CN115386863B - Precise electroless plating device and method for small holes of multilayer printed circuit board - Google Patents
Precise electroless plating device and method for small holes of multilayer printed circuit board Download PDFInfo
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- CN115386863B CN115386863B CN202211057895.3A CN202211057895A CN115386863B CN 115386863 B CN115386863 B CN 115386863B CN 202211057895 A CN202211057895 A CN 202211057895A CN 115386863 B CN115386863 B CN 115386863B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
The invention discloses a precise chemical plating device and a precise chemical plating method for small holes of a multilayer printed circuit board, which relate to the technical field of small hole forming plating of the multilayer printed circuit board, wherein a positioning seat is fixedly arranged right above a groove body, a positioning groove is formed in the top surface of the positioning seat, the positioning groove penetrates through the right end surface of the positioning seat, a plurality of liquid outlet holes are formed in the groove bottom of the positioning groove along the length direction of the positioning groove, a liquid outlet pipe extending into the groove body is welded at the bottom of each liquid outlet hole, and a connector communicated with the liquid outlet pipe is formed on the left side wall of the groove body; the backing plate is erected on the first portal frame located right above the groove body, an electric cylinder is fixedly arranged at the top of the first portal frame beam, a piston rod of the electric cylinder penetrates through the beam, and a disc body is welded on the extending end. The beneficial effects of the invention are as follows: compact structure, greatly reducing the working intensity of workers, greatly improving the quality of the small hole chemical plating of the multilayer printed circuit board and having high degree of automation.
Description
Technical Field
The invention relates to the technical field of small hole forming plating layers of a multilayer printed circuit board, in particular to a precise chemical plating device and a precise chemical plating method for small holes of the multilayer printed circuit board.
Background
The electronic component assembly comprises a single-sided circuit board, a double-sided circuit board, a PCB (printed circuit board), a multi-layer printed circuit board, a printed circuit board and the like, is a core component of the controller, and can play an important role, namely, can control the automatic operation of a numerical control machine tool, cutting equipment and the like. The structure of the multi-layer printed circuit board is shown in fig. 1-2, a plurality of small holes 20 are formed in the multi-layer printed circuit board in an array, a plating layer is plated on the inner wall of each small hole 20 in the process, and the plating layer conducts each layer of circuits in the multi-layer printed circuit board.
The existing workshop adopts a chemical plating method to plate a layer of plating in the small holes 20, and the specific operation method is as follows: the worker firstly wraps the multilayer printed circuit board to be chemically plated by adopting the dry film, so that each small hole 20 is exposed, then the worker immerses the multilayer printed circuit board wrapped with the dry film into a groove body containing the chemical plating solution, and after the chemical plating solution flows into the small holes 20, a layer of plating layer can be chemically plated on the inner walls of the small holes 20.
However, although this method can chemically plate a plating layer in each small hole of the multilayer printed circuit board, the following technical drawbacks still occur in actual operation:
I. the dry film layer needs to be manually wrapped outside the multilayer printed circuit board in advance, and the whole wrapping process needs to be manually completed, which clearly increases the working strength of workers.
II. After the electroless plating is finished, the quality inspection worker detects and discovers that: some of the holes 20 are not plated, and the main reason is that after the multilayer printed circuit board is immersed in the electroless plating solution, bubbles are formed in the holes 20 or at the ports, so that the electroless plating solution cannot flow into the holes 20, and thus some of the holes 20 are not plated, and the quality of the electroless plating is greatly reduced. Therefore, there is a need for a device that greatly reduces the labor intensity of workers and greatly improves the quality of electroless plating of small holes in multilayer printed circuit boards.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a precise electroless plating device and method for the pinholes of the multilayer printed circuit board, which have compact structure, greatly lighten the working intensity of workers, greatly improve the electroless plating quality of the pinholes of the multilayer printed circuit board and have high automation degree.
The aim of the invention is achieved by the following technical scheme: the utility model provides a precision electroless plating device of multilayer printed circuit board aperture, it includes the cell body that sets firmly on the backing plate, set firmly the positioning seat directly over the cell body, set up the constant head tank on the top surface of positioning seat, the constant head tank runs through the right-hand member face setting of positioning seat, the longitudinal width of positioning seat equals the longitudinal width of multilayer printed circuit board, the tank bottom of constant head tank has seted up a plurality of drain holes along its length direction, and the drain pipe that stretches into in the cell body is all welded to the bottom of every drain hole, set up the joint rather than the intercommunication on the left side wall of cell body;
the utility model discloses a circulating pump, including the backing plate, the backing plate is erect on the backing plate, is located the first portal frame directly over the cell body, and the top of first portal frame crossbeam has set firmly the electric jar, and the piston rod of electric jar runs through the crossbeam setting, and the welding has the disk body on the extension, and the welding has many risers that correspond about the liquid outlet on the basal surface of disk body, the last port of every riser all communicates with the inner chamber of disk body, and the lower port department of every riser all has set firmly the rubber ring, the inner chamber of disk body is connected through first hose with the leakage fluid dram of circulating pump, and the drawing liquid mouth of circulating pump is connected through second hose and joint.
The right side wall of the tank body is provided with a liquid discharge valve.
The left side wall and the right side wall of the groove body are fixedly provided with brackets, and the bottom surfaces of the positioning seats are welded on the top surfaces of the two brackets.
The top of the tray body is welded with a conical pipe communicated with the tray body, and the top end opening of the conical pipe is connected with a liquid outlet of the circulating pump through a first hose.
And a second portal frame is erected on the beam of the first portal frame, and the circulating pump is fixedly arranged on the beam of the second portal frame.
The beam of the first portal frame is provided with electric cylinders at the left end and the right end, piston rods of the two electric cylinders penetrate through the beam, and the top surface of the tray body is welded to the acting ends of the piston rods of the two electric cylinders.
The chemical plating device also comprises a controller, wherein the controller is electrically connected with the electric cylinder, the liquid discharge valve and the circulating pump through signal wires.
A method for precisely electroless plating small holes of a multilayer printed circuit board comprises the following steps:
s1, workers add a certain amount of chemical plating solution into a tank body in advance, so that the liquid level of the chemical plating solution is ensured to be higher than a joint;
s2, positioning the multilayer printed circuit boards, wherein workers plug the plurality of multilayer printed circuit boards into the positioning groove at intervals from right to left, so that the leftmost multilayer printed circuit board is ensured to be abutted against the left side wall of the positioning seat, and meanwhile, two adjacent multilayer printed circuit boards are ensured to be abutted against each other, thus realizing positioning of the multilayer printed circuit boards, and at the moment, small holes which are in an array on each multilayer printed circuit board are just positioned between the liquid outlet hole and the rubber ring;
s3, the workers control piston rods of the two electric cylinders to extend downwards, the piston rods drive the disc bodies to move downwards, the disc bodies drive the vertical pipes to move downwards synchronously, after the piston rods of the electric cylinders extend completely, rubber rings on the vertical pipes correspondingly press against the top surfaces of the multilayer printed circuit boards, and the rubber rings are communicated with small holes in an array on the multilayer printed circuit boards;
s4, a worker controls a circulating pump to start, the circulating pump pumps out the chemical plating solution in the tank body, the pumped chemical plating solution sequentially passes through the connector, the second hose, the circulating pump, the first hose, the conical tube, the inner cavity of the tray body, the vertical tube, the rubber ring and the small holes and the liquid outlet holes which are arranged in an array on the multilayer printed circuit board, and finally the chemical plating solution is returned to the tank body through the liquid outlet tube, wherein a plating layer is formed on the inner wall of the small holes in the process of flowing through the small holes, and after the circulating pump continuously works for a period of time, the plating layer can be formed in each small hole on each multilayer printed circuit board;
s5, taking out the multilayer printed circuit board, after forming, controlling a piston rod of an electric cylinder to retract upwards by a worker, driving a disc body to move upwards by the piston rod, driving a vertical pipe to move upwards by the disc body, and taking out the multilayer printed circuit board from a positioning groove from left to right by the worker after resetting;
s6, repeating the operations of the steps S1-S5, and forming a plating layer in the small holes of the multilayer printed circuit board of another batch.
The invention has the following advantages: compact structure, greatly reducing the working intensity of workers, greatly improving the quality of the small hole chemical plating of the multilayer printed circuit board and having high degree of automation.
Drawings
FIG. 1 is a schematic diagram of a multi-layer printed circuit board;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a schematic diagram of the structure of the present invention;
FIG. 4 is a schematic view of a positioning seat;
FIG. 5 is a top view of FIG. 4;
FIG. 6 is a schematic view of the positioning of a multilayer printed circuit board according to the present invention;
FIG. 7 is a schematic view in the direction A of FIG. 6;
FIG. 8 is a schematic view of the piston rod of the electric cylinder fully extended;
FIG. 9 is an enlarged partial schematic view of the portion I of FIG. 8;
in the figure, 1-backing plate, 2-groove body, 3-positioning seat, 4-positioning groove, 5-liquid outlet hole, 6-liquid outlet pipe, 7-connector, 8-first portal frame, 9-electric cylinder, 10-disk body, 11-riser, 12-rubber ring, 13-circulating pump, 14-first hose, 15-second hose, 16-drain valve, 17-support, 18-conical tube, 19-second portal frame, 20-aperture, 21-multilayer printed circuit board.
Detailed Description
The invention is further described below with reference to the accompanying drawings, the scope of the invention not being limited to the following:
as shown in fig. 3-4, the precise chemical plating device for the small holes of the multilayer printed circuit board comprises a groove body 2 fixedly arranged on a base plate 1, a positioning seat 3 is fixedly arranged right above the groove body 2, a positioning groove 4 is formed in the top surface of the positioning seat 3, the positioning groove 4 penetrates through the right end surface of the positioning seat 3, the longitudinal width of the positioning seat 3 is equal to that of the multilayer printed circuit board, a plurality of liquid outlet holes 5 are formed in the groove bottom of the positioning groove 4 along the length direction of the groove bottom, a liquid outlet pipe 6 extending into the groove body 2 is welded at the bottom of each liquid outlet hole 5, and a connector 7 communicated with the liquid outlet pipe is formed in the left side wall of the groove body 2;
the backing plate 1 is erected with a first portal frame 8 positioned right above the groove body 2, an electric cylinder 9 is fixedly arranged at the top of a cross beam of the first portal frame 8, a piston rod of the electric cylinder 9 penetrates through the cross beam, a tray body 10 is welded on an extending end, a plurality of vertical pipes 11 vertically corresponding to the liquid outlet holes 5 are welded on the bottom surface of the tray body 10, an upper port of each vertical pipe 11 is communicated with an inner cavity of the tray body 10, rubber rings 12 are fixedly arranged at lower ports of the vertical pipes 11, the inner cavity of the tray body 10 is connected with a liquid outlet of a circulating pump 13 through a first hose 14, and a liquid outlet of the circulating pump 13 is connected with a joint 7 through a second hose 15.
A drain valve 16 is arranged on the right side wall of the tank body 2. The left side wall and the right side wall of the groove body 2 are fixedly provided with brackets 17, and the bottom surfaces of the positioning seats 3 are welded on the top surfaces of the two brackets 17. The top of the tray body 10 is welded with a conical pipe 18 communicated with the tray body, and the top end opening of the conical pipe 18 is connected with the liquid outlet of the circulating pump 13 through a first hose 14. The beam of the first portal frame 8 is erected with a second portal frame 19, the circulating pump 13 is fixedly arranged on the beam of the second portal frame 19, the beam of the first portal frame 8 is provided with the electric cylinders 9 fixedly at the left end and the right end of the beam, piston rods of the two electric cylinders 9 penetrate through the beam, and the top surface of the tray body 10 is welded on the acting ends of the piston rods of the two electric cylinders 9.
The chemical plating device further comprises a controller, the controller is electrically connected with the electric cylinder 9, the liquid discharge valve 16 and the circulating pump 13 through signal wires, a worker can control the extension or retraction of a piston rod of the electric cylinder 9 through the controller, and meanwhile, the liquid discharge valve 16 and the circulating pump 13 can be controlled to be started or closed, so that the operation of the worker is facilitated, and the chemical plating device has the characteristic of being high in automation degree.
A method for precisely electroless plating small holes of a multilayer printed circuit board comprises the following steps:
s1, workers add a certain amount of chemical plating solution into a tank body 2 in advance, so that the liquid level of the chemical plating solution is ensured to be higher than a joint 7;
s2, positioning the multilayer printed circuit boards, wherein a worker plugs a plurality of multilayer printed circuit boards 21 into the positioning groove 4 from right to left at intervals, so that the leftmost multilayer printed circuit board 21 is ensured to be abutted against the left side wall of the positioning seat 3, and meanwhile, two adjacent multilayer printed circuit boards 21 are ensured to be abutted against each other, thereby realizing positioning of the multilayer printed circuit boards, and as shown in fig. 6-7, the small holes 20 in an array on each multilayer printed circuit board 21 are just positioned between the liquid outlet holes 5 and the rubber rings 12;
s3, a worker controls piston rods of the two electric cylinders 9 to extend downwards, the piston rods drive the disc body 10 to move downwards, the disc body 10 drives the vertical pipes 11 to move downwards synchronously, after the piston rods of the electric cylinders 9 extend completely, rubber rings 12 on the vertical pipes 11 correspondingly press against the top surfaces of the multilayer printed circuit boards 21, and the rubber rings 12 are communicated with small holes 20 in arrays on the multilayer printed circuit boards 21, as shown in fig. 8-9;
s4, a worker controls the circulating pump 13 to start, the circulating pump 13 pumps out the chemical plating solution in the tank body 2, the pumped chemical plating solution sequentially passes through the joint 7, the second hose 15, the circulating pump 13, the first hose 14, the conical tube 18, the inner cavity of the tray body 10, the vertical tube 11, the rubber ring 12, the small holes 20 and the liquid outlet holes 5 which are arranged on the multilayer printed circuit board 21, and finally the chemical plating solution is returned to the tank body 2 through the liquid outlet pipe 6, the flowing direction is shown by the hollow arrow in FIG. 8, wherein a plating layer is formed on the inner wall of the small holes 20 in the process of flowing through the small holes 20, and after the circulating pump 13 continuously works for a period of time, the plating layer can be formed in each small hole 20 on each multilayer printed circuit board 21;
in the steps S1-S4, namely in the process of forming the coating in the small holes 20, a worker only needs to position the multilayer printed circuit boards 21 in the positioning grooves 4, then sequentially starts the electric cylinders 9 and the circulating pumps 13, and the coating can be formed in the small holes of each multilayer printed circuit board 21.
In addition, the chemical plating solution pumped out from the tank body 2 by the circulating pump 13 is continuously pumped into the small holes 20 of the multilayer printed circuit board 21, and compared with the traditional immersion type chemical plating method, bubbles are not formed in the small holes 20 or at the ports, so that the inner wall of the small holes 20 in an array on each multilayer circuit board is ensured to be plated, and the chemical plating quality of the small holes 20 in the multilayer printed circuit board, namely the chemical plating precision, is greatly improved.
S5, taking out the multilayer printed circuit board, after forming, controlling a piston rod of the electric cylinder 9 to retract upwards by a worker, driving the disc body 10 to move upwards by the piston rod, driving the vertical pipe 11 to move upwards by the disc body 10, and taking out the multilayer printed circuit board 21 from the positioning groove 4 from left to right by the worker after resetting;
s6, repeating the operations of the steps S1 to S5, and forming a plating layer in the small holes 20 of the multilayer printed circuit board 21 of another batch.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (1)
1. The method adopts a chemical plating device, the chemical plating device comprises a groove body (2) fixedly arranged on a base plate (1), a positioning seat (3) is fixedly arranged right above the groove body (2), a positioning groove (4) is formed in the top surface of the positioning seat (3), the positioning groove (4) penetrates through the right end face of the positioning seat (3), the longitudinal width of the positioning seat (3) is equal to that of the multilayer printed circuit board, a plurality of liquid outlet holes (5) are formed in the groove bottom of the positioning groove (4) along the length direction of the positioning groove, a liquid outlet pipe (6) extending into the groove body (2) is welded at the bottom of each liquid outlet hole (5), and a connector (7) communicated with the liquid outlet pipe is formed in the left side wall of the groove body (2);
the base plate (1) is erected with a first portal frame (8) positioned right above the groove body (2), an electric cylinder (9) is fixedly arranged at the top of a cross beam of the first portal frame (8), a piston rod of the electric cylinder (9) penetrates through the cross beam, a tray body (10) is welded at the extending end, a plurality of vertical pipes (11) vertically corresponding to the liquid outlet holes (5) are welded on the bottom surface of the tray body (10), the upper port of each vertical pipe (11) is communicated with the inner cavity of the tray body (10), a rubber ring (12) is fixedly arranged at the lower port of each vertical pipe (11), the inner cavity of the tray body (10) is connected with a liquid outlet of a circulating pump (13) through a first hose (14), and a liquid pumping port of the circulating pump (13) is connected with a joint (7) through a second hose (15); a liquid discharge valve (16) is arranged on the right side wall of the tank body (2); brackets (17) are fixedly arranged on the left side wall and the right side wall of the groove body (2), and the bottom surfaces of the positioning seats (3) are welded on the top surfaces of the two brackets (17); the top of the tray body (10) is welded with a conical pipe (18) communicated with the tray body, and the top end opening of the conical pipe (18) is connected with a liquid outlet of the circulating pump (13) through a first hose (14); a second portal frame (19) is erected on the cross beam of the first portal frame (8), and the circulating pump (13) is fixedly arranged on the cross beam of the second portal frame (19); the transverse beam of the first portal frame (8) is fixedly provided with electric cylinders (9) at the left end and the right end of the transverse beam, piston rods of the two electric cylinders (9) penetrate through the transverse beam, and the top surface of the tray body (10) is welded on the acting ends of the piston rods of the two electric cylinders (9); the chemical plating device further comprises a controller, wherein the controller is electrically connected with the electric cylinder (9), the liquid discharge valve (16) and the circulating pump (13) through signal wires, and the chemical plating device is characterized in that: the method comprises the following steps:
s1, workers add a certain amount of chemical plating solution into a tank body (2) in advance, so that the liquid level of the chemical plating solution is ensured to be higher than a joint (7);
s2, positioning the multilayer printed circuit boards, wherein a worker plugs a plurality of multilayer printed circuit boards (21) into the positioning groove (4) from right to left at intervals, so that the leftmost multilayer printed circuit board (21) is ensured to be abutted against the left side wall of the positioning seat (3), and meanwhile, two adjacent multilayer printed circuit boards (21) are ensured to be abutted against each other, thereby realizing positioning of the multilayer printed circuit boards, and at the moment, small holes (20) which are arrayed on each multilayer printed circuit board (21) are just positioned between the liquid outlet hole (5) and the rubber ring (12);
s3, controlling piston rods of the two electric cylinders (9) to extend downwards by workers, driving the disc body (10) to move downwards by the piston rods, driving the stand pipes (11) to move downwards synchronously by the disc body (10), and correspondingly pressing rubber rings (12) on the stand pipes (11) on the top surfaces of the multilayer printed circuit boards (21) after the piston rods of the electric cylinders (9) extend completely, wherein the rubber rings (12) are communicated with small holes (20) which are arranged in an array on the multilayer printed circuit boards (21);
s4, a worker controls a circulating pump (13) to start, the circulating pump (13) pumps out the chemical plating solution in the tank body (2), the pumped chemical plating solution sequentially passes through a joint (7), a second hose (15), the circulating pump (13), a first hose (14), a conical pipe (18), an inner cavity of a tray body (10), a vertical pipe (11), a rubber ring (12) and small holes (20) and liquid outlet holes (5) which are arranged in an array on a multilayer printed circuit board (21), and finally the chemical plating solution is returned to the tank body (2) through the liquid outlet pipe (6), wherein a plating layer is formed on the inner wall of the small holes (20) in the process of flowing through the small holes (20), and after the circulating pump (13) continuously works for a period of time, the plating layer can be formed in each small hole (20) on each multilayer printed circuit board (21);
s5, taking out the multilayer printed circuit board, after forming, controlling a piston rod of an electric cylinder (9) to retract upwards by a worker, driving a disc body (10) to move upwards by the piston rod, driving a vertical pipe (11) to move upwards by the disc body (10), and taking out the multilayer printed circuit board (21) from the positioning groove (4) from left to right by the worker after resetting;
s6, repeating the operations of the steps S1-S5, and forming a plating layer in the small holes (20) of the multilayer printed circuit board (21) of another batch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211057895.3A CN115386863B (en) | 2022-08-31 | 2022-08-31 | Precise electroless plating device and method for small holes of multilayer printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211057895.3A CN115386863B (en) | 2022-08-31 | 2022-08-31 | Precise electroless plating device and method for small holes of multilayer printed circuit board |
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| CN115386863A CN115386863A (en) | 2022-11-25 |
| CN115386863B true CN115386863B (en) | 2023-07-07 |
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| CN116219414B (en) * | 2023-02-01 | 2023-10-20 | 四川英创力电子科技股份有限公司 | Copper plating device and method for improving electroless plating quality of circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455363A (en) * | 2016-08-09 | 2017-02-22 | 华进半导体封装先导技术研发中心有限公司 | Printed circuit board manufacturing method and printed circuit board |
| KR20220046958A (en) * | 2020-10-08 | 2022-04-15 | 한국생산기술연구원 | Electroless plating method of printed circuit board |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0548267A (en) * | 1991-08-15 | 1993-02-26 | Mitsubishi Electric Corp | Electroless plating method for printed circuit board |
| JP4216135B2 (en) * | 2003-06-30 | 2009-01-28 | シャープ株式会社 | Plating equipment |
| JP2006093651A (en) * | 2004-08-26 | 2006-04-06 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board and non-electrolytic plating device for wiring board manufacture |
| CN104178754B (en) * | 2013-05-23 | 2017-02-08 | 中国科学院大连化学物理研究所 | A cyclic chemical plating method for a multi-channel metal palladium composite film |
| KR102113690B1 (en) * | 2019-02-07 | 2020-05-21 | 김원영 | Basket Device for Electrless of Printed Circuit Board |
| CN212894972U (en) * | 2020-05-25 | 2021-04-06 | 南雄市溢诚化工有限公司 | Chemical tinning device for printed circuit board |
| CN111560629A (en) * | 2020-06-19 | 2020-08-21 | 四川海英电子科技有限公司 | Electroplating method for micropores on high-speed high-density board |
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| CN214782206U (en) * | 2021-01-19 | 2021-11-19 | 西安德宇机械科技有限公司 | Deep hole nickel plating device |
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| CN114262919B (en) * | 2022-01-25 | 2023-04-21 | 四川深北电路科技有限公司 | Electroplating device and electroplating method for electroplating copper layers with equal thickness on printed circuit board |
| CN114351199B (en) * | 2022-02-09 | 2023-04-21 | 四川深北电路科技有限公司 | Equipment and electroplating process for precisely electroplating through holes in high-frequency circuit board |
| CN114351221B (en) * | 2022-02-17 | 2022-10-25 | 四川英创力电子科技股份有限公司 | System and method for automatically and quantitatively adding liquid medicine for electroplating printed circuit board |
| CN217283646U (en) * | 2022-04-29 | 2022-08-23 | 肇庆昌隆电子有限公司 | Circuit board electro-coppering hole-filling device |
| CN114885503B (en) * | 2022-05-06 | 2023-05-05 | 四川海英电子科技有限公司 | Forming device and method for precisely forming high-frequency high-speed printed circuit board |
| CN114786366B (en) * | 2022-06-22 | 2022-09-02 | 四川英创力电子科技股份有限公司 | Floating type chemical plating device and method for driving bubbles in holes of circuit board |
| CN114828432B (en) * | 2022-06-27 | 2022-09-02 | 四川英创力电子科技股份有限公司 | Device and method for precisely manufacturing high-speed printed circuit board |
-
2022
- 2022-08-31 CN CN202211057895.3A patent/CN115386863B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455363A (en) * | 2016-08-09 | 2017-02-22 | 华进半导体封装先导技术研发中心有限公司 | Printed circuit board manufacturing method and printed circuit board |
| KR20220046958A (en) * | 2020-10-08 | 2022-04-15 | 한국생산기술연구원 | Electroless plating method of printed circuit board |
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