CN115415131A - Integrated packaging device with built-in IC and LED and method thereof - Google Patents

Integrated packaging device with built-in IC and LED and method thereof Download PDF

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Publication number
CN115415131A
CN115415131A CN202211152984.6A CN202211152984A CN115415131A CN 115415131 A CN115415131 A CN 115415131A CN 202211152984 A CN202211152984 A CN 202211152984A CN 115415131 A CN115415131 A CN 115415131A
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China
Prior art keywords
mounting
built
placing
led
integrated packaging
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Granted
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CN202211152984.6A
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Chinese (zh)
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CN115415131B (en
Inventor
李浩锐
林坚耿
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Tiancheng High Tech Shenzhen Co ltd
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Shenzhen Tiancheng Lighting Co ltd
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Priority to CN202211152984.6A priority Critical patent/CN115415131B/en
Publication of CN115415131A publication Critical patent/CN115415131A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02Means for manipulating or holding work, e.g. for separate articles for particular articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles

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Abstract

The invention relates to the field of integrated packaging of light emitting diodes, in particular to an integrated packaging device with a built-in IC and an LED and a method thereof. The integrated packaging device with the built-in IC and the LED comprises a mounting base, wherein a rotating motor is fixedly mounted in the center of the top end of the mounting base, the output end of the rotating motor is fixedly connected with the center of the lower surface of a rotating workbench, the rotating workbench and the top end of the mounting base are in mutual rotating fit, and a mounting support is fixedly mounted on the primary side of the top end of the mounting base. The integrated packaging device with the built-in IC and the LED and the method thereof have the advantages that the multi-station disc type arrangement is adopted, so that the occupied area of equipment is reduced when the equipment is put into production, in addition, the mechanical transmission mode is adopted when the equipment is processed, compared with intelligent production equipment, the integrated packaging device does not need to carry out multiple times of equipment adjustment when the equipment is put into production, and can be directly put into the production of the equipment.

Description

Integrated packaging device with built-in IC and LED and method thereof
Technical Field
The invention relates to the field of integrated packaging of light emitting diodes, in particular to an integrated packaging device with a built-in IC and an LED and a method thereof.
Background
In the production of the existing LED with the built-in IC, the dispensing equipment needs to be adjusted and calibrated for multiple times when being put into a production line so as to improve the production precision of the equipment and further put into subsequent production, thus the equipment needs to be put into a large amount of time before being used, and the equipment is not beneficial to being quickly put into production.
Therefore, it is necessary to provide a new integrated package device with built-in IC and LED light emitting diode and a method thereof to solve the above technical problems.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides an integrated package device with an IC and an LED built therein and a method thereof.
The integrated packaging device of the built-in IC and the LED provided by the invention comprises: the installation base, the top central authorities fixed mounting of installation base has the rotating electrical machines, the output of rotating electrical machines and the lower surface central authorities fixed connection of swivel work head, and the cooperation of mutually rotating between swivel work head and the top of installation base, the top of installation base once inclines fixed mounting has the installing support, the top one end fixed mounting of installing support has cartridge clip feed bin, the one end fixed mounting that the installing support was kept away from on the top of installation base has the installation lug, the top fixed mounting of installation lug has the mount, the top one end sliding connection of mount has a gluing device, one side fixed mounting of mount has a gluing pump, the output of gluing pump passes through interconnect between connecting pipe and the input of adhesive deposite device, one side of installation base is equipped with glues the storehouse, fixed connection between the top of gluing the storehouse is passed through connecting pipe and the input of adhesive deposite pump, adhesive deposite device output below is equipped with the following mechanism of the adhesive deposite device mutual following removal, and follow mechanism mutually supports with between the upper surface of adhesive deposite device and swivel work head respectively, the bottom of installation base is equipped with the discharge gate.
Preferably, one end of the mounting base, which is far away from the mounting lug, is fixedly provided with an extension block which is matched with the mounting bracket.
Preferably, the following mechanism includes: restriction pole, restriction pole fixed mounting has the lower surface of adhesive deposite device, swivel work head's upper surface outer lane seted up with the restriction pole between the guide slot of mutually supporting, installation base upper surface outer lane fixed mounting has touch switch, swivel work head's upper surface outer lane equidistance fixed mounting have and touch switch between the touch switch touch board of mutually supporting, a plurality of mounting grooves have been seted up to swivel work head's upper surface equidistance, the equal fixed mounting in inside of a plurality of mounting grooves has the attenuator, the equal sliding connection in inside of a plurality of mounting grooves has the seat of placing, and a plurality of one side of placing the seat respectively with the one end fixed connection of a plurality of attenuators, the top central authorities fixed mounting of installation base has and places between the seat extrusion complex pin each other.
Preferably, the guide slot comprises following portion, the portion that resets and removal portion triplex, parallel arrangement between the following portion of guide slot and the mounting groove, is the symmetry setting between the following portion of guide slot and the portion that resets, and the removal portion of guide slot is the arc setting.
Preferably, the top end of the placing seat is provided with a placing groove, the placing groove of the placing seat is arranged as a through hole, and the top end of the placing groove of the placing seat is subjected to rounding treatment.
Preferably, one side of the touch plate is an arc-shaped device matched with the rotary workbench, and the two ends of one side of the arc-shaped touch plate are provided with fillets matched with the touch switch.
Preferably, the diameter of the discharge port is larger than the diameter of the placing groove of the placing seat.
Preferably, the pin is certain inclination setting, and the fillet has been seted up with placing extrusion fit's one end between the seat to the pin.
Preferably, the circle center of the output end of the rotating motor coincides with the circle center of the rotating workbench.
The invention also provides a packaging method of the integrated packaging device with the built-in IC and the LED, which comprises the following steps:
1) Preparing materials, namely sequentially placing the objects to be glued in the cartridge clip upper bin, and sequentially placing the placing seats by the cartridge clip upper bin in cooperation with the rotation of the rotary worktable;
2) After the step of material preparation is completed, the equipment starts to operate, the dispensing operation of the materials on the placing seat is realized through the mutual cooperation between the dispensing device and the following mechanism, the dispensing device and the following mechanism adopt mechanical follow-up, the resetting can be performed after the step of the dispensing process is completed, and then the dispensing process is performed again;
3) The materials are unloaded, and when the equipment is operated, the whole rotary worktable is periodic circular motion, and after the process of dispensing is completed, the placing seat on the rotary worktable can pass through the discharge hole which is arranged on the mounting base in advance, and at the moment, the materials on the placing seat can directly fall from the discharge hole to complete the unloading process.
Compared with the related art, the integrated packaging device with the built-in IC and the LED and the method thereof provided by the invention have the following beneficial effects:
adopt the setting of multistation disc type for equipment reduces area when putting into production, in addition, equipment is adding man-hour, what adopt is mechanical transmission mode, compare in intelligent production facility, it does not need to carry out equipment timing many times when putting into production, can directly put into the production of equipment, the construction of faster completion assembly line, in addition, the processing mode of disc type, from the material loading unloading is processed by an equipment, need not occupy too much labour, reduce the cost of production input, be favorable to the quick production of processing built-in IC and LED emitting diode.
Drawings
FIG. 1 is a schematic structural diagram of an integrated package device with built-in IC and LED and a method thereof according to a preferred embodiment of the present invention;
FIG. 2 is a schematic view of a portion of the structure shown in FIG. 1;
FIG. 3 is a schematic view of the half section shown in FIG. 1;
fig. 4 is a schematic structural view of the bottom part shown in fig. 1.
The reference numbers in the figures: 1. installing a base; 2. a rotating electric machine; 3. rotating the working table; 4. mounting a bracket; 5. loading the cartridge clip into a storage bin; 6. mounting a bump; 7. a fixed mount; 8. a dispensing device; 9. a glue dispensing pump; 10. a connecting pipe; 11. a glue bin; 12. a following mechanism; 13. a restraining bar; 14. a guide groove; 15. a touch switch; 16. a touch plate; 17. mounting grooves; 18. a damper; 19. a placing seat; 20. a stop lever; 21. and (4) a discharge port.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Specific implementations of the present invention are described in detail below with reference to specific embodiments.
Referring to fig. 1 to 4, an integrated package device with an IC and an LED light emitting diode built therein and a method thereof according to an embodiment of the present invention are provided, and the integrated package device with an IC and an LED light emitting diode built therein and the method thereof include: installation base 1, installation base 1's top central authorities fixed mounting has rotating electrical machines 2, rotating electrical machines 2's output and rotating workbench 3's lower surface central authorities fixed connection, and rotating workbench 3 and installation base 1's top between the cooperation of rotating each other, installation base 1's top side fixed mounting has installing support 4, the top one end fixed mounting of installing support 4 has cartridge clip feed bin 5, the one end fixed mounting that installing support 4 was kept away from on installation base 1's top has installation lug 6, the top fixed mounting of installation lug 6 has mount 7, the top one end sliding connection of mount 7 has adhesive deposite device 8, one side fixed mounting of mount 7 has adhesive deposite pump 9, the output of adhesive deposite pump 9 passes through interconnect between connecting pipe 10 and adhesive deposite device 8's input, one side of installation base 1 is equipped with glues storehouse 11, the top of gluing storehouse 11 is through the fixed connection between connecting pipe 10 and the input of adhesive deposite pump 9, adhesive deposite device 8 output below is equipped with the follower 12 of following each other with adhesive deposite device 8 and follows the mechanism 12 and is equipped with adhesive deposite device 8 and the outlet between the mounting surface of rotating workbench 3 respectively the adhesive deposite pump 21 upper surface.
It should be noted that: the article that will wait to glue is placed in proper order in cartridge clip feed bin 5, the rotatory realization of feed bin 5 cooperation swivel work head 3 is gone on placing seat 19 and is carried out blowing in proper order by the cartridge clip, after the step of material preparation is accomplished, at this moment, equipment begins to operate, begin to realize carrying out the glue dispensing work to the material of placing on the seat 19 through mutually supporting between adhesive deposite device 8 and follower 12, and adopt the follow-up of mechanical type between adhesive deposite device 8 and the follower 12, can reset after the step of accomplishing the glue dispensing process, subsequently, carry out the point again and glue the manufacturing procedure, when equipment is moving, whole swivel work head 3 is periodic circular motion, after accomplishing the glue dispensing process, place seat 19 on the swivel work head 3 can be through setting up in advance discharge gate 21 on installation base 1, at this moment, the material of placing on the seat 19 can directly fall from discharge gate 21 from top to bottom and accomplish the process of unloading.
In the embodiment of the present invention, referring to fig. 1, an extending block which is matched with the mounting bracket 4 is fixedly installed at one end of the mounting base 1 away from the mounting protrusion 6, so as to facilitate the fixing and installation of the mounting bracket 4.
In an embodiment of the present invention, referring to fig. 2 and 3, the following mechanism 12 includes: restriction pole 13, restriction pole 13 fixed mounting has the lower surface of adhesive deposite device 8, swivel work head 3's upper surface outer lane offer with restriction pole 13 between the guide slot 14 of mutually supporting, installation base 1 upper surface outer lane fixed mounting has touch switch 15, swivel work head 3's upper surface outer lane equidistance fixed mounting have with touch switch 15 between the touch board 16 of mutually supporting, a plurality of mounting groove 17 has been seted up to swivel work head 3's upper surface equidistance, and is a plurality of the equal fixed mounting in inside of mounting groove 17 has attenuator 18, and is a plurality of the equal sliding connection in inside of mounting groove 17 places seat 19, and a plurality of one side of placing seat 19 respectively with the one end fixed connection of a plurality of attenuator 18, installation base 1's top central authorities fixed mounting have and place mutual extrusion fit's pin 20 between the seat 19.
In an embodiment of the present invention, referring to fig. 1 and 2, the guide groove 14 is composed of a following portion, a resetting portion and a moving portion, the following portion of the guide groove 14 and the installation groove 17 are arranged in parallel, the following portion and the resetting portion of the guide groove 14 are symmetrically arranged, and the moving portion of the guide groove 14 is arranged in an arc shape.
It should be noted that: when the following mechanism 12 is used, at this time, the rotating motor 2 drives the rotating table 3 to rotate, the automatic feeding of the placing seat 19 is realized by matching with the cartridge clip feeding bin 5, meanwhile, the rotating table 3 still rotates, the dispensing device 8 can follow the guide slot 14 arranged on the rotating table 3 to synchronously change due to the limiting rod 13, firstly, the dispensing device 8 moves through the following part on the guide slot 14 through the limiting rod 13, meanwhile, the touch plate 16 moves along with the rotating table 3, the touch switch 15 is triggered, the dispensing device 8 is controlled to perform dispensing work, in addition, along with the rotation of the rotating table 3, the placing seat 19 can extrude with the stop rod 20, the placing seat 19 can slide along the mounting slot 17 due to the position of the stop rod 20, the mounting slot 17 moves along the following part of the guide slot 14, the dispensing device 8 performs dispensing work simultaneously, when the placing seat 19 moves to the tail end of the mounting slot 17, the extrusion contact critical value between the stop rod 20 and the placing seat 19 is released, then, the stop rod 20 reaches the extrusion of the placing seat 19, the extrusion of the dispensing device 8 moves along the guide slot 14, and the extrusion of the dispensing device 8 moves to the lower dispensing device 14, and the reset control device 14, thereby, the dispensing device 14 stops moving along the lower dispensing device 13, and the lower dispensing device 14, and the dispensing device moves to stop the reset of the lower dispensing device 14.
In the embodiment of the present invention, referring to fig. 1, a placing groove is formed at the top end of the placing seat 19, the placing groove of the placing seat 19 is a through hole, the top end of the placing groove of the placing seat 19 is rounded, the material can be placed by the placing groove on the placing seat 19, and in addition, the smoothness of the material entering the placing seat 19 can be increased by the rounded processing.
In the embodiment of the present invention, please refer to fig. 1 and 2, one side of the touch plate 16 is in an arc shape that is matched with the rotary table 3, both ends of the arc-shaped side of the touch plate 16 are provided with rounded corners that are matched with the touch switches 15, and the rounded corners can match with the circular motion of the rotary table 3, so that the touch distance between the touch plate 16 and the touch switches 15 is not changed, the operation stability of the dispensing device 8 is increased, the phenomenon of touch interruption is not generated, and the rounded corners are processed, so that the touch plate 16 and the touch switches 15 are more smoothly contacted.
The diameter of the discharge port 21 is larger than the diameter of the placing groove of the placing seat 19, so that the processed materials can be discharged from the placing seat 19 more conveniently.
In the embodiment of the present invention, please refer to fig. 3, the stop lever 20 is arranged at a certain slope, and a rounded corner is formed at one end of the stop lever 20, which is in press fit with the placing seat 19, so as to increase the smoothness of the press contact between the stop lever 20 and the placing seat 19.
In the embodiment of the present invention, referring to fig. 1, the center of the output end of the rotating electrical machine 2 coincides with the center of the rotating table 3, so that the stability of the rotating table 3 during operation can be increased.
A packaging method of an integrated packaging device with a built-in IC and an LED comprises the following steps:
1) Preparing materials, namely sequentially placing the objects to be glued in the cartridge clip upper bin 5, and sequentially placing the placing seats 19 by the rotation of the cartridge clip upper bin 5 in cooperation with the rotation of the rotary workbench 3;
2) After the step of material preparation is completed, the equipment starts to operate, the dispensing operation of the materials on the placing seat 19 is realized by the mutual cooperation between the dispensing device 8 and the following mechanism 12, the dispensing device 8 and the following mechanism 12 adopt mechanical following, the resetting can be performed after the step of the dispensing process is completed, and then the dispensing process is performed again;
3) The materials are unloaded, and when the equipment is operated, the whole rotary worktable 3 is periodic circular motion, and after the glue dispensing process is completed, the placing seat 19 on the rotary worktable 3 can pass through the discharge hole 21 which is arranged on the installation base 1 in advance, and at the moment, the materials on the placing seat 19 can directly fall from the discharge hole 21 to complete the unloading process.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. An integrated packaging device with built-in IC and LED light-emitting diode (LED), comprising: the mounting base (1), a rotating motor (2) is fixedly mounted in the center of the top end of the mounting base (1), the output end of the rotating motor (2) is fixedly connected with the center of the lower surface of a rotating workbench (3), the rotating workbench (3) is rotationally matched with the top end of the mounting base (1), a mounting bracket (4) is fixedly mounted on the top end of the mounting base (1) at a primary side, a cartridge clip feeding bin (5) is fixedly mounted at one end of the top end of the mounting bracket (4), a mounting lug (6) is fixedly mounted at the end, far away from the mounting bracket (4), of the top end of the mounting base (1), a fixing frame (7) is fixedly mounted at the top end of the mounting lug (6), a glue dispensing device (8) is slidably connected to one end of the top of the fixing frame (7), a glue dispensing pump (9) is fixedly mounted on one side of the fixing frame (7), the output end of the glue dispensing pump (9) is connected with the input end of the glue dispensing device (8) through a connecting pipe (10), a glue dispensing device (11) is arranged on one side of the mounting base (1), and a glue dispensing device (8) is connected with the output end of the glue dispensing pump (10) and a glue dispensing device (8) and a movable following mechanism (12) is arranged below the glue dispensing device is arranged below the connecting pipe (8), and the following mechanism (12) is respectively matched with the upper surfaces of the glue dispensing device (8) and the rotary workbench (3), and a discharge hole (21) is formed in the bottom end of the mounting base (1).
2. The integrated packaging device with built-in IC and LED (light-emitting diode) as claimed in claim 1, wherein an end of the mounting base (1) far away from the mounting bump (6) is fixedly mounted with an extension block which is matched with the mounting bracket (4).
3. The integrated package device with built-in IC and LED according to claim 1, wherein the following mechanism (12) comprises: restriction pole (13), restriction pole (13) fixed mounting has the lower surface of adhesive deposite device (8), the upper surface outer lane of swivel work head (3) seted up with between restriction pole (13) mutually supported guide slot (14), installation base (1) upper surface outer lane fixed mounting has touch switch (15), the upper surface outer lane equidistance fixed mounting of swivel work head (3) have with touch switch (15) between mutually supporting touch board (16), a plurality of mounting groove (17) have been seted up to the upper surface equidistance of swivel work head (3), and is a plurality of the equal fixed mounting in inside of mounting groove (17) has attenuator (18), and is a plurality of the equal sliding connection in inside of mounting groove (17) places seat (19), and a plurality of one side of placing seat (19) respectively with the one end fixed connection of a plurality of attenuators (18), the top central authorities fixed mounting of installation base (1) have with place between seat (19) each other extrusion fit's pin (20).
4. The integrated packaging device with built-in IC and LED according to claim 3, wherein the guide groove (14) is composed of a following portion, a resetting portion and a moving portion, the following portion of the guide groove (14) and the mounting groove (17) are arranged in parallel, the following portion and the resetting portion of the guide groove (14) are symmetrically arranged, and the moving portion of the guide groove (14) is arranged in an arc shape.
5. The integrated packaging device with built-in IC and LED according to claim 3, wherein the top end of the placing seat (19) is provided with a placing groove, the placing groove of the placing seat (19) is provided with a through hole, and the top end of the placing groove of the placing seat (19) is rounded.
6. The integrated packaging device with built-in IC and LED as claimed in claim 3, wherein one side of the touch plate (16) is in an arc shape matched with the rotary table (3), and both ends of the arc-shaped side of the touch plate (16) are provided with rounded corners matched with the touch switch (15).
7. The integrated packaging device with built-in IC and LED light-emitting diode as claimed in claim 1, wherein the diameter of the discharge hole (21) is larger than the diameter of the placement groove of the placement seat (19).
8. The integrated packaging device with built-in IC and LED as claimed in claim 3, wherein the stop lever (20) is disposed at a certain slope, and one end of the stop lever (20) which is in press fit with the placing seat (19) is rounded.
9. The integrated packaging device of the built-in IC and the LED according to claim 1, wherein the center of the output end of the rotating motor (2) coincides with the center of the rotating table (3).
10. The packaging method of the integrated packaging device with built-in IC and LED light-emitting diode according to any one of claims 1 to 9, characterized by comprising the following steps:
1) Preparing materials, namely sequentially placing the objects to be glued in the cartridge clip upper bin (5), and sequentially placing the placing seats (19) by the rotation of the cartridge clip upper bin (5) in cooperation with the rotation of the rotary workbench (3);
2) After the step of material preparation is completed, the equipment starts to operate, the dispensing of the materials on the placing seat (19) is realized through the mutual cooperation between the dispensing device (8) and the following mechanism (12), the mechanical following is adopted between the dispensing device (8) and the following mechanism (12), the resetting can be performed after the step of the dispensing process is completed, and then the dispensing process is performed again;
3) The material is unloaded, and equipment is when moving, and whole swivel work head (3) are periodic circular motion, and after accomplishing the gluey process of point, seat (19) of placing on swivel work head (3) can be through discharge gate (21) of setting in advance on installation base (1), and at this moment, the material of placing on seat (19) can directly fall from discharge gate (21) and accomplish the process of unloading.
CN202211152984.6A 2022-09-21 2022-09-21 Integrated packaging device with built-in IC and LED and method thereof Active CN115415131B (en)

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CN202211152984.6A CN115415131B (en) 2022-09-21 2022-09-21 Integrated packaging device with built-in IC and LED and method thereof

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Application Number Priority Date Filing Date Title
CN202211152984.6A CN115415131B (en) 2022-09-21 2022-09-21 Integrated packaging device with built-in IC and LED and method thereof

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CN115415131B CN115415131B (en) 2024-03-26

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM324791U (en) * 2007-07-11 2008-01-01 Kenmec Mechanical Engineering Automated dispensing apparatus
CN210546088U (en) * 2019-09-19 2020-05-19 江西奥普照明有限公司 Plug and glue dispensing integrated machine of LED lamp
CN112289717A (en) * 2020-11-11 2021-01-29 合肥高地创意科技有限公司 Semiconductor packaging device
CN114267612A (en) * 2021-12-06 2022-04-01 深圳市伟方成科技有限公司 Packaging system for LED packaging

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM324791U (en) * 2007-07-11 2008-01-01 Kenmec Mechanical Engineering Automated dispensing apparatus
CN210546088U (en) * 2019-09-19 2020-05-19 江西奥普照明有限公司 Plug and glue dispensing integrated machine of LED lamp
CN112289717A (en) * 2020-11-11 2021-01-29 合肥高地创意科技有限公司 Semiconductor packaging device
CN114267612A (en) * 2021-12-06 2022-04-01 深圳市伟方成科技有限公司 Packaging system for LED packaging

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Address after: 518000, 1st floor, Building 4, No. 263 Changfeng Road, Fenghuang Community, Fenghuang Street, Guangming District, Shenzhen, Guangdong Province

Patentee after: Tiancheng High tech (Shenzhen) Co.,Ltd.

Country or region after: China

Address before: 518000 building 4, left, 33 Dongfang Avenue, Songgang street, Bao'an District, Shenzhen City, Guangdong Province

Patentee before: SHENZHEN TIANCHENG LIGHTING Co.,Ltd.

Country or region before: China