CN115972073A - Double-side polishing method for quartz hemispherical harmonic oscillator - Google Patents
Double-side polishing method for quartz hemispherical harmonic oscillator Download PDFInfo
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- CN115972073A CN115972073A CN202310027437.3A CN202310027437A CN115972073A CN 115972073 A CN115972073 A CN 115972073A CN 202310027437 A CN202310027437 A CN 202310027437A CN 115972073 A CN115972073 A CN 115972073A
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Abstract
The invention discloses a double-side polishing method of a quartz hemispherical harmonic oscillator, which comprises the following steps of: preparing a non-Newtonian fluid polishing solution with a shear thickening effect; mounting the hemispherical harmonic oscillator on a machine tool rotary table through a clamp; measuring the position of the harmonic oscillator of the current hemisphere by a sensor; designing and manufacturing an inner surface polisher and an outer surface polisher; and simultaneously polishing the outer surface and the inner surface of the semi-spherical harmonic oscillator. The polishing device is designed, so that the polishing contact area is increased, and the overall processing efficiency is improved; through the design of the polisher, the inner surface and the outer surface of the hemispherical harmonic oscillator are simultaneously processed, so that the stress of the hemispherical harmonic oscillator is balanced, the materials on the inner surface and the outer surface are uniformly removed at the same time, the uniformity of the wall thickness of the hemispherical harmonic oscillator is ensured, and the processing efficiency is improved. The invention controls the size of the fluid pressure by controlling the gap between the inner polisher wall and the outer polisher wall and the hemispherical harmonic oscillator wall, thereby ensuring that the hemispherical harmonic oscillator is integrally and uniformly processed.
Description
Technical Field
The invention belongs to an ultra-precision machining technology of a fused quartz spherical surface workpiece, relates to a polishing principle, and particularly relates to a double-side polishing method of a quartz hemispherical harmonic oscillator.
Background
The hemispherical resonator gyroscope has the advantages of simple structure, light weight, high working reliability, high precision, long service life, low loss, good radiation resistance, good impact vibration resistance and other performances, and is widely applied to inertial navigation systems of equipment such as long-life satellites, land-based weapon missiles, large ships, civil aircrafts, deep space detectors and the like. The quartz hemispherical harmonic oscillator is a core sensitive functional component of the hemispherical resonant gyroscope, and the quality, the size and the shape precision of the processed surface of the quartz hemispherical harmonic oscillator can change the vibration characteristics of harmonic oscillator parts, so that the service performance and the service life of the hemispherical resonant gyroscope are influenced. At present, a hemisphere harmonic oscillator is mostly manufactured by adopting milling and polishing processes, a blank piece is obtained by milling, then the surface quality, the size precision and the shape precision are further improved by fine grinding, and finally the high-quality hemisphere harmonic oscillator is obtained by ultra-precision polishing.
At present, the precision polishing of domestic hemispherical harmonic oscillators mainly adopts a magnetorheological polishing technology, a chemical mechanical polishing technology and a shear rheological polishing technology. Although the magnetorheological polishing technology can realize high surface roughness, the uniformity of spherical surface polishing of the harmonic oscillator and the surface shape precision of inner and outer spherical surfaces are difficult to ensure; the chemical mechanical polishing technology is widely used for processing harmonic oscillators made of metal materials, the quartz hemispherical harmonic oscillator cannot be subjected to pressure polishing, and the polishing mode is used without space due to the fact that the inner spherical surface of the quartz hemispherical harmonic oscillator is provided with the central supporting rod. For example, chinese patent CN202010843765 introduces a hemisphere resonator flow channel constraint-shear rheological polishing method, which utilizes a shear rheological flow field and controls the flow rate of a polishing solution and the rotation speed of a workpiece spindle to realize efficient polishing of a hemisphere resonator, and although the method can process a hemisphere resonator with high surface quality, because the method separately processes the inner and outer spherical surfaces of the hemisphere resonator, the workpiece is damaged due to unbalanced stress during the processing, and in the face changing process, clamping errors, repeated positioning errors and the like are introduced, so that the processing accuracy is reduced, and the high-precision hemisphere resonator is difficult to process. In order to solve the problems in the prior art, the invention ensures the surface shape precision of the processed hemispherical harmonic oscillator by controlling the gap between the polisher and the surface of the harmonic oscillator, and simultaneously processes the inner surface and the outer surface of the harmonic oscillator, thereby greatly improving the processing efficiency.
Disclosure of Invention
In order to solve the problems in the prior art, the invention aims to design a double-side polishing method of the quartz hemispherical harmonic oscillator, which can ensure the surface shape precision of the hemispherical harmonic oscillator and greatly improve the processing efficiency.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a double-side polishing method of a quartz hemispherical harmonic oscillator comprises the following steps:
A. preparing non-Newtonian fluid polishing solution with shear thickening effect, and adding the non-Newtonian fluid polishing solution into a polishing solution station for later use after ultrasonic dispersion;
B. mounting the hemispherical harmonic oscillator on a machine tool rotary table through a clamp, and adjusting the rotary axis of the hemispherical harmonic oscillator to enable the rotary axis of the hemispherical harmonic oscillator to be superposed with the rotary axis of the machine tool rotary table;
C. measuring the position of the harmonic oscillator of the current hemisphere by a sensor, and recording the position in a numerical control system of a five-axis numerical control machine tool;
D. designing and manufacturing an inner surface polisher and an outer surface polisher, then installing the outer surface polisher on a main shaft of a machine tool, adjusting the position of a hemispherical harmonic oscillator recorded by a numerical control system, and connecting the inner surface polisher and the outer surface polisher together to form an integral polisher;
E. starting a liquid circulating pump, enabling the polishing liquid to enter a gap between an inner surface polisher and the inner surface of the hemispherical harmonic oscillator and a gap between an outer surface polisher and the outer surface of the hemispherical harmonic oscillator, starting a main shaft and a rotary table of a machine tool, enabling the polisher and the hemispherical harmonic oscillator to rotate relatively, enabling the polishing liquid to flow in the gap between the polisher and the hemispherical harmonic oscillator, forming two shear rheological flow fields on the inner side and the outer side of the hemispherical harmonic oscillator, controlling the rotation speed of the polisher and the rotation speed of the hemispherical harmonic oscillator through a control console of the machine tool, and simultaneously polishing the outer surface and the inner surface of the hemispherical harmonic oscillator.
Further, in the step a, the non-newtonian fluid polishing solution is a mixture of a non-newtonian fluid base solution, an abrasive and an additive, the non-newtonian fluid base solution is a non-newtonian fluid composed of a polyhydroxy polymer and water, and the abrasive particles are silica; the additive is a dispersant, a preservative and a pH regulator.
Furthermore, in the step B, the connection mode of the hemispherical resonator and the fixture is mechanical clamping, the hemispherical resonator adopts a positioning fixture, the cylindrical surface of the central support column of the hemispherical resonator is used for positioning and clamping, the fixture is connected with the machine tool turntable through the positioning surface, the positioning error is eliminated, and the coaxiality error between the turntable axis and the hemispherical resonator axis is ensured to be less than 10 μm.
Further, in the step C, the position of the center of the hemispherical resonator is detected by using a touch sensor, the hemispherical resonator is contacted by using the touch sensor at the same height, namely the Z-direction height, and finally, the specific position of the clamped hemispherical resonator is calculated by using a macro program in the machine tool and recorded in a numerical control system of the machine tool.
Further, in the step D, before the hemispherical resonator is machined, the taylor profiler is used to measure the surface shape accuracy of the milled hemispherical resonator, and to see whether the surface shape accuracy meets the application requirements, if so, the polisher maintains the existing surface shape accuracy; otherwise, designing a corresponding polisher to trim the surface shape according to the measured surface shape of the hemispherical harmonic oscillator.
Further, before the step D, a plane workpiece which is the same as the hemispherical harmonic oscillator material is manufactured, a cylindrical polisher with the diameter of 12mm is manufactured, and under the condition of the same linear velocity, the plane workpiece and the cylindrical polisher are used for carrying out an experiment that the gap is changed from 0 mm to 0.4mm, so that the material removal rate conditions under different gap sizes are obtained; and calculating the polishing pressure of different points on the hemispherical harmonic oscillator by using the relationship between the polishing clearance and the removal rate obtained by the previous experiment according to the following material removal rate formula:
MRR＝kPV
wherein MRR is the material removal rate, k is the Preston coefficient, which is constant under certain processing conditions, P is the polishing pressure, and V is the relative velocity.
Further, when designing the polisher for correcting the surface shape, the corresponding polisher is designed according to the measured surface shape of the hemispherical resonator, a relatively large gap is designed at a place where the material removal rate is high, and a relatively small gap is designed at a place where the material removal rate is low. Meanwhile, in order to prevent interference, the outer surface polisher punches a hole in the center, and the radius of the hole is 1-3mm larger than that of the support column; internal surface polisher And an outer surface polisher Polishing pad grooves are formed in the polishing pad, and the number of the polishing pad grooves is 3-6.
Further, the overall shape of the inner surface polisher and the outer surface polisher is hemispherical, three-eighths spherical, or one-eighth spherical.
Further, the shape of the polishing pad groove is trapezoidal, fan-shaped, linear or crescent.
Further, the overall shape of the inner surface polisher and the outer surface polisher is hemispherical, three-quarter spherical, or quarter spherical.
Furthermore, the inner surface polisher and the outer surface polisher can be mounted at different positions, and the inner surface polisher and the outer surface polisher can be driven to process respectively.
Compared with the prior art, the invention has the following beneficial effects:
1. because the designed polisher is adopted to replace the point contact polishing of the traditional small polishing head, the polishing contact area is increased, and the overall processing efficiency is improved; through the design of polisher, the internal and external surface of hemisphere harmonic oscillator is processed simultaneously, not only makes hemisphere harmonic oscillator atress balanced, has guaranteed moreover that the material of internal and external surface evenly gets rid of simultaneously, has guaranteed the homogeneity of hemisphere harmonic oscillator wall thickness, has improved machining efficiency.
2. The invention controls the gap between the inner and outer polisher wall and the hemisphere harmonic oscillator wall to control the fluid pressure, thereby ensuring the hemisphere harmonic oscillator to be processed uniformly; because the hemispherical harmonic oscillator is a spherical thin-wall part, and the vertical distances of points at different heights on the spherical surface relative to the rotation center are different, the relative linear velocities of the points at different heights are different, so that the material removal rates at different points are different, and according to factors influencing the material removal rates, when the speed is fixed, the pressure can be changed to control the material removal rate; the polishing pressure of points with different heights on the hemispherical harmonic oscillator is calculated by utilizing the relation between the polishing clearance and the removal rate obtained by the previous experiment, so that the integral uniform processing is realized.
3. Because the invention adopts the high-precision touch sensor to detect the clamping position of the hemispherical harmonic oscillator and the relative position of the polisher, the processing error caused by the clamping error can be eliminated; the position of the hemispherical harmonic oscillator is detected by adopting a high-precision touch sensor (the precision is 1 mu m), so that the polisher can accurately move right above the hemispherical harmonic oscillator, the coaxiality of the harmonic oscillator cannot be influenced in the machining process, the clamping error is avoided, and the high-precision hemispherical harmonic oscillator can be machined.
4. The flexible non-contact processing method adopted by the invention realizes the high-quality processing of the surface of the hemispherical resonator, and the shear thickening effect is adopted to remove the surface material of the workpiece in the polishing process, and the removing principle is as follows: the shear thickening property of the fluid enables solid particles in the fluid to form a particle family, abrasive particles are held and wrapped in the particle family, and the fluid shear force F is generated Shearing The shear thickening effect is continuously enhanced due to further increaseThe holding effect of the solid particles on the abrasive is enhanced, so that a flexible fixing mold is formed and the abrasive can be held under a larger fluid pressure F Press and press Under the action of the abrasive particles, the abrasive particles generate relative motion on the surface of the workpiece, so that the material on the surface of the workpiece is removed. The abrasive particles are in flexible contact with the surface of the workpiece in the machining process, damage to the surface caused by scratches and embedding of the abrasive particles can be avoided, and the surface material which is not damaged can be removed.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is an enlarged view at a of fig. 1 (for showing the size of the gap between the polisher and the hemispherical resonator).
Fig. 3 is a schematic view of the assembly of the internal and external polishers and the hemispherical resonator.
Fig. 4 is a schematic view of an outer surface polisher.
Fig. 5 is a schematic view of an inner surface polisher.
FIG. 6 is a schematic view of example 2.
FIG. 7 is a flow chart of a polisher design.
Description of reference numerals: the polishing method comprises the following steps of 1-polishing solution container, 2-clamp, 3-turntable, 4-numerical control system, 5-circulating pump, 6-polishing solution storage station, 7-polishing solution circulating pipeline, 8-connecting part of internal and external polishers, 9-internal polisher, 10-hemispherical harmonic oscillator, 11-external surface polisher, 12-supporting column and 13-shear thickening solution.
Detailed Description
The invention is further described below with reference to fig. 1-6.
The device for efficiently processing the quartz hemispherical harmonic oscillator comprises a polishing solution container 1, a polishing solution storage station 6, a circulating pump 5, a rotary table 3, a main shaft and a numerical control system 4, wherein the polishing solution storage station 6 is used for storing and cooling shear thickening solution 12; the outlet of the polishing solution storage station 6 is connected with the inlet of the polishing solution container 1 through a circulating pipeline 7 and a circulating pump 5, and the inlet is connected with the outlet of the polishing solution container 1 through the circulating pipeline 7; the spindle is connected with the outer surface polisher 10 through a standard tool handle to drive the polisher to rotate; the polishing solution container 1 is fixed on the turntable 3, and the clamp 2, the polisher and the hemispherical harmonic oscillator 9 are all arranged in the polishing solution container 1; the turntable 3 is connected with a hemispherical harmonic oscillator 9 through a clamp 2 to drive the hemispherical harmonic oscillator 9 to rotate; the numerical control system 4 controls the rotating speed of the main shaft and the rotary table 3 and the flow of the polishing solution, and the numerical control system 4, the main shaft and the rotary table 3 are all components of a machine tool.
The examples of the invention are as follows:
example 1:
1. preparing a non-Newtonian fluid polishing solution with a shear thickening effect, wherein the non-Newtonian fluid consists of 55wt% of polyhydroxy polymer and 34wt% of water, the abrasive particles are silica with a particle size of 50nm and account for 10wt%, 0.2wt% of sodium phenylpropionate is added as an antiseptic, 0.2wt% of thixotropic agent and 0.6wt% of Ph regulator to adjust the pH value of the shear thickening solution 12 to 9.6, the polyhydroxy polymer, the abrasive particles, the dispersing agent, the antiseptic and the like are mixed according to the proportion, then the mixture is placed in an ultrasonic cleaning instrument, and ultrasonic dispersion is carried out for 15min to obtain a multiphase dispersed phase; adding deionized water into the multiphase dispersed phase, stirring for 30min by using a stirrer, putting into an ultrasonic cleaning instrument, continuing ultrasonic dispersion for 15min to obtain shear thickening liquid 12, and adding into a polishing liquid storage station 6 for later use after ultrasonic dispersion;
2. the method comprises the following steps of clamping a hemispherical harmonic oscillator 9 on a clamp 2 by taking the cylindrical surface of a central supporting column of the hemispherical harmonic oscillator 9 as a reference, fixing the hemispherical harmonic oscillator 9 and the clamp 2 integrally in a polishing solution container 1 through a bolt, transferring the whole to a rotary table 3 of a machine tool through a flange, and then ensuring that the rotary axis of the hemispherical harmonic oscillator 9 is coaxial with that of the rotary table 3 of the machine tool through manual adjustment;
3. measuring the position of the hemispherical harmonic oscillator 9 by using a high-precision touch sensor, firstly installing the sensor on a machine tool spindle, starting the sensor, touching the hemispherical harmonic oscillator 9 from four different directions at a certain height (a Z value of the machine tool), recording specific coordinates of the four points, then obtaining specific position coordinates of the hemispherical harmonic oscillator 9 through calculation, and recording the specific position coordinates in the numerical control system 4 of the machine tool;
4. adhering a trapezoidal polishing pad into a polishing pad groove, then installing a semicircular outer surface polisher 10 adhered with the polishing pad on a main shaft of a machine tool through a chuck, adjusting the semicircular outer surface polisher to the position of a hemispherical harmonic oscillator 9 recorded by the machine tool polishing pad, and connecting an inner surface polisher 8 and the outer surface polisher 10 together through bolt connection to form an integral polisher;
5. starting a circulating pump 5, enabling a shear thickening liquid 12 to enter a gap between an inner surface polisher 8 and an outer surface polisher 10 and the inner surface and the outer surface of a hemispherical resonator 9, starting a machine tool spindle and a turntable 3, setting the rotation speed to be 200rpm and 100rpm respectively, enabling the polisher and the hemispherical resonator 9 to rotate relatively, enabling the shear thickening liquid 12 to flow in the gap between the polisher and the hemispherical resonator 9 to form two shear rheological flow fields, enabling the shear thickening liquid 12 to mainly generate shear thickening effect in the two flow fields, removing the surface material of the hemispherical resonator 9 through the formed shear force, adjusting the size of the gap between the polisher and the hemispherical resonator 9, and controlling the rotation speed of the polisher and the rotation speed of the hemispherical resonator 9 through a numerical control system 4 of the machine tool, so that high-quality high-efficiency polishing of the hemispherical resonator 9 is achieved. After 2.5h of polishing, the results were that the inner surface roughness Ra was reduced from 215.3nm to 7.5nm and the outer surface roughness Ra was reduced from 205.7nm to 6.7nm.
Example 2:
this example differs from example 1 in that: the inner surface polisher and the outer surface polisher change the installation positions, the inner surface polisher and the outer surface polisher are driven respectively, and double-sided processing is achieved. The other steps and parameters were the same as in example 1.
Example 3:
this example differs from example 1 in that: and 4, the shape of the adhered polishing pad grooves is one of trapezoid, fan-shaped, linear and crescent, and the number of the polishing pad grooves is 3-6. The other steps and parameters were the same as in example 1.
Example 4:
this example differs from example 1 in that: the overall shape of the polisher in step 4 may be one of a hemispherical shape, a three-eighths spherical shape, and a one-eighth spherical shape. The other steps and parameters were the same as in example 1.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification to illustrate the principles of the present invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed.
Claims (9)
1. A double-sided polishing method of a quartz hemisphere harmonic oscillator is characterized by comprising the following steps: the method comprises the following steps:
A. preparing non-Newtonian fluid polishing solution with shear thickening effect, and adding the non-Newtonian fluid polishing solution into a polishing solution station for later use after ultrasonic dispersion;
B. mounting the hemispherical harmonic oscillator (9) on a machine tool rotary table (3) through a clamp (2), and adjusting the rotary axis of the hemispherical harmonic oscillator (9) to enable the rotary axis of the hemispherical harmonic oscillator (9) to be coincident with the rotary axis of the machine tool rotary table (3);
C. measuring the position of the harmonic oscillator (9) of the current hemisphere by a sensor, and recording the position in a numerical control system (4) of the machine tool;
D. designing and manufacturing an inner surface polisher (8) and an outer surface polisher (10), then installing the outer surface polisher (10) on a main shaft of a machine tool, adjusting the position of a hemispherical harmonic oscillator (9) recorded by a numerical control system (4), and connecting the inner surface polisher (8) and the outer surface polisher (10) together through bolt connection to form an integral polisher;
E. and starting a circulating pump (5), enabling the polishing solution to enter a gap between the inner surface polisher (8) and the inner surface of the hemispherical resonator (9) and a gap between the outer surface polisher (10) and the outer surface of the hemispherical resonator (9), starting a spindle and a turntable (3) of the machine tool, enabling the polisher and the hemispherical resonator (9) to rotate relatively, enabling the polishing solution to flow in the gap between the polisher and the hemispherical resonator (9), forming two flow fields of shear flow on the inner side and the outer side of the hemispherical resonator (9), controlling the rotating speed of the polisher and the rotating speed of the hemispherical resonator (9) through a control console of the machine tool, and simultaneously polishing the outer surface and the inner surface of the hemispherical resonator (9).
2. The double-sided polishing method for the quartz hemispherical resonator according to claim 1, characterized in that: in the step A, the non-Newtonian fluid polishing solution is a mixture prepared from a non-Newtonian fluid base solution, an abrasive and an additive, the non-Newtonian fluid base solution is a non-Newtonian fluid consisting of a polyhydroxy polymer and water, and the abrasive particles are silicon dioxide; the additive is a dispersant, a preservative and a pH regulator.
3. The double-sided polishing method for the quartz hemispherical resonator according to claim 1, characterized in that: in the step B, the connection mode of the hemispherical harmonic oscillator (9) and the clamp (2) is mechanical clamping, the hemispherical harmonic oscillator (9) is positioned and clamped with the cylindrical surface of a supporting column (11) at the center of the hemispherical harmonic oscillator (9) through the clamp (2), the clamp (2) is connected with the machine tool rotary table (3) through a positioning surface, positioning errors are eliminated, and the coaxiality error between the rotary axis of the rotary table (3) and the rotary axis of the hemispherical harmonic oscillator (9) is ensured to be less than 10 microns.
4. The double-sided polishing method of the quartz hemispherical resonator according to claim 1, characterized in that: and in the step C, detecting the position of the center of the hemispherical harmonic oscillator (9) by using a touch sensor, contacting the hemispherical harmonic oscillator (9) by using the touch sensor at the same height, namely Z-direction height, and finally calculating the specific position of the clamped hemispherical harmonic oscillator (9) by using a macro program in the machine tool and recording the specific position into a numerical control system (4) of the machine tool.
5. The double-sided polishing method for the quartz hemispherical resonator according to claim 1, characterized in that: in the step D, before the hemisphere harmonic oscillator (9) is machined, measuring the surface shape precision of the ground hemisphere harmonic oscillator (9) by using a Taylor profiler, and judging whether the surface shape precision meets the application requirement, wherein if the surface shape precision meets the application requirement, the polisher keeps the existing surface shape precision; otherwise, designing a corresponding polisher to finish the surface shape according to the measured surface shape of the hemispherical harmonic oscillator (9).
6. The double-sided polishing method for the quartz hemispherical resonator according to claim 1, characterized in that: before the step D, a plane workpiece with the same material as the hemispherical harmonic oscillator (9) is manufactured, a cylindrical polisher with the diameter of 12mm is manufactured, and under the condition of the same linear velocity, the plane workpiece and the cylindrical polisher are used for carrying out an experiment that the gap is changed from 0 mm to 0.4mm, so that the material removal rate conditions under different gap sizes are obtained; and calculating the polishing pressure at different points on the hemispherical harmonic oscillator (9) by using the relationship between the polishing clearance and the removal rate obtained by the previous experiment through the following material removal rate formula:
MRR＝kPV
wherein MRR is the material removal rate, k is the Preston coefficient, which is constant under certain processing conditions, P is the polishing pressure, and V is the relative velocity.
7. The double-sided polishing method of the quartz hemispherical resonator according to claim 6, characterized in that: when designing the polisher for correcting the surface shape, designing a corresponding polisher according to the measured surface shape of the hemispherical harmonic oscillator (9), designing a relatively large gap at a place with high material removal rate, and designing a relatively small gap at a place with low material removal rate; meanwhile, in order to prevent interference, the outer surface polisher (10) punches a hole in the center, and the radius of the hole is 1-3mm larger than that of the support column (11); polishing pad grooves are formed in the inner surface polisher (8) and the outer surface polisher (10), and the number of the polishing pad grooves is 3-6.
8. The double-sided polishing method for the quartz hemispherical resonator according to claim 7, characterized in that: the shape of the polishing pad groove is trapezoidal, fan-shaped, linear or crescent.
9. The double-sided polishing method for the quartz hemispherical resonator according to claim 1, characterized in that: the overall shape of the inner surface polisher (8) and the outer surface polisher (10) is hemispherical, three-eighths spherical, or one-eighth spherical.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117182720A (en) * | 2023-11-06 | 2023-12-08 | 四川图林科技有限责任公司 | Precision machining equipment and machining method for hemispherical resonant gyroscope harmonic oscillator |
| CN117532412A (en) * | 2024-01-10 | 2024-02-09 | 四川图林科技有限责任公司 | Hemispherical resonator surface polishing treatment method of hemispherical resonator gyroscope |
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2023
- 2023-01-09 CN CN202310027437.3A patent/CN115972073A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117182720A (en) * | 2023-11-06 | 2023-12-08 | 四川图林科技有限责任公司 | Precision machining equipment and machining method for hemispherical resonant gyroscope harmonic oscillator |
| CN117182720B (en) * | 2023-11-06 | 2024-01-19 | 四川图林科技有限责任公司 | Precision machining equipment and machining method for hemispherical resonant gyroscope harmonic oscillator |
| CN117532412A (en) * | 2024-01-10 | 2024-02-09 | 四川图林科技有限责任公司 | Hemispherical resonator surface polishing treatment method of hemispherical resonator gyroscope |
| CN117532412B (en) * | 2024-01-10 | 2024-03-15 | 四川图林科技有限责任公司 | Hemispherical resonator surface polishing treatment method of hemispherical resonator gyroscope |
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