CN115389820A - MLCC insulation resistance detection device and use method - Google Patents
MLCC insulation resistance detection device and use method Download PDFInfo
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- CN115389820A CN115389820A CN202211325666.5A CN202211325666A CN115389820A CN 115389820 A CN115389820 A CN 115389820A CN 202211325666 A CN202211325666 A CN 202211325666A CN 115389820 A CN115389820 A CN 115389820A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/025—Measuring very high resistances, e.g. isolation resistances, i.e. megohm-meters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/72—Investigating presence of flaws
Abstract
The invention relates to a MLCC insulation resistance detection device and a use method thereof, wherein the MLCC insulation resistance detection device comprises: the device comprises a placing platform, an infrared scanning instrument, a mechanical arm, a control unit and a PCB; the infrared scanning instrument is arranged above the placing platform, the mechanical arm is arranged on the placing platform, the mechanical arm is provided with a hot air gun, the control panel is arranged on the side surface of the placing platform, and the control panel is respectively connected with the infrared scanning instrument, the mechanical arm and the hot air gun; the placing platform is provided with a placing groove, and the placing groove is used for placing the PCB; the infrared scanning instrument is used for shooting an infrared state diagram of the MLCC on the PCB; the mechanical arm is used for moving the hot air gun to a specified position; the control unit is used for controlling the infrared scanning instrument and the mechanical arm, and by using the hot air gun, a large number of MLCCs can be measured at one time, suspected failure capacitors are screened out for insulation resistance detection, and the failure detection efficiency of the MLCCs is remarkably improved.
Description
Technical Field
The invention relates to the field of MLCC detection, in particular to an MLCC insulation resistance detection device and a using method thereof.
Background
In recent years, with the rapid development of electronic devices and integrated circuits, the demand for miniaturization and multi-functionalization of electronic apparatuses is also increasing. Basic electronic components, especially chip multilayer ceramic capacitors (MLCC), have the advantages of small volume, multilayering, suitability for mass production, low cost, high stability and the like, and are widely applied in the industries of information, military industry, mobile communication, electronic and electric appliances, aviation, automotive electronics and the like.
The reliability of the MLCC directly affects the reliability of its application device, and therefore, it is necessary to detect the reliability of the MLCC. The reliability detection of the MLCC is generally to detect the failure of a plurality of MLCCs connected to a PCB, and during detection, the plurality of MLCCs are required to be mounted on the PCB to form a parallel circuit, and then the PCB is electrified to detect the failure of each MLCC, and when a fault is indicated by the detected parallel circuit, the MLCCs on the PCB are required to be taken down one by one and are individually detected, however, the number of the MLCCs on the PCB is large, and even hundreds or thousands of MLCCs may be detected, which seriously affects the detection efficiency.
Disclosure of Invention
Accordingly, an object of the present invention is to provide a method of using an MLCC insulation resistance detection device and a method of using the same, which have an advantage of high detection efficiency.
In one aspect, the present invention provides an MLCC insulation resistance detection apparatus, which includes:
the device comprises a placing platform, an infrared scanning instrument, a mechanical arm, a control unit and a PCB;
the infrared scanning instrument and the mechanical arm are arranged on the placing platform, a hot air gun is arranged on the mechanical arm, and the control unit is respectively connected with the infrared scanning instrument, the mechanical arm and the hot air gun;
the PCB board is provided with a power input end, a power output end and a plurality of test circuits connected with the power input end and the power output end in parallel, for each test circuit, two bonding pads connected into the test circuit in series are formed on the surface of the PCB board, and each two bonding pads are welded with MLCCs;
the infrared scanning instrument is used for scanning the PCB from the top to obtain an infrared state diagram after the power supply input end and the power supply output end are connected with an external power supply for testing;
the control unit is used for carrying out infrared spectrum image analysis on the heating abnormal points of the infrared state diagram and determining the positions of the heating abnormal points;
the control unit is further used for driving the mechanical arm to move the hot air gun to the position of the heating abnormal point and controlling the hot air gun to blow the heating abnormal point so as to blow off the MLCC welded to the heating abnormal point.
Furthermore, the hot air gun comprises an air inlet cavity and two air outlet needle tubes which are communicated with the air inlet cavity and are positioned on two sides of the bottom of the air inlet cavity, and an air outlet nozzle is formed at the bottom of each air outlet needle tube.
Furthermore, the air inlet cavity comprises an air inlet cavity and air guide cavities communicated with the two sides of the air inlet cavity, the air outlet needle tubes are communicated with the corresponding air guide cavities, the air guide cavities are communicated with the air inlet cavity through connecting channels, and the cross-sectional areas of the connecting channels are smaller than those of the air inlet cavity and the air guide cavities. The buffer function is realized for hot air.
Further, the device also comprises an adsorption tube;
an adsorption cavity is arranged at the bottom of the air inlet cavity and is positioned between the two air outlet needle tubes; the inner wall of the bottom of the adsorption cavity is provided with a fixed part, a through hole for communicating the adsorption cavity with the outside is arranged in the fixed part, the through hole comprises communicating parts at two ends and a movable part in the middle, and the inner diameter of the movable part is larger than that of the communicating parts;
a through hole is formed in the side wall of the adsorption cavity, one end of the adsorption tube penetrates through the through hole and is connected with the vacuum adsorption device, and the other end of the adsorption tube penetrates through the through hole, extends to the lower part of the adsorption cavity and is positioned between the two air outlet needle tubes;
the adsorption tube comprises a limiting part, the limiting part is located in the movable part, the size of the limiting part is smaller than that of the movable part and larger than that of the communicating part, so that the limiting part can move up and down in the movable part.
Furthermore, the movable part and the limiting part of the adsorption tube are cylindrical cavities.
Furthermore, the temperature of the hot air gun is adjustable, and the air outlet needle tube and the adsorption tube form an outward inclined inclination angle. By adjusting the air outlet temperature and the hot blowing time of the hot air gun and the distance between the hot air gun and the MLCC, the device can be adapted to the MLCC with different sizes.
In another aspect, the present invention provides a method for using an MLCC insulation resistance detection apparatus, including the steps of:
s1: providing a direct-current power supply, a PCB (printed Circuit Board) and an MLCC (Multi-level capacitor) insulation resistance detection device, wherein a test circuit is arranged on the PCB and comprises a power supply input end, a power supply output end and a plurality of test positions connected between the power supply input end and the power supply output end, the plurality of test positions are connected between the power supply input end and the power supply output end in parallel, and the PCB is arranged on a placing platform;
s2: connecting a plurality of MLCCs to each test position on the PCB, connecting the positive pole of the direct current power supply with the power supply input end of the test circuit, and connecting the negative pole of the direct current power supply with the power supply output end of the test circuit;
s3: energizing a plurality of the MLCCs on the PCB board by the DC power supply;
s4: after the power is switched on for a first time, scanning the PCB through an infrared scanning instrument to obtain a first target image, performing edge detection on the basis of the first target image to obtain a second target image only containing image information within the range of the PCB, performing color space identification on the basis of the second target image to obtain a plurality of color areas, establishing an X-Y coordinate system on the basis of the second target image, performing area division on the second target image on the basis of the color areas to obtain coordinate information of different areas, obtaining characteristic information of each color area, comparing the characteristic information with a set threshold value, and determining the area exceeding the set threshold value as a suspected-failure capacitor area;
s5: the control unit acquires coordinate information of the suspected failure capacitor area, controls the mechanical arm to move to the suspected failure capacitor area and then downwards approach the capacitor, and starts a hot air gun to blow the contact point for a period of time;
s6: and removing the suspected failure capacitor.
Further, the test bit includes two pads respectively connected to the power input terminal and the power output terminal, and step S5 specifically includes:
after the mechanical arm moves to the central position of the suspected failure capacitor area, the mechanical arm is pressed close to the capacitor downwards, the adsorption tube is in contact with the MLCC, two air outlets of the air outlet needle tube are respectively aligned to the two bonding pads, and a hot air gun is started to blow the two bonding pads for a period of time.
Further, the suspected failure capacitor is taken down by a mechanical arm, and the step S6 specifically includes:
after the hot air gun is heated and blown for a set time, the vacuum adsorption device is started, the adsorption tube adsorbs the MLCC, the mechanical arm ascends, the suspected-to-be-failed capacitor is taken away from the PCB by the adsorption tube, the mechanical arm moves to the failed capacitor placing area, the vacuum adsorption device is closed, and the suspected-to-be-failed capacitor falls into the failed capacitor placing area.
Furthermore, in step S3, the time for electrifying the PCB is 1-5 minutes, and the electrifying voltage is 1v-6v.
Further, in step S4, the time for scanning the PCB by the infrared scanning instrument is 1 to 3 minutes.
For a better understanding and practice, the invention is described in detail below with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic structural diagram of an MLCC insulation resistance detection device according to the invention;
FIG. 2 is a schematic structural diagram of a heat gun and a capacitor when the MLCC insulation resistance measurement device of the invention is in operation;
FIG. 3 is a schematic cross-sectional view of an adsorption chamber and an adsorption tube in an exemplary embodiment;
FIG. 4 is a schematic view of another structure of a heat gun of the MLCC insulation resistance measurement device according to the invention;
FIG. 5 is an equivalent circuit diagram of an exemplary prior art measurement;
fig. 6 is a flow chart of a method of using the MLCC insulation resistance detection apparatus.
Reference numerals are as follows:
1. placing a platform; 11.a placement groove; 2. an infrared scanning instrument; 21.a fixed mount; 22.a detection mechanism; 3. a mechanical arm; 31. a hot air gun; 311. an air inlet chamber; 311.a, an air inlet cavity; 311.b, a wind guide cavity; 312. an air outlet needle tube; 32. an adsorption chamber; 321.a fixed part; 321.a, a communication part; 321.b, the movable part; 322. an adsorption tube; 322.a, a limiting part; 4. a control panel; 5. a PCB board; 51. and (4) MLCC.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.
It should be understood that the embodiments described are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without any creative effort belong to the protection scope of the embodiments in the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the present application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application, as detailed in the appended claims. In the description of the present application, it is to be understood that the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not necessarily used to describe a particular order or sequence, nor are they to be construed as indicating or implying relative importance. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
Further, in the description of the present application, "a plurality" means two or more unless otherwise specified. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.
It is to be understood that the embodiments of the present application are not limited to the precise arrangements described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the embodiments of the present application is limited only by the following claims.
The reliability of the MLCC51, which is a widely used capacitor device, directly affects the reliability of the applied equipment, and therefore, it is necessary to detect the reliability of the MLCC51 during the production process. Meanwhile, the reliability of the MLCC51 is mainly measured by measuring the insulation resistance at present, and fig. 5 is an equivalent circuit diagram of an exemplary conventional measurement method. Generally, the failure of a plurality of MLCCs 51 connected to the PCB 5 is detected, during detection, the plurality of MLCCs 51 are required to be installed on the PCB 5 to form a parallel circuit, and then the PCB 5 is electrified to detect the failure of each MLCC51, when the parallel circuit is detected to prompt a fault, the MLCCs 51 on the PCB 5 are required to be taken down one by one and detected individually, or each MLCC51 is tested individually and screened one by one, or each branch of the parallel circuit where each MLCC51 is located is subjected to current detection. However, the number of MLCCs 51 on the PCB 5 is large, even as many as several hundreds to thousands, which seriously affects the detection efficiency.
Based on this, referring to fig. 1 and 2, the present embodiment provides an MLCC insulation resistance detection apparatus for solving the above problems, including:
a placing platform 1, an infrared scanning instrument 2, a mechanical arm 3, a control unit (not shown) and a PCB 5.
The placing platform 1 is provided with a placing groove 11, and the placing groove 11 is used for placing the PCB 5; a plurality of MLCCs 51 are welded on the surface A of the PCB 5, a circuit is etched on the surface B of the PCB 5, the MLCCs 51 welded on the surface A of the PCB 5 are connected in parallel, a power input end and a power output end are arranged on the PCB 5, and the power input end and the power output end are used for being connected with an external circuit. Fig. 1 shows the distribution of MLCCs 51 on the partially enlarged PCB 5, and in practice, thousands of MLCCs 51 are soldered on the PCB 5 on the partially enlarged PCB 5, and for convenience of understanding, the distribution is given as an exemplary distribution. Outer electrodes at two ends of the MLCCs 51 are welded on bonding pads of the PCB 5, the MLCCs 51 are arranged at equal intervals, and the MLCCs 51 are mutually connected in parallel.
The infrared scanning apparatus 2 includes: mount 21 and detection mechanism 22, mount 21 one end is fixed on placing platform 1, and the other end level extends, and the end that the level extends is fixed with detection mechanism 22, and detection mechanism 22 is just to PCB board 5 for shoot the detection to MLCC51 on PCB board 5 in the testing process.
The mechanical arm 3 sets up on place the platform 1, is equipped with a plurality of pivots on the mechanical arm 3, moves the motion that the mechanical arm 3 can realize XYZ three-dimensional side around the pivot through computer control mechanical arm 3, and 3 one end of mechanical arm is fixed on place the platform 1, and the other end is equipped with hot-blast rifle 31, and hot-blast rifle 31 includes air inlet chamber 311.a and air outlet. The heat gun 31 is used to blow heat at the welding point of the MLCC51 and the PCB 5, so that the MLCC51 is detached from the PCB 5.
The control unit is connected with control panel 4, and control panel 4 sets up the side at place the platform 1, and control panel 4 can control infrared scanning instrument 2, arm 3, hot-blast rifle 31's user state through setting up the parameter.
In another preferred embodiment, referring to fig. 2, the heat gun 31 further includes an air inlet chamber 311, and two air outlet needle tubes 312 connected to the air inlet chamber 311 and located at two sides of the bottom of the air inlet chamber 311, wherein the bottom of the air outlet needle tubes 312 forms an air outlet nozzle. After entering the chamber, the hot air enters the two air outlet needle tubes 312, and finally blows out the hot air to two places through the two air outlet nozzles. By the structure, accurate hot blowing of welding points of the MLCC51 and the PCB 5 can be realized, and the damage of the high temperature of the hot air gun 31 to the MLCC51 is avoided.
In another preferred embodiment, the air inlet chamber 311 includes an air inlet cavity 311.a and air guide cavities 311.b communicating with both sides of the air inlet cavity 311.a, the air outlet needle tube 312 communicates with the corresponding air guide cavities 311.b, the air guide cavities 311.b communicate with the air inlet cavity 311.a through a connecting channel, and the cross-sectional area of the connecting channel is smaller than that of the air inlet cavity 311.a and the air guide cavities 311.b. The structure can play a role in buffering blown hot air.
Referring to fig. 3, fig. 3 is a schematic cross-sectional view of the adsorption cavity 32 and the adsorption tube 322 in an exemplary embodiment, and fig. 3 is a schematic cross-sectional view only, and the space size is enlarged to better illustrate the design concept. In another preferred embodiment, a sorbent tube 322 is further included;
an adsorption cavity 32 is arranged at the bottom of the air inlet cavity 311.a, and the adsorption cavity 32 is positioned between the two air outlet needle tubes 312; a fixed part 321 is arranged on the inner wall of the bottom of the adsorption cavity 32, a through hole for communicating the adsorption cavity 32 with the outside is arranged in the fixed part 321, the through hole comprises communicating parts 321.a at two ends and a movable part 321.b in the middle, and the inner diameter of the movable part 321.b is larger than that of the communicating part 321.a;
a through hole is formed in the side wall of the adsorption cavity 32, one end of the adsorption tube 322 passes through the through hole and is connected with a vacuum adsorption device, and the other end of the adsorption tube 322 passes through the through hole, extends to the lower part of the adsorption cavity 32 and is positioned between the two air outlet needle tubes 312;
the adsorption tube 322 comprises a limiting part 322.a, the limiting part 322.a is located in the movable part 321.b, and the size of the limiting part 322.a is smaller than that of the movable part 321.b and larger than that of the communication part 321.a, so that the limiting part 322.a can move up and down in the movable part 321.b.
The bottom of the air inlet cavity 311.a is provided with an adsorption cavity 32, the adsorption cavity 32 is located between the two air outlet needle tubes 312, the adsorption cavity 32 is fixedly connected with the air inlet cavity 311.a, a through hole for communicating the adsorption cavity 32 with the outside is arranged inside the fixing portion 321, the through hole comprises a communicating portion 321.a at two ends and a movable portion 321.b at the middle, and the movable portion 321.b is a cylindrical cavity. The inner diameter of the movable portion 321.b is larger than the inner diameter of the communication portion 321.a.
The side wall of the adsorption cavity 32 is provided with a through hole, one end of the adsorption tube 322 passes through the through hole and is connected with a vacuum adsorption device (not shown), and the other end of the adsorption tube 322 passes through the through hole, extends to the lower part of the adsorption cavity 32, and is located between the two air outlet needle tubes 312. The adsorption tube 322 passes through the through hole and is directly connected with the vacuum adsorption device, so that the vacuum adsorption device is prevented from extracting air in the whole adsorption cavity 32 through the through hole to form vacuum, and resources are saved.
The adsorption tube 322 comprises a limiting part 322.a, the limiting part 322.a is also a cylindrical cavity, the limiting part 322.a is located in the movable part 321.b, and the size of the limiting part 322.a is smaller than that of the movable part 321.b and larger than that of the communication part 321.a, so that the limiting part 322.a can move up and down in the movable part 321.b.
By designing the structure, the adsorption tube 322 can be fixed in the fixing part 321 and can move up and down in the movable part 321.b, on one hand, the suspected failure capacitor can be automatically taken down from the PCB 5 by the structure, on the other hand, the situation that the adsorption tube 322 with different lengths is required to be used for avoiding the capacitor from being damaged when the mechanical arm 3 is close to the capacitor is avoided by the adsorption tube 322 with different lengths is avoided. When reducing the risk of damaging the condenser, can save the adsorption tube 322 of changing different length, the cost is solved, reduces the process.
Referring to fig. 4, fig. 4 is a schematic diagram illustrating an example, and the tilt angle and the spacing between devices are enlarged to better illustrate the design concept. In another preferred embodiment, air outlet syringe 312 and suction tube 322 form an outward inclined angle. When the MLCC51 is in different sizes, the descending distance of the mechanical arm 3, the temperature parameter of the hot air gun 31, the hot air blowing speed of the hot air gun 31 and the hot air blowing time can be set through the control panel 4, so as to realize the function of matching the application scenes of the MLCC51 in different sizes.
Referring to fig. 1, 2 and 4, the operation process of the MLCC51 insulation resistance detection apparatus of the present embodiment is as follows:
a plurality of MLCCs 51 are welded on the PCB 5, the PCB 5 is placed in the placing groove 11 after welding, the PCB 5 is connected with a circuit, the infrared scanning instrument 2 and the mechanical arm 3 are preset through the control panel 4, and the device is started after the use parameters of the hot air gun 31. After the device is started, the PCB 5 is powered on, after the power is continuously supplied for a period of time, the infrared scanning instrument 2 performs thermal imaging shooting on the area of the PCB 5 in the placing groove 11, computer equipment connected with the control panel 4 performs area division according to pictures shot by the infrared scanning instrument 2, marks the area with the temperature exceeding the threshold value, controls the mechanical arm 3 to move according to coordinate information, controls the hot air gun 31 to be close to the MLCC51 after the mechanical arm 3 moves to the specified position, controls the adsorption tube 322 to be in contact with the MLCC51 in the process of closing to the MLCC51, and because the mechanical arm 3 continues to move downwards, the adsorption tube 322 is pushed, the limiting part 322.a moves upwards, the adsorption tube 322 contracts, the MLCC51 is not damaged, and when the mechanical arm 3 stops, the adsorption tube 322 is tightly attached to the MLCC 51. And starting the hot air gun 31, hot-blowing the welding spot welded between the MLCC51 and the PCB 5 by the hot air gun 31, finishing hot-blowing after a period of hot-blowing, starting the vacuum adsorption device, adsorbing the MLCC51 by the adsorption tube 322, lifting the mechanical arm 3, falling the limiting part 322.A, and extending the adsorption tube 322. The control unit controls the mechanical arm 3 to move to the blanking area, the vacuum adsorption device stops, and the MLCC51 falls into the blanking area. The above operation is repeated until all MLCCs 51 of the region in which the temperature exceeds the threshold are taken out.
Referring to fig. 6, the present embodiment provides a method for using an MLCC insulation resistance detection apparatus, which includes the following steps:
s1: providing a direct-current power supply, a PCB (printed circuit board) 5 and the MLCC insulation resistance detection device of the embodiment, wherein the PCB 5 is provided with a test circuit, the test circuit comprises a power input end, a power output end and a plurality of test positions connected between the power input end and the power output end, the plurality of test positions are connected between the power input end and the power output end in parallel, and the PCB 5 is arranged on the placing platform 1;
s2: connecting a plurality of MLCCs 51 to each test position on the PCB 5, connecting the positive pole of a direct current power supply with the power supply input end of a test circuit, connecting the negative pole of the direct current power supply with the power supply output end of the test circuit, and setting the use parameters of the infrared scanning instrument 2, the mechanical arm 3 and the hot air gun 31 on the control panel 4;
s3: energizing a plurality of MLCCs 51 on the PCB panel 5 by a dc power supply; specifically, in this embodiment, the time for applying power to the PCB 5 is 1 to 5 minutes, and the voltage for applying power is 1 to 6v.
S4: after the power is switched on for a first time, scanning the PCB 5 through the infrared scanning instrument 2 to obtain a first target image, performing edge detection based on the first target image to obtain a second target image only containing image information within the range of the PCB 5, performing color space identification based on the second target image to obtain a plurality of color areas, establishing an X-Y coordinate system based on the second target image, performing area division on the second target image based on the color areas to obtain coordinate information of different areas, obtaining characteristic information of each color area, comparing the characteristic information with a set threshold value, and determining the area exceeding the set threshold value as a suspected failure capacitor area;
specifically, in this embodiment, the time for scanning the PCB 5 by the infrared scanning instrument 2 is 1 to 3 minutes, and the infrared scanning instrument 2 is a handheld thermal imager, and the step S2 includes: s21: generating a thermal imaging image on a display device after scanning the PCB 5 by using the infrared scanning instrument 2; s22: the regions of higher temperature are determined from the thermographic image.
When the heat amount of the MLCC51 is higher than or equal to the heat amount threshold corresponding to the temperature threshold, the thermal imaging image is displayed as a first color (such as red); when the heat of the MLCC51 is lower than the heat threshold corresponding to the temperature threshold, the thermal imaging image is displayed as a second color (e.g., blue), and the first color is different from the second color. Moreover, since the insulation resistance of the MLCC51 will increase when the MLCC51 fails, when a plurality of MLCCs 51 are connected in parallel, the current through each MLCC51 is the same, and the heat of the failed MLCC51 will be higher than the heat of the non-failed MLCC51, and the MLCC51 showing the first color in the thermal imaging image is determined to be a suspected failure capacitor.
S5: the control unit acquires coordinate information of a suspected-failure capacitor area, controls the mechanical arm 3 to move to the suspected-failure capacitor area, controls the mechanical arm 3 to downwardly approach the capacitor, controls the adsorption tube 322 to contact the capacitor in the process of approaching the capacitor, controls the adsorption tube 322 to receive thrust force due to the fact that the mechanical arm 3 continues to downwardly, controls the limiting portion 322.A to upwardly move, controls the adsorption tube 322 to shrink, prevents the capacitor from being damaged, and controls the hot air gun 31 to heat and blow a welding point when the mechanical arm 3 stops.
S6: the suspected failure capacitor is removed. Purging the suspected-to-failure capacitor through the hot air gun 31 to enable two welding points connected with the PCB 5 at the bottom of the suspected-to-failure capacitor to fall off, controlling the vacuum adsorption device to start, adsorbing the MLCC51 through the adsorption pipe 322, moving the MLCC51 to a failure capacitor placing area, controlling the vacuum adsorption device to stop, enabling the suspected-to-failure capacitor to fall into the failure capacitor placing area, and purging the suspected-to-failure capacitor through the hot air gun 31 for 80-100 seconds.
In the invention, the material of the bonding pad is tin, and the hot air blowing temperature is 300 +/-20 ℃.
The above examples only express the preferred embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, to those skilled in the art, changes and modifications may be made without departing from the spirit of the present invention, and it is intended that the present invention encompass such changes and modifications.
Claims (10)
1. An MLCC insulation resistance detection device, characterized by comprising:
the device comprises a placing platform, an infrared scanning instrument, a mechanical arm, a control unit and a PCB;
the infrared scanning instrument and the mechanical arm are arranged on the placing platform, a hot air gun is arranged on the mechanical arm, and the control unit is respectively connected with the infrared scanning instrument, the mechanical arm and the hot air gun;
the PCB board is provided with a power input end, a power output end and a plurality of test circuits connected with the power input end and the power output end in parallel, for each test circuit, two bonding pads connected into the test circuit in series are formed on the surface of the PCB board, and each two bonding pads are welded with MLCCs;
the infrared scanning instrument is used for scanning the PCB from the top to obtain an infrared state diagram after the power supply input end and the power supply output end are connected with an external power supply for testing;
the control unit is used for carrying out infrared spectrum image analysis on the heating abnormal points of the infrared state diagram and determining the positions of the heating abnormal points;
the control unit is further used for driving the mechanical arm to move the hot air gun to the position of the heating abnormal point and controlling the hot air gun to blow the heating abnormal point so as to blow off the MLCC welded to the heating abnormal point.
2. The MLCC insulation resistance detection device of claim 1, wherein:
the hot air gun comprises an air inlet chamber and two air outlet needle tubes which are communicated with the air inlet chamber and are positioned on two sides of the bottom of the air inlet chamber, and air outlet nozzles are formed at the bottoms of the air outlet needle tubes.
3. The MLCC insulation resistance detection device of claim 2, wherein:
the air inlet cavity comprises an air inlet cavity and air guide cavities communicated with the two sides of the air inlet cavity, the air outlet needle tubes are communicated with the corresponding air guide cavities, the air guide cavities are communicated with the air inlet cavity through connecting channels, and the cross-sectional areas of the connecting channels are smaller than those of the air inlet cavity and the air guide cavities.
4. The MLCC insulation resistance detection device of claim 3, wherein:
the device also comprises an adsorption tube;
an adsorption cavity is arranged at the bottom of the air inlet cavity and is positioned between the two air outlet needle tubes; the inner wall of the bottom of the adsorption cavity is provided with a fixed part, a through hole for communicating the adsorption cavity with the outside is arranged in the fixed part, the through hole comprises communicating parts at two ends and a movable part in the middle, and the inner diameter of the movable part is larger than that of the communicating parts;
a through hole is formed in the side wall of the adsorption cavity, one end of the adsorption tube penetrates through the through hole and is connected with the vacuum adsorption device, and the other end of the adsorption tube penetrates through the through hole, extends to the lower part of the adsorption cavity and is positioned between the two air outlet needle tubes;
the adsorption tube comprises a limiting part, the limiting part is located in the movable part, the size of the limiting part is smaller than that of the movable part and larger than that of the communicating part, so that the limiting part can move up and down in the movable part.
5. The MLCC insulation resistance detection device according to claim 4, wherein:
the movable part and the limiting part of the adsorption tube are cylindrical cavities.
6. The MLCC insulation resistance detection device of claim 5, wherein:
the temperature of the hot air gun is adjustable, and the air outlet needle tube and the adsorption tube form an outward inclined angle.
7. A use method of an MLCC insulation resistance detection device is characterized by comprising the following steps:
s1: providing a direct-current power supply, a PCB (printed Circuit Board) and an MLCC (Multi-level capacitor) insulation resistance detection device, wherein a test circuit is arranged on the PCB and comprises a power supply input end, a power supply output end and a plurality of test positions connected between the power supply input end and the power supply output end, the plurality of test positions are connected between the power supply input end and the power supply output end in parallel, and the PCB is arranged on a placing platform;
s2: connecting a plurality of MLCCs to each test position on the PCB, connecting the positive pole of the direct current power supply with the power input end of the test circuit, and connecting the negative pole of the direct current power supply with the power output end of the test circuit;
s3: energizing a plurality of the MLCCs on the PCB board by the DC power supply;
s4: after the PCB is electrified for a first time, scanning the PCB through an infrared scanning instrument to obtain a first target image, performing edge detection based on the first target image to obtain a second target image only containing image information in the range of the PCB, performing color space identification based on the second target image to obtain a plurality of color areas, establishing an X-Y coordinate system based on the second target image, performing area division on the second target image based on the color areas to obtain coordinate information of different areas, obtaining characteristic information of each color area, comparing the characteristic information with a set threshold value, and determining the area exceeding the set threshold value as a suspected failure capacitor area;
s5: the control unit acquires coordinate information of the suspected failure capacitor area, controls the mechanical arm to move to the suspected failure capacitor area, and starts a hot air gun to blow a contact point for a period of time after the mechanical arm is pressed close to the capacitor downwards;
s6: and removing the suspected failure capacitor.
8. The method for using the MLCC insulation resistance detection device according to claim 7, wherein the test bit comprises two pads respectively connected to the power input terminal and the power output terminal, and the step S5 specifically comprises:
after the mechanical arm moves to the central position of the suspected failure capacitor area, the mechanical arm is pressed close to the capacitor downwards, the adsorption tube is in contact with the MLCC, two air outlets of the air outlet needle tube are respectively aligned to the two bonding pads, and a hot air gun is started to blow the two bonding pads for a period of time.
9. The method for using the MLCC insulation resistance detection device according to claim 8, wherein the suspected-failure capacitor is removed by a mechanical arm, and step S6 specifically comprises:
after the hot air gun is blown for a set time, the vacuum adsorption device is started, the adsorption tube adsorbs the MLCC, the mechanical arm rises, the suspected failure capacitor is taken away from the PCB by the adsorption tube, the mechanical arm moves to the failure capacitor placing area, the vacuum adsorption device is closed, and the suspected failure capacitor falls into the failure capacitor placing area.
10. The use method of the MLCC insulation resistance detection device according to claim 7, wherein in step S3, the power is applied to the PCB for 1-5 minutes and the power voltage is 1-6 v.
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| CN116047166A (en) * | 2023-01-28 | 2023-05-02 | 四川绵润科技有限公司 | Insulation resistance test fixture based on electric capacity |
Citations (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61189443A (en) * | 1985-02-19 | 1986-08-23 | Hitachi Ltd | Pattern inspecting device for printed board |
| JPH02118467A (en) * | 1988-10-27 | 1990-05-02 | Fujitsu Ltd | Method for testing temperature of electronic equipment |
| CN2625867Y (en) * | 2003-06-05 | 2004-07-14 | 华中科技大学 | Intelligent heat radiation and infrared scanning imaging integrated experimental apparatus |
| US20070087311A1 (en) * | 2005-10-19 | 2007-04-19 | Garvey Raymond E Iii | Apparatus and Method for Infrared Imaging With Performance Algorithm |
| KR20100010680A (en) * | 2008-07-23 | 2010-02-02 | 삼화콘덴서공업주식회사 | Capacitor module |
| CN203817573U (en) * | 2013-12-27 | 2014-09-10 | 上海斐讯数据通信技术有限公司 | Bracket |
| CN105097283A (en) * | 2014-05-22 | 2015-11-25 | 株式会社村田制作所 | Multilayer ceramic capacitor |
| WO2017214503A1 (en) * | 2016-06-10 | 2017-12-14 | Brain Corporation | Systems and methods for automatic detection of spills |
| CN107775135A (en) * | 2017-11-16 | 2018-03-09 | 广州市谊华电子设备有限公司 | A kind of Multi-functional hot air tin attracting welding gun |
| CN108204861A (en) * | 2016-12-16 | 2018-06-26 | 比亚迪股份有限公司 | For detecting the temperature measuring equipment of PTC cores and there is its detection device |
| CN109580695A (en) * | 2018-12-07 | 2019-04-05 | 王国才 | A kind of adjusting method of chamber limiting device that simulating underground heat |
| CN109884121A (en) * | 2019-04-03 | 2019-06-14 | 哈尔滨商业大学 | A kind of fiber metal board defect microwave hot air excitation infrared thermal wave detection device and method |
| KR20190095080A (en) * | 2018-02-05 | 2019-08-14 | 주식회사 진시스템 | Real-time polymerase Chain Reaction Apparatus for multiple diagnosis with single sample |
| CN110174532A (en) * | 2019-05-28 | 2019-08-27 | 江苏伊施德创新科技有限公司 | A kind of method that capacitor carries box and carries out capacity measurement and aging using the load box |
| CN110632392A (en) * | 2019-11-04 | 2019-12-31 | 湖北航天技术研究院计量测试技术研究所 | Rapid testing device and testing method for insulation resistance of capacitor |
| CN110672955A (en) * | 2019-10-14 | 2020-01-10 | 华北电力大学 | Composite insulator temperature rise prediction method |
| JP2020008283A (en) * | 2018-07-02 | 2020-01-16 | 中部電力株式会社 | Blister tester and method |
| WO2020047469A2 (en) * | 2018-08-30 | 2020-03-05 | Saudi Arabian Oil Company | Machine learning system and data fusion for optimization of deployment conditions for detection of corrosion under insulation |
| CN211785947U (en) * | 2020-01-17 | 2020-10-27 | 珠海斗门超毅实业有限公司 | Circuit board insulation resistance failure detection system |
| JP2021155694A (en) * | 2020-03-26 | 2021-10-07 | 東レ株式会社 | Polyphenylene sulfide resin composition and hollow molding using the same |
| CN113613403A (en) * | 2021-07-16 | 2021-11-05 | 上海第二工业大学 | Automatic disassembling device and method for key devices of circuit board of mobile terminal |
| CN215066166U (en) * | 2021-05-07 | 2021-12-07 | 武汉融颐生物科技有限公司 | Fluorescence microscope spectral microscopic imaging device |
| WO2021258519A1 (en) * | 2020-06-24 | 2021-12-30 | 广州万孚生物技术股份有限公司 | Detection assembly, detection analyzer, and detection analysis method |
| CN215468944U (en) * | 2021-08-18 | 2022-01-11 | 常州福佑达智能装备科技有限公司 | Laser scribing equipment for preventing photovoltaic cell piece from moving |
| CN114043156A (en) * | 2022-01-12 | 2022-02-15 | 深圳市家鹏顺五金塑胶有限公司 | Charger PCB board welding jig |
| WO2022081320A1 (en) * | 2020-10-15 | 2022-04-21 | Electro Scientific Industries, Inc. | Systems and methods for use in handling components |
| CN114563670A (en) * | 2022-03-01 | 2022-05-31 | 中国大唐集团科学技术研究院有限公司中南电力试验研究院 | On-line monitoring device and method for insulation of impact capacitor in generator outlet circuit breaker |
| CN114894318A (en) * | 2022-03-21 | 2022-08-12 | 华能曲阜热电有限公司 | Infrared detection alarm system |
| JP7147093B1 (en) * | 2021-10-26 | 2022-10-04 | Ｙｕｒｉホールディングス株式会社 | Capacitor inspection method and inspection device used therefor |
-
2022
- 2022-10-27 CN CN202211325666.5A patent/CN115389820B/en active Active
Patent Citations (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61189443A (en) * | 1985-02-19 | 1986-08-23 | Hitachi Ltd | Pattern inspecting device for printed board |
| JPH02118467A (en) * | 1988-10-27 | 1990-05-02 | Fujitsu Ltd | Method for testing temperature of electronic equipment |
| CN2625867Y (en) * | 2003-06-05 | 2004-07-14 | 华中科技大学 | Intelligent heat radiation and infrared scanning imaging integrated experimental apparatus |
| US20070087311A1 (en) * | 2005-10-19 | 2007-04-19 | Garvey Raymond E Iii | Apparatus and Method for Infrared Imaging With Performance Algorithm |
| KR20100010680A (en) * | 2008-07-23 | 2010-02-02 | 삼화콘덴서공업주식회사 | Capacitor module |
| CN203817573U (en) * | 2013-12-27 | 2014-09-10 | 上海斐讯数据通信技术有限公司 | Bracket |
| CN105097283A (en) * | 2014-05-22 | 2015-11-25 | 株式会社村田制作所 | Multilayer ceramic capacitor |
| WO2017214503A1 (en) * | 2016-06-10 | 2017-12-14 | Brain Corporation | Systems and methods for automatic detection of spills |
| CN108204861A (en) * | 2016-12-16 | 2018-06-26 | 比亚迪股份有限公司 | For detecting the temperature measuring equipment of PTC cores and there is its detection device |
| CN107775135A (en) * | 2017-11-16 | 2018-03-09 | 广州市谊华电子设备有限公司 | A kind of Multi-functional hot air tin attracting welding gun |
| KR20190095080A (en) * | 2018-02-05 | 2019-08-14 | 주식회사 진시스템 | Real-time polymerase Chain Reaction Apparatus for multiple diagnosis with single sample |
| JP2020008283A (en) * | 2018-07-02 | 2020-01-16 | 中部電力株式会社 | Blister tester and method |
| WO2020047469A2 (en) * | 2018-08-30 | 2020-03-05 | Saudi Arabian Oil Company | Machine learning system and data fusion for optimization of deployment conditions for detection of corrosion under insulation |
| CN109580695A (en) * | 2018-12-07 | 2019-04-05 | 王国才 | A kind of adjusting method of chamber limiting device that simulating underground heat |
| CN109884121A (en) * | 2019-04-03 | 2019-06-14 | 哈尔滨商业大学 | A kind of fiber metal board defect microwave hot air excitation infrared thermal wave detection device and method |
| CN110174532A (en) * | 2019-05-28 | 2019-08-27 | 江苏伊施德创新科技有限公司 | A kind of method that capacitor carries box and carries out capacity measurement and aging using the load box |
| CN110672955A (en) * | 2019-10-14 | 2020-01-10 | 华北电力大学 | Composite insulator temperature rise prediction method |
| CN110632392A (en) * | 2019-11-04 | 2019-12-31 | 湖北航天技术研究院计量测试技术研究所 | Rapid testing device and testing method for insulation resistance of capacitor |
| CN211785947U (en) * | 2020-01-17 | 2020-10-27 | 珠海斗门超毅实业有限公司 | Circuit board insulation resistance failure detection system |
| JP2021155694A (en) * | 2020-03-26 | 2021-10-07 | 東レ株式会社 | Polyphenylene sulfide resin composition and hollow molding using the same |
| WO2021258519A1 (en) * | 2020-06-24 | 2021-12-30 | 广州万孚生物技术股份有限公司 | Detection assembly, detection analyzer, and detection analysis method |
| WO2022081320A1 (en) * | 2020-10-15 | 2022-04-21 | Electro Scientific Industries, Inc. | Systems and methods for use in handling components |
| CN215066166U (en) * | 2021-05-07 | 2021-12-07 | 武汉融颐生物科技有限公司 | Fluorescence microscope spectral microscopic imaging device |
| CN113613403A (en) * | 2021-07-16 | 2021-11-05 | 上海第二工业大学 | Automatic disassembling device and method for key devices of circuit board of mobile terminal |
| CN215468944U (en) * | 2021-08-18 | 2022-01-11 | 常州福佑达智能装备科技有限公司 | Laser scribing equipment for preventing photovoltaic cell piece from moving |
| JP7147093B1 (en) * | 2021-10-26 | 2022-10-04 | Ｙｕｒｉホールディングス株式会社 | Capacitor inspection method and inspection device used therefor |
| CN114043156A (en) * | 2022-01-12 | 2022-02-15 | 深圳市家鹏顺五金塑胶有限公司 | Charger PCB board welding jig |
| CN114563670A (en) * | 2022-03-01 | 2022-05-31 | 中国大唐集团科学技术研究院有限公司中南电力试验研究院 | On-line monitoring device and method for insulation of impact capacitor in generator outlet circuit breaker |
| CN114894318A (en) * | 2022-03-21 | 2022-08-12 | 华能曲阜热电有限公司 | Infrared detection alarm system |
Non-Patent Citations (3)
| Title |
|---|
| XUANLONG CHEN等: "Resistive Failure Localization of Electronic Components by Lock-in Thermography", 《2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)》 * |
| 秦德满等: "一种高绝缘电阻测试仪的设计", 《电子设计工程》 * |
| 翁珠奋等: "陶瓷绝缘子绝缘电阻检测辅助器在输电线路上的应用", 《电子元器件与信息技术》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116047166A (en) * | 2023-01-28 | 2023-05-02 | 四川绵润科技有限公司 | Insulation resistance test fixture based on electric capacity |
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Denomination of invention: MLCC insulation resistance detection device and usage method Effective date of registration: 20230815 Granted publication date: 20230324 Pledgee: Yunfu Branch of China Construction Bank Co.,Ltd. Pledgor: GUANGDONG WEIRONG ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023980052154 |
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