CN115415622A - Preparation method of PCB direct display board for mini LED - Google Patents
Preparation method of PCB direct display board for mini LED Download PDFInfo
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- CN115415622A CN115415622A CN202210912371.1A CN202210912371A CN115415622A CN 115415622 A CN115415622 A CN 115415622A CN 202210912371 A CN202210912371 A CN 202210912371A CN 115415622 A CN115415622 A CN 115415622A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 238000012360 testing method Methods 0.000 claims abstract description 99
- 238000003475 lamination Methods 0.000 claims abstract description 57
- 238000000034 method Methods 0.000 claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- 238000012545 processing Methods 0.000 claims abstract description 20
- 238000005476 soldering Methods 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 21
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 238000005553 drilling Methods 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 9
- 239000004744 fabric Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 5
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- 230000008018 melting Effects 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 18
- 238000003466 welding Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
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- 238000000227 grinding Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Abstract
The invention discloses a preparation method of a PCB direct display board for a mini LED, which comprises the following steps: s1: the shrinkage of the PCB direct display board is obtained by the specific method as follows: s11: designing 2M test board sub-laminates in the test PCB direct display board, wherein the test board sub-laminates positioned symmetrically at two sides of the center of the test PCB direct display board have the same shrinkage, residual copper rate and lamination thickness; s12: processing the test board lamination to form a test PCB direct display board; s13: reflow soldering is carried out on the test PCB direct display board, the size of the test PCB direct display board after reflow soldering is measured, and the shrinkage of the test PCB direct display board is calculated; s2: and designing the initial size of the target board lamination according to the target size and the shrinkage of the target PCB direct display board, and processing the target board lamination. The invention carries out size compensation on the target PCB direct display board by testing the shrinkage of the PCB direct display board, and avoids the defects that the finished product of the PCB direct display board is warped and the size is expanded and shrunk and cannot be controlled.
Description
Technical Field
The invention relates to the field of PCB direct display board preparation, in particular to a preparation method of a PCB direct display board for a mini LED.
Background
An LED (Light Emitting Diode) electronic display screen is a large-scale display screen system which integrates the microelectronic technology, the computer technology and the information processing. The mini LED technology uses very small chips with chip sizes in the range of 50-20 μm to generate the light for the display screen. Compared with a traditional display screen, the mini LED can provide superior local dimming characteristics, can form more partitions with more quantity and more accurate display, has stronger light control capability, and is higher in picture contrast.
A plurality of technical characteristics and difficulties exist in the manufacturing method of the PCB direct display board of the mini LED:
1, the PCB direct display board has small size;
the PCB direct display board has small thickness, and the board is easy to warp or deform by external force;
3. the amount of expansion and contraction deformation cannot be confirmed;
4. the outer layer has small line width space, and volcanic ash particles of a resistance welding pretreatment horizontal line can be clamped in the board space.
When the PCB direct display board and the LED chip are pasted, as shown in an attached drawing 1, the LED chip 3 is firstly fixed on the glass cover plate 2, when a huge amount of laser 1 passes through the glass cover plate 2 for operation, the PCB direct display board 4 can be fixed, meanwhile, solder mask tin on the surface layer of the PCB direct display board 4 becomes soldering flux, the LED chip 3 on the glass cover plate 2 is pasted on the PCB direct display board 4 under the action of thermal stress, the operation process has very strict requirements on warping and size expansion of the PCB direct display board, otherwise, the pasted chip is deviated or misplaced when the huge amount of laser is transferred. In order to ensure the effective mounting of the PCB linear plate and the LED chip, the problems that the finished product warpage and the size expansion and shrinkage of the PCB direct display plate cannot be confirmed need to be solved.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the problems in the related art. Therefore, the invention aims to provide a preparation method of a PCB direct display board for a mini LED, which is characterized in that through the design of the board lamination, the shrinkage of each board lamination is controlled within a controllable range, and then the shrinkage of the PCB direct display board is tested to perform size compensation on a target PCB direct display board, so that the defects that the finished product of the PCB direct display board is warped and the size expansion and contraction cannot be controlled are avoided.
In order to achieve the purpose, the following technical scheme is adopted in the application: a preparation method of a PCB direct display board for a mini LED comprises the following steps:
s1: the shrinkage of the PCB direct display board is obtained by the specific method as follows:
s11: designing 2M test board sub-laminates in the test PCB direct display board, wherein the test board sub-laminates positioned at two sides of the center of the test PCB direct display board have the same shrinkage, residual copper rate and lamination thickness; m is an integer greater than 0; measuring the dimension L00 of the test plate stack;
s12: processing the test board lamination to form a test PCB direct display board;
s13: reflow soldering is carried out on the test PCB direct display board, the size L01 of the test PCB direct display board after reflow soldering is measured, and the shrinkage of the test PCB direct display board is calculated according to L00 and L01;
s2: designing the initial size of the target board lamination according to the target size of the target PCB direct display board and the obtained shrinkage, and processing the target board lamination to form the target PCB direct display board; the test PCB direct display board and the target PCB direct display board have the same structure.
Further, in the step S11, by calling data in the shrinkage library, the board type, the board thickness, the glass cloth type, the resin type and the resin content in the test board lamination are designed to ensure that the test board laminations positioned symmetrically at two sides of the center of the test PCB direct display board have the same shrinkage;
the shrinkage library stores shrinkage corresponding to different plate types, different plate thicknesses, different glass cloth types, different resin types and different resin contents.
Further, in the step S11, the copper sheets are added in the test board sub-lamination layer to ensure that the test board sub-lamination layers symmetrically positioned at the two sides of the center of the test PCB direct display board have the same residual copper rate.
Further, in step S11, the resin content is designed according to the copper layer pattern in the test board sub-laminate, so as to ensure that the test board sub-laminates symmetrically located at two sides of the center of the test PCB direct display board have the same lamination thickness, wherein the lamination thickness refers to the thickness of the test board sub-laminate tiled after the resin is melted in the lamination process.
Further, the processing procedure in step S12 includes cutting, browning, pressing, drilling, pattern etching and solder resisting.
Further, before resistance welding, chemical super-roughening treatment is carried out on the PCB direct display board by adopting etching liquid medicine.
Furthermore, cutting and baking are carried out after cutting, browning and baking are carried out after browning, drilling and baking are carried out after drilling, pattern etching and baking are carried out after pattern etching, and resistance welding and baking are carried out after resistance welding, so that the internal stress of the PCB direct display board is ensured to be released.
Furthermore, solder resist is performed by adopting solder resist ink in the solder resist process.
Further, the method also comprises the step S3: and (3) mounting the LED chip on the surface of the target PCB through a huge amount of laser.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages: the test PCB direct display board and the target PCB direct display board have the same structure, the test PCB direct display board is used for testing the shrinkage of the PCB direct display board under the structure, and the size of an initial PCB direct display board is designed according to the shrinkage and the size of the PCB direct display board which is finally needed; therefore, the problem of size expansion and shrinkage of the PCB direct display board can be effectively solved;
the finished product warpage appears in PCB direct display board among the prior art is because the shrinkage of each board stromatolite is inconsistent, and this application ensures that the board stromatolite that lies in PCB direct display board central bilateral symmetry has the same shrinkage, incomplete copper rate and pressfitting thickness in structural design, can ensure PCB direct display board longitudinal symmetry like this, can not appear warpage and difference in height in the pressfitting technology, has effectively solved the finished product warpage problem that PCB direct display board probably appears.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
In the drawings:
FIG. 1 is a schematic view of an LED chip mounted on a PCB direct display board in the prior art;
FIG. 2 is a schematic flow chart of a method for manufacturing a PCB direct display board for a mini LED according to the present application;
reference numerals: 1. a bulk laser; 2. a glass cover plate; 3. an LED chip; 4. PCB directly shows the board.
Detailed Description
For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the following description, it is to be understood that the directions or positional relationships indicated by "front", "rear", "upper", "lower", "left", "right", "longitudinal", "lateral", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail", and the like are configured and operated in specific directions based on the directions or positional relationships shown in the drawings, and are only for convenience of describing the present invention, and do not indicate that the referred mechanism or element must have a specific direction, and thus, are not to be construed as limiting the present invention.
It is also noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," "disposed," and the like are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or intervening elements may also be present. The terms "first", "second", "third", etc. are only for convenience in describing the present technical solution, and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
The application provides a preparation method of a PCB direct display board for a mini LED, which comprises the following steps:
s1: the shrinkage of the PCB direct display board is obtained by the specific method as follows:
s11: designing 2M test board sub-laminates in the test PCB direct display board, wherein the test board sub-laminates positioned at two sides of the center of the test PCB direct display board have the same shrinkage, residual copper rate and lamination thickness; m is an integer greater than 0; measuring the dimension L00 of the test plate stack;
s12: processing the test board lamination to form a test PCB direct display board;
s13: reflow soldering is carried out on the test PCB direct display board, the size L01 of the test PCB direct display board after reflow soldering is measured, and the shrinkage of the test PCB direct display board is calculated according to L00 and L01;
s2: designing the initial size of the target board lamination according to the target size of the target PCB direct display board and the obtained shrinkage, and processing the target board lamination to form the target PCB direct display board; the test PCB direct display board and the target PCB direct display board have the same structure.
Step S13 adopts reflow soldering to simulate the shrinkage of target PCB direct display board when indisputable station LED chip in this application, and through verifying, the shrinkage of target PCB direct display board when subsides dress equals the shrinkage in the reflow soldering technology basically, because the test PCB direct display board is used for testing the shrinkage of PCB direct display board itself, need not to carry out special subsides dress, only need adopt reflow soldering to simulate the shrinkage of subsides dress process can, can shorten the shrinkage acquisition time like this.
The direct display board of test PCB and target PCB in this application have the same structure, and the processing procedure of the two is also identical, the difference lies in: the initial dimension of the PCB direct display board is set according to an empirical value, and a mounting process is simulated by reflow soldering instead of a mounting process after the processing procedure is finished; the function of the test PCB direct display board is to determine the shrinkage of the PCB direct display board under the same structure.
The test PCB direct display board is used for testing the shrinkage of the PCB direct display board under the structure, and the size of the initial PCB direct display board is designed according to the shrinkage and the size of the PCB direct display board finally required; therefore, the problem of size expansion and shrinkage of the PCB direct display board can be effectively solved;
the finished product warpage appears in PCB direct display board among the prior art is because the shrinkage of each board stromatolite is inconsistent, and this application ensures that the board stromatolite that lies in PCB direct display board central bilateral symmetry has the same shrinkage, incomplete copper rate and pressfitting thickness in structural design, can ensure PCB direct display board longitudinal symmetry like this, can not appear warpage and difference in height in the pressfitting technology, has effectively solved the finished product warpage problem that PCB direct display board probably appears.
Referring to fig. 2, a method for manufacturing a PCB direct display board for a mini LED provided in the present application includes:
s1: the shrinkage of the PCB direct display board is obtained by the specific method as follows:
s11: designing 2M test board sub-laminates in the test PCB direct display board, wherein the test board sub-laminates positioned at two sides of the center of the test PCB direct display board have the same shrinkage, residual copper rate and lamination thickness; m is an integer greater than 0; the dimension L00 of the test plate stack was measured.
When the PCB direct display board comprises 6 board laminates, the shrinkage, the residual copper rate and the lamination thickness of the first layer and the sixth layer of board laminates are the same, the shrinkage, the residual copper rate and the lamination thickness of the second layer and the fifth layer of board laminates are the same, and the shrinkage, the residual copper rate and the lamination thickness of the third layer of board laminates are the same as those of the fourth layer of board laminates.
In the application, the laminated plate comprises the etched pattern made of the copper material and the resin, in the pressing process, the resin can be filled in the area outside the etched pattern after being melted, and the pressing thickness refers to the thickness of the area outside the etched pattern, which is uniformly filled after the resin is melted.
Before the lamination design of the plates, the shrinkage library needs to be prepared, and the shrinkage library stores shrinkage corresponding to different plate types, different plate thicknesses, different glass cloth types, different resin types and different resin contents. The manufacturing process of the contraction library specifically comprises the following steps: and arranging a plurality of plate laminations with different plate types, different plate thicknesses, different glass cloth types, different resin types and different resin contents, and sequentially processing the plate laminations to obtain the shrinkage of the plate laminations.
By calling data in a shrinkage library, designing the plate type, the plate thickness, the glass cloth type, the resin type and the resin content in the test plate lamination, and ensuring that the test plate laminations positioned at the two symmetrical sides of the center of the test PCB direct display plate have the same shrinkage; by adding the copper sheets in the test board sub-lamination, the test board sub-lamination symmetrically positioned at the two sides of the center of the test PCB direct display board is ensured to have the same residual copper rate. Designing resin content according to the copper layer graph in the test board sub-lamination, and ensuring that the test board sub-lamination symmetrically positioned at two sides of the center of the test PCB direct display board has the same lamination thickness, wherein the lamination thickness refers to the thickness of the test board sub-lamination which is tiled after resin is melted in a lamination process.
Three principles of the design of the step are as follows: the test board lamination layers positioned at the two sides of the center of the test PCB direct display board are symmetrical and have the same shrinkage, the same residual copper rate and the same lamination thickness, the purpose is to control the shrinkage of each board lamination layer in the test PCB direct display board in a controllable range, ensure that the shrinkage of each board lamination layer is as consistent as possible and the lamination thickness is as consistent as possible, thus ensuring that each board lamination layer shrinks uniformly and the thickness of each layer is uniform in the reflow soldering process of the test PCB direct display board, and avoiding the warping phenomenon caused by nonuniform thickness or nonuniform shrinkage at each position.
S12: processing the test board lamination to form a test PCB direct display board;
the specific processing procedures comprise cutting, browning, pressing, drilling, pattern etching, resistance welding and the like.
In the prior art, a PCB direct display board needs to be subjected to super-roughening treatment before solder resistance so as to facilitate ink adhesion; in the prior art, the super-roughening treatment is to add a grinding plate section and a volcanic ash section before a solder resist process, wherein the grinding plate section is used for grinding the surface of the PCB direct display plate so as to roughen the surface of the PCB direct display plate, and the volcanic ash section is used for removing impurities on the surface of the PCB direct display plate. Because the PCB directly shows that the board thickness is thinner, the board process of rubbing can cause the PCB to directly show that the board shrink is huge and produce deformation, and the granule that the volcanic ash section produced can block in the PCB directly shows the board circuit, causes the circuit short circuit.
Before resistance welding, chemical super-roughening treatment is carried out on the PCB direct display board by using etching liquid medicine; and the grinding plate section and the volcanic ash section are closed, so that the thin plate is prevented from being greatly contracted and deformed by the grinding plate, and the particles of the volcanic ash section are prevented from being blocked in the space between the plates to form short circuit. The solder resist process adopts solder resist ink, and oil falling after surface treatment of solder is avoided.
In the processing procedure, the internal stress of the PCB direct display board needs to be released carefully, and then the next process is carried out. Particularly, a baking process can be added after the corresponding process, so that the internal stress of the PCB direct display board is fully released. For example, the cutting and baking are carried out after cutting, the browning and baking are carried out after browning, the drilling and baking are carried out after drilling, the pattern etching and baking are carried out after pattern etching, and the resistance welding and baking are carried out after resistance welding, so that the internal stress of the PCB direct display board in the process is ensured to be released, and the PCB direct display board is prevented from warping.
In the drilling and image transfer process, the drilling equipment needs to set fixed expansion and contraction quantities to drill holes and back drilling holes corresponding to the drill holes, and the exposure machine needs to set fixed expansion and contraction quantities to perform pattern transfer operation to transfer inner-layer patterns and outer-layer patterns and to transfer exposure machines.
S13: and performing reflow soldering on the test PCB direct display board, measuring the size L01 of the test PCB direct display board after reflow soldering, and calculating the shrinkage of the test PCB direct display board according to L00 and L01. And the shrinkage amount is = (L01-L00)/100, if the shrinkage amount is a positive number, the expansion of the test PCB direct display board is indicated, and if the shrinkage amount is a negative number, the retraction of the test PCB direct display board is indicated.
S2: and designing the initial size of the target board lamination according to the target size of the target PCB direct display board and the obtained shrinkage, and processing the target board lamination to form the target PCB direct display board. For example, if the shrinkage is-0.02%, the initial dimension of the target board stack, i.e., the initial target PCB direct display board dimension, is designed to be 1.02% times the target value.
In the step, the structures of the test PCB direct display board and the target PCB direct display board are completely the same, and the initial sizes are slightly different after being supplemented; the processing process and the processing parameters are also completely the same. The processing is not described in detail here.
S3: and (3) mounting the LED chip on the surface of the target PCB through a huge amount of laser. The mounting process in this step is similar to the reflow soldering in step S13, and the shrinkage amounts generated by the two are substantially the same.
The target PCB direct display board in the application is supplemented by the shrinkage, can be aligned to the LED chip, does not deviate or misplace the LED chip, and can ensure that the performance of the mini LE keeps the best state.
It is to be understood that the foregoing examples, while indicating the preferred embodiments of the invention, are given by way of illustration and description, and are not to be construed as limiting the scope of the invention; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several changes and modifications can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.
Claims (9)
1. A preparation method of a PCB direct display board for a mini LED is characterized by comprising the following steps:
s1: the shrinkage of the PCB direct display board is obtained by the specific method as follows:
s11: designing 2M test board sub-laminates in the test PCB direct display board, wherein the test board sub-laminates positioned at two sides of the center of the test PCB direct display board have the same shrinkage, residual copper rate and lamination thickness; m is an integer greater than 0; measuring the dimension L00 of the test plate stack;
s12: processing the test board lamination to form a test PCB direct display board;
s13: reflow soldering is carried out on the test PCB direct display board, the size L01 of the test PCB direct display board after reflow soldering is measured, and the shrinkage of the test PCB direct display board is calculated according to L00 and L01;
s2: designing the initial size of the target board lamination according to the target size of the target PCB direct display board and the obtained shrinkage, and processing the target board lamination to form the target PCB direct display board; the test PCB direct display board and the target PCB direct display board have the same structure.
2. The method for preparing the PCB direct display board for the mini LED as claimed in claim 1, wherein in the step S11, the board type, the board thickness, the glass cloth type, the resin type and the resin content in the test board sub-lamination are designed by calling data in the shrinkage library, so as to ensure that the test board sub-lamination symmetrically positioned at two sides of the center of the test PCB direct display board has the same shrinkage;
the shrinkage library stores shrinkage corresponding to different plate types, different plate thicknesses, different glass cloth types, different resin types and different resin contents.
3. The method as claimed in claim 1, wherein the step S11 of adding copper sheets to the test PCB sub-laminate ensures that the test PCB sub-laminates symmetrically located at both sides of the center of the test PCB sub-laminate have the same residual copper ratio.
4. The method according to claim 1, wherein in step S11, the resin content is designed according to the copper layer pattern in the test board sub-laminate, so as to ensure that the test board sub-laminates symmetrically positioned at two sides of the center of the test PCB sub-laminate have the same lamination thickness, wherein the lamination thickness refers to the thickness of the test board sub-laminate laid with the resin after melting in the lamination process.
5. The method for preparing the PCB direct display board for the mini LED as claimed in claim 1, wherein the processing procedure in the step S12 comprises cutting, browning, pressing, drilling, pattern etching and solder resisting.
6. The method for preparing the PCB direct display board for the mini LED as claimed in claim 5, wherein before the solder mask, the PCB direct display board is chemically super-roughened by using an etching solution.
7. The method for preparing the PCB direct display board for the mini LED as claimed in claim 5, wherein the cutting baking is performed after cutting, the browning baking is performed after browning, the drilling baking is performed after drilling, the pattern etching baking is performed after pattern etching, and the solder resist baking is performed after solder resist, so that the internal stress of the PCB direct display board is released.
8. The method for preparing the PCB direct display board for the mini LED as claimed in claim 1, wherein solder resist is performed by using solder resist ink in a solder resist process.
9. The method for preparing a PCB direct display board for a mini LED as claimed in claim 1, further comprising S3: and (3) attaching the LED chip to the surface of the target PCB direct display board by adopting a huge amount of laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210912371.1A CN115415622B (en) | 2022-07-29 | 2022-07-29 | Preparation method of PCB (printed circuit board) direct display board for mini LED (light-emitting diode) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210912371.1A CN115415622B (en) | 2022-07-29 | 2022-07-29 | Preparation method of PCB (printed circuit board) direct display board for mini LED (light-emitting diode) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115415622A true CN115415622A (en) | 2022-12-02 |
| CN115415622B CN115415622B (en) | 2024-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210912371.1A Active CN115415622B (en) | 2022-07-29 | 2022-07-29 | Preparation method of PCB (printed circuit board) direct display board for mini LED (light-emitting diode) |
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| CN115415622B (en) | 2024-02-02 |
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