CN115421254B - Optical fiber hole processing method and processing equipment based on same - Google Patents
Optical fiber hole processing method and processing equipment based on same Download PDFInfo
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- CN115421254B CN115421254B CN202211169853.9A CN202211169853A CN115421254B CN 115421254 B CN115421254 B CN 115421254B CN 202211169853 A CN202211169853 A CN 202211169853A CN 115421254 B CN115421254 B CN 115421254B
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 100
- 238000003672 processing method Methods 0.000 title claims abstract description 15
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims abstract description 159
- 239000011521 glass Substances 0.000 claims abstract description 44
- 239000006247 magnetic powder Substances 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 238000005498 polishing Methods 0.000 claims abstract description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 26
- 238000012986 modification Methods 0.000 claims abstract description 18
- 230000004048 modification Effects 0.000 claims abstract description 17
- 239000000835 fiber Substances 0.000 claims description 56
- 238000005260 corrosion Methods 0.000 claims description 28
- 230000007797 corrosion Effects 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 21
- 230000005684 electric field Effects 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 15
- 239000008367 deionised water Substances 0.000 claims description 11
- 229910021641 deionized water Inorganic materials 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 4
- 239000003082 abrasive agent Substances 0.000 abstract description 22
- 230000000694 effects Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 3
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3833—Details of mounting fibres in ferrules; Assembly methods; Manufacture
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3833—Details of mounting fibres in ferrules; Assembly methods; Manufacture
- G02B6/3863—Details of mounting fibres in ferrules; Assembly methods; Manufacture fabricated by using polishing techniques
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Coupling Of Light Guides (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
Description
技术领域Technical field
本发明涉及光纤技术领域，尤其涉及一种光纤孔的加工方法及基于其的加工设备。The present invention relates to the field of optical fiber technology, and in particular, to a method for processing optical fiber holes and processing equipment based thereon.
背景技术Background technique
目前，玻璃采用激光改性后，去除改性的材料的方法主要是采用腐蚀方法。腐蚀方法所使用的腐蚀液为氢氟酸（HF），通过氢氟酸溶液缓慢腐蚀掉改性的材料，从而实现对玻璃改性区域的腐蚀贯通。但该方法耗时较久，而且随着腐蚀区域的慢慢增加，对不同改性位置腐蚀程度不一样。如果直接将该腐蚀工艺应用到光纤孔的加工工序中，将会导致加工出的光纤孔的孔壁凸凹不平，在后续光在波导内传播受到影响。At present, after glass is modified by laser, the main method to remove the modified material is corrosion. The etching solution used in the etching method is hydrofluoric acid (HF). The modified material is slowly etched away by the hydrofluoric acid solution, thereby achieving corrosion penetration into the modified area of the glass. However, this method takes a long time, and as the corrosion area slowly increases, the corrosion degree of different modified positions is different. If this etching process is directly applied to the processing process of optical fiber holes, the hole wall of the processed optical fiber hole will be uneven, which will affect the subsequent light propagation in the waveguide.
发明内容Contents of the invention
本发明提供了一种光纤孔的加工方法及基于其的加工设备，提高光纤孔孔壁的平整均匀度，减少后续光在波导内传播受到影响。The invention provides an optical fiber hole processing method and processing equipment based on the same, which improves the smoothness and uniformity of the optical fiber hole wall and reduces the impact on subsequent light propagation in the waveguide.
第一方面，本发明提供了一种光纤孔的加工方法，光纤孔为MT插芯中的光纤孔，MT插芯应用于MPO连接器中。该光纤孔的加工方法包括：提供一玻璃基板，玻璃基板具有相对的第一端面和第二端面；玻璃基板内形成有至少一个改性区，每个改性区均经激光分层加工改性而成，且每个改性区均贯穿第一端面和第二端面。将玻璃基板放入带有磁性粉末的氢氟酸溶液中。在承载有磁性粉末的氢氟酸溶液的周围外加交流磁场，驱动氢氟酸溶液流动，选择性腐蚀掉每个改性区中的材料，以在玻璃基板内形成至少一个光纤孔。采用带有磨料的高压水导光纤对每个光纤孔的孔壁进行旋转抛光。In a first aspect, the present invention provides a method for processing an optical fiber hole. The optical fiber hole is an optical fiber hole in an MT ferrule, and the MT ferrule is used in an MPO connector. The optical fiber hole processing method includes: providing a glass substrate with opposite first end faces and second end faces; at least one modified zone is formed in the glass substrate, and each modified zone is modified by laser layering processing formed, and each modified zone runs through the first end face and the second end face. Place the glass substrate into a solution of hydrofluoric acid with magnetic powder. An AC magnetic field is applied around the hydrofluoric acid solution carrying magnetic powder to drive the hydrofluoric acid solution to flow and selectively etch away the material in each modified area to form at least one optical fiber hole in the glass substrate. The hole wall of each optical fiber hole is rotated and polished using a high-pressure water-conducting optical fiber with abrasives.
在上述的方案中，通过在氢氟酸溶液中加入磁性粉末，在将改性完成的玻璃基板放入到带有磁性粉末的氢氟酸溶液中之后，在承载有磁性粉末的氢氟酸溶液的周围外加交流磁场，驱动氢氟酸溶液流动，选择性腐蚀掉每个改性区中的材料，从而能够加快改性区腐蚀成型的速率，快速腐蚀去除改性区的材料，改善由于腐蚀时间过长而各向同性对光纤孔孔壁的凸凹不平的影响程度。之后，还采用带有磨料的高压水导光纤对每个光纤孔的孔壁进行旋转抛光，不仅能够提高光纤孔孔壁的平整均匀度，减少后续光在波导内传播受到影响，而且还提高抛光效果及效率。In the above scheme, by adding magnetic powder to the hydrofluoric acid solution, after placing the modified glass substrate into the hydrofluoric acid solution carrying the magnetic powder, the hydrofluoric acid solution carrying the magnetic powder is An AC magnetic field is applied around it to drive the flow of hydrofluoric acid solution and selectively corrode the material in each modified zone, thereby speeding up the corrosion forming rate of the modified zone, quickly etching and removing the material in the modified zone, and improving the corrosion time. The degree of influence of excessive length and isotropy on the unevenness of the fiber hole wall. After that, high-pressure water-conducting optical fibers with abrasives are used to rotate and polish the hole walls of each fiber hole. This not only improves the flatness and uniformity of the fiber hole walls and reduces the impact on subsequent light propagation in the waveguide, but also improves polishing. Effectiveness and efficiency.
在一个具体的实施方式中，氢氟酸溶液的质量浓度为30-50％之间，提高选择性腐蚀的效率。In a specific embodiment, the mass concentration of the hydrofluoric acid solution is between 30-50%, which improves the efficiency of selective corrosion.
在一个具体的实施方式中，磁性粉末的粒度在200目-600目之间，提高驱动氢氟酸溶液流动的效果。In a specific embodiment, the particle size of the magnetic powder is between 200 mesh and 600 mesh, which improves the effect of driving the flow of hydrofluoric acid solution.
在一个具体的实施方式中，高压水导光纤的水径小于20um，且高压水导光纤的辅助水导液为掺有磨料的去离子水，提高抛光的精度。In a specific embodiment, the water diameter of the high-pressure water-conducting optical fiber is less than 20 um, and the auxiliary water-conducting liquid of the high-pressure water-conducting optical fiber is deionized water mixed with abrasives to improve polishing accuracy.
在一个具体的实施方式中，采用带有磨料的高压水导光纤对每个光纤孔的孔壁进行旋转抛光包括：通过控制承载光纤激光头的螺旋运动平台，采用螺旋加工的方式，对设定纤径的光纤孔进行旋转抛光，提高抛光效果。In a specific embodiment, using high-pressure water-conducting optical fiber with abrasives to rotate the hole wall of each fiber hole includes: controlling the spiral motion platform carrying the fiber laser head, using spiral processing to set the The optical fiber hole with smaller fiber diameter is rotated and polished to improve the polishing effect.
在一个具体的实施方式中，设定纤径为30um-300um，使加工出的光纤孔能够更细，提高精度及应用场景的适应性。In a specific implementation, the fiber diameter is set to 30um-300um, so that the processed optical fiber hole can be thinner, improving accuracy and adaptability to application scenarios.
在一个具体的实施方式中，在承载有磁性粉末的氢氟酸溶液的周围外加交流磁场，包括：在承载有磁性粉末的氢氟酸溶液的底部外加交流磁场，驱动氢氟酸溶液流动，选择性腐蚀掉每个改性区中的材料，以在玻璃基板内形成至少一个光纤孔。提高驱动氢氟酸溶液流动的效果。In a specific embodiment, applying an AC magnetic field around the hydrofluoric acid solution carrying magnetic powder includes: applying an AC magnetic field at the bottom of the hydrofluoric acid solution carrying magnetic powder, driving the hydrofluoric acid solution to flow, and selecting The material in each modification zone is permanently etched away to form at least one optical fiber hole in the glass substrate. Improve the effect of driving the flow of hydrofluoric acid solution.
第二方面，本发明还提供了一种光纤孔的加工设备，光纤孔为MT插芯中的光纤孔，MT插芯应用于MPO连接器中。光纤孔的加工设备基于上述任意一种光纤孔的加工方法，该光纤孔的加工设备包括：腐蚀容器、交流电场驱动装置、和高压水导光纤抛光装置。其中，腐蚀容器用于盛放带有磁性粉末的氢氟酸溶液，还用于盛放玻璃基板。交流电场驱动装置用于在承载有磁性粉末的氢氟酸溶液的周围外加交流磁场，驱动氢氟酸溶液流动，选择性腐蚀掉每个改性区中的材料，以在玻璃基板内形成至少一个光纤孔。高压水导光纤抛光装置用于采用带有磨料的高压水导光纤对每个光纤孔的孔壁进行旋转抛光。In a second aspect, the present invention also provides an optical fiber hole processing equipment. The optical fiber hole is an optical fiber hole in an MT ferrule, and the MT ferrule is used in an MPO connector. The optical fiber hole processing equipment is based on any of the above optical fiber hole processing methods. The optical fiber hole processing equipment includes: an etching container, an AC electric field driving device, and a high-pressure water conductive optical fiber polishing device. Among them, the etching container is used to hold hydrofluoric acid solution with magnetic powder, and is also used to hold glass substrates. The AC electric field driving device is used to apply an AC magnetic field around the hydrofluoric acid solution carrying magnetic powder, drive the hydrofluoric acid solution to flow, and selectively etch away the material in each modification zone to form at least one in the glass substrate. Fiber optic holes. The high-pressure water-conducting optical fiber polishing device is used to rotate and polish the hole wall of each optical fiber hole using high-pressure water-conducting optical fiber with abrasives.
在上述的方案中，通过在氢氟酸溶液中加入磁性粉末，在将改性完成的玻璃基板放入到带有磁性粉末的氢氟酸溶液中之后，在承载有磁性粉末的氢氟酸溶液的周围外加交流磁场，驱动氢氟酸溶液流动，选择性腐蚀掉每个改性区中的材料，从而能够加快改性区腐蚀成型的速率，快速腐蚀去除改性区的材料，改善由于腐蚀时间过长而各向同性对光纤孔孔壁的凸凹不平的影响程度。之后，还采用带有磨料的高压水导光纤对每个光纤孔的孔壁进行旋转抛光，不仅能够提高光纤孔孔壁的平整均匀度，减少后续光在波导内传播受到影响，而且还提高抛光效果及效率。In the above scheme, by adding magnetic powder to the hydrofluoric acid solution, after placing the modified glass substrate into the hydrofluoric acid solution carrying the magnetic powder, the hydrofluoric acid solution carrying the magnetic powder is An AC magnetic field is applied around it to drive the flow of hydrofluoric acid solution and selectively corrode the material in each modified zone, thereby speeding up the corrosion forming rate of the modified zone, quickly etching and removing the material in the modified zone, and improving the corrosion time. The degree of influence of excessive length and isotropy on the unevenness of the fiber hole wall. After that, high-pressure water-conducting optical fibers with abrasives are used to rotate and polish the hole walls of each fiber hole. This not only improves the flatness and uniformity of the fiber hole walls and reduces the impact on subsequent light propagation in the waveguide, but also improves polishing. Effectiveness and efficiency.
在一个具体的实施方式中，腐蚀容器位于交流电场驱动装置的上方，从而使交流电场驱动装置能够在氢氟酸溶液的周围外加交流磁场，从氢氟酸溶液的底部驱动氢氟酸溶液流动。提高驱动氢氟酸溶液流动的效果。In a specific embodiment, the corrosion container is located above the AC electric field driving device, so that the AC electric field driving device can apply an AC magnetic field around the hydrofluoric acid solution to drive the hydrofluoric acid solution to flow from the bottom of the hydrofluoric acid solution. Improve the effect of driving the flow of hydrofluoric acid solution.
在一个具体的实施方式中，高压水导光纤抛光装置包括：辅助水导液提供系统、光纤激光加工头、螺旋运动平台。其中，辅助水导液提供系统用于提供掺有磨料的去离子水。光纤激光加工头用于接收掺有磨料的去离子水，并输出带有磨料的高压水导光纤。螺旋运动平台用于带动光纤激光加工头螺旋运动，以采用螺旋加工的方式，对设定纤径的光纤孔进行旋转抛光，提高抛光精度和效果。In a specific embodiment, the high-pressure water-conducting optical fiber polishing device includes: an auxiliary water-conducting liquid supply system, a fiber laser processing head, and a spiral motion platform. Among them, the auxiliary water conduction liquid supply system is used to provide deionized water mixed with abrasives. The fiber laser processing head is used to receive deionized water mixed with abrasives and output high-pressure water-conducting optical fiber with abrasives. The spiral motion platform is used to drive the spiral motion of the fiber laser processing head to rotate and polish the fiber hole with a set fiber diameter in a spiral processing manner to improve polishing accuracy and effect.
附图说明Description of the drawings
图1为本发明实施例提供的一种光纤孔的加工方法的流程图；Figure 1 is a flow chart of an optical fiber hole processing method provided by an embodiment of the present invention;
图2为本发明实施例提供的一种改性后的玻璃基板的示意图；Figure 2 is a schematic diagram of a modified glass substrate provided by an embodiment of the present invention;
图3为本发明实施例提供的一种腐蚀容器和交流电场驱动装置的结构示意图；Figure 3 is a schematic structural diagram of a corrosion container and an AC electric field driving device provided by an embodiment of the present invention;
图4为本发明实施例提供的一种高压水导光纤抛光装置的结构示意图。Figure 4 is a schematic structural diagram of a high-pressure water-conducting optical fiber polishing device provided by an embodiment of the present invention.
附图标记：Reference signs:
10-玻璃基板11-改性区12-光纤孔10-Glass substrate 11-Modification area 12-Optical fiber hole
21-腐蚀容器22-交流电场驱动装置23-内部回流装置21-Corrosion container 22-AC electric field driving device 23-Internal return device
31-辅助水导液提供系统32-光纤激光加工头33-螺旋运动平台31-Auxiliary water conduction liquid supply system 32-Fiber laser processing head 33-Spiral motion platform
具体实施方式Detailed ways
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments These are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.
为了方便理解本发明实施例提供的光纤孔的加工方法，下面首先说明一下本发明实施例提供的加工方法的应用场景，该加工方法应用于光纤孔的加工过程中，其中的光纤孔为MT插芯中的光纤孔，MT插芯应用于MPO连接器中。下面结合附图对该光纤孔的加工方法进行详细的叙述。In order to facilitate understanding of the processing method of the optical fiber hole provided by the embodiment of the present invention, the application scenarios of the processing method provided by the embodiment of the present invention are first explained below. The processing method is applied in the processing of the optical fiber hole, in which the optical fiber hole is an MT insert. The fiber hole in the core, MT ferrule is used in MPO connectors. The processing method of the optical fiber hole will be described in detail below with reference to the accompanying drawings.
参考图1~图4，本发明实施例提供的光纤孔的加工方法包括：Referring to Figures 1 to 4, the optical fiber hole processing method provided by the embodiment of the present invention includes:
Step10：提供一玻璃基板10，玻璃基板10具有相对的第一端面和第二端面；玻璃基板10内形成有至少一个改性区11，每个改性区11均经激光分层加工改性而成，且每个改性区11均贯穿第一端面和第二端面；Step10: Provide a glass substrate 10. The glass substrate 10 has a first end face and a second end face that are opposite to each other; at least one modified region 11 is formed in the glass substrate 10, and each modified region 11 is modified by laser layering processing. into, and each modification zone 11 runs through the first end face and the second end face;
Step20：将玻璃基板10放入带有磁性粉末的氢氟酸溶液中；Step20: Place the glass substrate 10 into the hydrofluoric acid solution containing magnetic powder;
Step30：在承载有磁性粉末的氢氟酸溶液的周围外加交流磁场，驱动氢氟酸溶液流动，选择性腐蚀掉每个改性区11中的材料，以在玻璃基板10内形成至少一个光纤孔12；Step 30: Apply an AC magnetic field around the hydrofluoric acid solution carrying magnetic powder, drive the hydrofluoric acid solution to flow, and selectively etch away the material in each modification zone 11 to form at least one optical fiber hole in the glass substrate 10 12;
Step40：采用带有磨料的高压水导光纤对每个光纤孔12的孔壁进行旋转抛光。Step 40: Use high-pressure water-conducting optical fiber with abrasives to rotate and polish the hole wall of each optical fiber hole 12.
在上述的方案中，通过在氢氟酸溶液中加入磁性粉末，在将改性完成的玻璃基板10放入到带有磁性粉末的氢氟酸溶液中之后，在承载有磁性粉末的氢氟酸溶液的周围外加交流磁场，驱动氢氟酸溶液流动，选择性腐蚀掉每个改性区11中的材料，从而能够加快改性区11腐蚀成型的速率，快速腐蚀去除改性区11的材料，改善由于腐蚀时间过长而各向同性对光纤孔12孔壁的凸凹不平的影响程度。之后，还采用带有磨料的高压水导光纤对每个光纤孔12的孔壁进行旋转抛光，不仅能够提高光纤孔12孔壁的平整均匀度，减少后续光在波导内传播受到影响，而且还提高抛光效果及效率。下面结合附图对上述各个步骤进行详细的介绍。In the above scheme, by adding magnetic powder to the hydrofluoric acid solution, after placing the modified glass substrate 10 into the hydrofluoric acid solution carrying the magnetic powder, the hydrofluoric acid carrying the magnetic powder is An AC magnetic field is applied around the solution to drive the hydrofluoric acid solution to flow and selectively etch away the material in each modified zone 11, thereby speeding up the corrosion forming rate of the modified zone 11 and quickly etching and removing the material in the modified zone 11. Improve the degree of isotropic influence on the unevenness of the hole wall of fiber hole 12 due to too long corrosion time. After that, high-pressure water-conducting optical fibers with abrasives are used to rotate and polish the hole walls of each fiber hole 12, which not only improves the flatness and uniformity of the walls of the fiber holes 12 and reduces the impact on subsequent light propagation in the waveguide, but also Improve polishing effect and efficiency. Each of the above steps will be introduced in detail below with reference to the accompanying drawings.
首先，参考图1及图2，提供一玻璃基板10，玻璃基板10具有相对的第一端面和第二端面；玻璃基板10内形成有至少一个改性区11，每个改性区11均经激光分层加工改性而成，且每个改性区11均贯穿第一端面和第二端面。当然，改性区11的个数具体与MT插芯所支持的光纤芯数有关，在MR插芯支持多个光纤芯数时，需要在MT插芯中形成多个光纤孔12，则需要在玻璃基板10上形成多个改性区11。多个光纤孔12可以呈阵列排列的方式排列在MT插芯上。First, with reference to Figures 1 and 2, a glass substrate 10 is provided. The glass substrate 10 has an opposite first end surface and a second end surface; at least one modification zone 11 is formed in the glass substrate 10, and each modification zone 11 is It is modified by laser layering processing, and each modified area 11 runs through the first end surface and the second end surface. Of course, the number of modified areas 11 is specifically related to the number of fiber cores supported by the MT ferrule. When the MR ferrule supports multiple fiber core numbers, multiple fiber holes 12 need to be formed in the MT ferrule. A plurality of modified regions 11 are formed on the glass substrate 10 . The plurality of optical fiber holes 12 may be arranged in an array on the MT ferrule.
接下来，如图1及图3所示，将玻璃基板10放入带有磁性粉末的氢氟酸溶液中。氢氟酸溶液的质量浓度可以为30-50％之间，具体的，氢氟酸溶液的质量浓度可以为30%、35%、40%、45%、50%等介于30-50％之间的任意值，以提高选择性腐蚀的效率。其中的磁性粉末的粒度可以在200目-600目之间，具体的，磁性粉末的粒度可以在200目、300目、400目、500目、600目等介于200目-600目之间的任意值，以提高驱动氢氟酸溶液流动的效果。Next, as shown in FIGS. 1 and 3 , the glass substrate 10 is placed in a hydrofluoric acid solution containing magnetic powder. The mass concentration of the hydrofluoric acid solution can be between 30-50%. Specifically, the mass concentration of the hydrofluoric acid solution can be between 30%, 35%, 40%, 45%, 50%, etc., between 30-50%. Any value between to improve the efficiency of selective corrosion. The particle size of the magnetic powder can be between 200 mesh and 600 mesh. Specifically, the particle size of the magnetic powder can be between 200 mesh, 300 mesh, 400 mesh, 500 mesh, 600 mesh, etc., between 200 mesh and 600 mesh. Any value to improve the effectiveness of driving hydrofluoric acid solution flow.
接下来，继续参考图1及图3，在承载有磁性粉末的氢氟酸溶液的周围外加交流磁场，驱动氢氟酸溶液流动，选择性腐蚀掉每个改性区11中的材料，以在玻璃基板10内形成至少一个光纤孔12。具体的，可以在承载有磁性粉末的氢氟酸溶液的底部外加交流磁场，驱动氢氟酸溶液流动，选择性腐蚀掉每个改性区11中的材料，以在玻璃基板10内形成至少一个光纤孔12。提高驱动氢氟酸溶液流动的效果。应当理解的是，交流磁场的施加方式并不限于上述示出的在氢氟酸溶液底部的方式，除此之外，还可以采用其他的方式。上述的方式中，通过在氢氟酸溶液中加入磁性粉末，在将改性完成的玻璃基板10放入到带有磁性粉末的氢氟酸溶液中之后，在承载有磁性粉末的氢氟酸溶液的周围外加交流磁场，驱动氢氟酸溶液流动，选择性腐蚀掉每个改性区11中的材料，从而能够加快改性区11腐蚀成型的速率，快速腐蚀去除改性区11的材料，改善由于腐蚀时间过长而各向同性对光纤孔12孔壁的凸凹不平的影响程度。Next, continue to refer to Figures 1 and 3, and an AC magnetic field is applied around the hydrofluoric acid solution carrying magnetic powder to drive the hydrofluoric acid solution to flow and selectively etch away the material in each modification zone 11, so as to At least one optical fiber hole 12 is formed in the glass substrate 10 . Specifically, an AC magnetic field can be applied to the bottom of the hydrofluoric acid solution carrying magnetic powder to drive the hydrofluoric acid solution to flow and selectively etch away the material in each modification zone 11 to form at least one in the glass substrate 10 Fiber optic hole 12. Improve the effect of driving the flow of hydrofluoric acid solution. It should be understood that the application method of the alternating magnetic field is not limited to the method shown above at the bottom of the hydrofluoric acid solution. In addition, other methods can also be used. In the above method, magnetic powder is added to the hydrofluoric acid solution, and after the modified glass substrate 10 is placed into the hydrofluoric acid solution carrying the magnetic powder, the hydrofluoric acid solution carrying the magnetic powder is An AC magnetic field is applied around to drive the hydrofluoric acid solution to flow and selectively etch away the material in each modified zone 11, thereby speeding up the corrosion forming rate of the modified zone 11, quickly etching and removing the material in the modified zone 11, and improving The extent of the impact of isotropy on the unevenness of the hole wall of the optical fiber hole 12 due to too long corrosion time.
接下来，参考图1及图4，采用带有磨料的高压水导光纤对每个光纤孔12的孔壁进行旋转抛光。其中，高压水导光纤的水径可以小于20um，且高压水导光纤的辅助水导液为掺有磨料的去离子水，提高抛光的精度。Next, referring to Figures 1 and 4, a high-pressure water-conducting optical fiber with abrasives is used to rotate and polish the hole wall of each optical fiber hole 12. Among them, the water diameter of the high-pressure water-conducting optical fiber can be less than 20um, and the auxiliary water-conducting liquid of the high-pressure water-conducting optical fiber is deionized water mixed with abrasives to improve the precision of polishing.
另外，参考图4，采用带有磨料的高压水导光纤对每个光纤孔12的孔壁进行旋转抛光时，可以通过控制承载光纤激光头的螺旋运动平台33，采用螺旋加工的方式，对设定纤径的光纤孔12进行旋转抛光，提高抛光效果。其中的设定纤径可以为30um-300um，具体的，设定纤径可以为30um、50um、70um、80um、100um、130um、150um、170um、180um、200um、230um、250um、270um、280um、300um等介于30um-300um之间的任意值，使加工出的光纤孔12能够更细，提高精度及应用场景的适应性。通过采用带有磨料的高压水导光纤对每个光纤孔12的孔壁进行旋转抛光，不仅能够提高光纤孔12孔壁的平整均匀度，减少后续光在波导内传播受到影响，而且还提高抛光效果及效率。In addition, referring to Figure 4, when using high-pressure water-conducting optical fiber with abrasives to rotate and polish the hole wall of each optical fiber hole 12, the device can be processed by spiral processing by controlling the spiral motion platform 33 carrying the fiber laser head. The fiber hole 12 with a fixed fiber diameter is rotated and polished to improve the polishing effect. The set fiber diameter can be 30um-300um. Specifically, the set fiber diameter can be 30um, 50um, 70um, 80um, 100um, 130um, 150um, 170um, 180um, 200um, 230um, 250um, 270um, 280um, 300um Any value between 30um and 300um enables the processed optical fiber hole 12 to be thinner, improving accuracy and adaptability to application scenarios. By using a high-pressure water-conducting optical fiber with abrasives to rotate and polish the hole wall of each fiber hole 12, it can not only improve the flatness and uniformity of the hole wall of the fiber hole 12, reduce the impact on subsequent light propagation in the waveguide, but also improve polishing. Effectiveness and efficiency.
在上述示出的各种实施方式中，通过在氢氟酸溶液中加入磁性粉末，在将改性完成的玻璃基板10放入到带有磁性粉末的氢氟酸溶液中之后，在承载有磁性粉末的氢氟酸溶液的周围外加交流磁场，驱动氢氟酸溶液流动，选择性腐蚀掉每个改性区11中的材料，从而能够加快改性区11腐蚀成型的速率，快速腐蚀去除改性区11的材料，改善由于腐蚀时间过长而各向同性对光纤孔12孔壁的凸凹不平的影响程度。之后，还采用带有磨料的高压水导光纤对每个光纤孔12的孔壁进行旋转抛光，不仅能够提高光纤孔12孔壁的平整均匀度，减少后续光在波导内传播受到影响，而且还提高抛光效果及效率。In the various embodiments shown above, by adding magnetic powder to the hydrofluoric acid solution, after the modified glass substrate 10 is placed into the hydrofluoric acid solution containing the magnetic powder, it is loaded with magnetic An AC magnetic field is applied around the powdered hydrofluoric acid solution to drive the flow of the hydrofluoric acid solution and selectively corrode the material in each modification zone 11, thereby speeding up the corrosion forming rate of the modification zone 11 and quickly etching away modifications. The material in zone 11 improves the isotropic influence on the unevenness of the hole wall of the optical fiber hole 12 due to too long corrosion time. Afterwards, a high-pressure water-conducting optical fiber with abrasives is used to rotate and polish the hole wall of each fiber hole 12, which can not only improve the flatness and uniformity of the fiber hole 12 wall and reduce the impact on subsequent light propagation in the waveguide, but also Improve polishing effect and efficiency.
另外，本发明实施例还提供了一种光纤孔的加工设备，参考图1~图4，该光纤孔12为MT插芯中的光纤孔12， MT插芯应用于MPO连接器中。该光纤孔的加工设备基于上述任意一种光纤孔的加工方法，该光纤孔的加工设备包括：腐蚀容器21、交流电场驱动装置22、和高压水导光纤抛光装置。其中，腐蚀容器21用于盛放带有磁性粉末的氢氟酸溶液，还用于盛放玻璃基板10。交流电场驱动装置22用于在承载有磁性粉末的氢氟酸溶液的周围外加交流磁场，驱动氢氟酸溶液流动，选择性腐蚀掉每个改性区11中的材料，以在玻璃基板10内形成至少一个光纤孔12。高压水导光纤抛光装置用于采用带有磨料的高压水导光纤对每个光纤孔12的孔壁进行旋转抛光。In addition, embodiments of the present invention also provide a fiber hole processing equipment. Referring to Figures 1 to 4, the fiber hole 12 is the fiber hole 12 in the MT ferrule, and the MT ferrule is used in MPO connectors. The optical fiber hole processing equipment is based on any of the above optical fiber hole processing methods. The optical fiber hole processing equipment includes: an etching container 21, an AC electric field driving device 22, and a high-pressure water conductive optical fiber polishing device. Among them, the etching container 21 is used to hold the hydrofluoric acid solution containing magnetic powder, and is also used to hold the glass substrate 10 . The AC electric field driving device 22 is used to apply an AC magnetic field around the hydrofluoric acid solution carrying the magnetic powder, drive the hydrofluoric acid solution to flow, and selectively etch away the material in each modification zone 11 so as to remove the material in the glass substrate 10 At least one optical fiber hole 12 is formed. The high-pressure water-conducting optical fiber polishing device is used to rotate and polish the hole wall of each optical fiber hole 12 using high-pressure water-conducting optical fiber with abrasives.
在上述的方案中，通过在氢氟酸溶液中加入磁性粉末，在将改性完成的玻璃基板10放入到带有磁性粉末的氢氟酸溶液中之后，在承载有磁性粉末的氢氟酸溶液的周围外加交流磁场，驱动氢氟酸溶液流动，选择性腐蚀掉每个改性区11中的材料，从而能够加快改性区11腐蚀成型的速率，快速腐蚀去除改性区11的材料，改善由于腐蚀时间过长而各向同性对光纤孔12孔壁的凸凹不平的影响程度。之后，还采用带有磨料的高压水导光纤对每个光纤孔12的孔壁进行旋转抛光，不仅能够提高光纤孔12孔壁的平整均匀度，减少后续光在波导内传播受到影响，而且还提高抛光效果及效率。In the above scheme, by adding magnetic powder to the hydrofluoric acid solution, after placing the modified glass substrate 10 into the hydrofluoric acid solution carrying the magnetic powder, the hydrofluoric acid carrying the magnetic powder is An AC magnetic field is applied around the solution to drive the hydrofluoric acid solution to flow and selectively etch away the material in each modified zone 11, thereby speeding up the corrosion forming rate of the modified zone 11 and quickly etching and removing the material in the modified zone 11. Improve the degree of isotropic influence on the unevenness of the hole wall of fiber hole 12 due to too long corrosion time. Afterwards, a high-pressure water-conducting optical fiber with abrasives is used to rotate and polish the hole wall of each fiber hole 12, which can not only improve the flatness and uniformity of the fiber hole 12 wall and reduce the impact on subsequent light propagation in the waveguide, but also Improve polishing effect and efficiency.
参考图3，在放置腐蚀容器21和交流电场驱动装置22时，腐蚀容器21可以位于交流电场驱动装置22的上方，从而使交流电场驱动装置22能够在氢氟酸溶液的周围外加交流磁场，从氢氟酸溶液的底部驱动氢氟酸溶液流动。提高驱动氢氟酸溶液流动的效果。应当理解的是，腐蚀容器21并不限于采用图3示出的放置在交流电场驱动装置22的上方的方式，除此之外，还可以采用其他的放置方式。另外，参考图3，还可以在腐蚀容器21内部增加设置内部回流装置23，来引导氢氟酸溶液在腐蚀容器21内动态的回流，提高腐蚀效果。Referring to Figure 3, when placing the corrosion container 21 and the AC electric field driving device 22, the corrosion container 21 can be located above the AC electric field driving device 22, so that the AC electric field driving device 22 can apply an AC magnetic field around the hydrofluoric acid solution. The bottom of the hydrofluoric acid solution drives the flow of the hydrofluoric acid solution. Improve the effect of driving the flow of hydrofluoric acid solution. It should be understood that the corrosion container 21 is not limited to being placed above the AC electric field driving device 22 as shown in FIG. 3 . In addition, other placement methods can also be used. In addition, referring to FIG. 3 , an internal reflux device 23 can also be added inside the corrosion container 21 to guide the dynamic backflow of the hydrofluoric acid solution in the corrosion container 21 to improve the corrosion effect.
在设置高压水导光纤抛光装置时，如图4所示，高压水导光纤抛光装置可以包括：辅助水导液提供系统31、光纤激光加工头32、螺旋运动平台33。其中，辅助水导液提供系统31用于提供掺有磨料的去离子水。光纤激光加工头32用于接收掺有磨料的去离子水，并输出带有磨料的高压水导光纤。螺旋运动平台33用于带动光纤激光加工头32螺旋运动，以采用螺旋加工的方式，对设定纤径的光纤孔12进行旋转抛光，提高抛光精度和效果。When setting up a high-pressure water-conducting optical fiber polishing device, as shown in Figure 4, the high-pressure water-conducting optical fiber polishing device may include: an auxiliary water-conducting liquid supply system 31, a fiber laser processing head 32, and a spiral motion platform 33. Among them, the auxiliary water conduction liquid supply system 31 is used to provide deionized water mixed with abrasives. The fiber laser processing head 32 is used to receive deionized water mixed with abrasives and output high-pressure water-conducting optical fiber with abrasives. The spiral motion platform 33 is used to drive the fiber laser processing head 32 to spirally move to rotate and polish the optical fiber hole 12 with a set fiber diameter in a spiral processing manner to improve polishing accuracy and effect.
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应该以权利要求的保护范围为准。The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present invention. All are covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.
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| CN109773662A (en) * | 2019-02-21 | 2019-05-21 | 上海理工大学 | Using the inner hole of workpiece burnishing device of abrasive water-jet |
| CN110405354A (en) * | 2019-07-24 | 2019-11-05 | 西安交通大学 | Femtosecond laser processing method for fiber optic lens |
| CN110531468A (en) * | 2019-09-06 | 2019-12-03 | 安徽光纤光缆传输技术研究所(中国电子科技集团公司第八研究所) | A kind of forming method of fiber stub, fiber stub docking facilities and fiber stub |
| CN110653667A (en) * | 2019-10-28 | 2020-01-07 | 河南工业大学 | Laser-induced cavitation auxiliary liquid jet polishing device and nozzle for jet polishing |
| CN113770816A (en) * | 2021-09-09 | 2021-12-10 | 广东工业大学 | A kind of magnetorheological elastomer and its preparation method and application |
| CN113953896A (en) * | 2021-10-29 | 2022-01-21 | 西北工业大学 | Planetary polishing method driven by mixing of magnetic nanoparticles and non-magnetic nanoparticles |
| CN114055257A (en) * | 2021-11-23 | 2022-02-18 | 大连理工大学 | A chemical mechanical polishing equipment for complex curved surfaces with controlled magnetic field |
| CN114815066A (en) * | 2022-03-18 | 2022-07-29 | 中山市精量光电子科技有限公司 | Technology for preparing optical fiber end face micro-lens array based on femtosecond laser assisted wet etching |
| CN114656158A (en) * | 2022-04-26 | 2022-06-24 | 翔实光电科技(昆山)有限公司 | Device, method and transfer device for polishing AG glass |
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