CN115424958B - Double-sided heat dissipation semiconductor packaging structure and process thereof - Google Patents
Double-sided heat dissipation semiconductor packaging structure and process thereof Download PDFInfo
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- CN115424958B CN115424958B CN202211131162.XA CN202211131162A CN115424958B CN 115424958 B CN115424958 B CN 115424958B CN 202211131162 A CN202211131162 A CN 202211131162A CN 115424958 B CN115424958 B CN 115424958B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Abstract
The invention relates to the technical field of double-sided heat dissipation semiconductor packaging, in particular to a double-sided heat dissipation semiconductor packaging structure and a process thereof, which are used for solving the problems that the existing carrier substrate has larger error in placement position and is easy to be subjected to interference vibration, so that the carrier substrate cannot be quickly and accurately spliced with wafer pins, and the problem that the wafer pins are ejected out of the carrier substrate due to vibration, a telescopic rod I is fixedly connected between a supporting plate and an I-shaped chute I, a compression spring I is sleeved outside the telescopic rod I, two ends of the compression spring I are respectively and fixedly connected with the supporting plate and the inner wall of the I-shaped chute I, an operation groove is formed in the top of a workbench in a penetrating manner, a sliding component and a positioning component are arranged at the top of the workbench, and a sliding rod and a receiving plate are respectively and fixedly connected with the top of the workbench through a supporting rod I and a supporting rod II; compared with the prior art, the carrier substrate can be placed rapidly and accurately, and meanwhile shaking of the carrier substrate in the process of mounting and welding the carrier substrate and a wafer is avoided.
Description
Technical Field
The invention relates to the technical field of double-sided heat dissipation semiconductor packaging, in particular to a double-sided heat dissipation semiconductor packaging structure and a process thereof.
Background
The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, the semiconductor has wide application in radio, television and temperature measurement, for example, a diode is a device manufactured by adopting the semiconductor, the semiconductor refers to a material with controllable conductivity ranging from the insulator to the conductor, the importance of the semiconductor is very huge from the technical or economic development point of view, most electronic products today, such as core units in computers, mobile phones or digital recorders, are very closely related to the semiconductor, common semiconductor materials comprise silicon, germanium, gallium arsenide and the like, and silicon is one of various semiconductor materials with the most influence in commercial application.
The EMC is epoxy resin molding compound and epoxy plastic package material, which is powder molding compound prepared by taking epoxy resin as matrix resin, taking high-performance phenolic resin as curing agent, adding silica powder and the like as filler, and adding various auxiliary agents, wherein more than 90% of plastic package (plastic package) material adopts EMC, and the plastic package process is to extrude the EMC into a mold cavity by a transfer molding method and embed a semiconductor chip therein, and simultaneously crosslink, solidify and mold the semiconductor chip into a semiconductor device with a certain structural shape.
Because the jack on the carrier substrate is narrow and small, the pin of wafer is more, the arm of transfer module can adjust the position of wafer when placing the wafer in addition, after the wafer was placed on processing platform, the position of wafer probably takes place to shift, lead to the position that carrier substrate was placed to have great error, make the pin of wafer unable accurate intubate carrier substrate top run through in the hole of seting up, and then can cause the wafer can't aim at the jack at the in-process pin of pegging graft and lead to its emergence bending or rupture, make the wafer unable be used, and current carrier substrate is when installing and welding with the wafer, in order to fix it, lead to it to receive the interference easily and produce the vibration, and then can make carrier substrate when installing with the wafer, carrier substrate's rocking can lead to the problem that the wafer pin can't aim at to appear, and carrier substrate's vibration can lead to the pin of wafer from the jack and then need dock again.
In view of the above technical drawbacks, a solution is now proposed.
Disclosure of Invention
The invention aims to provide a double-sided heat dissipation semiconductor packaging structure and a process thereof, wherein a motor drives two transmission rods to rotate in opposite directions simultaneously through a series of transmission, and two guide plates slide simultaneously, so that a driving groove drives a driving rod and a second connecting seat to rotate simultaneously through a convex block, the second connecting seat drives the first connecting seat and a pushing rod to deflect through a connecting rod, the pushing rod drives an abutting wheel to move, and the symmetrically arranged abutting wheel pushes a carrier substrate to move, so that quick and accurate position positioning of carrier substrates with different sizes is realized, and the problem that the carrier substrate cannot be quickly and accurately spliced with wafer pins due to large and inaccurate placement position errors of the existing carrier substrate is solved;
the electric push rod pushes the push plate to move, the push plate pushes the first slide plate to slide until the upper and lower retaining plates are respectively positioned at the top and bottom of the carrier substrate, the roller supports the top of the carrier substrate tightly under the double cooperation of the telescopic rod III and the compression spring III, and further the carrier substrates with different thicknesses are supported tightly, so that the problem that the existing carrier substrate is not effectively fixed, is easy to be interfered by the interference to generate vibration, and leads to the ejection of wafer pins from the carrier substrate is solved.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the utility model provides a double-sided heat dissipation semiconductor packaging structure, includes the workstation, glue injection device is installed at the top of workstation, two backup pads are fixed with through the bolt in the top of workstation, I-shaped spout first has been seted up at the top of backup pad, I-shaped spout first sliding connection has the layer board, fixedly connected with telescopic link first between layer board and the I-shaped spout, the outside cover of telescopic link first is equipped with compression spring first, compression spring first's both ends respectively with layer board and I-shaped spout first inner wall fixed connection, the top of workstation runs through and has seted up the operation groove, the top of workstation is provided with sliding subassembly and counterpoint subassembly;
the aligning assembly comprises a sliding rod and a bearing plate, the sliding rod and the bearing plate are fixedly connected with the top of the workbench through a first supporting rod and a second supporting rod respectively, a support is fixedly connected with the top of the bearing plate, a first swinging seat is movably connected with the top of the support through a bearing, one end of the first swinging seat is fixedly connected with a pushing rod, one end of the pushing rod, far away from the first swinging seat, is movably connected with a supporting wheel through a bearing, the other end of the first swinging seat is movably connected with a connecting rod through a bearing, the top of the bearing plate is penetrated and provided with a slotted hole, a rotating rod is arranged in the slotted hole, the rotating rod is movably connected with the inner wall of the slotted hole through a bearing, one end of the rotating rod, which is positioned at the top of the bearing plate, is sleeved and fixed with a second swinging seat, and one end of the connecting rod, far away from the first swinging seat, is movably connected with the second swinging seat through the bearing.
Further, the bull stick is located the one end outside fixedly connected with actuating lever of holding plate bottom, the outside sliding connection of slide bar has the sleeve, two the sleeve all moves the bottom of connecting at same deflector, the drive groove has been seted up to the top symmetry of deflector, there is the lug bottom of actuating lever through bearing swing joint, lug sliding connection is in the drive groove.
Further, the slip subassembly includes electric putter, there is the housing at the top of workstation through the bolt fastening, the top fixed mounting of workstation has electric putter, and electric putter is located the housing, electric putter's output fixedly connected with push pedal, the top fixedly connected with riser of workstation, I-shaped spout second has all been seted up to the adjacent one side of push pedal and riser, I-shaped spout second sliding connection has slide one that the push pedal was seted up, I-shaped spout second sliding connection has slide two that the riser was seted up.
Furthermore, a second telescopic rod is fixedly connected between the first sliding plate and the second inner wall of the I-shaped sliding groove and between the second sliding plate and the second inner wall of the I-shaped sliding groove, a second compression spring is fixedly sleeved on the outer side of the second telescopic rod, and two ends of the second compression spring are respectively connected with the first sliding plate, the second sliding plate and the second I-shaped sliding groove which are correspondingly arranged in a matched mode.
Further, one side of the first sliding plate and one side of the second sliding plate are fixedly connected with an upper retaining plate and a lower retaining plate, the bottom of the upper retaining plate is fixedly connected with a third telescopic rod, the bottom of the third telescopic rod is movably connected with a roller through a second support bearing, a third compression spring is fixedly sleeved on the outer side of the third telescopic rod, and two ends of the third compression spring are fixedly connected with the bottom of the upper retaining plate and the second support respectively.
Further, one side fixedly connected with link of deflector, the internally mounted of workstation has the motor, output cover of motor is established and is fixed with straight-tooth wheel one and bevel gear one, the inside of workstation is through bearing swing joint has pivot one, pivot two and pivot three, the one end fixedly connected with bevel gear two of pivot one, the one end fixedly connected with bevel gear three and straight-tooth wheel two in proper order of pivot two the outside cover of pivot three is established and is fixed with straight-tooth wheel three and straight-tooth wheel four, bevel gear two is connected with bevel gear one and three meshing of bevel gear, straight-tooth wheel one and straight-tooth wheel three that corresponds the setting and straight-tooth wheel two and the straight-tooth wheel three that corresponds the setting are connected through chain one, the top symmetry fixedly connected with equipment frame of workstation, through bearing swing joint has the transfer line in the equipment frame, the one end fixedly connected with straight-tooth wheel five of transfer line, be connected through chain two between straight-tooth wheel five and the straight-tooth wheel four.
Further, the outside cover of transfer line is established and is fixed with the axle sleeve, axle sleeve outside fixedly connected with ejector pin, the one end and the link rotation of ejector pin are connected.
The invention also provides a packaging process of the double-sided heat dissipation semiconductor packaging structure, which comprises the following steps:
step one: firstly, slotting on the surface of a wafer, cutting the wafer into single wafers, forming steps on the surface of the cut wafers, placing a carrier substrate on a supporting plate at the top of a workbench, pushing a first sliding plate by an electric push rod through a push plate until one end of the carrier substrate is pushed to be contacted with a second sliding plate by the first sliding plate, and at the moment, positioning the carrier substrate between an upper retaining plate and a lower retaining plate, and carrying out preliminary correction on the position of the carrier substrate by the aid of the first sliding plate, the second sliding plate and the electric push rod;
step two: the motor drives the first spur gear and the first bevel gear to rotate, the first spur gear and the first bevel gear drive the fourth spur gear to rotate through a series of transmissions, the fourth spur gear drives the fifth spur gear and the transmission rods to rotate through the second chain, the rotation directions of the two transmission rods are opposite, so that the ejector rods push the guide plates to slide, the movement of the driving grooves formed in the tops of the guide plates drive the driving rods to rotate, the rotating rods drive the first swinging seat to deflect through the second swinging seat and the connecting rods, the rotation of the first swinging seat drives the pushing rods to drive the abutting wheels to move until the four abutting wheels drive the carrier substrate to move through two sides of the carrier substrate, and the movement of the carrier substrate drives the first sliding plate, the second sliding plate and the supporting plate to move until the carrier substrate is pushed to the correct position, so that pins of a wafer are convenient to accurately abut against holes formed in the carrier substrate;
step three: the wafer is sequentially inserted into corresponding holes on the surface of the carrier substrate through the mechanical arm, then the pins of the wafer are welded through the welding device, after the pins of the wafer are welded, the top of the wafer is exposed during plastic packaging through the die design, and the package body with the top and the bottom capable of radiating heat on two sides is formed.
Compared with the prior art, the invention has the beneficial effects that:
1. when the invention is used, the motor drives the two transmission rods to rotate in opposite directions simultaneously through a series of transmissions, the transmission rods drive the ejector rods to deflect through the shaft sleeves, so that the two guide plates slide simultaneously, the driving groove drives the driving rods and the second connecting seat to rotate simultaneously through the convex blocks, the second connecting seat drives the first connecting seat and the pushing rods to deflect through the connecting rods, the pushing rods drive the abutting wheels to move, and the symmetrically arranged abutting wheels push the carrier substrate to move, so that the carrier substrates with different sizes are positioned rapidly and accurately, and the problems that the pins of wafers cannot be completely inserted into the carrier substrate and the pins of the wafers cannot be bent or broken are prevented from occurring due to inaccurate placement of the carrier substrate are solved;
2. when the invention is used, the electric push rod pushes the push plate to move, the push plate pushes the slide plate I to slide until the upper and lower withstanding plates are respectively positioned at the top and bottom of the carrier substrate, the roller supports the top of the carrier substrate under the double cooperation of the telescopic rod III and the compression spring III, so that the carrier substrates with different thicknesses are supported tightly, and meanwhile, the problem that the carrier substrate shakes during the installation and welding of the carrier substrate and the problem that pins of a wafer are ejected from holes of the carrier substrate due to vibration are effectively prevented;
3. when the carrier substrate moving device is used, the I-shaped sliding groove I and the I-shaped sliding groove II are formed, so that the supporting plate slides in the I-shaped sliding groove I, the first sliding plate and the second sliding plate slide in the I-shaped sliding groove II which are correspondingly arranged, and further the symmetrically arranged abutting wheels can push the carrier substrate to move, and the carrier substrate is ensured to be quickly moved to an accurate position.
Drawings
For the convenience of those skilled in the art, the present invention will be further described with reference to the accompanying drawings;
FIG. 1 is a top view of the overall structure of the present invention;
FIG. 2 is a side view of a drive rod configuration of the present invention;
FIG. 3 is a schematic view of a skateboard according to the present invention;
FIG. 4 is a schematic structural diagram of the method of the area A in the present invention;
FIG. 5 is a schematic diagram of a B-region method structure according to the present invention;
FIG. 6 is a schematic view of a guide plate structure according to the present invention;
FIG. 7 is a schematic view of the internal structure of the workbench according to the invention;
FIG. 8 is a schematic diagram of a chip molding process according to the present invention;
fig. 9 is a schematic view of a carrier substrate structure according to the present invention.
Reference numerals: 1. a work table; 100. a wafer; 200. a carrier substrate; 2. a housing; 3. a support plate; 4. i-shaped chute I; 5. a supporting plate; 6. an operation groove; 7. a slip assembly; 701. an electric push rod; 702. a push plate; 703. a riser; 704. a first sliding plate; 705. a second slide plate; 706. an upper abutment plate; 707. a lower retaining plate; 708. a roller; 8. an alignment assembly; 801. a slide bar; 802. a receiving plate; 803. a support; 804. a first swinging seat; 805. a push rod; 806. an abutment wheel; 807. a connecting rod; 808. a rotating rod; 809. a second swinging seat; 810. a driving rod; 811. a sleeve; 812. a guide plate; 813. a driving groove; 9. a connecting frame; 10. a motor; 11. a spur gear I; 12. bevel gears I; 13. bevel gears II; 14. bevel gears III; 15. a spur gear II; 16. a spur gear III; 17. a spur gear IV; 18. a first chain; 19. a transmission rod; 20. spur gears five; 21. and (5) a push rod.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1-9, the present invention provides a technical solution:
embodiment one:
when the carrier substrate 200 is mounted and soldered to the wafer 100, the carrier substrate 200 is easily vibrated due to human or mechanical interference, so as to affect the mounting and soldering to the wafer 100, and to solve the problem, the following specific operations are performed:
the output end of the electric push rod 701 is fixedly connected with a push plate 702, the top of the workbench 1 is fixedly connected with a vertical plate 703, the top of the workbench 1 is provided with an operation groove 6, one side of the push plate 702 adjacent to the vertical plate 703 is provided with an I-shaped sliding groove II, the I-shaped sliding groove II formed in the push plate 702 is internally and slidably connected with a first sliding plate 704, the I-shaped sliding groove II formed in the vertical plate 703 is internally and slidably connected with a second sliding plate 705, one side of the first sliding plate 704 and one side of the second sliding plate 705 are fixedly connected with an upper resisting plate 706 and a lower resisting plate 707, the top of the workbench 1 is fixedly connected with two supporting plates 3 through bolts, the top of the supporting plate 3 is provided with an I-shaped sliding groove 4, the I-shaped sliding groove 4 is internally and slidably connected with a supporting plate 5, the electric push rod 701 of the housing 2 pushes the push plate 702 to move, the first sliding plate 704 is pushed by the push plate 702 to slide when the sliding assembly 7 slides, until the upper and lower retaining plates 706 and 707 are respectively located at the top and bottom of the carrier substrate 200, the bottom of the upper retaining plate 706 is fixedly connected with a third telescopic rod, the bottom of the third telescopic rod is movably connected with a roller 708 through a second bearing of the bracket, the outer side of the third telescopic rod is sleeved and fixed with a third compression spring, two ends of the third compression spring are respectively fixedly connected with the bottom of the upper retaining plate 706 and the second bracket, when the upper retaining plate 706 and the lower retaining plate 707 pass through the carrier substrate 200, the roller 708 is firstly contacted with the carrier substrate 200 and tightly abuts against the carrier substrate 200 under the double matching of the third telescopic rod and the third compression spring, the problem that pins of the wafer 100 cannot be aligned due to shaking of the carrier substrate 200 when the carrier substrate 200 is mounted with the wafer 100 is prevented, and the problem that pins of the wafer 100 need to be re-butted due to the shaking of the carrier substrate 200 in the hole is prevented from being ejected in the welding process, meanwhile, the position of the carrier substrate 200 is primarily corrected under the cooperation of the electric push rod 701;
embodiment two:
in the existing carrier substrate 200 placement process, because the wafer 100 needs to adjust the position, the wafer 100 is caused to have position offset after being placed, so that a larger error exists in the placement position of the carrier substrate 200, more pins on the wafer 100 can cause that the pins of the wafer 100 cannot be accurately inserted into holes formed in the top of the carrier substrate 200 in a penetrating manner, in addition, in the mounting process of the wafer 100, external mechanical vibration or vibration generated by manually driving the carrier substrate 200 can cause that the wafer 100 cannot accurately insert the pins into the holes, and further, the pins of the wafer 100 can be bent or broken, so that the wafer 100 cannot be used, and the specific operation is as follows:
the top of the workbench 1 is symmetrically and fixedly connected with a device frame, a transmission rod 19 is movably connected in the device frame through a bearing, a shaft sleeve is sleeved and fixed on the outer side of the transmission rod 19, a push rod 21 is fixedly connected on the outer side of the shaft sleeve, one end of the push rod 21 is rotationally connected with the connecting frame 9, a second swinging seat 809 is fixedly sleeved and arranged on the outer side of one end of the top of the bearing plate 802, one end of the connecting rod 807 far away from the first swinging seat 804 is movably connected with the second swinging seat 809 through the bearing, a driving groove 813 is symmetrically arranged on the top of the guide plate 812, the bottom of the driving rod 810 is movably connected with a lug through the bearing, the lug is slidingly connected in the driving groove 813, in particular operation, the bottom of the guide plate 812 is fixedly connected with a sleeve 811, a sleeve 811 included in the alignment assembly 8 slides on the outer side of the sliding rod 801, the push rod 21 deflects under the rotation of the shaft sleeve, the push rod 21 pushes the guide plate 812 and the sleeve 811 through the connecting frame 9, the constant moving direction of the guide plate 812 and the moving process of the sleeve 811 are further enabled by being provided with the sliding rod 801 and the sleeve 811, the driving groove 813 deflects under the movement of the guide plate 812, the driving lug 808 and the driving rod 810 is driven by the driving rod 808 under the movement of the guide plate 812, the driving rod 808 is driven to deflect, the driving rod 808 is driven by the driving rod 808 to rotate under the driving rod 808, the driving rod 808 and the driving rod 808 to deflect the first swinging seat 809 and the second swinging seat 809 to be fixedly connected with the first swinging seat 809 through the connecting rod 809,
the top of the support plate 802 is fixedly connected with a support 803, the top of the support 803 is movably connected with a first swing seat 804 through a bearing, one end of the first swing seat 804 is fixedly connected with a push rod 805, one end of the push rod 805 away from the first swing seat 804 is movably connected with a second abutment wheel 806 through a first support bearing, the other end of the first swing seat 804 is movably connected with a connecting rod 807 through a bearing, as shown in fig. 1, the four abutment wheels 806 are arranged, and are symmetrically arranged at the top of the workbench 1, when the first swing seat 804 rotates under the action of the connecting rod 807, the first swing seat 804 drives the push rod 805 to deflect, and further the correspondingly arranged abutment wheels 806 gradually approach to two sides of the carrier substrate 200, the push rod 805 deflects simultaneously under the transmission of a series of structures such as a motor 10, and as the first slide plate 704 slides in the second I-shaped slide groove formed by the push plate 702, and the second slide plate slides in the first I-shaped slide groove 4 formed by the vertical plate 703, and the symmetrically arranged abutment wheels 806 can push the carrier substrate 200 to move, so that the carrier substrate 200 can be pushed to move, and the carrier substrate 200 can not be accurately inserted into the carrier 100 after the wafer 100 is completely inserted into the carrier 100, and the wafer 100 is completely inserted into the wafer carrier 100 after the wafer 100 is completely positioned, and the wafer is completely soldered;
by arranging the sliding component 7 and the aligning component 8, the lower retaining plate 707 is matched with the upper retaining plate 706 and the roller 708 to tightly support the top and the bottom of the carrier substrate 200, and meanwhile, the supporting wheel 806 is matched with the structure of the first swing seat 804 and the like to accurately position the carrier substrate 200, so that the problems that the carrier substrate 200 cannot be quickly and accurately inserted with the pins of the wafer 100 due to position deviation and interference vibration when the existing carrier substrate 200 is placed and the problem that the pins of the wafer 100 are ejected from the carrier substrate 200 due to vibration are solved;
embodiment III:
as shown in fig. 8-9, firstly, slotting on the surface of a wafer, cutting the wafer into single chips 100, forming steps on the surface of the cut chips 100, sequentially inserting the chips 100 into corresponding holes on the surface of a carrier substrate 200 by a mechanical arm, then welding pins of the chips 100 by a welding device, after the pins of the chips 100 are welded, exposing the top of the chips 100 and extruding EMC into a die cavity during plastic packaging and embedding the semiconductor chips 100 therein by a die design, and simultaneously, crosslinking, curing and forming to form a package body with two sides radiating at the top and the bottom;
what needs to be explained here is: the EMC is epoxy resin molding compound and epoxy plastic package material, which is powdery molding compound prepared by taking epoxy resin as matrix resin, taking high-performance phenolic resin as curing agent, adding silica powder and the like as filler, and adding various auxiliary agents, wherein more than 90% of plastic package (plastic package) material adopts EMC, and the plastic package process is to extrude the EMC into a mold cavity by a transfer molding method and embed a semiconductor chip therein, and simultaneously crosslink, solidify and mold the semiconductor chip into a semiconductor device with a certain structural shape;
embodiment four:
as shown in fig. 7, the motor 10 drives the first spur gear 11 and the first bevel gear 12 to rotate simultaneously, the first spur gear 11 drives the third spur gear 16 to rotate through the first chain 18, the first bevel gear 12 drives the third bevel gear 14 to rotate in the opposite direction to the first bevel gear 12 through the second bevel gear 13, the third bevel gear 14 drives the second spur gear 15 to rotate, the second spur gear 15 drives the third spur gear 16 to rotate through the first chain 18, at this time, the rotation directions of the two fourth spur gears 17 are opposite, the fourth spur gear 17 drives the fifth correspondingly arranged spur gears 20 to rotate through the second chain, the fifth spur gears 20 drive the correspondingly arranged transmission rods 19 to rotate in the opposite direction, the two guide plates 812 are further moved reversely, and the guide plates 812 enable the four correspondingly arranged abutting wheels 806 to perform rapid and accurate position alignment on the carrier substrate 200 through a series of transmission.
The foregoing is merely illustrative of the structures of this invention and various modifications, additions and substitutions for those skilled in the art can be made to the described embodiments without departing from the scope of the invention or from the scope of the invention as defined in the accompanying claims.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended only to assist in the explanation of the invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The invention is limited only by the claims and the full scope and equivalents thereof.
Claims (8)
1. The utility model provides a double-sided heat dissipation semiconductor packaging structure, includes workstation (1), its characterized in that, injecting glue device is installed at the top of workstation (1), two backup pads (3) are fixed with through the bolt in the top of workstation (1), I-shaped spout (4) have been seted up at the top of backup pad (3), I-shaped spout (4) sliding connection has layer board (5), fixedly connected with telescopic link first between layer board (5) and I-shaped spout (4), the outside cover of telescopic link first is equipped with compression spring first, compression spring first's both ends respectively with layer board (5) and I-shaped spout (4) inner wall fixed connection, operation groove (6) have been run through to the top of workstation (1), the top of workstation (1) is provided with slip subassembly (7) and counterpoint subassembly (8);
the aligning assembly (8) comprises a sliding rod (801) and a bearing plate (802), the sliding rod (801) and the bearing plate (802) are fixedly connected with the top of the workbench (1) through a first supporting rod and a second supporting rod respectively, the top of the bearing plate (802) is fixedly connected with a support (803), the top of the support (803) is movably connected with a first swinging seat (804) through a bearing, one end of the first swinging seat (804) is fixedly connected with a pushing rod (805), one end of the pushing rod (805) away from the first swinging seat (804) is movably connected with a abutting wheel (806) through a support bearing, the other end of the first swinging seat (804) is movably connected with a connecting rod (807) through a bearing, a slotted hole is formed in the top of the bearing plate (802), the rotating rod (808) is movably connected with the inner wall of the slotted hole through a bearing, one end of the rotating rod (808) located at the top of the bearing plate (802) is sleeved with a second swinging seat (809), and one end of the connecting rod (807) away from the first swinging seat (804) is movably connected with the second swinging seat (809) through a bearing.
2. The double-sided radiating semiconductor packaging structure according to claim 1, wherein the rotating rod (808) is fixedly connected with a driving rod (810) outside one end of the bottom of the receiving plate (802), a sleeve (811) is slidably connected with the outer side of the sliding rod (801), the two sleeves (811) are fixedly connected to the bottom of the same guide plate (812), driving grooves (813) are symmetrically formed in the top of the guide plate (812), and protruding blocks are movably connected to the bottom of the driving rod (810) through bearings and are slidably connected in the driving grooves (813).
3. The double-sided heat dissipation semiconductor packaging structure as set forth in claim 1, wherein the sliding assembly (7) comprises an electric push rod (701), a housing (2) is fixed on the top of the workbench (1) through bolts, the electric push rod (701) is fixedly mounted on the top of the workbench (1) and located in the housing (2), a push plate (702) is fixedly connected to the output end of the electric push rod (701), a vertical plate (703) is fixedly connected to the top of the workbench (1), an I-shaped sliding groove II is formed in one side, adjacent to the push plate (702), of the vertical plate (703), a sliding plate I (704) is connected in the I-shaped sliding groove II formed in the push plate (702), and a sliding plate II (705) is connected in the I-shaped sliding groove II formed in the vertical plate (703).
4. The semiconductor package structure according to claim 3, wherein a second telescopic rod is fixedly connected between the first sliding plate (704) and the second inner wall of the i-shaped chute and between the second sliding plate (705) and the second inner wall of the i-shaped chute, a second compression spring is sleeved and fixed on the outer side of the second telescopic rod, and two ends of the second compression spring are respectively connected with the first sliding plate (704), the second sliding plate (705) and the second i-shaped chute in a matched manner.
5. The semiconductor packaging structure with double-sided heat dissipation according to claim 3, wherein an upper retaining plate (706) and a lower retaining plate (707) are fixedly connected to one sides of the first sliding plate (704) and the second sliding plate (705), a third telescopic rod is fixedly connected to the bottom of the upper retaining plate (706), a roller (708) is movably connected to the bottom of the third telescopic rod through a second support bearing, a third compression spring is fixedly sleeved on the outer side of the third telescopic rod, and two ends of the third compression spring are fixedly connected with the bottom of the upper retaining plate (706) and the second support respectively.
6. The double-sided radiating semiconductor packaging structure according to claim 2, wherein one side of the guide plate (812) is fixedly connected with a connecting frame (9), a motor (10) is installed inside the workbench (1), a first spur gear (11) and a first bevel gear (12) are fixedly sleeved at the output end of the motor (10), a first rotating shaft, a second rotating shaft and a third rotating shaft are movably connected inside the workbench (1) through bearings, one end of the first rotating shaft is fixedly connected with a second bevel gear (13), one end of the second rotating shaft is sequentially fixedly connected with a third bevel gear (14) and a second spur gear (15), two outer sides of the third rotating shaft are fixedly sleeved with a third spur gear (16) and a fourth spur gear (17), the second bevel gear (13) is in meshed connection with the first bevel gear (12) and the third bevel gear (14), the first spur gear (11) and the third spur gear (16) which are correspondingly arranged are connected with the third spur gear (16) which is correspondingly arranged through a first chain (18), the second rotating shaft is fixedly connected with a fifth gear (19) through a second chain (20), and the second straight gear (19) is fixedly connected with a fifth gear (20) through a transmission device.
7. The double-sided radiating semiconductor packaging structure according to claim 6, wherein a shaft sleeve is sleeved and fixed on the outer side of the transmission rod (19), a push rod (21) is fixedly connected to the outer side of the shaft sleeve, and one end of the push rod (21) is rotatably connected with the connecting frame (9).
8. The packaging process of a double-sided heat-dissipating semiconductor package according to any one of claims 1 to 7, comprising the steps of:
step one: firstly, slotting the surface of a wafer, cutting the wafer into single chips (100), forming steps on the surfaces of the cut chips (100), placing a carrier substrate (200) on a supporting plate (5) at the top of a workbench (1), pushing a first sliding plate (704) by an electric push rod (701) through a push plate (702) to move until the first sliding plate (704) pushes one end of the carrier substrate (200) to be in contact with a second sliding plate (705), and at the moment, positioning the carrier substrate (200) between an upper abutting plate (706) and a lower abutting plate (707), and carrying out primary correction on the position of the carrier substrate (200) by the aid of the first sliding plate (704), the second sliding plate (705) and the electric push rod (701);
step two: the motor (10) drives the spur gear I (11) and the bevel gear I (12) to rotate, the spur gear I (11) and the bevel gear I (12) drive the spur gear IV (17) to rotate through a series of transmission, the spur gear IV (17) drives the spur gear V (20) and the transmission rods (19) to rotate through the chain II, the rotation directions of the two transmission rods (19) are opposite, so that the ejector rods (21) push the guide plates (812) to slide, the driving rods (810) drive the rotating rods (808) to rotate through the driving grooves (813) formed in the tops of the guide plates (812), the rotating rods (808) drive the swing seat I (804) to deflect through the swing seat II (809) and the connecting rods (807), and the rotation of the swing seat I (804) drives the pushing rods (805) to drive the abutting wheels (806) to move until the four abutting wheels (806) drive the carrier substrate (200) to move through the two sides of the carrier substrate (200), the movement of the carrier substrate (200) drives the first slide plate (704), the second slide plate (705) and the slide plate (5) to move until the carrier substrate (200) is pushed to the carrier substrate (200) to the positions of the carrier substrate (200) to be accurately matched with the supporting plate holes;
step three: the wafer (100) is sequentially inserted into holes corresponding to the surface of the carrier substrate (200) through the mechanical arm, then the pins of the wafer (100) are welded through the welding device, after the pins of the wafer (100) are welded, the top of the wafer (100) is exposed during plastic packaging through the die design, and the package body with the top and the bottom radiating on two sides is formed.
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| TWI343103B (en) * | 2007-06-13 | 2011-06-01 | Siliconware Precision Industries Co Ltd | Heat dissipation type package structure and fabrication method thereof |
| US10825705B2 (en) * | 2015-05-15 | 2020-11-03 | Suss Microtec Lithography Gmbh | Apparatus, system, and method for handling aligned wafer pairs |
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| JP2017059777A (en) * | 2015-09-18 | 2017-03-23 | Ａｉメカテック株式会社 | Conveyance device and solder ball print system |
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