CN115400931B - 一种减少超声换能器声串扰的深槽隔离方法及超声换能器 - Google Patents
一种减少超声换能器声串扰的深槽隔离方法及超声换能器 Download PDFInfo
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- CN115400931B CN115400931B CN202211342448.2A CN202211342448A CN115400931B CN 115400931 B CN115400931 B CN 115400931B CN 202211342448 A CN202211342448 A CN 202211342448A CN 115400931 B CN115400931 B CN 115400931B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
- B06B2201/70—Specific application
- B06B2201/76—Medical, dental
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211342448.2A CN115400931B (zh) | 2022-10-31 | 2022-10-31 | 一种减少超声换能器声串扰的深槽隔离方法及超声换能器 |
| PCT/CN2023/127260 WO2024093842A1 (fr) | 2022-10-31 | 2023-10-27 | Procédé d'isolation de tranchée profonde pour réduire la diaphonie acoustique d'un transducteur à ultrasons, et transducteur à ultrasons |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211342448.2A CN115400931B (zh) | 2022-10-31 | 2022-10-31 | 一种减少超声换能器声串扰的深槽隔离方法及超声换能器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115400931A CN115400931A (zh) | 2022-11-29 |
| CN115400931B true CN115400931B (zh) | 2023-03-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211342448.2A Active CN115400931B (zh) | 2022-10-31 | 2022-10-31 | 一种减少超声换能器声串扰的深槽隔离方法及超声换能器 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115400931B (fr) |
| WO (1) | WO2024093842A1 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111884647B (zh) * | 2020-08-13 | 2023-09-29 | 中国工程物理研究院电子工程研究所 | 一种压电微机械声波换能器阵列耦合隔离方法 |
| CN115400931B (zh) * | 2022-10-31 | 2023-03-24 | 浙江仙声科技有限公司 | 一种减少超声换能器声串扰的深槽隔离方法及超声换能器 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002057300A (ja) * | 2000-08-14 | 2002-02-22 | Toshiba Corp | 半導体装置の製造方法及び半導体装置 |
| US9351081B2 (en) * | 2013-02-27 | 2016-05-24 | Texas Instruments Incorporated | Capacitive micromachined ultrasonic transducer (CMUT) with through-substrate via (TSV) substrate plug |
| US20210314718A1 (en) * | 2016-12-29 | 2021-10-07 | Gmems Tech Shenzhen Limited | Process of fabricating lateral mode capacitive microphone including a capacitor plate with sandwich structure |
| JP2018124275A (ja) * | 2018-01-21 | 2018-08-09 | 俊 保坂 | 半導体センサー・デバイスおよびその製造方法 |
| CN109244232B (zh) * | 2018-09-13 | 2023-07-04 | 徐景辉 | 微机电系统压电换能器及制作方法 |
| CN114486014B (zh) * | 2022-03-18 | 2022-11-22 | 浙江仙声科技有限公司 | Pmut结合mems压力传感器的超声换能器单元、阵列及制造方法 |
| CN114890372B (zh) * | 2022-05-07 | 2023-07-18 | 四川大学 | 一种带隔离沟槽的pmut的设计及制备方法 |
| CN115400931B (zh) * | 2022-10-31 | 2023-03-24 | 浙江仙声科技有限公司 | 一种减少超声换能器声串扰的深槽隔离方法及超声换能器 |
-
2022
- 2022-10-31 CN CN202211342448.2A patent/CN115400931B/zh active Active
-
2023
- 2023-10-27 WO PCT/CN2023/127260 patent/WO2024093842A1/fr unknown
Non-Patent Citations (1)
| Title |
|---|
| 一种基于刻蚀的SOI深槽介质隔离工艺;刘勇等;《微电子学》;20041020(第05期);586-588页 * |
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| Publication number | Publication date |
|---|---|
| WO2024093842A1 (fr) | 2024-05-10 |
| CN115400931A (zh) | 2022-11-29 |
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