CN217011285U

CN217011285U - Printed board for rapidly testing filling performance of dry film

Info

Publication number: CN217011285U
Application number: CN202220804532.0U
Authority: CN
Inventors: 李华; 曹永梅; 蔡奕康; 刘文敏; 李艳国
Original assignee: Canyon Circuit Technology Huizhou Co ltd
Current assignee: Canyon Circuit Technology Huizhou Co ltd
Priority date: 2022-04-08
Filing date: 2022-04-08
Publication date: 2022-07-19
Anticipated expiration: 2032-04-08

Abstract

The utility model discloses a printed board for rapidly testing filling performance of a dry film, which comprises an L1 copper foil layer, a PP layer, an L2 copper foil layer, a base material layer, an L3 copper foil layer, a PP layer and an L4 copper foil layer which are sequentially stacked from top to bottom, wherein the PP layer comprises PP and glass fibers which are attached to the PP and are abutted against the L1 copper foil layer or the L4 copper foil layer, the L2 copper foil layer, the base material layer and the L3 copper foil layer form a copper-clad plate, the L2 copper foil layer and the L3 copper foil layer are symmetrically arranged in a pattern mode, a plurality of copper-free areas with different residual copper rate designs are arranged on the L2 copper foil layer and the L3 copper foil layer, and pits with different depths are formed in the positions of the L1 copper foil layer and the L4 copper foil layer corresponding to the copper-free areas in a sunken mode. The utility model has the beneficial effects that: the dry film filling performance can be fully tested at one time by designing different pit depths; the design can quickly and effectively test the filling performance of the newly introduced dry film.

Description

Printed board for rapidly testing dry film filling performance

[ technical field ] A method for producing a semiconductor device

The utility model relates to the technical field of printed boards, in particular to a printed board for rapidly testing dry film filling performance.

[ background ] A method for producing a semiconductor device

With the rapid development of 5G communication and semiconductors, printed boards are well matched with the development of electronic products of this type towards high-definition, and particularly, circuits on printed boards are developed towards high-definition (50 μm → 38 μm → 15 μm), the circuits are manufactured by means of exposure imaging → development → etching of dry films without the core effect of dry films, and the circuits can be manufactured by means of exposure imaging → development → etching of dry films, while the circuits with high definition need high filling performance and bonding force, because if the materials coming from the previous process cause insufficient filling of dry films due to warpage, pits and the like of the boards, the boards are etched by liquid medicine due to the floating of the dry films during etching, which finally causes quality problems of circuit gaps, fine lines and the like, and the real filling performance of the dry films needs to be reasonably evaluated, the conventional PCB manufacturers usually use artificial methods (for example, several particles are scattered on the boards during lamination of the previous row of boards, forming a pit after pressing) manufacturing a pit on a board or pasting a dry film on a copper-clad plate to develop a small bonding pad and then obtaining an uneven surface by reducing copper, then pasting a dry film to carry out filling performance test, but the artificially manufactured pit cannot be designed and the dry film filling performance can be accurately measured, and the depth of the pit obtained by pasting the dry film to develop and reducing copper is single, if different pit depths are required to be designed, a test board with multiple designs is required to be correspondingly tested, so that manpower and material resources are greatly wasted.

Therefore, it is necessary to design a circuit board for sufficiently evaluating the dry film filling performance at a time to solve the above problems.

[ Utility model ] content

The utility model discloses a printed board for rapidly testing dry film filling performance, which can solve the technical problems related to the background technology.

In order to achieve the purpose, the technical scheme of the utility model is as follows:

the utility model provides a test dry film filling performance's printing board fast, includes from last to stacking gradually L1 copper foil layer, PP layer, L2 copper foil layer, substrate layer, L3 copper foil layer, PP layer and L4 copper foil layer that sets up extremely down, the PP layer include PP and attached in on the PP and with L1 copper foil layer perhaps the glass fiber of L4 copper foil layer butt, L2 copper foil layer the substrate layer with L3 copper foil layer constitutes the copper-clad plate, L2 copper foil layer with figure symmetry sets up on L3 copper foil layer, just L2 copper foil layer with be equipped with the no copper district of a plurality of different copper rate designs on the L3 copper foil layer, L1 copper foil layer with L4 copper foil layer corresponds the position that no copper district is sunken to be formed with the pit of the different degree of depth.

In a preferred improvement of the present invention, the copper residue ratio of the copper-free region includes 30%, 40%, 50%, 60%, 70%.

As a preferable improvement of the utility model, the PP has a thickness of 0.05mm, and the glass fiber has a thickness of 0.033 mm.

As a preferable improvement of the utility model, the thicknesses of the L2 copper foil layer and the L3 copper foil layer are both 0.07mm, and the thickness of the substrate layer is 0.15 mm.

As a preferable improvement of the utility model, the thicknesses of the L1 copper foil layer and the L4 copper foil layer are not less than 0.015 mm.

The printed board for rapidly testing the dry film filling performance provided by the utility model has the beneficial effects that:

1. the thickness of the cream layer is designed to be less than or equal to 0 according to a glue filling formula, the contact between glass fibers and copper foils after the 4-layer plate is pressed is ensured, the cross resin positions of the warp and weft glass fibers are filled in an open area to form height differences with the glass fibers, different copper residue rates correspond to different height differences, namely different pit depths, and the dry film filling performance can be fully tested at one time through the different pit depth designs;

2. the design can quickly and effectively test the filling performance of the newly introduced dry film.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:

fig. 1 is a schematic view of a laminated structure of a printed board for rapidly testing dry film filling performance provided by the present invention;

FIG. 2 is a schematic diagram of the partial copper remaining percentage design for the L2 copper foil layer and the L3 copper foil layer of the present invention;

FIG. 3 is a schematic diagram of the dishing degree corresponding to different residual copper rate positions after the pressing.

[ detailed description ] embodiments

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1-3, the printed board for rapidly testing dry film filling performance provided by the utility model comprises an L1 copper foil layer 1, a PP layer 2, an L2 copper foil layer 3, a substrate layer 4, an L3 copper foil layer 5, a PP layer 6 and an L4 copper foil layer 7 which are sequentially stacked from top to bottom, and the printed board is formed by laminating the above layers.

The thicknesses of the L1 copper foil layer and the L4 copper foil layer are not less than 0.015 mm.

The PP layer 2 comprises PP21 and glass fibers 22 attached to the PP21 and abutted to the L1 copper foil layer 1 or the L4 copper foil layer 7, specifically, the PP21 is 0.05mm in thickness, and the glass fibers 22 are 0.033mm in thickness.

L2 copper foil layer 3 the substrate layer 4 and L3 copper foil layer 5 constitutes the copper-clad plate, and is specific, L2 copper foil layer with L3 copper foil layer thickness is 0.07mm, the substrate layer thickness is 0.15 mm.

Referring to fig. 2 again, the L2 copper foil layer 3 and the L3 copper foil layer 5 are symmetrically arranged in the pattern, so that the warping of the pressed board can be prevented. And the L2 copper foil layer 3 with be equipped with the no copper district 8 that a plurality of different incomplete copper rate designs on the L3 copper foil layer 5, it is specific, the incomplete copper rate in no copper district includes but not limited to 30%, 40%, 50%, 60%, 70%, it needs to explain that, the design of incomplete copper rate is because need cream layer thickness is less than or equal to 0, the copper foil pastes that the fine position of glass contacts with the copper foil after the PP pressfitting this moment, the crisscross resin position of fine position of longitude and latitude glass corresponds different pit depths according to the incomplete copper rate position of difference, the formula cream layer thickness of filling in glue is PP thickness-fine thickness- (1-incomplete copper rate) · the copper thickness of filling in glue, design according to maximum incomplete copper rate 70%, calculate and obtain cream layer thickness < 0, other incomplete copper rate positions correspond cream layer thickness < 0.

Referring to fig. 3 again, the L1 copper foil layer 1 and the L4 copper foil layer 7 are recessed to form recesses 9 with different depths corresponding to the positions of the copper-free areas 8. The principle of formation of the pits 9 is that: after lamination and lamination, the copper foil is in contact with the glass fiber part, the copper foil is kept horizontal due to the glass fiber blocking, the resin position where the glass fibers are staggered in the longitudinal direction and the transverse direction is sunken due to downward glue filling, height differences are formed between the resin position and the glass fiber part, and different copper residue rate positions correspond to different height differences, namely different pit depths.

The printed board for rapidly testing the filling performance of the dry film has the beneficial effects that:

1. the thickness of the cream layer is designed to be less than or equal to 0 according to a glue filling formula, the contact between glass fibers and copper foil after 4-layer lamination is ensured, the staggered resin positions of the warp and weft glass fibers form height differences with the glass fibers because the resin positions are filled in an open area, different residual copper rates correspond to different height differences, namely different pit depths, and the dry film filling performance can be fully tested at one time through the different pit depth designs;

While embodiments of the utility model have been disclosed above, it is not limited to the applications set forth in the specification and the embodiments, which are fully applicable to various fields of endeavor for which the utility model pertains, and further modifications may readily be made by those skilled in the art, it being understood that the utility model is not limited to the details shown and described herein without departing from the general concept defined by the appended claims and their equivalents.

Claims

1. The utility model provides a test dry film filling performance's printing board fast, its characterized in that includes from last to stacking gradually L1 copper foil layer, PP layer, L2 copper foil layer, substrate layer, L3 copper foil layer, PP layer and L4 copper foil layer down, the PP layer include PP and attached in on the PP and with L1 copper foil layer perhaps the glass fiber of L4 copper foil layer butt, L2 copper foil layer the substrate layer with L3 copper foil layer constitutes the copper-clad plate, L2 copper foil layer with figure symmetry sets up on the L3 copper foil layer, just L2 copper foil layer with be equipped with the no copper district of the design of the incomplete copper rate of a plurality of differences on the L3 copper foil layer, L1 copper foil layer with L4 copper foil layer corresponds the position of no copper district is sunken to be formed with the pit of the different degree of depth.

2. The printed board for rapidly testing dry film filling performance according to claim 1, wherein the copper residue ratio of the copper-free area comprises 30%, 40%, 50%, 60%, 70%.

3. The printed board for rapidly testing the filling property of the dry film according to claim 1, wherein the thickness of the PP is 0.05mm, and the thickness of the glass fiber is 0.033 mm.

4. The printed board for rapidly testing the filling property of the dry film according to claim 1 or 3, wherein the thickness of the L2 copper foil layer and the thickness of the L3 copper foil layer are both 0.07mm, and the thickness of the substrate layer is 0.15 mm.

5. The printed board for rapidly testing the filling performance of the dry film according to claim 4, wherein the thickness of the L1 copper foil layer and the thickness of the L4 copper foil layer are not less than 0.015 mm.