CN115432919A - Etching and splitting method for glass laser cutting - Google Patents
Etching and splitting method for glass laser cutting Download PDFInfo
- Publication number
- CN115432919A CN115432919A CN202211310339.2A CN202211310339A CN115432919A CN 115432919 A CN115432919 A CN 115432919A CN 202211310339 A CN202211310339 A CN 202211310339A CN 115432919 A CN115432919 A CN 115432919A
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- China
- Prior art keywords
- glass
- cutting
- glass substrate
- fluorine
- laser
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005530 etching Methods 0.000 title claims abstract description 16
- 238000003698 laser cutting Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 239000010922 glass waste Substances 0.000 claims abstract description 14
- 238000002791 soaking Methods 0.000 claims abstract description 8
- 239000003513 alkali Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 229910021642 ultra pure water Inorganic materials 0.000 claims description 3
- 239000012498 ultrapure water Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000012634 fragment Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 108090000790 Enzymes Proteins 0.000 description 1
- 102000004190 Enzymes Human genes 0.000 description 1
- 108010093096 Immobilized Enzymes Proteins 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- -1 hydroxide ions Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
Abstract
The invention relates to the technical field of glass processing, in particular to an etching and splitting method for glass laser cutting. The method comprises the following steps: s1, planning cutting tracks of a plurality of micropores on a glass substrate, and cutting the glass substrate along the tracks by laser; s2, soaking the glass substrate containing the glass cutting seam in a fluorine-free solution, and corroding the glass waste in the micropores by the fluorine-free solution at a high temperature to finish the splitting. The method focuses the pulse laser inside the glass to enable the quality of the cut seam of the glass to change, then the whole glass substrate is soaked in the fluorine-free solution for soaking, the fluorine-free solution is used for corroding the quality part, the cut seam is widened until the glass waste is physically separated from the glass substrate, the damage to the surface of the glass is small, and the wall of the micropore hole is free of burrs and microcracks.
Description
Technical Field
The invention relates to the technical field of glass processing, in particular to an etching and splitting method for glass laser cutting.
Background
With the continuous improvement of glass processing technology, glass products gradually develop towards fine processing, and the applied fields are wider and wider. The processing of the micropore of the glass is a refined processing mode, and the micropore glass is developed into a new functional material with a plurality of purposes due to the specific composition, structure and characteristics of the micropore glass. In the chemical industry, the membrane can be used as a separation membrane for separating mixed gas or mixed liquid; can also be used as a carrier of a catalyst, various adsorbents and a material for gas-liquid concentration; in medicine, it can be used as a separation membrane for medical treatment such as blood purification; biologically, it can be used as carrier of immobilized enzyme to make enzyme retain stable catalytic activity.
At present, the processing technology of the microporous glass mainly adopts CNC engraving, and the problems existing at present mainly comprise: the smaller the micropore is, the more difficult the processing is, the probability of edge breakage of the glass hole is increased, and the yield is low; the cutter or the grinding tool is easy to wear, the efficiency is low, and the cost is high; rough inner wall of the hole, large inclination of the hole and the like.
Disclosure of Invention
The invention provides an etching and splitting method for glass laser cutting, and aims to solve the problems in the existing microporous glass processing.
The invention provides an etching and splitting method for glass laser cutting, which comprises the following steps:
s1, planning cutting tracks of a plurality of micropores on a glass substrate, and cutting the glass substrate along the tracks by laser;
s2, soaking the glass substrate containing the glass cutting seam in a fluorine-free solution, and corroding the glass waste in the micropores by the fluorine-free solution at a high temperature to finish the splitting.
As a further improvement of the present invention, in step S1, specifically, the method includes:
according to the shape of the glass substrate, the number of the micropores to be formed, the size of the micropores and the position relationship of the micropores, a cutting track of the micropores at the planned position on the surface of the glass substrate is formed, and the pulse laser travels along the cutting track and is focused in the glass substrate, so that the interior of the glass substrate at the cutting track is transformed into a quality cutting line, and the cutting seam is formed.
As a further improvement of the present invention, the step S2 specifically includes:
the fluorine-free solution completely immerses the glass substrate containing the glass kerf, the kerf corroded by the fluorine-free solution expands and widens the kerf, and the glass waste extrudes out of the glass substrate to complete the splitting.
As a further improvement of the present invention, the laser in step S1 is a picosecond infrared laser.
As a further improvement of the present invention, the fluorine-free solution in step S2 includes an alkaline etching solution.
As a further improvement of the invention, the formula proportion of the alkaline corrosive liquid is 80 to 90 percent of ultrapure water, 6 to 18 percent of strong base solution and not more than 4 percent of weak base solution.
As a further improvement of the present invention, the high temperature is 90 degrees celsius or higher.
In a further improvement of the present invention, the material of the glass substrate is silica glass.
The invention has the beneficial effects that: the pulse laser is focused in the glass to enable the quality of the cutting seam of the glass to change, then the whole glass substrate is soaked in the fluorine-free solution for soaking, the fluorine-free solution is used for corroding the quality part, the cutting seam is widened until the glass waste is physically separated from the glass substrate, the damage to the surface of the glass is small, and the wall of the micropore hole is free of burrs and microcracks.
Drawings
FIG. 1 is a flow chart of a glass laser cutting etching splitting method in the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments.
As shown in FIG. 1, the invention relates to a glass laser cutting etching splitting method, which comprises the following steps:
s1, cutting tracks of a plurality of micropores are planned on a glass substrate, and laser cuts the glass substrate along the tracks.
In step S1, the method specifically includes:
according to the shape of the glass substrate, the number of the micropores to be formed, the size of the micropores and the position relationship of the micropores, a cutting track of the micropores at the planned position on the surface of the glass substrate is formed, and the pulse laser travels along the cutting track and is focused in the glass substrate, so that the interior of the glass substrate at the cutting track is transformed into a quality cutting line, and the cutting seam is formed.
In the track design process, a cutting track can be drawn on a corresponding drawing firstly, then the corresponding drawing is covered on the surface of the glass substrate, the laser walks on the glass substrate according to the track by capturing the cutting track on the drawing, and is focused in the glass through pulse laser to generate 'explosion' to vitrify the glass, so that the glass substrate on the cutting track is punctured, all the glass substrates on the cutting track are vitrified, and the intermolecular structure of the glass substrate at the cutting joint is changed.
When the laser irradiates a seam, the laser cuts through the glass substrate, so that the cutting track is chemically changed, but the glass waste in the micropores is not physically separated from the glass substrate, the laser spot diameter is only 0.4um to 5um, the glass waste cannot be separated, and the subsequent seam is corroded to separate the glass waste.
The laser light to be irradiated is preferably picosecond infrared laser light having a wavelength of 1064 nm. The infrared picosecond laser with the wave band of 1064nm is adopted to cut the glass, so that the cutting efficiency is improved and the cost is reduced while the glass substrate is not damaged. If the laser with the wave band higher than 1064nm is adopted, the glass substrate is easy to be directly burnt and cracked, and the glass substrate cannot be cut; if the laser with the wave band lower than 1064nm, such as green light, ultraviolet laser, etc., is adopted, the cutting efficiency is very low, and the cost is high.
S2, soaking the glass substrate containing the glass cutting seam in a fluorine-free solution, and corroding the glass waste in the micropores by the fluorine-free solution at a high temperature to finish the splitting. The cracking at high temperature can accelerate the penetration of the fluorine-free solution to the cutting seam and reduce the processing time. The soaking time of the fluorine-free solution is different according to the thickness of the glass, and finally the glass substrate can be cracked.
The step S2 specifically includes:
the fluorine-free solution completely immerses the glass substrate containing the glass kerf, the kerf corroded by the fluorine-free solution expands and widens the kerf, and the glass waste extrudes out of the glass substrate to complete the splitting.
The fluorine-free solution includes an alkaline etchant, for example, an alkaline etchant having a formula ratio of 80 to 90% of ultrapure water, 6 to 18% of a strong alkali solution, and not more than 4% of a weak alkali solution, wherein the strong alkali solution is a metal compound solution containing hydroxide ions, and the weak alkali solution is a metal compound solution containing carbonate ions or bicarbonate ions. And (3) corroding the glass at 90 ℃, wherein the fluorine-free solution only corrodes the cutting crack of the glass and does not corrode the surface of the glass, so that the quality-change waste in the cutting crack is gradually reduced, the cutting crack is gradually widened, and finally the glass waste is separated from the glass substrate to form the microporous glass.
By soaking in the fluorine-free solution, the kerfs and the vitrified glass waste can be pertinently corroded without damaging the glass substrate, and the finally formed glass micropore wall has no burrs or microcracks by matching with the irradiation of picosecond infrared laser.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (8)
1. The etching and splitting method for glass laser cutting is characterized by comprising the following steps of:
s1, planning cutting tracks of a plurality of micropores on a glass substrate, and cutting the glass substrate along the tracks by using laser;
s2, soaking the glass substrate containing the glass cutting seam in a fluorine-free solution, and corroding the glass waste in the micropores by the fluorine-free solution at a high temperature to finish the splitting.
2. The glass laser cutting etching and splitting method according to claim 1, wherein the step S1 specifically comprises the following steps:
according to the shape of the glass substrate, the number of the micropores required to be formed, the size of the micropores and the position relationship of the micropores, the cutting track of the micropores at the planned position on the surface of the glass substrate is moved along the cutting track through pulse laser and focused inside the glass substrate, so that the inside of the glass substrate at the cutting track is transformed into a quality, and the cutting seams are formed.
3. The glass laser cutting etching splitting method according to claim 2, wherein the step S2 specifically comprises:
the fluorine-free solution completely immerses the glass substrate containing the glass kerf, the kerf corroded by the fluorine-free solution expands and widens the kerf, and the glass waste extrudes out of the glass substrate to complete the splitting.
4. The glass laser cutting etching splitting method according to claim 1, wherein the laser in step S1 is a picosecond infrared laser.
5. The glass laser cutting etching splitting method according to claim 1, wherein the fluorine-free solution in the step S2 comprises an alkaline etching solution.
6. The etching and splitting method for glass laser cutting according to claim 5, wherein the alkaline corrosive liquid is prepared from 80 to 90% of ultrapure water, 6 to 18% of strong alkali solution and not more than 4% of weak alkali solution.
7. The glass laser cutting etched fragment method as claimed in claim 1, wherein the elevated temperature is above 90 ℃.
8. The method of claim 1, wherein the glass substrate is silica glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211310339.2A CN115432919A (en) | 2022-10-25 | 2022-10-25 | Etching and splitting method for glass laser cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211310339.2A CN115432919A (en) | 2022-10-25 | 2022-10-25 | Etching and splitting method for glass laser cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115432919A true CN115432919A (en) | 2022-12-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211310339.2A Pending CN115432919A (en) | 2022-10-25 | 2022-10-25 | Etching and splitting method for glass laser cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115432919A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120299219A1 (en) * | 2011-05-27 | 2012-11-29 | Hamamatsu Photonics K.K. | Laser processing method |
| US20140147624A1 (en) * | 2012-11-29 | 2014-05-29 | Corning Incorporated | Methods of Fabricating Glass Articles by Laser Damage and Etching |
| JP2016011219A (en) * | 2014-06-27 | 2016-01-21 | 旭硝子株式会社 | Method for cutting glass substrate |
| CN108137375A (en) * | 2015-10-09 | 2018-06-08 | 康宁股份有限公司 | The base material and its formation process of glass sensor with through-hole |
| JP2020045251A (en) * | 2018-09-14 | 2020-03-26 | 株式会社ニチワ工業 | Cutting method of glass |
| US20210114925A1 (en) * | 2019-10-22 | 2021-04-22 | Bsp Co., Ltd. | Crack-free glass substrate cutting and thinning method |
| DE102021100144A1 (en) * | 2020-01-09 | 2021-07-15 | Lpkf Laser & Electronics Aktiengesellschaft | Process for processing a glass |
| CN113767075A (en) * | 2019-03-05 | 2021-12-07 | 株式会社Nsc | Etching solution for glass and method for producing glass substrate |
-
2022
- 2022-10-25 CN CN202211310339.2A patent/CN115432919A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120299219A1 (en) * | 2011-05-27 | 2012-11-29 | Hamamatsu Photonics K.K. | Laser processing method |
| US20140147624A1 (en) * | 2012-11-29 | 2014-05-29 | Corning Incorporated | Methods of Fabricating Glass Articles by Laser Damage and Etching |
| JP2016011219A (en) * | 2014-06-27 | 2016-01-21 | 旭硝子株式会社 | Method for cutting glass substrate |
| CN108137375A (en) * | 2015-10-09 | 2018-06-08 | 康宁股份有限公司 | The base material and its formation process of glass sensor with through-hole |
| JP2020045251A (en) * | 2018-09-14 | 2020-03-26 | 株式会社ニチワ工業 | Cutting method of glass |
| CN113767075A (en) * | 2019-03-05 | 2021-12-07 | 株式会社Nsc | Etching solution for glass and method for producing glass substrate |
| US20210114925A1 (en) * | 2019-10-22 | 2021-04-22 | Bsp Co., Ltd. | Crack-free glass substrate cutting and thinning method |
| DE102021100144A1 (en) * | 2020-01-09 | 2021-07-15 | Lpkf Laser & Electronics Aktiengesellschaft | Process for processing a glass |
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