CN217283646U

CN217283646U - Circuit board electro-coppering hole-filling device

Info

Publication number: CN217283646U
Application number: CN202221056212.8U
Authority: CN
Inventors: 胡国安; 张进权
Original assignee: Zhaoqing Changlong Electronics Co ltd
Current assignee: Zhaoqing Changlong Electronics Co ltd
Priority date: 2022-04-29
Filing date: 2022-04-29
Publication date: 2022-08-23
Anticipated expiration: 2032-04-29

Abstract

The utility model discloses a circuit board electro-coppering hole-filling device, which comprises a copper cylinder, a return pipe, a circulating pump, a lifting mechanism, a lifting platform, a parallel baffle, a jet flow box arranged in the parallel baffle, and a circulating pushing mechanism arranged on the lifting platform; the jet flow box comprises a box body, a first jet screen plate arranged on the side surface of the box body and a flow slowing plate arranged in the center of the interior of the box body; the first injection net plate is provided with first injection holes at equal intervals; the device comprises an L-shaped support plate and a limit plate, wherein second injection holes are formed in the vertical surface of the L-shaped support plate at equal intervals; through the cooperation of circulation pushing mechanism and jet-flow case, realize the up-and-down reciprocating motion of jet-flow case, cooperate circulating pump, back flow, first jet orifice and second jet orifice again, realize the continuous dislocation of first jet orifice and second jet orifice, increase or reduce the size of the jet-flow copper liquid of circuit board both sides from corresponding, and then be convenient for discharge the bubble, improve the copper facing effect.

Description

Circuit board electro-coppering hole-filling device

Technical Field

The utility model relates to a circuit board production preparation field, concretely relates to circuit board electro-coppering pore-filling device.

Background

At present, in a printed circuit board, conduction of an interlayer line is generally realized through a plated through hole. The quality of plated through holes is generally difficult to ensure, and especially for holes with high aspect ratio, bubbles can exist in the through holes of the circuit board when the circuit board is placed in a circuit board copper plating device and copper plating is carried out. The existing solution is to accelerate the flow of the bath solution by using modes such as swinging, ultrasonic oscillation and the like to take away bubbles in the through hole. However, the swing and the ultrasonic oscillation also generate micro bubbles, and the bubbles remain in the through hole, so that a cavity exists in a copper plating layer formed after the through hole is plated with copper, and further, the copper plating layer in the through hole may be broken in later processes such as high-temperature and high-pressure pressing, mounting and the like, thereby seriously affecting the conduction performance and the signal transmission quality of the circuit board. Therefore, there is a need for a copper plating apparatus for a circuit board, which can prevent the copper plating layer in the via hole from cracking by making the bubbles in the via hole of the circuit board easily escape during the copper plating process.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present invention provides a copper electroplating hole filling device for circuit board.

In order to solve the technical problem, the technical scheme of the utility model is that: a circuit board copper electroplating hole filling device comprises a copper cylinder, return pipes symmetrically arranged at the bottom of the copper cylinder, a circulating pump arranged on the return pipes, lifting mechanisms symmetrically arranged at the front side and the rear side of the copper cylinder, a lifting platform arranged on the lifting mechanisms, parallel baffles symmetrically arranged in the copper cylinder, jet flow boxes arranged in the parallel baffles and communicated with the tail ends of the return pipes, and a circulating pushing mechanism arranged on the lifting platform and hinged with the jet flow boxes at one end.

Preferably, the circulation pushing mechanism comprises a double-head motor, a first rotating disc and a second rotating disc which are respectively arranged at two ends of a rotating shaft of the double-head motor, a fixed shaft arranged on the first rotating disc and the second rotating disc, and a connecting rod arranged on the fixed shaft and movably connected with the fixed shaft.

Preferably, the spouting tank includes a tank body, a first jet screen provided on a side surface of the tank body, and a baffle plate provided in a center inside the tank body.

Preferably, the first injection holes are formed in the first injection mesh plate at equal intervals.

Preferably, the parallel baffle comprises an L-shaped support plate and a limit plate, and second injection holes are arranged on the vertical surface of the L-shaped support plate at equal intervals.

Preferably, the return pipe is provided with a telescopic joint.

The utility model discloses technical effect mainly embodies: through the cooperation of circulation pushing mechanism and jet-flow case, realize the up-and-down reciprocating motion of jet-flow case, cooperate circulating pump, back flow, first jet orifice and second jet orifice again, realize the continuous dislocation of first jet orifice and second jet orifice, increase or reduce the size of the jet-flow copper liquid of circuit board both sides from corresponding, and then be convenient for discharge the bubble, improve the copper facing effect.

Drawings

FIG. 1 is a schematic diagram of a copper electroplating hole filling apparatus for a circuit board according to the present invention;

fig. 2 is a structural view of the jet box of fig. 1.

Detailed Description

The following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings, so as to make the technical solutions of the present invention easier to understand and grasp.

In the present embodiment, it should be understood that the terms "middle", "upper", "lower", "top", "right", "left", "above", "back", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the present embodiment, if the connection or fixing manner between the components is not specifically described, the connection or fixing manner may be a bolt fixing manner, a pin connecting manner, or the like, which is commonly used in the prior art, and therefore, details thereof are not described in the present embodiment.

A copper electroplating hole filling device for a circuit board comprises a copper cylinder 1, return pipes 2 symmetrically arranged at the bottom of the copper cylinder 1, lifting mechanisms 4 symmetrically arranged at the front side and the rear side of the copper cylinder 1, lifting platforms 5 arranged on the lifting mechanisms 4, parallel baffle plates 6 symmetrically arranged in the copper cylinder 1, a flow control device for controlling the flow of copper liquid sprayed from the spray pipes 7, a spray tank 7 arranged in the parallel baffle plates 6 and communicated with the tail end of the return pipe 2, a buffer flow treatment device for buffering the copper liquid refluxed in the return pipe 2 and a control device for controlling the flow of copper liquid according to the liquid pressure generated by the circulation pumps 3, the copper spraying device comprises a copper cylinder 1, a circulating pushing mechanism 8 which is arranged on the lifting platform 5 and one end of which is hinged with a spraying box 7, and is used for circularly adjusting the height of the spraying box 7 so as to enable the spraying box 7 and a parallel baffle 6 to generate relative displacement; the return pipe 2 is provided with an expansion joint 21, so that the return pipe 2 and the upper end of the return pipe move up and down along with the jet flow box 7.

The circulating pushing mechanism 8 comprises a double-head motor 81, a first rotating disc 82 and a second rotating disc 83 which are respectively arranged at two ends of a rotating shaft of the double-head motor 81 and are rotated by the double-head motor 81 so as to drive the first rotating disc 82 and the second rotating disc 83 to rotate, a fixed shaft 84 arranged on the first rotating disc 82 and the second rotating disc 83, a connecting rod 85 arranged on the fixed shaft 84 and movably connected with the fixed shaft 84 and used for hinging the fixed shaft 84 and the jet flow box 7, so that after the first rotating disc 82 and the second rotating disc 83 rotate, the fixed shaft 84 rotates and drives the jet flow box 7 to move up and down.

The jet flow box 7 comprises a box body 71, a first jet screen plate 72 arranged on the side surface of the box body 71, and a flow slowing plate 73 arranged in the center of the inside of the box body 71 and used for slowing down the flow velocity of the copper liquid sprayed out of the return pipe 2; the first spraying net plate 72 is provided with first spraying holes 74 at equal intervals, and the first spraying holes 74 spray the copper liquid.

The parallel baffle 6 comprises an L-shaped support plate 61 and a limiting plate 62, wherein the limiting plate 62 is used for limiting the jet flow box 7, and second jet holes 63 are arranged on the vertical surface of the L-shaped support plate 61 at equal intervals and used for controlling the flow of the copper liquid jetted from the first jet holes 74.

The working principle is as follows: firstly, under the action of the circulation pushing mechanism 8 and the circulation pump 3, the circulation up-and-down movement of the jet flow box 7 is realized, and high-pressure copper liquid is pumped into the jet flow box 7, and then the copper liquid in the jet flow box 7 can be jetted onto the circuit board only through the first jet screen plate 72 and the first jet hole 74 and the second jet hole 63 on the L-shaped support plate 61, wherein due to the up-and-down movement of the jet flow box 7, dislocation is continuously formed between the first jet hole 74 and the second jet hole 63, so that the sectional area and the speed of copper liquid jet flow are continuously adjusted, and the height of the circulation pushing mechanism 8 is adjusted by matching with the lifting mechanism 4, so that the dislocation relation between the first jet hole 74 and the second jet hole 63 is changed, thereby the jet flow strength at two sides of the circuit board is different, bubbles in the through holes are more easily discharged, and the copper plating effect is improved.

Of course, the above is only a typical example of the present invention, and besides, the present invention can also have other various specific embodiments, and all technical solutions adopting equivalent replacement or equivalent transformation are all within the scope of the present invention as claimed.

Claims

1. The utility model provides a circuit board electro-coppering pore-filling device, includes the copper jar, the symmetry sets up the back flow of copper jar bottom sets up circulating pump on the back flow, its characterized in that: the device comprises lifting mechanisms symmetrically arranged on the front side and the rear side of the copper cylinder, a lifting platform arranged on the lifting mechanisms, parallel baffle plates symmetrically arranged in the copper cylinder, jet flow boxes arranged in the parallel baffle plates and communicated with the tail ends of the return pipes, and a circulating pushing mechanism arranged on the lifting platform and hinged with the jet flow boxes at one end.

2. The copper electroplating via filling device for circuit board as claimed in claim 1, wherein: circulation pushing mechanism includes double-end motor, sets up respectively the first rotating disk and the second rotating disk at double-end motor's axis of rotation both ends, and set up fixed axle on first rotating disk and the second rotating disk sets up fixed epaxial and with fixed axle swing joint's connecting rod.

3. The copper electroplating via filling device for circuit board as claimed in claim 1, wherein: the jet flow box comprises a box body, a first jet screen plate arranged on the side face of the box body, and a flow buffering plate arranged in the center of the interior of the box body.

4. The copper electroplating via filling device for circuit board as claimed in claim 3, wherein: the first injection net plate is provided with first injection holes at equal intervals.

5. The copper electroplating via filling device for circuit board as claimed in claim 1, wherein: the parallel baffle comprises an L-shaped supporting plate and a limiting plate, and second spraying holes are formed in the vertical surface of the L-shaped supporting plate at equal intervals.

6. The copper electroplating via filling device for circuit board as claimed in claim 1, wherein: the return pipe is provided with a telescopic joint.