CN115372740A - RF chip line loss test method, system, readable storage medium and electronic device - Google Patents
RF chip line loss test method, system, readable storage medium and electronic device Download PDFInfo
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- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R21/00—Arrangements for measuring electric power or power factor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention discloses a method and a system for testing line loss of an RF chip, a readable storage medium and electronic equipment, and belongs to the technical field of chip testing. The method comprises the following steps: placing a radio frequency chip to be tested in a test base, wherein a first spring pin and a second spring pin touch a pin part of the radio frequency chip; the first spring needle is connected with a test instrument; establishing a connection between the goldensample and the second pogo pin; acquiring a radio frequency signal sent by the goldensample to the first test instrument, and calculating the power value of the radio frequency signal; acquiring a line loss value of a radio frequency line under the frequency of the radio frequency signal and a line loss value of a PCB (printed circuit board) routing; obtaining a line loss value introduced by the contact impedance of the pogo pins; after the goldensample is disconnected from the second spring pin, the radio frequency chip to be tested sends or receives a radio frequency signal, and the first testing instrument measures the power of the radio frequency signal to obtain a line loss value of the testing loop. The invention can measure the line loss value introduced by the contact impedance of the spring needle, and reduce the test deviation so as to improve the result accuracy.
Description
Technical Field
The invention belongs to the technical field of chip testing, and particularly relates to a method and a system for testing line loss of an RF chip, a readable storage medium and electronic equipment.
Background
Different rf line materials and line lengths result in different power losses, commonly referred to as line losses. During the mass production test, the power loss of the radio frequency line must be measured, and the corresponding value is compensated in the test process, otherwise, the test introduces larger measurement error. However, this compensation value is usually a fixed compensation value for a specific line, and if the radio frequency line corresponding to the calibration value is not used, it may cause an abnormality in the test value.
Fig. 1 shows a connection relationship diagram of a current RF chip in a mass production test. The distance between the spring pins and the SMA interface for routing the circuit on the test board is short, and the introduced line loss is small and is usually ignored.
Pogo pins (pogo pins) connecting the chip pins with the circuit board are the easiest to ignore in the test loop and are also the easiest places to introduce large measurement errors.
Ideally, the contact resistance between the pogo pins and the chip pins is about 0.2 ohm, but as the number of tests increases, the pogo pins are oxidized or contaminated, so that the contact resistance also changes, and in a severe case, the contact resistance may reach 5 ohm.
In addition, the magnitude of the handler pressure also affects the value of the contact resistance. The power loss of the radio frequency signal introduced by different contact impedances is different, and because the contact impedances are dynamically changed, each contact between the chip and the spring pins in the test base can cause impedance change, so that the power loss of the radio frequency signal is dynamically changed in each test. Therefore, the line loss value that dynamically changes makes the conventional fixed value compensation method no longer applicable, and also causes a large deviation in the test value.
In summary, it is a technical problem to be solved at present how to provide a method for testing line loss of an RF chip, which can measure a line loss value induced by a pogo pin contact impedance, reduce a deviation of a test value, and thereby improve accuracy of a test result.
Disclosure of Invention
The invention aims to provide a method and a system for testing the line loss of an RF chip, a readable storage medium and electronic equipment. In the test, the test circuit from the first test instrument to the first pogo pin is disconnected, and the circuit from the second pogo pin to the gold sample is communicated, so that the line loss value introduced by the contact impedance of the pogo pin can be obtained.
The invention provides a method for testing line loss of an RF chip, which is applied to a testing device, wherein the testing device comprises a testing base, a testing instrument and a network analyzer;
wherein the test base comprises pogo pins, the pogo pins comprising a first pogo pin and a second pogo pin;
the test instrument comprises a gold sample and a first test instrument;
the method comprises the following steps:
placing a radio frequency chip to be tested in a test base, wherein the first spring pin and the second spring pin touch a pin part of the radio frequency chip, and the first spring pin is connected to a first test instrument so as to be communicated with a test loop from the first spring pin to the first test instrument;
establishing a connection of the gold sample with the second pogo pin to communicate a circuit from the gold sample to the second pogo pin;
acquiring a radio frequency signal sent by the gold sample to the first test instrument, and calculating a power value of the radio frequency signal;
acquiring a line loss value of a radio frequency line under the frequency of the radio frequency signal and a line loss value of PCB wiring through the network analyzer; the PCB routing comprises a first PCB routing and a second PCB routing;
obtaining a line loss value introduced by the contact impedance of the pogo pin;
after the connection between the gold sample and the second spring needle is disconnected, the radio frequency chip to be tested sends or receives radio frequency signals, and the first testing instrument measures the power of the radio frequency signals to obtain a line loss value of the testing loop.
Furthermore, the calculation formula of the line loss value introduced by the contact impedance of the pogo pins is as follows,
wherein, X is the frequency of the radio frequency signal;
P 1 power value, P, of a radio frequency signal transmitted for a gold sample 2 The power value of the radio frequency signal received by the first test instrument is obtained;
L1 x routing a line loss value for the first PCB; l2 x The line loss value of the radio frequency line is obtained; l3 x And the line loss value of the second PCB routing is obtained.
Further, the step of obtaining the value of the line loss introduced by the contact impedance of the pogo pin further comprises the step of obtaining the value of the line loss introduced by the contact impedance of the first pogo pin, wherein the step of obtaining the value of the line loss introduced by the contact impedance of the first pogo pin comprises the following steps,
the test loop is communicated, and the power of the first radio frequency signal is obtained by the chip to be tested according to the first radio frequency signal sent by the gold sample;
disconnecting the test loop, and obtaining the power of a second radio frequency signal according to the second radio frequency signal sent by the chip to be tested according to the gold sample, wherein the power of the second radio frequency signal is the same as that of the first radio frequency signal;
calculating a power difference between the measured power of the first radio frequency signal and the measured power of the second radio frequency signal;
and calculating a line loss value introduced by the contact impedance of the first spring needle and a line loss value introduced by the contact impedance of the second spring needle.
Furthermore, the line loss value introduced by the contact impedance of the first spring needle is calculated by the formula,
wherein, X is the frequency of the radio frequency signal; p rg Is the measured power of the first radio frequency signal; p re Is the measured power of the second radio frequency signal.
Further, the step of obtaining the line loss value of the test loop further comprises compensating the test loop according to the obtained line loss value introduced by the contact impedance of the pogo pin.
Further, the line loss value of the test loop is calculated according to the formula PA x ＝PL x +L1 x +L2 x 。
Further, obtaining an ideal line loss value of the test loop before testing, and calculating a difference value between the line loss value of the test loop and the ideal line loss value of the test loop;
and triggering an alarm when the difference value is greater than a preset threshold value.
Further, the sum of the length of the second pogo pin and the length of the PCB trace is smaller than the wavelength of the radio frequency signal.
The invention also provides an RF chip mass production line loss testing system for implementing any one of the methods, which comprises:
switch module: the test circuit is used for establishing connection between the first spring pin and the first test instrument so as to communicate a test loop from the radio frequency chip to be tested to the first test instrument; and the device is used for establishing the connection between the gold sample and the second spring needle so as to communicate the circuit from the gold sample to the second spring needle, or cutting off the connection between the gold sample and the second spring needle so as to disconnect the circuit from the gold sample to the second spring needle.
A sending module: for transmitting a radio frequency signal to the first test instrument via a gold sample;
a receiving module: for receiving a radio frequency signal generated by a gold sample by the first test instrument;
an acquisition module: the radio frequency line loss value under the frequency of the radio frequency signal and the line loss value of the PCB wiring are obtained through a network analyzer;
a calculation module: the device is used for calculating the power value of the radio frequency signal received by the first test instrument, the line loss value introduced by the contact impedance of the spring pin and the line loss value of the test loop.
Further, the calculation module is further configured to calculate an ideal line loss value of the test loop, calculate a difference value between the line loss value of the test loop and the ideal line loss value of the test loop, and determine whether the difference value between the line loss value of the test loop and the ideal line loss value of the test loop is greater than a preset threshold value.
The invention also provides a computer readable storage medium, on which a detection program is stored, which when executed by a processor implements the steps of the RF chip line loss testing method as described in any one of the above.
The present invention also provides an electronic device, comprising: memory, a processor and a computer program stored on the memory and executable on the processor, the processor when executing the program implementing: the method for testing the line loss of the RF chip.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the advantages and positive effects that the method is taken as an example and is not limited:
the first spring needle connected with the first testing instrument and the second spring needle connected with the gold sample are simultaneously contacted with a pin part of the radio frequency chip in the testing base, a testing loop from the first testing instrument to the first spring needle is kept disconnected in testing, meanwhile, a loop from the second spring needle to the gold sample is communicated, after a line loss value introduced by the contact impedance of the spring needle is obtained, the testing loop is communicated, the line loss value introduced by the contact impedance of the spring needle is compensated, and the line loss value of the testing loop is obtained. By measuring the contact impedance of the dynamically-changed spring needle and the radio frequency chip to be tested and compensating the contact impedance in the test process, the test deviation is reduced, and the accuracy of the measurement result is improved.
The chip test can be automatically compensated, or monitored and alarmed.
The radio frequency signal is sent by adopting the gold sample, so that the routing of the PCB is simplified, the requirement on the radio frequency testing equipment resource is avoided, and the testing cost is reduced.
Drawings
FIG. 1 is a schematic diagram of connection relationship of RF chips in mass production test.
Fig. 2 is a flowchart of a line loss testing method for an RF chip according to the present invention.
Fig. 3 is a schematic connection diagram of the RF chip line loss testing method provided by the present invention.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; for a better explanation of the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
As shown in fig. 2, the present invention provides a method for testing line loss of an RF chip, which is applied to a testing apparatus including a testing base, a testing instrument and a network analyzer.
Wherein the test base comprises a spring probe using a dual spring pinhole for RF IO, the spring probe comprising a first spring probe and a second spring probe.
The test instrument includes a gold sample and a first test instrument.
S100, placing a radio frequency chip to be tested in a test base, wherein the first spring pin and the second spring pin touch a pin part of the radio frequency chip, and the first spring pin is connected to a first test instrument so as to communicate a test loop from the first spring pin to the first test instrument; the test loop keeps a connection state in the process of testing the line loss value introduced by the contact impedance of the spring needle. Optionally, the connection or disconnection between the first pogo pin and the first test instrument is controlled by RFswitch.
S200, establishing connection between the gold sample and the second spring needle, and optionally connecting the gold sample to the second spring needle through a set RF switch so as to communicate the loop of the gold sample to the second spring needle; and the connection and disconnection between the gold sample and the second pogo pin are controlled through the RF switch.
S300, acquiring the radio frequency signal sent by the gold sample to the first testing instrument, and calculating the power value of the radio frequency signal.
Specifically, if the gold sample sends a frequency X to the first test instrument 1 Power is a known value P 1 The first test instrument receives the signal and calculates the received signal power as P 2 . Thus, the frequency X can be calculated 1 When the line loss value of the radio frequency line of the loop connecting the gold sample and the first test instrument is equal to
In this embodiment, the golden sample is used, and the transmission power from one end of the loop is a known value P 1 The first test instrument at the other end of the loop receives the radio frequency signal, so that an additional circuit is avoided, and the test cost is reduced.
And repeating the process, and calculating to obtain the line loss value corresponding to each channel frequency only by changing the frequency.
S400, acquiring a line loss value of the radio frequency line under the radio frequency signal and a line loss value of the PCB wiring through the network analyzer, wherein the PCB wiring comprises a first PCB wiring and a second PCB wiring. And setting the transmitting power of the network analyzer, accessing the radio frequency line to be tested into an interface of the network analyzer for transmission calibration, and then accessing the radio frequency line to be tested, wherein the insertion loss value is the line loss value of the radio frequency line to be tested.
S500, obtaining a line loss value introduced by the contact impedance of the pogo pin, wherein a calculation formula is as follows,
wherein, X 1 Is the frequency of the radio frequency signal; p is 1 Power value, P, of a radio frequency signal transmitted for a gold sample 2 The power value of the radio frequency signal received by the first test instrument;
It should be emphasized that, in this embodiment, the above formula refers to the averaging process performed on the line loss values introduced by the first pogo pins, the second pogo pins and their contact impedances, so as to obtain uniform line loss values introduced by each pogo pin and its contact impedance.
Likewise, the gold sample is disconnected from the second pogo pin by the aforementioned RF switch, so that the loop between the gold sample and the second pogo pin is disconnected, and the loop remains disconnected until the test process for testing the actual line loss value of the loop is finished. This operation means that the gold sample is now in the power off or idle state.
The line loss value test process of the test loop is as follows: s600, after the gold sample is disconnected from the second spring needle, under the condition that a test loop between the first spring needle and a first test instrument is communicated, a radio frequency signal is sent or received through a radio frequency chip to be tested, wherein the frequency of the radio frequency signal is X 2 。X 2 Frequency X of radio frequency signal transmitted by the above-mentioned gold sample 1 The values of (A) may be the same or different.
Specifically, the first test instrument measures the power of the radio frequency signal sent or received by the radio frequency chip to be tested, and the first test instrument measures the power of the radio frequency signal to obtain the line loss value of the test loop.
It should be noted that, the obtaining the line loss value of the test loop further includes compensating the test loop according to the obtained line loss value introduced by the pogo pin contact impedance.
By the formula PA x ＝PL x +L1 x +L2 x And calculating the line loss value of the test loop.
As one typical implementation, before a single RF chip test is started, an ideal line loss value of a test loop is obtained.
The ideal line loss value of the test loop can be obtained through the following method steps: placing a radio frequency chip to be tested in the test base, wherein the first spring pin and the second spring pin are in contact with a base pin of the radio frequency chip and are in a conducting state, and the radio frequency chip is in a power off state at the moment;
the RF switch is controlled to connect the gold sample to the second pogo pin.
And controlling the gold sample to send a radio frequency signal, receiving the signal by the first testing instrument, and calculating the received signal power. From this, the bus loss value of the loop from the gold sample to the first test instrument at the frequency of the rf signal can be calculated. And calculating the line loss value corresponding to each channel frequency in turn.
And obtaining a line loss value introduced by the contact impedance of the pogo pins, and recording the line loss value in a preset calibration file.
Controlling the RF switch to be turned off can enable the gold sample to be in a power off or idle state. The first test instrument can measure the radio frequency signal by sending or receiving the radio frequency signal with the frequency of X through the radio frequency chip to be tested. Obtaining the ideal line loss value of the corresponding test loop as PA x ＝PL X +L1 X +L2 X And recording the data in a preset calibration file. It is emphasized that the method steps for testing the desired line loss value can refer to the above-mentioned testing method for the line loss test of the RF chip.
After the line loss value of the test loop is tested, calculating the difference value between the line loss value of the test loop and the ideal line loss value of the test loop, and when the difference value is greater than a preset threshold value, triggering an alarm, stopping the test, and waiting for subsequent manual processing. Therefore, whether the line loss value of the test environment is abnormal or not can be monitored, the monitoring times and time intervals can be flexibly controlled, and the additional test time is short.
In another embodiment, after obtaining the line loss value introduced into the test loop due to the contact impedance or other reasons through the steps of the RF chip line loss test method provided by the present invention, similarly, the dynamic line loss value introduced by the pogo pin contact impedance at different radio frequency signals and the total line loss value of the test loop at that time can be obtained. When the radio frequency chip is tested, the corresponding line loss value is compensated in real time, and the accuracy of subsequent measurement can be improved.
The invention can also be used for compensating the line loss values of the test loops at different temperatures.
It is contemplated that truck-scale or industrial type chips typically require testing of the chips at different temperatures. The test is carried out at three temperatures of-40 ℃,25 ℃ and 125 ℃ according to the requirements of the Grade1 of the vehicle. The contact impedance of the spring needle at different temperatures is obviously different, and the oxidation speed of the spring needle at high temperature is obviously higher than that at normal temperature and low temperature. The oxidation degree of the spring needle tip is close to the result of 2000 times under the normal temperature condition after every 500 times of using the spring needle under the high temperature condition.
Before the test is started, the line loss values of the test loops at different environmental temperatures are measured and recorded as calibration values.
First, the program sets the test temperature of the sorter through the GPIB. After the setting is completed, whether the test environment temperature reaches the set temperature at the moment is inquired through the GPIB. And when the ambient temperature reaches the set temperature, measuring the line loss value at the moment by using the method for testing the line loss value of the loop, and recording the measured line loss value into a corresponding temperature line loss calibration file. If the line loss value is recorded to a calibration file Lx at the temperature of minus 40 DEG C LT In the middle, the line loss value is recorded to a calibration file Lx at the temperature of 25 DEG C RT In the middle, the 125 ℃ test line loss value is recorded into a calibration file Lx HT In (1).
After the actual test started, the program reads the test environment temperature at this time on the sorter via the GPIB. And reading the line loss calibration temperature corresponding to the temperature according to the test temperature at the moment. If the test temperature is 125 ℃, then access is madeReading calibration file Lx HT . And compensating the corresponding line loss value in the file to an actual test. It is also possible to arrange that the test of the line loss value of the test loop is triggered after every 200 times of accumulation. And when the test line loss value exceeds the line loss value in the calibration file by 0.2dB, triggering an alarm and suspending the test. The return line loss value at 2442Mhz as this time is 3.3dB, while the return line loss value at 2442Mhz calibrated in the document is 2.1dB at this temperature. The actual return line loss value is 1.2dB greater than the calibration value, so the program alarms and stops the test.
The method can compensate the line loss value of the test loop under different test environments, and avoids test errors caused by test temperature changes. Meanwhile, real-time compensation is not needed, and testing time can be saved.
The invention also provides an implementation mode, namely, the line loss values introduced by the first spring pin, the second spring pin and the contact impedance of the first spring pin and the second spring pin are respectively calculated through the steps of the RF chip line loss testing method provided by the invention.
The obtaining of the value of the line loss induced by the contact impedance of the pogo pin further comprises obtaining a value of the line loss induced by the contact impedance of the first pogo pin, the obtaining of the value of the line loss induced by the contact impedance of the first pogo pin comprises the steps of,
and communicating the test loop, and obtaining the power of the first radio frequency signal by the chip to be tested according to the first radio frequency signal sent by the gold sample.
And disconnecting the test loop, and obtaining the power of a second radio frequency signal sent by the chip to be tested according to the gold sample, wherein the power of the second radio frequency signal is the same as that of the first radio frequency signal.
A power difference between the measured power of the first radio frequency signal and the measured power of the second radio frequency signal is calculated.
And calculating a line loss value introduced by the contact impedance of the first spring pin and a line loss value introduced by the contact impedance of the second spring pin.
In the foregoing embodiment, the line loss values introduced by the first pogo pin and the second pogo pin and their contact impedances are averaged. In practical application, the contact resistance inevitably has difference due to the possible contamination and oxidation degree of the two spring needles or the difference of the service life. In the embodiment, the line loss value introduced by each spring needle and the contact impedance thereof is calculated, so that more accurate measurement can be realized.
The line loss test method of the RF chip can obtain the following results:
(L p1 +L p2 ) X ＝(P1-P2) X -(L1 X +L2 X +L3 X ) (1) (X is a signal frequency)
Wherein, the line loss value introduced by the first spring needle and the contact impedance thereof is L p1 The line loss value introduced by the second spring needle and the contact impedance thereof is L p2 。
The DUT is configured to be in a receive state. Close RF switch, GU sends a signal with power P, at which time the DUT can obtain a received power value P rg 。
The RF switch is turned off, and signals with power P are transmitted together through the test. At this point the DUT can obtain another received power value P re 。
The difference between the two power values received by the DUT is due to the inconsistency of the two test loop line losses, and thus:
(P rg -P re ) X ＝(L 1 +L 2 +L p1 ) X -(L 3 +L p2 ) x (2) (X is a signal frequency)
From equations (1) and (2), we can see that:
As at 2442Mhz, the loop is closed first, and the gold sample transmits a signal with power P1=5dB, and P2=2.4dB is measured at the test instrument. L1=0.1db, L2=1.9db, and L3=0.05db at 2442 Mhz. Then, the DUT is configured to be in a receiving state, the gold sample transmits a 5dB signal, and the DUT measures corresponding power P rg =4.7dB. The RF switch is turned off and the tester sends 5dBSignal when DUT measures corresponding power P re =2.6dB. Substituting equation (3) can result in L p1 =0.35dB. When testing the DUT, 0.35dB is brought into compensation when calculating power.
The invention provides a system for testing line loss of RF (radio frequency) chip mass production, which is used for implementing any one of the methods, and the system comprises:
switch module: the test circuit is used for establishing connection between the first spring pin and the first test instrument so as to communicate a test loop from the radio frequency chip to be tested to the first test instrument; and the device is used for establishing the connection between the gold sample and the second spring needle to communicate the circuit from the gold sample to the second spring needle, or cutting off the connection between the gold sample and the second spring needle to disconnect the circuit from the gold sample to the second spring needle.
A sending module: the radio frequency signal is sent to the first testing instrument through the gold sample;
a receiving module: for receiving a radio frequency signal generated by a gold sample by the first test instrument;
an acquisition module: the radio frequency line loss value under the frequency of the radio frequency signal and the line loss value of the PCB wiring are obtained through a network analyzer;
a calculation module: the device is used for calculating the power value of the radio frequency signal received by the first test instrument, the line loss value introduced by the contact impedance of the spring pin and the line loss value of the test loop.
The calculation module is further configured to calculate an ideal line loss value of the test loop, calculate a difference value between the line loss value of the test loop and the ideal line loss value of the test loop, and determine whether the difference value between the line loss value of the test loop and the ideal line loss value of the test loop is greater than a preset threshold value.
Optionally, the system further comprises an alarm module, wherein the alarm module is configured to: and when the difference value between the line loss value of the test loop and the ideal line loss value of the test loop calculated by the calculation module is greater than a preset threshold value, giving an alarm.
The present invention also provides a computer readable storage medium, which may be, for example, a Read-Only Memory (ROM), a Random Access Memory (RAM), a Compact Disc Read-Only Memory (CDROM), a magnetic tape, a floppy disk, an optical data storage device, and the like.
The computer readable storage medium has stored thereon a detection program which, when executed by a processor, implements the steps of the RF chip line loss testing method as described in any one of the above.
The invention also provides an electronic device, which can be an industrial personal computer, a notebook computer, a tablet personal computer, a handheld computer, a super mobile personal computer, a netbook and other devices with data processing functions, and the embodiment of the invention is not limited in particular. The electronic device includes: a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor when executing the program implementing: the method for testing the line loss of the RF chip.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (12)
1. A method for testing line loss of an RF chip is applied to a testing device, and the testing device comprises a testing base, a testing instrument and a network analyzer;
wherein the test base comprises pogo pins, the pogo pins comprising a first pogo pin and a second pogo pin;
the test instrument comprises a gold sample and a first test instrument;
the method is characterized by comprising the following steps:
placing a radio frequency chip to be tested in a test base, wherein the first spring pin and the second spring pin touch a pin part of the radio frequency chip, and the first spring pin is connected to a first test instrument so as to communicate a test loop from the first spring pin to the first test instrument;
establishing a connection of the gold sample with the second pogo pin to communicate a circuit from the gold sample to the second pogo pin;
acquiring a radio frequency signal sent by the gold sample to the first testing instrument, and calculating a power value of the radio frequency signal;
acquiring a line loss value of a radio frequency line under the frequency of the radio frequency signal and a line loss value of a PCB (printed circuit board) routing through the network analyzer; the PCB comprises a first PCB and a second PCB;
obtaining a line loss value introduced by the contact impedance of the pogo pins;
after the connection between the gold sample and the second spring needle is disconnected, the radio frequency chip to be tested sends or receives a radio frequency signal, and the first testing instrument measures the power of the radio frequency signal to obtain a line loss value of the testing loop.
2. The RF chip line loss test method of claim 1, wherein: the calculation formula of the line loss value introduced by the contact resistance of the pogo pins is as follows,
wherein, X is the frequency of the radio frequency signal;
P 1 power value, P, of a radio frequency signal transmitted for a gold sample 2 The power value of the radio frequency signal received by the first test instrument is obtained;
L1 x routing a line loss value for the first PCB; l2 x The line loss value of the radio frequency line is obtained; l3 x And the line loss value of the second PCB routing is obtained.
3. The RF chip line loss test method of claim 1, wherein: the obtaining of the value of the line loss induced by the contact impedance of the pogo pin further comprises obtaining a value of the line loss induced by the contact impedance of the first pogo pin, the obtaining of the value of the line loss induced by the contact impedance of the first pogo pin comprises the steps of,
the test loop is communicated, and the power of the first radio frequency signal is obtained by the chip to be tested according to the first radio frequency signal sent by the gold sample;
disconnecting the test loop, and obtaining the power of a second radio frequency signal according to the second radio frequency signal sent by the chip to be tested according to the gold sample, wherein the power of the second radio frequency signal is the same as that of the first radio frequency signal;
calculating a power difference value of the measured power of the first radio frequency signal and the measured power of the second radio frequency signal;
and calculating a line loss value introduced by the contact impedance of the first spring needle and a line loss value introduced by the contact impedance of the second spring needle.
4. The RF chip line loss testing method of claim 3, wherein; the calculation formula of the line loss value introduced by the contact resistance of the first pogo pin is as follows,
wherein, X is the frequency of the radio frequency signal; p rg Is the measured power of the first radio frequency signal; p re Is the measured power of the second radio frequency signal.
5. The RF chip line loss test method of claim 1, wherein; the step of obtaining the line loss value of the test loop further comprises the step of compensating the test loop according to the obtained line loss value introduced by the contact impedance of the pogo pin.
6. The RF chip line loss testing method of claim 5, wherein: the calculation formula of the actual line loss value of the test loop is PA x ＝PL x +L1 x +L2 x 。
7. The RF chip line loss test method of claim 1, wherein: obtaining an ideal line loss value of the test loop before testing, and calculating a difference value between the line loss value of the test loop and the ideal line loss value of the test loop;
and when the difference value is larger than a preset threshold value, triggering an alarm.
8. The RF chip line loss test method of claim 1, wherein: the sum of the length of the second spring pin and the length of the PCB routing is smaller than the wavelength of the radio frequency signal.
9. An RF chip line loss test system for implementing the method of any one of claims 1-8, wherein:
the system comprises:
switch module: the test circuit is used for establishing connection between the first spring pin and the first test instrument so as to communicate a test loop from the radio frequency chip to be tested to the first test instrument; and the device is used for establishing the connection between the gold sample and the second spring needle to communicate the circuit from the gold sample to the second spring needle, or cutting off the connection between the gold sample and the second spring needle to disconnect the circuit from the gold sample to the second spring needle. A sending module: the radio frequency signal is sent to the first testing instrument through the gold sample;
a receiving module: the radio frequency signal is used for acquiring the radio frequency signal sent by the gold sample to the first testing instrument;
an acquisition module: the system comprises a network analyzer, a radio frequency signal processing module, a signal processing module and a signal processing module, wherein the network analyzer is used for acquiring a radio frequency line loss value under the frequency of the radio frequency signal and a line loss value of PCB wiring;
a calculation module: the device is used for calculating the power value of the radio frequency signal received by the first test instrument, the line loss value introduced by the contact impedance of the spring needle and the line loss value of the test loop.
10. The system of claim 9, wherein: the calculation module is further configured to calculate an ideal line loss value of the test loop, calculate a difference value between the line loss value of the test loop and the ideal line loss value of the test loop, and determine whether the difference value between the line loss value of the test loop and the ideal line loss value of the test loop is greater than a preset threshold value.
11. A computer-readable storage medium, having a detection program stored thereon, which when executed by a processor, implements the steps of the RF chip line loss testing method of any one of claims 1 to 8.
12. An electronic device, comprising: a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor when executing the program implementing: the RF chip line loss testing method of any one of claims 1 to 8.
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