CN114055257A - Controlled magnetic field complex curved surface chemical mechanical polishing device - Google Patents

Controlled magnetic field complex curved surface chemical mechanical polishing device Download PDF

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Publication number
CN114055257A
CN114055257A CN202111396877.3A CN202111396877A CN114055257A CN 114055257 A CN114055257 A CN 114055257A CN 202111396877 A CN202111396877 A CN 202111396877A CN 114055257 A CN114055257 A CN 114055257A
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China
Prior art keywords
polishing
electromagnetic
spindle
magnetic field
curved surface
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CN202111396877.3A
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CN114055257B (en
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张振宇
李玉彪
任政
赵枢明
孟凡宁
徐光宏
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Dalian University of Technology
China Weapon Science Academy Ningbo Branch
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Dalian University of Technology
China Weapon Science Academy Ningbo Branch
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/005Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B31/00Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
    • B24B31/10Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
    • B24B31/102Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work using an alternating magnetic field
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B31/00Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
    • B24B31/12Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention provides a controlled magnetic field complex curved surface chemical mechanical polishing device which comprises a spindle system, a magnetic field system, a polishing groove and a numerical control system. During polishing, chemical polishing liquid and magnetic grinding materials are filled in the polishing groove, an electromagnetic field inside the polishing groove can be controlled by accurately controlling the power supply form of the electromagnetic coil in the polishing process, the motion trail and the motion form of the magnetic grinding materials in the polishing groove are further controlled, the change of the rotating speed and the deflection angle of the main shaft and the axial ultrasonic vibration effect of the main shaft are combined, the magnetic grinding materials can reach any surface of the curved surface part, a softening film formed by the chemical polishing liquid on the surface of the complex curved surface part can be removed by strong uniform mechanical grinding acting force, the equipment can be suitable for polishing complex curved surface parts of different types and different materials, the universality is strong, the surface consistency of the polished complex curved surface part is good, and the surface quality is high.

Description

Controlled magnetic field complex curved surface chemical mechanical polishing device
Technical Field
The invention relates to the technical field of machining equipment, in particular to controlled magnetic field complex curved surface chemical mechanical polishing equipment.
Background
The complex curved surface part is usually milled by adopting five-axis linkage, or manufactured by adopting a material increasing and decreasing manufacturing process. The surface roughness Ra of the machined surface is more than or equal to 3.2um after ordinary five-axis linkage milling, and the surface roughness Ra of the machined surface is more than or equal to 8um after material addition and subtraction manufacturing. Therefore, under the condition of the prior art, in order to further improve the surface quality of the complex curved surface part, further processing is required to be carried out by a grinding machine and polishing equipment so as to meet the service requirement. The existing polishing modes, such as soft abrasive belt polishing, magnetorheological abrasive flow polishing, robot polishing and other traditional mechanical polishing methods, have the polishing mode of removing materials by stress, processing knife lines are inevitably left in the polishing process, damage sources are generated, the residual damage layer is thick after processing, the processing efficiency is low, and the level of chemical mechanical polishing cannot be reached.
The chemical mechanical polishing process is widely applied to plane polishing, and the process flow can be simply summarized as adopting a chemical reagent to corrode or oxidize a workpiece to form a layer of uniform softening film on the surface of the workpiece, then removing the softening film on the surface of the workpiece through an abrasive and a polishing pad under the action of normal pressure, and realizing surface planarization in the chemical film forming and mechanical film removing processes which are continuously and alternately carried out. Chemical mechanical polishing is currently the most effective method for achieving global planarization and is widely used in integrated circuit manufacturing. But the chemical mechanical polishing applied to the complex curved surface part is difficult to realize at present, and the main reasons are that the uniform mechanical acting force is difficult to apply on the complex curved surface, and the softening film on the surface of the complex curved surface workpiece is difficult to remove through the uniform mechanical acting force. Therefore, designing equipment capable of applying uniform mechanical force on the surface has great significance for chemical mechanical polishing of complex curved surfaces.
Disclosure of Invention
According to the technical problems provided by the invention, the chemical mechanical polishing equipment for the complex curved surface with the controlled magnetic field is provided, and the chemical mechanical polishing of any curved surface can be realized. The problems that the surface roughness of the complex curved surface is high after the existing five-axis linkage milling processing and material increase and decrease manufacturing, the polishing precision of the existing complex curved surface is low, and the damage layer thickness is thick after polishing are solved.
As shown in fig. 1, the invention discloses controlled magnetic field complex curved surface chemical mechanical polishing equipment, which comprises a spindle system, a magnetic field system, a polishing tank and a numerical control system, wherein the spindle system comprises a movable spindle and a clamp connected to the spindle, the clamp is used for clamping a piece to be polished, the spindle is used for adjusting the spatial posture of the clamp to enable the piece to be polished to enter a preset position of the polishing tank, chemical polishing liquid and magnetic abrasive are contained in the polishing tank, the magnetic field system is arranged outside the polishing tank, and the numerical control system is connected with the spindle system and the magnetic field system and is used for controlling the movement track and movement form of the magnetic abrasive in the polishing tank by controlling an electromagnetic field in the polishing tank, so that the polishing of the piece to be polished is completed.
Further, the spindle system comprises a clamp, an ultrasonic transducer, a spindle, a deflection box and a spindle box installed on the machine body. The ultrasonic vibration testing fixture comprises a main shaft box, a deflection box, an ultrasonic transducer, a fixture and a base, wherein the main shaft box is arranged on a lathe bed through a slide rail and provides Z-direction translational freedom degree for a main shaft, the main shaft box is arranged on the deflection box, the deflection box can rotate around a Y axis by taking the main shaft box as a circle center and provides Y-axis rotational freedom degree for the main shaft, the main shaft is arranged on the deflection box and has Z-axis rotational freedom degree, the ultrasonic transducer is arranged on the main shaft and is used for providing Z-direction ultrasonic vibration for the main shaft, the fixture is arranged at the bottom of the main shaft through a quick connector and is resistant to acid and alkali corrosion.
Furthermore, the polishing groove is of a cubic structure with an open top, a discharge port is arranged below the polishing groove, chemical polishing liquid and magnetic abrasive materials are contained in the polishing groove during polishing, and the polishing groove is made of non-magnetic acid-base corrosion resistant materials.
Further, the magnetic field system comprises a soft iron core, a plurality of electromagnetic coils wound in multiple directions and a power-adjustable direct-current power supply, wherein the soft iron core is of a cubic thin-wall structure with the top and the bottom open, is detachably embedded in the outer wall of the polishing groove, is made of soft iron and is used for enhancing the magnetic field generated by the electromagnetic coils.
Further, the electromagnetic coil comprises a (001) electromagnetic coil, a (-101) electromagnetic coil and a (101) electromagnetic coil, wherein the (001) electromagnetic coil is an electromagnetic annular coil, the installation direction is a (0,0,1) direction, the electromagnetic coil is used for generating an electromagnetic field in a (0,0,1) direction or a (0,0, -1) direction inside the polishing groove when electrified, the (-101) electromagnetic coil is an electromagnetic annular coil, the installation direction is a (-1,0,1) direction, the electromagnetic coil is nested and enveloped in a (001) direction to the outer wall of the electromagnetic coil in sequence in a (-1,0,1) direction, the external dimension is determined according to the section of the (-1,0,1) direction at the installation position, the electromagnetic coil is used for generating an electromagnetic field in a (-1,0,1) direction or a (1,0, -1) direction inside the polishing groove when electrified, the (101) directional electromagnetic coil is an electromagnetic annular coil, the installation direction is the (1,0,1) direction, the (1,0,1) direction is sequentially nested on the outer wall of the (-101) directional electromagnetic coil, the external dimension depends on the section of the (1,0,1) direction at the installation position, and the (101) directional electromagnetic coil is used for generating an electromagnetic field in the (1,0,1) direction or the (-1,0, -1) direction in the polishing groove when the (1,0,1) directional electromagnetic field is electrified.
Furthermore, the (001) electromagnetic coil, (-101) electromagnetic coil, and (101) electromagnetic coils in all directions are independently powered, and the electromagnetic coils in the same direction are also independently powered, so that in the polishing process, direct currents with different voltages, different currents and different directions are supplied to the electromagnetic coils, electromagnetic fields with different intensities and different directions are generated in different areas in the polishing groove, magnetic abrasive is pushed to move in the polishing groove through magnetic field force, the movement track of the magnetic abrasive is completely changed by the change of the electromagnetic field, and the change of the electromagnetic field is attributed to the power supply form of the electromagnetic coils. Therefore, the electromagnetic field in the polishing groove can be controlled by accurately controlling the power supply form of the electromagnetic coil, the movement of the magnetic grinding materials is further controlled to achieve the expected polishing effect, and the magnetic grinding materials with different particle sizes and different shapes can be replaced according to the actual processing requirement in the polishing process, so that the optimal polishing effect is achieved. When all the electromagnetic coils are powered off, the magnetic field in the polishing groove disappears, and the magnetic abrasive can be easily discharged through the discharge port.
Furthermore, the power-adjustable direct current power supply is arranged on the lathe bed and used for independently supplying direct current to all the electromagnetic coils.
Furthermore, the numerical control system integrally controls the Z-direction translational motion of the spindle box, the deflection direction and the deflection angle of the deflection box around the Y axis, the rotation direction and the rotation speed of the spindle, the vibration frequency and the vibration amplitude generated by the ultrasonic transducer, and the power supply form of the power-adjustable direct-current power supply.
The invention has the following advantages:
the invention provides a controlled magnetic field complex curved surface chemical mechanical polishing device which can realize the chemical mechanical polishing of complex curved surface parts through multi-degree-of-freedom linkage operation and solve the problem that the surface precision of the current complex curved surface parts is difficult to improve after the complex curved surface parts are polished only by a traditional polishing mode of removing materials through stress. The electromagnetic field inside the polishing groove can be controlled through accurately controlling the power supply form of the electromagnetic coil in the polishing process, the motion trail and the motion form of magnetic grinding materials in the polishing groove are further controlled, the change of the rotating speed and the deflection angle of the main shaft and the axial ultrasonic vibration effect of the main shaft are combined, the magnetic grinding materials can reach any surface of a curved surface part, a softening film formed by chemical polishing liquid on the surface of the complex curved surface part can be removed through strong uniform mechanical grinding acting force, the equipment can be suitable for polishing complex curved surface parts of different types and different materials, the universality is strong, the surface consistency of the complex curved surface part after polishing is good, and the surface quality is high.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic diagram of a three-dimensional assembly structure of the device in the embodiment of the present invention.
FIG. 2 is a schematic view of the installation of the polishing trough, soft iron core and electromagnetic coil.
In the figure: 1. a power adjustable DC power supply; 2. a bed body; 3. a deflection box; 4. a main shaft; 5. a main spindle box; 6. an ultrasonic transducer; 7. a clamp; 8. a numerical control system; 9. a polishing tank; 10. a soft iron core; 11. (001) a solenoid; 12. a polishing tank support; 13. -101 towards the solenoid; 14. a discharge outlet; 15. (101) towards the electromagnetic coil.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, the embodiment of the invention discloses a controlled magnetic field chemical mechanical polishing device for a complex curved surface, which comprises a spindle system, a polishing tank, a magnetic field system and a numerical control system, wherein the device is of a vertical structure and can realize chemical mechanical polishing of the complex curved surface. The main shaft system comprises a movable main shaft and a clamp connected to the main shaft, the clamp is used for clamping a piece to be polished, the main shaft is used for adjusting the space pose of the clamp, the piece to be polished enters a preset position of a polishing groove, chemical polishing liquid and magnetic abrasive are contained in the polishing groove, the magnetic field system is arranged outside the polishing groove, and the numerical control system is connected with the main shaft system and the magnetic field system and is used for controlling the motion trail and the motion form of the magnetic abrasive in the polishing groove by controlling an electromagnetic field in the polishing groove, so that the polishing of the piece to be polished is completed.
Specifically, the spindle system of the present invention includes a jig 7, an ultrasonic transducer 6, a spindle 4, a deflection yoke 3, and a headstock 5 mounted on a bed 2. The ultrasonic vibration machining device is characterized in that the spindle box 5 is mounted on the machine tool body 2 through a slide rail, the slide rail is arranged along the Z direction, so that the spindle box 5 can move in a translational mode along the Z axis to provide translational freedom degree in the Z direction for the spindle 4, the deflection box 3 is mounted with the spindle box 4, the deflection box 3 can rotate +/-60 degrees around the Y axis by taking the spindle box 5 as a circle center to provide rotational freedom degree of the Y axis for the spindle 4, the spindle 4 is mounted on the deflection box 3, can rotate forwards and backwards and has rotational freedom degree of the Z axis, the ultrasonic transducer 6 is mounted on the spindle 4 to provide ultrasonic vibration in the Z direction for the spindle 4, the clamp 7 is mounted at the bottom of the spindle 4 through a quick connector and used for clamping workpieces, and the clamp 7 is resistant to acid and alkali corrosion.
The polishing groove 9 is of a cubic structure with an open top, the polishing groove support 12 is arranged on the periphery of the bottom of the polishing groove and is installed on the lathe bed 2, the discharge outlet 14 for discharging polishing liquid or magnetic abrasive is formed in the bottom of the polishing groove, and the polishing groove is made of nonmagnetic acid-base corrosion-resistant material.
The magnetic field system comprises a soft iron core 10, a (001) directional electromagnetic coil 11, a (-101) directional electromagnetic coil 13, a (101) directional electromagnetic coil 15 and a power-adjustable direct-current power supply 1, wherein the soft iron core 10 is of a cubic thin-wall structure with open top and bottom, is embedded in the outer wall of the polishing groove 9 and is detachable, is made of soft iron materials, is used for enhancing the magnetic field generated by the electromagnetic coil, and can be used for installing or detaching the soft iron core 10 according to the processing requirement. The (001) electromagnetic coil 11 is an electromagnetic toroidal coil, the installation direction is (0,0,1) direction, the electromagnetic coil is used for generating an electromagnetic field in the (0,0,1) direction or the (0,0, -1) direction inside the polishing groove 9 when electrified, the (-101) electromagnetic coil 13 is also an electromagnetic toroidal coil, the installation direction is (-1,0,1) direction, the electromagnetic coil is nested and enveloped in the (001) direction to the outer wall of the electromagnetic coil 11 in the (-1,0,1) direction in sequence, the external dimension is determined according to the section of the (-1,0,1) direction at the installation position, the electromagnetic coil is used for generating an electromagnetic field in the (-1,0,1) direction or the (1,0, -1) direction inside the polishing groove 9 when electrified, the (101) electromagnetic coil 15 is also an electromagnetic toroidal coil, and the installation direction is the (1,0,1) direction, the electromagnetic coil 13 is sequentially nested in the (1,0,1) direction on the outer wall of the (-101) electromagnetic coil 13, the external dimension is determined by the section of the (1,0,1) direction at the installation position, and the electromagnetic coil is used for generating an electromagnetic field in the (1,0,1) direction or the (-1,0, -1) direction inside the polishing groove 9 when electricity is supplied.
The (001) electromagnetic coils 11, (-101) electromagnetic coils 13, and (101) electromagnetic coils 15 are powered independently from each other in the directions of electromagnetic fields, and the electromagnetic coils in the same direction are powered independently from each other, so that in the polishing process, by supplying different voltages, different currents, and direct currents in different directions to the electromagnetic coils, electromagnetic fields with different intensities and different directions can be generated in different areas inside the polishing groove 9, and further, magnetic abrasive materials are pushed to move inside the polishing groove 9 by magnetic field force, the movement track of the magnetic abrasive materials is changed completely by the change of the electromagnetic field, and the change of the electromagnetic field is attributed to the power supply form of the electromagnetic coils. Therefore, the electromagnetic field inside the polishing groove 9 can be controlled by accurately controlling the power supply form of the electromagnetic coil, so that the movement of the magnetic grinding materials is controlled to achieve the expected polishing effect, and the magnetic grinding materials with different particle sizes and different shapes can be replaced according to the actual processing requirement in the polishing process, so that the optimal polishing effect can be achieved. When all the electromagnetic coils are powered off, the magnetic field in the polishing groove 9 disappears, and the magnetic abrasive can be discharged through the discharge port easily.
As shown in fig. 2, the adjustable power dc power supply 1 is installed in the bed 2 to independently supply dc power to the electromagnetic coils 11, (001), (101) and (15).
The numerical control system 8 integrally controls the Z-direction translational motion of the main spindle box 5, the deflection direction and the deflection angle of the deflection box 3 around the Y axis, the rotation direction and the rotation speed of the main spindle 4, the vibration frequency and the vibration amplitude generated by the ultrasonic transducer 6, and the current, the voltage, the electrifying time and the current direction of each (001) electromagnetic coil 11, the (-101) electromagnetic coil 13 and the (101) electromagnetic coil 15.
In the polishing process, an electromagnetic field inside the polishing groove can be controlled by accurately controlling the power supply form of the electromagnetic coil, so that the motion trail and the motion form of the magnetic grinding materials in the polishing groove are controlled, the magnetic grinding materials can reach any surface of the curved surface part by combining the change of the rotating speed and the deflection angle of the main shaft and the axial ultrasonic vibration effect of the main shaft, and a softening film formed by chemical polishing liquid on the surface of the complex curved surface part can be removed by strong uniform mechanical grinding acting force.
The bed body is also provided with an opening and closing door which is closed in operation, and the surfaces of the bed body and the internal mechanism which can be splashed by the polishing liquid in the drum are coated with hydrophobic, oleophobic and corrosion-resistant coatings or are provided with a shade.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (8)

1. The controlled magnetic field complex curved surface chemical mechanical polishing device is characterized by comprising a spindle system, a magnetic field system, a polishing groove and a numerical control system, wherein the spindle system comprises a movable spindle and a clamp connected to the spindle, the clamp is used for clamping a piece to be polished, the spindle is used for adjusting the space pose of the clamp to enable the piece to be polished to enter a preset position of the polishing groove, chemical polishing liquid and magnetic abrasive are contained in the polishing groove, the magnetic field system is arranged outside the polishing groove, and the numerical control system is connected with the spindle system and the magnetic field system and used for controlling the motion track and motion form of the magnetic abrasive in the polishing groove by controlling an electromagnetic field in the polishing groove to finish polishing of the piece to be polished.
2. The controlled magnetic field complex curved surface chemical mechanical polishing device of claim 1, wherein the spindle system comprises a fixture, an ultrasonic transducer, a spindle, a deflection box and a spindle box installed on the machine body, the spindle box is installed on the machine body through a slide rail and provides a Z-direction translational freedom degree for the spindle, the deflection box is provided with the spindle box, the deflection box can rotate around a Y axis with the spindle box as a center and provides a Y-axis rotational freedom degree for the spindle, the spindle is installed on the deflection box and has a Z-axis rotational freedom degree, the ultrasonic transducer is installed on the spindle and is used for providing Z-direction ultrasonic vibration for the spindle, the fixture is installed at the bottom of the spindle through a quick connector and is resistant to acid and alkali corrosion.
3. The controlled magnetic field complex curved surface chemical mechanical polishing device of claim 1, wherein the polishing trough is of a cubic structure with an open top, a discharge port is arranged below the polishing trough, chemical polishing liquid and magnetic abrasive materials are contained in the polishing trough during polishing, and the polishing trough is made of non-magnetic acid-base corrosion-resistant materials.
4. The controlled magnetic field complex curved surface chemical mechanical polishing device as claimed in claim 1, wherein the magnetic field system comprises a soft iron core, a plurality of electromagnetic coils wound in multiple directions and a power-adjustable direct current power supply, the soft iron core is of a cubic thin-wall structure with open top and bottom, is detachably nested on the outer wall of the polishing groove, and is made of soft iron materials and is used for enhancing the magnetic field generated by the electromagnetic coils.
5. The controlled magnetic field complex curved surface chemical mechanical polishing apparatus of claim 4, wherein the electromagnetic coils comprise a (001) directional electromagnetic coil, a (-101) directional electromagnetic coil and a (101) directional electromagnetic coil, the (001) directional electromagnetic coil is an electromagnetic toroidal coil, the installation direction is a (0,0,1) direction, which is used for generating an electromagnetic field in a (0,0,1) direction or a (0,0, -1) direction inside the polishing groove when being electrified, the (-101) directional electromagnetic coil is an electromagnetic toroidal coil, the installation direction is a (-1,0,1) direction, which is nested and enveloped in the (001) directional electromagnetic coil outer wall in a (-1,0,1) direction in sequence, the external dimension is determined according to the cross section of the (-1,0,1) direction at the installation position, which is used for generating a (-1, the electromagnetic field in the direction of 0,1) or (1,0, -1), the electromagnetic coil (101) is an electromagnetic annular coil, the installation direction is the direction of (1,0,1), the electromagnetic annular coil is sequentially nested in the direction of (1,0,1) on the outer wall of the electromagnetic coil (101), the external dimension is determined according to the section in the direction of (1,0,1) at the installation position, and the electromagnetic annular coil is used for generating the electromagnetic field in the direction of (1,0,1) or (1,0, -1) inside the polishing groove when the electromagnetic annular coil is electrified.
6. The controlled magnetic field complex curved surface chemical mechanical polishing equipment as claimed in claim 5, wherein the (001) direction electromagnetic coil, the (-101) direction electromagnetic coil, and the (101) direction electromagnetic coils are independently powered, and the electromagnetic coils in the same direction are also independently powered, and during the polishing process, different voltages, different currents and direct currents in different directions are supplied to the electromagnetic coils, so that electromagnetic fields with different intensities and different directions are generated in different areas inside the polishing groove, and the magnetic abrasive is further pushed to move inside the polishing groove by the magnetic field force.
7. The controlled magnetic field complex curved surface chemical mechanical polishing device as claimed in any one of claims 4 to 6, wherein the power adjustable DC power supply is installed on the machine body and used for supplying DC power to all the electromagnetic coils independently.
8. The controlled magnetic field complex curved surface chemical mechanical polishing device of claim 1, wherein the numerical control system integrally controls the Z-direction translational motion of the spindle box, the deflection direction and the deflection angle of the deflection box around the Y-axis, the rotation direction and the rotation speed of the spindle, the vibration frequency and the amplitude generated by the ultrasonic transducer, and the power supply form of the power-adjustable direct current power supply.
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Cited By (2)

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CN114589636A (en) * 2022-03-14 2022-06-07 陕西捷特智能科技有限公司 Device and method for cleaning inner flow channel of pneumatic reciprocating jet 3D complex part based on magnetic guidance
CN115421254A (en) * 2022-09-23 2022-12-02 中国科学院微电子研究所 Processing method of optical fiber hole and processing equipment based on same

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CN110480427A (en) * 2019-08-28 2019-11-22 绍兴金辉久研科技有限公司 A kind of magnetorheological Ultraprecise polished device of ultrasonic activation auxiliary
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JP2004025234A (en) * 2002-06-25 2004-01-29 Nippon Steel Corp Electromagnetic stirring apparatus
CN105328515A (en) * 2015-11-06 2016-02-17 蓝思科技(长沙)有限公司 Grinding and polishing treatment device and method
CN107984306A (en) * 2018-01-28 2018-05-04 吉林大学 A kind of magnetic field is distant to manipulate vortex flow orientation burnishing device and polishing method
CN109079590A (en) * 2018-09-30 2018-12-25 湖南大学 A kind of non-newtonian fluid thickening polishing method and polishing system based on magnetic field auxiliary
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Publication number Priority date Publication date Assignee Title
CN114589636A (en) * 2022-03-14 2022-06-07 陕西捷特智能科技有限公司 Device and method for cleaning inner flow channel of pneumatic reciprocating jet 3D complex part based on magnetic guidance
CN114589636B (en) * 2022-03-14 2023-02-17 陕西捷特智能科技有限公司 Device and method for cleaning inner flow channel of 3D complex part based on magnetic guiding pneumatic reciprocating jet flow
CN115421254A (en) * 2022-09-23 2022-12-02 中国科学院微电子研究所 Processing method of optical fiber hole and processing equipment based on same
CN115421254B (en) * 2022-09-23 2023-10-24 中国科学院微电子研究所 Optical fiber hole processing method and processing equipment based on same

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