedly connected with first gears (42), the two first gears (42) are respectively engaged and connected with the axial surface of the placing table (43), four first placing grooves (431) are formed in the top surface of the placing table (43), limiting glass beads (432) are symmetrically arranged at the two ends of the inner sides of the four first placing grooves (431).
4. The chip wafer storage device according to claim 3, wherein the storage mechanism (5) comprises a storage box (50), the storage box (50) is provided with a sealing door, a connecting seat (51) is arranged at the top of the storage box (50), a plurality of sliding grooves (54) are symmetrically arranged on two sides of the interior of the storage box (50), the sliding grooves (54) at two opposite sides are matched with and slidably provided with a placement mechanism (55), a wind shield (52) is arranged in the middle of the top surface of the interior of the storage box (50), an air inlet groove (53) is arranged at the connecting part of the top of the wind shield (52) and the storage box (50), an air exhaust groove (56) and two exhaust holes (57) are formed in the center of the bottom surface of the interior of the storage box (50), the two exhaust holes (57) are communicated with the air exhaust groove (56), and a third electromagnetic valve is arranged in each of the two exhaust holes (57).
5. The chip wafer storage device as claimed in claim 4, wherein the placing mechanism (55) comprises a first placing plate (551) and a second placing plate (552), a plurality of second placing grooves (553) are formed on the top surface of the first placing plate (551), a plurality of annular through grooves are formed in the bottoms of the plurality of second placing grooves (553), the plurality of annular through grooves are sequentially arranged from the outer side to the inner side, the diameters of the plurality of annular through grooves are sequentially reduced, limiting rings (554) are slidably mounted in the plurality of annular through grooves, the diameters of the plurality of limiting rings (554) are equal to the diameters of the corresponding annular through grooves, the second placing plate (552) is fixedly connected to the bottom surface of the first placing plate (551), a plurality of second mounting grooves are formed in the top surface of the second placing plate (552), adjusting rods (555) are symmetrically arranged on two sides of the bottom of each limiting ring (554), and the plurality of adjusting rods (555) are in threaded connection with the second placing plate (552), a plurality of vent holes are uniformly formed in the first placing plate (551) and the second placing plate (552).
6. The use method of the chip wafer storage device according to claim 1, wherein the use method of the chip wafer storage device comprises the following steps:
step one, adjusting an adjusting rod (555), supporting a limit ring (554), sequentially placing wafers into a second placing groove (553), pushing the placing mechanisms (55) into a sliding groove (54) after the wafers are fully placed, and closing a sealing door until all the placing mechanisms (55) are placed;
step two, after the four storage mechanisms (5) are fully stored with the wafers, pushing the storage mechanisms (5) into the first placing groove (431) in sequence, and limiting through the limiting glass beads (432);
after the placement is finished, starting the first air cylinder (311), driving the third conveying pipe (38) and the inflating head (39) to descend until the inflating head (39) is inserted into the connecting seat (51), opening the first electromagnetic valve (34) and the third electromagnetic valve, discharging air in the storage box (50), and filling nitrogen;
and step four, manually detecting the nitrogen concentration of the gas discharged from the exhaust hole (57), closing the first electromagnetic valve (34) and the third electromagnetic valve when the nitrogen concentration reaches the set concentration, and closing the second operation door (21) for storage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110728417.XA CN113451184A (en) | 2021-06-29 | 2021-06-29 | Chip wafer storage device and use method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110728417.XA CN113451184A (en) | 2021-06-29 | 2021-06-29 | Chip wafer storage device and use method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN113451184A true CN113451184A (en) | 2021-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110728417.XA Withdrawn CN113451184A (en) | 2021-06-29 | 2021-06-29 | Chip wafer storage device and use method thereof |
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| CN (1) | CN113451184A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114211245A (en) * | 2021-12-16 | 2022-03-22 | 恒林家居股份有限公司 | Automatic assembly device of seat tray locking mechanism |
-
2021
- 2021-06-29 CN CN202110728417.XA patent/CN113451184A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114211245A (en) * | 2021-12-16 | 2022-03-22 | 恒林家居股份有限公司 | Automatic assembly device of seat tray locking mechanism |
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Application publication date: 20210928 |
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| WW01 | Invention patent application withdrawn after publication |