CN114351199A - Equipment and electroplating process for precise electroplating of through holes in high-frequency circuit board - Google Patents
Equipment and electroplating process for precise electroplating of through holes in high-frequency circuit board Download PDFInfo
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- CN114351199A CN114351199A CN202210120486.7A CN202210120486A CN114351199A CN 114351199 A CN114351199 A CN 114351199A CN 202210120486 A CN202210120486 A CN 202210120486A CN 114351199 A CN114351199 A CN 114351199A
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Abstract
The invention discloses equipment and an electroplating process for precise electroplating of through holes in a high-frequency circuit board, and the equipment comprises a workbench (4), a first portal frame (5) and a second portal frame (6) which are sequentially and fixedly arranged on the table top of the workbench (4), and a through groove (7) formed in the cross beam of the first portal frame (5), wherein a hollow tube (8) positioned right below the through groove (7) is fixedly arranged on the table top of the workbench (4), the top end and the bottom end of the hollow tube (8) are both closed, a guide hole (9) communicated with the closed top end of the hollow tube (8) is formed in the closed top end of the hollow tube, a plurality of radial holes (10) communicated with the hollow tube are formed in the cylindrical surface of the hollow tube (8), two positioning columns (11) are fixedly arranged on the table top of the workbench (4), and the two positioning columns (11) are respectively arranged on the left side and the right side of the hollow tube (8). The invention has the beneficial effects that: compact structure, improved electroplating quality, improved high-frequency circuit board production quality, reduced worker working strength, and simple operation.
Description
Technical Field
The invention relates to the technical field of forming an electroplated layer on the inner wall of a through hole of a high-frequency circuit board, in particular to equipment and an electroplating process for precisely electroplating the through hole in the high-frequency circuit board.
Background
The electronic component assembly includes a single-sided circuit board, a double-sided circuit board, a PCB board, a multi-layer printed circuit board, a high-frequency circuit board, and the like. The high-frequency circuit board has the characteristic of faster data transmission, so that the high-frequency circuit board is widely applied to a control part of a high-end numerical control machine tool. The structure of the high-frequency circuit board is shown in figure 1, the high-frequency circuit board is formed by hot pressing a plurality of printed boards 1, a through hole 2 is arranged in the high-frequency circuit board, a plating layer 3 is required to be plated on the inner wall of the through hole 2 in the process, the plating layer 3 conducts the circuit layers in the printed boards 1, and the structure of the high-frequency circuit board plated with the plating layer 3 is shown in figure 2.
The existing electroplating method is that a worker wraps a high-frequency circuit board to be electroplated by using a dry film, two ports of a through hole 2 in the high-frequency circuit board are exposed, then the high-frequency circuit board wrapped by the dry film is placed into an electroplating bath, the anode of a power supply is connected into electroplating solution in the electroplating bath, the cathode of the power supply is connected onto the high-frequency circuit board, and a layer of electroplated layer 3 can be electroplated in the through hole 2 of the high-frequency circuit board under the action of current. However, although this plating method can form a plating layer 3 on the inner wall of the through-hole 2, the existing plating method still has the following technical drawbacks: I. after the positive pole of power is connected into the plating solution, because the aperture of through-hole 2 is little, therefore can't form even electric field at all on the inner wall of through-hole 2, consequently can't form the plating layer 3 of thickness such as one deck on the inner wall of through-hole 2, very big reduction electroplating quality, and then reduced high frequency circuit board's production quality. II. After the high-frequency circuit board is immersed into the electroplating solution, bubbles can be formed in the through hole 2, the bubbles are attached to the area at the inner wall of the through hole 2, and the electroplating layer 3 cannot be formed at the position of the bubbles, so that the electroplating quality is further reduced, and the production quality of the high-frequency circuit board is reduced. III, a dry film is required to be manually wrapped on the outer part of the printed circuit board in advance, so that the production process is undoubtedly increased, and the working strength of workers is increased. Therefore, there is a need for an electroplating apparatus that can improve the electroplating quality, improve the production quality of high-frequency circuit boards, and reduce the working strength of workers.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides equipment and an electroplating process for precisely electroplating through holes in a high-frequency circuit board, which have the advantages of compact structure, improved electroplating quality, improved production quality of the high-frequency circuit board, reduced working strength of workers and simple operation.
The purpose of the invention is realized by the following technical scheme: a device for precise electroplating of a through hole in a high-frequency circuit board comprises a workbench, a first portal frame and a second portal frame which are sequentially and fixedly arranged on the surface of the workbench, and a through groove formed in a beam of the first portal frame, wherein a hollow pipe positioned right below the through groove is fixedly arranged on the surface of the workbench, the outer diameter of the hollow pipe is smaller than the diameter of the through hole of the high-frequency circuit board, the top end and the bottom end of the hollow pipe are both closed, a guide hole communicated with the hollow pipe is formed in the top closed end of the hollow pipe, a plurality of radial holes communicated with the hollow pipe are formed in the cylindrical surface of the hollow pipe, two positioning columns are further fixedly arranged on the surface of the workbench, and the two positioning columns are respectively arranged on the left side and the right side of the hollow pipe;
the lift cylinder has set firmly on the crossbeam of second portal frame, the piston rod of lift cylinder runs through the crossbeam setting of second portal frame, the welding has lifter plate and clamp plate on the piston rod of lift cylinder, the clamp plate sets up in the below of lifter plate, the clamp plate internal stability has set firmly the feed liquor pipe, the feed liquor pipe sets up directly over the guiding hole, the lower port of feed liquor pipe extends in the below of clamp plate, the last port of feed liquor pipe is sealed, the blind end of feed liquor pipe extends in the top of clamp plate, the branch pipe rather than the intercommunication sets firmly on the lateral wall of extension end on the feed liquor pipe, the branch pipe is connected with the leakage fluid dram of water pump, set firmly on the lifter plate and lead electrical pillar, lead electrical pillar and run through the blind end of feed liquor pipe downwards in order, the feed liquor pipe just extends in the below of feed liquor pipe.
An annular mounting groove I which is annularly distributed around the hollow pipe is formed in the table top of the workbench, and a sealing ring I is mounted in the annular mounting groove I.
An annular mounting groove II annularly distributed around the liquid inlet pipe is formed in the bottom surface of the pressing plate, and a sealing ring II is mounted in the annular mounting groove II.
The outer diameter of the liquid inlet pipe is equal to the diameter of the guide hole.
The lifting plate, the liquid inlet pipe, the pressing plate, the hollow pipe, the positioning column and the workbench are made of insulating materials.
The hollow pipe, the liquid inlet pipe and the conductive column are coaxially arranged.
The table top of the workbench is provided with a threaded hole, the bottom closed end of the hollow pipe is welded with a threaded head, and the hollow pipe is fixed on the workbench through the threaded head and the threaded hole in a threaded connection mode.
The equipment also comprises a controller which is electrically connected with the water pump and the electromagnetic valve of the lifting cylinder.
The equipment is used for the process of precisely electroplating the through hole in the high-frequency circuit board, and comprises the following steps:
s1, drilling two positioning holes on the high-frequency circuit board, ensuring that the distance between the two positioning holes is equal to the distance between the two positioning columns, and ensuring that the diameters of the positioning holes are equal to the diameters of the positioning columns;
s2, sleeving two positioning holes in the high-frequency circuit board on two positioning columns from top to bottom by workers, and supporting the high-frequency circuit board on the table top of the workbench, so that the fixture positioning of the high-frequency circuit board is realized, the hollow tube is just inserted into the through hole of the high-frequency circuit board, an annular gap is reserved between the hollow tube and the through hole, and the top surface of the hollow tube is flush with the top surface of the high-frequency circuit board;
s3, a worker controls a piston rod of a lifting cylinder to extend downwards, the piston rod drives a lifting plate and a pressing plate to move downwards synchronously, the lifting plate drives a conductive post to move downwards synchronously, the pressing plate drives a liquid inlet pipe and a branch pipe to move downwards synchronously, when the piston rod extends completely, the lower end part of the liquid inlet pipe is inserted into a guide hole of a hollow pipe, the conductive post is inserted into the hollow pipe, the pressing plate presses on the top surface of a high-frequency circuit board, meanwhile, the top surface of a through hole of the high-frequency circuit board is sealed by an annular sealing ring II, and the bottom surface of the through hole of the high-frequency circuit board is sealed by the annular sealing ring I;
s4, a worker turns on a water pump, the water pump pumps the electroplating solution in the electroplating bath, the pumped electroplating solution sequentially passes through the water pump, the branch pipe, the liquid inlet pipe, the inner cavity of the hollow pipe and the radial holes and finally enters the annular gap, after the electroplating solution is introduced for a period of time, the water pump is controlled to be closed, and at the moment, the inner cavity of the hollow pipe, the annular gap and the radial holes are filled with the electroplating solution;
s5, connecting the positive terminal of the power supply to the top end of the conductive column by workers, connecting the negative terminal of the power supply to the high-frequency circuit board, and plating a plating layer on the inner wall of the through hole of the high-frequency circuit board under the action of current;
s6, cutting off the power supply after electroplating for a period of time, then controlling the piston rod of the lifting cylinder to retract upwards, driving the lifting plate and the pressure plate to retract upwards and reset by the piston rod, driving the liquid inlet pipe to move upwards by the pressure plate, driving the conductive post to move upwards by the lifting plate, after resetting, lowering a thin pipe into the guide hole, and sucking the thin pipe by a pump so as to pump the waste electroplating solution into the recovery tank;
s7, obtaining a finished product high-frequency circuit board after pumping drainage is finished, and finally taking down the product from the positioning column; and repeating the operations of the steps S2-S6 to continuously produce a plurality of finished high-frequency circuit boards.
The invention has the following advantages: compact structure, improved electroplating quality, improved high-frequency circuit board production quality, reduced worker working strength, and simple operation.
Drawings
FIG. 1 is a schematic view of a high frequency circuit board;
FIG. 2 is a schematic structural view of a high-frequency circuit board plated with a plating layer;
FIG. 3 is a schematic structural view of the present invention;
FIG. 4 is an enlarged view of a portion I of FIG. 3;
FIG. 5 is a schematic view of the platen;
FIG. 6 is a bottom view of FIG. 5;
FIG. 7 is a schematic view of the structure of a hollow tube;
FIG. 8 is a front view of FIG. 7;
FIG. 9 is a top view of FIG. 8;
FIG. 10 is a schematic view of two positioning holes drilled in the high frequency circuit board;
FIG. 11 is a top view of FIG. 10;
FIG. 12 is a schematic view of a positioning tooling high frequency circuit board;
FIG. 13 is a schematic view of a high frequency circuit board at a plating station;
FIG. 14 is an enlarged partial view of section II of FIG. 13;
FIG. 15 is a schematic structural diagram of a finished high-frequency circuit board after electroplating;
in the figure, 1-printed board, 2-through hole, 3-electroplated layer, 4-workbench, 5-first portal frame, 6-second portal frame, 7-through groove, 8-hollow pipe, 9-guide hole, 10-radial hole, 11-positioning column, 12-lifting cylinder, 13-lifting plate, 14-pressing plate, 15-liquid inlet pipe, 16-branch pipe, 17-conductive column, 18-sealing ring I, 19-sealing ring II, 20-screw head, 21-positioning hole and 22-high frequency circuit board.
Detailed Description
The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:
as shown in fig. 3 to 9, an apparatus for precision electroplating of a through hole in a high-frequency circuit board comprises a worktable 4, a first portal frame 5 and a second portal frame 6 which are sequentially and fixedly arranged on a table-board of the worktable 4, and a through groove 7 arranged on a cross beam of the first portal frame 5, wherein a hollow tube 8 positioned right below the through groove 7 is fixedly arranged on the table-board of the worktable 4, the outer diameter of the hollow tube 8 is smaller than the diameter of the through hole of the high-frequency circuit board, the top end and the bottom end of the hollow tube 8 are both closed, a guide hole 9 communicated with the top closed end of the hollow tube 8 is arranged on the top closed end of the hollow tube 8, a plurality of radial holes 10 communicated with the cylindrical surface of the hollow tube 8 are arranged on the table-board of the worktable 4, two positioning columns 11 are further fixedly arranged on the table-board of the worktable 4, and the two positioning columns 11 are respectively arranged on the left side and the right side of the hollow tube 8;
a lifting cylinder 12 is fixedly arranged on a cross beam of the second portal frame 6, a piston rod of the lifting cylinder 12 penetrates through the cross beam of the second portal frame 6, a lifting plate 13 and a pressing plate 14 are welded on the piston rod of the lifting cylinder 12, the pressing plate 14 is arranged below the lifting plate 13, a liquid inlet pipe 15 is fixedly arranged in the pressing plate 14, the outer diameter of the liquid inlet pipe 15 is equal to the diameter of the guide hole 9, the liquid inlet pipe 15 is arranged right above the guide hole 9, a lower port of the liquid inlet pipe 15 extends below the pressing plate 14, an upper port of the liquid inlet pipe 15 is sealed, a closed end of the liquid inlet pipe 15 extends above the pressing plate 14, a branch pipe 16 communicated with the liquid outlet of the liquid inlet pipe 15 is fixedly arranged on the side wall of the upper extending end of the liquid inlet pipe 15, the branch pipe 16 is connected with the liquid outlet of a water pump, a conductive column 17 is fixedly arranged on the lifting plate 13, the conductive column 17 sequentially penetrates through the closed end of the liquid inlet pipe 15 and the liquid inlet pipe 15 downwards and extends below the liquid inlet pipe 15, the hollow pipe 8, the liquid inlet pipe 15 and the conductive column 17 are coaxially arranged. The lifting plate 13, the liquid inlet pipe 15, the pressing plate 14, the hollow pipe 8, the positioning column 11 and the workbench 4 are made of insulating materials.
An annular mounting groove I annularly distributed around the hollow pipe 8 is formed in the table top of the workbench 4, and a sealing ring I18 is mounted in the annular mounting groove I. An annular mounting groove II annularly distributed around the liquid inlet pipe 15 is formed in the bottom surface of the pressure plate 14, and a sealing ring II19 is mounted in the annular mounting groove II. A threaded hole is formed in the table top of the workbench 4, a threaded head 20 is welded to the bottom closed end of the hollow pipe 8, and the hollow pipe 8 is fixed to the workbench 4 through threaded connection of the threaded head 20 and the threaded hole.
The equipment further comprises a controller, the controller is electrically connected with the water pump and the electromagnetic valve of the lifting cylinder 12, a worker can control the piston rod of the lifting cylinder 12 to extend or retract through the controller, and meanwhile, the water pump can be controlled to be started or closed, so that the equipment is convenient for the operation and control of the worker and has the characteristics of flexibility and reliability.
The equipment is used for the process of precisely electroplating the through hole in the high-frequency circuit board, and comprises the following steps:
s1, drilling two positioning holes 21 on the high-frequency circuit board, as shown in fig. 10 to 11, ensuring that the distance between the two positioning holes 21 is equal to the distance between the two positioning posts 11, and ensuring that the diameter of the positioning hole 21 is equal to the diameter of the positioning post 11;
s2, sleeving two positioning holes 21 in the high-frequency circuit board 22 on two positioning columns 11 from top to bottom by a worker, and supporting the high-frequency circuit board 22 on the table top of the workbench 4, so that the fixture positioning of the high-frequency circuit board 22 is realized as shown in FIG. 12, at the moment, the hollow tube 8 is just inserted into the through hole 2 of the high-frequency circuit board 22, an annular gap is reserved between the hollow tube 8 and the through hole 2, and the top surface of the hollow tube 8 is flush with the top surface of the high-frequency circuit board 22;
s3, a worker controls a piston rod of the lifting cylinder 12 to extend downwards, the piston rod drives the lifting plate 13 and the pressing plate 14 to move downwards synchronously, the lifting plate 13 drives the conductive post 17 to move downwards synchronously, the pressing plate 14 drives the liquid inlet pipe 15 and the branch pipe 16 to move downwards synchronously, when the piston rod extends completely, as shown in figures 13-14, the lower end of the liquid inlet pipe 15 is inserted into the guide hole 9 of the hollow pipe 8, the conductive post 17 is inserted into the hollow pipe 8, the pressing plate 14 is pressed on the top surface of the high-frequency circuit board 22, meanwhile, the top surface of the through hole 2 of the high-frequency circuit board is sealed by an annular sealing ring II19, and the bottom surface of the through hole 2 of the high-frequency circuit board 22 is sealed by an annular sealing ring I18;
s4, a worker turns on a water pump, the water pump pumps the electroplating solution in the electroplating bath, the pumped electroplating solution sequentially passes through the water pump, the branch pipe 16, the liquid inlet pipe 15, the inner cavity of the hollow pipe 8 and the radial holes 10 and finally enters the annular gap, after the electroplating solution is introduced for a period of time, the water pump is controlled to be closed, and at the moment, the inner cavity of the hollow pipe 8, the annular gap and the radial holes 10 are filled with the electroplating solution; because the annular gap that the plating solution formed between with the inner wall of hollow tube 8 and through-hole 2 fills up to will be attached to the bubble extrusion on the inner wall of through-hole 2, ensured to have formed plating layer 3 on the inner wall of through-hole 2, consequently compare traditional electroplating method, greatly improved electroplating quality, and then very big improvement high frequency circuit board's production quality.
S5, connecting the positive terminal of the power supply to the top end of the conductive post 17 and the negative terminal of the power supply to the high-frequency circuit board 22 by workers, and plating a plating layer 3 on the inner wall of the through hole 2 of the high-frequency circuit board 22 under the action of current, wherein the structure of the product is shown in FIG. 15; because the conductive column 17 is arranged along the length direction of the hollow tube 8 and is soaked in the electroplating solution, an even electric field can be formed in the electroplating solution, and the electroplating layer 3 with the same thickness is electroplated on the inner wall of the through hole 2, so that the electroplating quality is greatly improved compared with the traditional electroplating method, and the production quality of the high-frequency circuit board is greatly improved.
S6, cutting off the power supply after a period of electroplating, controlling the piston rod of the lifting cylinder 12 to retract upwards, driving the lifting plate 13 and the pressing plate 14 to retract upwards for resetting by the piston rod, driving the liquid inlet pipe 15 to move upwards by the pressing plate 14, driving the conductive post 17 to move upwards by the lifting plate 13, after resetting, putting a thin pipe into the guide hole 9, and pumping the thin pipe by a pump so as to pump the waste electroplating solution into the recovery tank;
s7, obtaining a finished product high-frequency circuit board after pumping drainage is finished, and finally taking down the product from the positioning column 11; and repeating the operations of the steps S2-S6 to continuously produce a plurality of finished high-frequency circuit boards. Therefore, in the whole electroplating process, the high-frequency circuit board is not required to be wrapped in advance by the dry film and then electroplated, but is directly electroplated, so that the working strength is greatly reduced, and meanwhile, the electroplating efficiency is greatly improved.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The utility model provides an equipment that is used for accurate electroplating of through-hole in high frequency circuit board which characterized in that: the high-frequency circuit board drilling machine comprises a workbench (4), a first portal frame (5) and a second portal frame (6) which are sequentially and fixedly arranged on a table board of the workbench (4), and a through groove (7) formed in a cross beam of the first portal frame (5), wherein a hollow pipe (8) positioned right below the through groove (7) is fixedly arranged on the table board of the workbench (4), the outer diameter of the hollow pipe (8) is smaller than the diameter of a through hole of a high-frequency circuit board, the top end and the bottom end of the hollow pipe (8) are both closed, a guide hole (9) communicated with the hollow pipe (8) is formed in the closed end at the top of the hollow pipe (8), a plurality of radial holes (10) communicated with the hollow pipe (8) are formed in the cylindrical surface of the hollow pipe (8), two positioning columns (11) are further fixedly arranged on the table board of the workbench (4), and the two positioning columns (11) are respectively arranged on the left side and the right side of the hollow pipe (8);
a lifting cylinder (12) is fixedly arranged on a cross beam of the second portal frame (6), a piston rod of the lifting cylinder (12) penetrates through the cross beam of the second portal frame (6), a lifting plate (13) and a pressing plate (14) are welded on the piston rod of the lifting cylinder (12), the pressing plate (14) is arranged below the lifting plate (13), a liquid inlet pipe (15) is fixedly arranged in the pressing plate (14), the liquid inlet pipe (15) is arranged right above the guide hole (9), a lower port of the liquid inlet pipe (15) extends below the pressing plate (14), an upper port of the liquid inlet pipe (15) is sealed, a closed end of the liquid inlet pipe (15) extends above the pressing plate (14), a branch pipe (16) communicated with the liquid inlet pipe is fixedly arranged on a side wall of the extending end of the liquid inlet pipe (15), the branch pipe (16) is connected with a liquid discharge port of the water pump, a liquid discharge port (17) is fixedly arranged on the lifting plate (13), the conductive columns (17) sequentially penetrate through the closed end of the liquid inlet pipe (15), and the liquid discharge port, The liquid inlet pipe (15) extends below the liquid inlet pipe (15).
2. The apparatus for precision plating of through holes in high frequency circuit boards according to claim 1, wherein: an annular mounting groove I which is annularly distributed around the hollow pipe (8) is formed in the table top of the workbench (4), and a sealing ring I (18) is mounted in the annular mounting groove I.
3. The apparatus for precision plating of through holes in high frequency circuit boards according to claim 1, wherein: and an annular mounting groove II annularly distributed around the liquid inlet pipe (15) is formed in the bottom surface of the pressing plate (14), and a sealing ring II (19) is mounted in the annular mounting groove II.
4. The apparatus for precision plating of through holes in high frequency circuit boards according to claim 1, wherein: the outer diameter of the liquid inlet pipe (15) is equal to the diameter of the guide hole (9).
5. The apparatus for precision plating of through holes in high frequency circuit boards according to claim 1, wherein: the lifting plate (13), the liquid inlet pipe (15), the pressing plate (14), the hollow pipe (8), the positioning column (11) and the workbench (4) are made of insulating materials.
6. The apparatus for precision plating of through holes in high frequency circuit boards according to claim 1, wherein: the hollow pipe (8), the liquid inlet pipe (15) and the conductive column (17) are coaxially arranged.
7. The apparatus for precision plating of through holes in high frequency circuit boards according to claim 1, wherein: threaded holes are formed in the table top of the workbench (4), threaded heads (20) are welded to the bottom closed ends of the hollow pipes (8), and the hollow pipes (8) are fixed to the workbench (4) through the threaded heads (20) and the threaded holes in a threaded connection mode.
8. The apparatus for precision plating of through holes in high frequency circuit boards according to claim 1, wherein: the equipment also comprises a controller which is electrically connected with the water pump and the electromagnetic valve of the lifting cylinder (12).
9. The process for precisely electroplating the through hole in the high-frequency circuit board by the equipment according to any one of claims 1 to 8, wherein the process comprises the following steps: it comprises the following steps:
s1, drilling two positioning holes (21) in the high-frequency circuit board, ensuring that the distance between the two positioning holes (21) is equal to the distance between the two positioning columns (11), and simultaneously ensuring that the diameters of the positioning holes (21) are equal to the diameters of the positioning columns (11);
s2, sleeving two positioning holes (21) in a high-frequency circuit board (22) on two positioning columns (11) from top to bottom by a worker, and supporting the high-frequency circuit board (22) on the table top of a workbench (4), so that the tool positioning of the high-frequency circuit board (22) is realized, the hollow pipe (8) is just inserted into a through hole (2) of the high-frequency circuit board (22), an annular gap is reserved between the hollow pipe (8) and the through hole (2), and the top surface of the hollow pipe (8) is flush with the top surface of the high-frequency circuit board (22);
s3, a worker controls a piston rod of a lifting cylinder (12) to extend downwards, the piston rod drives a lifting plate (13) and a pressing plate (14) to move downwards synchronously, the lifting plate (13) drives a conductive post (17) to move downwards synchronously, the pressing plate (14) drives a liquid inlet pipe (15) and a branch pipe (16) to move downwards synchronously, after the piston rod extends completely, the lower end part of the liquid inlet pipe (15) is inserted into a guide hole (9) of a hollow pipe (8), the conductive post (17) is inserted into the hollow pipe (8), the pressing plate (14) is pressed on the top surface of a high-frequency circuit board (22), meanwhile, the top surface of a through hole (2) of the high-frequency circuit board is sealed by an annular sealing ring II (19), and the bottom surface of the through hole (2) of the high-frequency circuit board (22) is sealed by an annular sealing ring I (18);
s4, a worker turns on a water pump, the water pump pumps the electroplating solution in the electroplating bath, the pumped electroplating solution sequentially passes through the water pump, a branch pipe (16), a liquid inlet pipe (15), an inner cavity of a hollow pipe (8) and radial holes (10) and finally enters the annular gap, after the electroplating solution is introduced for a period of time, the water pump is controlled to be closed, and at the moment, the inner cavity of the hollow pipe (8), the annular gap and the radial holes (10) are filled with the electroplating solution;
s5, a worker connects the positive terminal of the power supply to the top end of the conductive post (17), connects the negative terminal of the power supply to the high-frequency circuit board (22), and can electroplate a layer of electroplated layer (3) on the inner wall of the through hole (2) of the high-frequency circuit board (22) under the action of current;
s6, cutting off a power supply after electroplating for a period of time, then controlling a piston rod of the lifting cylinder (12) to retract upwards, driving the lifting plate (13) and the pressing plate (14) to retract upwards for resetting by the piston rod, driving the liquid inlet pipe (15) to move upwards by the pressing plate (14), driving the conductive post (17) to move upwards by the lifting plate (13), lowering a thin pipe into the guide hole (9) after resetting, and pumping the thin pipe by a pump so as to pump the waste electroplating solution into the recovery tank;
s7, obtaining a finished product high-frequency circuit board after pumping drainage is finished, and finally taking down the product from the positioning column (11); and repeating the operations of the steps S2-S6 to continuously produce a plurality of finished high-frequency circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210120486.7A CN114351199B (en) | 2022-02-09 | 2022-02-09 | Equipment and electroplating process for precisely electroplating through holes in high-frequency circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210120486.7A CN114351199B (en) | 2022-02-09 | 2022-02-09 | Equipment and electroplating process for precisely electroplating through holes in high-frequency circuit board |
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| CN114351199A true CN114351199A (en) | 2022-04-15 |
| CN114351199B CN114351199B (en) | 2023-04-21 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115386863A (en) * | 2022-08-31 | 2022-11-25 | 四川海英电子科技有限公司 | Precise chemical plating device and method for small holes of multilayer printed circuit board |
| CN116219414A (en) * | 2023-02-01 | 2023-06-06 | 四川英创力电子科技股份有限公司 | Copper plating device and method for improving electroless plating quality of circuit board |
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